MDE MAX40-36CA High current transient voltage suppressor (tvs) diode stand-off voltage 12 to 150 volts 40000 watt peak pulse power Datasheet

MDE Semiconductor, Inc.
78-150 Calle Tampico, Unit 210, La Quinta, CA, U.S.A. Tel: 760-564-8656 • Fax 760-564-2414
1-800-831-4881 Email: [email protected] Web: www.mdesemiconductor.com
MAX™ 40 Series
HIGH CURRENT TRANSIENT VOLTAGE SUPPRESSOR (TVS) DIODE
STAND-OFF VOLTAGE 12 TO 150 Volts
40000 Watt Peak Pulse Power
FEATURES
• Glass passivated junction
• Bidirectional
• 40000W Peak Pulse Power
capability on 10x1000 μs waveform
• Excellent clamping capability
• Repetition rate (duty cycle):0.05%
• Sharp breakdown voltage
• Low incremental surge resistance
• Fast response time: typically less
than 1.0 ps from 0 volts to BV
See Demensions on Page 4
• Typical IR less than 20μA above 10V
• Operation Tempature: -55°C to +150°C
MECHANICAL DATA
Terminals: Ag Plated Axial leads, solderable per
MIL-STD-750, Method 2026
Mounting Position: Any
Weight: 1.490 ± 0.149g (0.053 ± 0.005 ounces)
DEVICES FOR BIPOLAR APPLICATIONS
Bidirectional use CA Suffix. Electrical characteristics apply in both directions.
Unidirectional A Suffix available as a special order
MAXIMUM RATINGS AND CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified.
RATING
Peak Pulse Power Dissipation on 10/1000 μs
waveform
Peak Pulse Current of on 10-1000 μs waveform
SYMBOL
VALUE
UNITS
Pppm
Minimum 20000
Watts
Ippm
SEE CURVE
Amps
5/21/2009
MDE Semiconductor, Inc.
78-150 Calle Tampico, Unit 210, La Quinta, CA. U.S.A. Tel: 760-564-8656 • Fax 760-564-2414
1-800-831-4881 Email: [email protected] Web: www.mdesemiconductor.com
MAX- 40™ Series
PART NUMBER
Cell
Count
MAX40-12CA
MAX40-13CA
MAX40-14CA
MAX40-15CA
MAX40-16CA
MAX40-17CA
MAX40-18CA
MAX40-20CA
MAX40-22CA
MAX40-24CA
MAX40-26CA
MAX40-28CA
MAX40-30CA
MAX40-33CA
MAX40-36CA
MAX40-40CA
MAX40-43CA
MAX40-45CA
MAX40-48CA
MAX40-51CA
MAX40-54CA
MAX40-58CA
MAX40-60CA
MAX40-64CA
MAX40-70CA
MAX40-75CA
MAX40-78CA
MAX40-85CA
MAX40-90CA
MAX40-100CA
MAX40-110CA
MAX40-120CA
MAX40-130CA
MAX40-150CA
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
3
3
3
3
3
4
4
4
4
4
4
6
6
6
6
6
6
8
REVERSE
STANDOFF
VOLTAGE
VRWM(V)
12
13
14
15
16
17
18
20
22
24
26
28
30
33
36
40
43
45
48
51
54
58
60
64
70
75
78
85
90
100
110
120
130
150
BREAKDOWN
TEST
PEAK
VOLTAGE
CURRENT
PULSE
VBR(V)
IT
CURRENT
MIN. @IT
Ipp (A)
(mA)
14.0
15.2
16.4
17.6
18.8
19.9
21.1
23.4
25.7
28.1
30.4
32.8
35.1
38.7
42.1
46.8
50.3
52.7
56.1
59.7
63.2
67.8
70.2
74.9
81.9
87.7
91.3
99.2
105.5
117.0
128.5
140.0
151.5
176.0
50
50
50
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
2010.1
1860.5
1724.1
1639.3
1538.5
1449.3
1369.6
1234.6
1126.8
1028.3
950.1
881.1
826.4
750.5
688.5
620.2
576.4
550.2
516.8
485.4
459.2
427.4
413.2
388.3
354.0
330.6
317.5
292.0
274.0
246.9
226.0
207.3
191.4
164.6
REVERSE
LEAKAGE
@ VRWM
IR(μA)
MAXIMUM
CLAMPING
VOLTAGE
@IPP VC (V)
2000
2000
2000
500
200
50
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
19.9
21.5
23.2
24.4
26.0
27.6
29.2
32.4
35.5
38.9
42.1
45.4
48.4
53.3
58.1
64.5
69.4
72.7
77.4
82.4
87.1
93.6
96.8
103.0
113.0
121.0
126.0
137.0
145
162
177
193
209
243
5/21/2009
KW
MAX-40
Rating Charactistic Curves
PEAK PULSE1
10000
Non-repetitive pulse
waveform shown in
Fig. 3T A = 25ºC
1000
100
1
0.1
1
10
100
1,000
10,000
100,000
td PULSE WIDTH 1 µsec
FIG. 1 PEAK PULSE POWER RATING
Fig.2 - Pulse Derating Curve
Peak Pulse Power (PPP)
or Current (IPP)
Derating in Percentage,%
100
87.5
75
62.5
50
37.5
25
12.5
0
0
25
50
75
100
125
150
175
200
TA - Ambient Temperature (°C)
150
IPPM - Peak Pulse Current,% IRSM
Pppm
1
10
TJ = 25°C
Pulse Width(td)is defined
as the point where the
peak current decays to
50% of IPPM
tr = 10μsec.
Peak Value
IPPM
100
Half Value- I PPM
2
10/1000μsec.Waveform
as defined by R.E.A.
50
td
0
0
1.0
2.0
3.0
3.0
4.0
4.0
t - Time(ms)
Fig.3 - Pulse Waveform
5/21/2009
MDE Semiconductor, Inc.
78-150 Calle Tampico, Unit 210, La Quinta, CA, U.S.A. Tel: 760-564-8656 • Fax 760-564-2414
1-800-831-4881 Email: [email protected] Web: www.mdesemiconductor.com
MAX™ 40 Series
Outline Dimensions
Stack 3 chip
Stack 2 chip
0.162±0.00984
(4.12±0.25)
0.131±0.00984
(3.33±0.25)
0.54 Max
(13.72Max)
0.54 Max
(13.72Ma)x
0.264 Max
(6.7Max)
0.886 Min
(22.5Min)
0.264 Max
(6.7Max)
0.866 Min
(22Min)
0.049±0.002
(1.25±0.05)
0.049±0.002
(1.25±0.05)
0.489±0.028
(12.42±0.71)
0.442±0.028
(11.22±0.71)
Stack 6 chip
Stack 4 chip
0.252±0.00984
(6.41±0.25)
0.192±0.00984
(4.88±0.25)
0.54 Max
(13.72Max)
UNIT: Inch
(mm)
0.264 Max
(6.7Max)
0.54 Max
(13.72Max)
0.264 Max
(6.7Max)
0.838 Min
(21.3Min)
0.838 Min
(21.3Min)
0.049±0.002
(1.25±0.05)
0.049±0.002
(1.25±0.05)
0.579±0.028
(14.71±0.71)
0.519±0.028
(13.18±0.71)
Stack 8 chip
0.36±0.018
(9.10±0.46)
0.54 Max
(13.72Max)
0.29 Max
(7.35Max)
0.787 Min
(20.0Min)
0.049±0.002
(1.25±0.05)
0.65±0.032
(16.50±0.83)
5/21/2009
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