MURS205T3G, SURS8205T3G, MURS210T3G, SURS8210T3G Surface Mount Ultrafast Power Rectifiers Ideally suited for high voltage, high frequency rectification, or as free wheeling and protection diodes in surface mount applications where compact size and weight are critical to the system. http://onsemi.com ULTRAFAST RECTIFIERS 2 AMPERES, 50−100 VOLTS Features Small Compact Surface Mountable Package with J−Bend Leads Rectangular Package for Automated Handling High Temperature Glass Passivated Junction Low Forward Voltage Drop (0.74 V Max @ 2.0 A, TJ = 150C) AEC−Q101 Qualified and PPAP Capable SURS8 Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements These are Pb−Free Packages* SMB CASE 403A MARKING DIAGRAM Mechanical Characteristics: AYWW U2x G G Case: Epoxy, Molded Weight: 95 mg (Approximately) Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 260C Max. for 10 Seconds Polarity: Polarity Band Indicates Cathode Lead ESD Ratings: Machine Model = C (> 400 V) Human Body Model = 3A (> 4 kV) A Y WW U2x G = = = = Assembly Location Year Work Week Device Code x= A for MURS205T3G = B for MURS210T3G = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION Package Shipping† MURS205T3G SMB (Pb−Free) 2,500 Tape & Reel SURS8205T3G SMB (Pb−Free) 2,500 Tape & Reel MURS210T3G SMB (Pb−Free) 2,500 Tape & Reel SURS8210T3G SMB (Pb−Free) 2,500 Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Semiconductor Components Industries, LLC, 2012 January, 2012 − Rev. 2 1 Publication Order Number: MURS205T3/D MURS205T3G, SURS8205T3G, MURS210T3G, SURS8210T3G MAXIMUM RATINGS Rating Symbol Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage MURA205T3G, SURS8205T3G MURA210T3G, SURS8210T3G VRRM VRWM VR Average Rectified Forward Current @ TL = 150C @ TL = 125C IF(AV) Non-Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) IFSM Operating Junction Temperature TJ Value Unit V 50 100 1.0 2.0 50 −60 to +175 A A C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. THERMAL CHARACTERISTICS Characteristic Thermal Resistance, Junction−to−Lead (TL = 25C) Symbol Max Unit RqJL 13 C/W ELECTRICAL CHARACTERISTICS Characteristic Symbol Maximum Instantaneous Forward Voltage (Note 1) (iF = 2.0 A, TJ = 25C) (iF = 2.0 A, TJ = 150C) vF Maximum Instantaneous Reverse Current (Note 1) (Rated dc Voltage, TJ = 25C) (Rated dc Voltage, TJ = 150C) iR Maximum Reverse Recovery Time (iF = 1.0 A, di/dt = 50 A/ms) (iF = 0.5 A, iR = 1.0 A, IR to 0.25 A) trr Maximum Forward Recovery Time (iF = 1.0 A, di/dt = 100 A/ms, Rec. to 1.0 V) tfr 1. Pulse Test: Pulse Width = 300 ms, Duty Cycle 2.0%. http://onsemi.com 2 Value 0.94 0.74 2.0 50 30 20 20 Unit V mA ns ns 10 10 7.0 7.0 5.0 5.0 3.0 3.0 175C 2.0 100C 1.0 0.7 0.5 25C 0.3 0.2 0.1 0.07 100C 1.0 0.7 0.5 TC = 25C 0.3 0.2 0.1 0.07 0.05 0.05 0.03 0.03 0.02 0.02 0.01 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 175C 2.0 IF, INSTANTANEOUS FORWARD CURRENT (mA) IF, INSTANTANEOUS FORWARD CURRENT (AMPS) MURS205T3G, SURS8205T3G, MURS210T3G, SURS8210T3G 0.01 0.3 1.1 vF, INSTANTANEOUS VOLTAGE (VOLTS) 0.6 0.7 0.8 0.9 1 1.1 Figure 2. Maximum Forward Voltage 100 100 IR, REVERSE CURRENT (mA) IR, REVERSE CURRENT (mA) 0.5 vF, INSTANTANEOUS VOLTAGE (VOLTS) Figure 1. Typical Forward Voltage TJ = 175C 10 1 TJ = 100C TJ = 25C 0.1 0.01 0.4 0 20 40 60 80 TJ = 175C 10 TJ = 100C 1 0.1 0.01 100 TJ = 25C VR, REVERSE VOLTAGE (VOLTS) 0 20 40 60 80 VR, REVERSE VOLTAGE (VOLTS) Figure 3. Typical Reverse Current* Figure 4. Maximum Reverse Current* * The curves shown are typical for the highest voltage device in the voltage grouping. Typical reverse current for lower voltage selections can be estimated from these same curves if applied VR is sufficiently below rated VR. http://onsemi.com 3 100 MURS205T3G, SURS8205T3G, MURS210T3G, SURS8210T3G 50 40 35 30 25 20 15 10 0 4 8 12 16 20 24 28 32 36 30 25 20 15 10 0 40 8 7 6 dc 4 3 2 SQUARE WAVE 90 12 16 20 24 28 32 VR, REVERSE VOLTAGE (VOLTS) 9 0 80 8 Figure 6. Maximum Capacitance RATED VOLTAGE APPLIED RqJC = 13C/W TJ = 175C 1 4 Figure 5. Typical Capacitance 10 5 0 VR, REVERSE VOLTAGE (VOLTS) PF, AVERAGE POWER DISSIPATION (WATTS) IF(AV), AVERAGE FORWARD CURRENT (AMPS) 40 35 5 5 0 NOTE: MAXIMUM CAPACITANCE AT 0 V = 47 V 45 C, CAPACITANCE (pF) 45 C, CAPACITANCE (pF) 50 NOTE: TYPICAL CAPACITANCE AT 0 V = 44 V 100 110 120 130 140 150 160 170 180 36 4 3.5 TJ = 175C 3 2.5 2 SQUARE WAVE 1.5 1 dc 0.5 0 0 TC, CASE TEMPERATURE (C) 0.5 1 1.5 2 IF(AV), AVERAGE FORWARD CURRENT (AMPS) Figure 8. Power Dissipation Figure 7. Current Derating, Case http://onsemi.com 4 40 2.5 MURS205T3G, SURS8205T3G, MURS210T3G, SURS8210T3G PACKAGE DIMENSIONS SMB CASE 403A−03 ISSUE H HE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P. E b DIM A A1 b c D E HE L L1 D POLARITY INDICATOR OPTIONAL AS NEEDED MIN 1.90 0.05 1.96 0.15 3.30 4.06 5.21 0.76 MILLIMETERS NOM MAX 2.20 2.28 0.10 0.19 2.03 2.20 0.23 0.31 3.56 3.95 4.32 4.60 5.44 5.60 1.02 1.60 0.51 REF MIN 0.075 0.002 0.077 0.006 0.130 0.160 0.205 0.030 INCHES NOM 0.087 0.004 0.080 0.009 0.140 0.170 0.214 0.040 0.020 REF MAX 0.090 0.007 0.087 0.012 0.156 0.181 0.220 0.063 A L L1 A1 c SOLDERING FOOTPRINT* 2.261 0.089 2.743 0.108 2.159 0.085 SCALE 8:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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