AVAGO HLMP-RD11-LP000 4 mm super oval precision optical performance alingap and ingan led Datasheet

HLMP-RG10
4 mm Super Oval Precision Optical Performance
AlInGaP and InGaN LEDs
Data Sheet
SunPower Series
HLMP-RG10, HLMP-SG10, HLMP-RL10, HLMP-SL10,
HLMP-RD11, HLMP-SD11, HLMP-RL11, HLMP-SL11,
HLMP-RM11, HLMP-SM11, HLMP-RB11, HLMP-SB11
Description
These Precision Optical Performance Oval LEDs are
specifically designed for Full Color/Video and
Passenger Information signs. The oval shaped
radiation pattern (60° x 120°) and high luminous
intensity ensure that these devices are excellent for
wide field of view outdoor applications where a wide
viewing angle and readability in sunlight are essential.
These lamps have very smooth, matched radiation
patterns ensuring consistent color mixing in full color
applications, message uniformity across the viewing
angle of the sign.
High efficiency LED materials are used in these lamps:
Aluminum Indium Gallium Phosphide (AlInGaP) for
Red and Amber color and Indium Gallium Nitride
(InGaN) for Blue and Green. There are two families
of red and amber lamps, AlInGaP and the higher
performance AlInGaP II. Each lamp is made with an
advanced optical grade epoxy offering superior high
temperature and high moisture resistance in outdoor
applications. The package epoxy contains both uv-a
and uv-b inhibitors to reduce the effects of long term
exposure to direct sunlight.
Designers can select parallel (where the axis of the
leads is parallel to the wide axis of the oval radiation
pattern) or perpendicular orientation. Both lamps are
available in tinted version.
Features
• Well defined spatial radiation pattern
• Viewing angle:
major axis 120°
minor axis 60°
• High luminous output
• Two red and amber intensity levels:
AlInGaP (bright) and AlInGaP II (brightest)
• Colors:
626/630 nm red
590/592 nm amber526 nm green
470 nm blue
• Superior resistance to moisture
• UV resistant epoxy
Benefits
• Viewing angle designed for wide field of view
applications
• Superior performance for outdoor environments
• Radiation pattern matched for red, green, and blue for
full color sign
Applications
• Full color signs
CAUTION: The Blue and Green LEDs are Class 1 ESD sensitive. Please observe appropriate
precautions during handling and processing. Refer to Avago Technologies Application Note AN-1142
for additional details.
Package Dimensions
21.0 MIN.
(0.827)
9.50 ± 0.50
(0.374 ± 0.007)
A
∅
4.0 ± 0.20
(0.157 ± 0.008)
1.0 MIN.
(0.039)
6.30 ± 0.20
(0.248 ± 0.008)
1.25 ± 0.20
(0.049 ± 0.008)
CATHODE
LEAD
0.44 ± 0.20
(0.017 ± 0.008)
2.54 ± 0.30
(0.100 ± 0.012)
0.80 MAX. EPOXY MENISCUS
(0.016)
+0.10
0.45 –0.04
+0.10
0.40 –0
+0.004
(0.018 –0.002)
+0.004
(0.016 –0.000)
21.0 MIN.
(0.827)
9.50 ± 0.50
(0.374 ± 0.007)
B
∅
4.0 ± 0.20
(0.157 ± 0.008)
1.0 MIN.
(0.039)
6.30 ± 0.20
(0.248 ± 0.008)
1.25 ± 0.20
(0.049 ± 0.008)
CATHODE
LEAD
0.44 ± 0.20
(0.017 ± 0.008)
2.54 ± 0.30
(0.100 ± 0.012)
0.80 MAX. EPOXY MENISCUS
(0.016)
+0.10
0.45 –0.04
+0.10
0.40 –0
+0.004
(0.018 –0.002)
+0.004
(0.016 –0.000)
DIMENSIONS ARE IN MILLIMETERS (INCHES).
Device Selection Guide for AlInGaP
Part Number
Color and
Dominant
Wavelength
λd (nm) Typ.
Luminous
Intensity
IV (mcd) at 20 mA
Min.
Max.
Leads with
Stand-Offs
Leadframe
Orientation
Package
Drawing
HLMP-SG10-JM000
Red 626
240
680
Yes
Perpendicular
A
HLMP-RG10-JM000
Red 626
240
680
Yes
Parallel
B
HLMP-SL10-LP0xx
Amber 590
400
1150
Yes
Perpendicular
A
HLMP-RL10-LP0xx
Amber 590
400
1150
Yes
Parallel
B
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package.
2. The optical axis is closely aligned with the package mechanical axis.
3. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
2
Device Selection Guide for AlInGaP II
Part Number
Color and
Dominant
Wavelength
λd (nm) Typ.
Luminous
Intensity
IV (mcd) at 20 mA
Min.
Max.
Leads with
Stand-Offs
Leadframe
Orientation
Package
Drawing
HLMP-RD11-J0000
Red 630
240
-
Yes
Parallel
B
HLMP-RD11-LP000
Red 630
400
1150
Yes
Parallel
B
HLMP-RD11-LPT00
Red 630
400
1150
Yes
Parallel
B
HLMP-RL11-H0000
Amber 592
180
-
Yes
Parallel
B
HLMP-RL11-LP000
Amber 592
400
1150
Yes
Parallel
B
HLMP-RL11-LPRxx
Amber 592
400
1150
Yes
Parallel
B
HLMP-SD11-J0000
Red 630
240
-
Yes
Perpendicular
A
HLMP-SD11-LP000
Red 630
400
1150
Yes
Perpendicular
A
HLMP-SD11-LPT00
Red 630
400
1150
Yes
Perpendicular
A
HLMP-SD11-MN0xx
Red 630
520
880
Yes
Perpendicular
A
HLMP-SD11-MNTxx
Red 630
520
880
Yes
Perpendicular
A
HLMP-SL11-H0000
Amber 592
180
-
Yes
Perpendicular
A
HLMP-SL11-HL0xx
Amber 592
180
520
Yes
Perpendicular
A
HLMP-SL11-KN0xx
Amber 592
310
880
Yes
Perpendicular
A
HLMP-SL11-LP0xx
Amber 592
400
1150
Yes
Perpendicular
A
HLMP-SL11-LPRxx
Amber 592
400
1150
Yes
Perpendicular
A
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package.
2. The optical axis is closely aligned with the package mechanical axis.
3. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
Device Selection Guide for InGaN
Part Number
Color and
Dominant
Wavelength
λd (nm) Typ.
Luminous
Intensity
IV (mcd) at 20 mA
Min.
Max.
Leads with
Stand-Offs
Leadframe
Orientation
Package
Drawing
HLMP-SM11-LP0xx
Green 526
400
1150
Yes
Perpendicular
A
HLMP-RM11-H00xx
Green 526
180
-
Yes
Parallel
B
HLMP-RM11-M00xx
Green 526
520
-
Yes
Parallel
B
HLMP-SB11-H00xx
Blue 470
180
-
Yes
Perpendicular
A
HLMP-RB11-D00xx
Blue 470
65
-
Yes
Parallel
B
HLMP-RB11-H00xx
Blue 470
180
-
Yes
Parallel
B
Notes:
4. The luminous intensity is measured on the mechanical axis of the lamp package.
5. The optical axis is closely aligned with the package mechanical axis.
6. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
3
Part Numbering System
HLMP - x x xx - x x x xx
Mechanical Options
00: Bulk Packaging
DD: Ammo Pack
YY: Flexi-Bin; Bulk Packaging
ZZ: Flexi-Bin; Ammo Pack
Color Bin & VF Selections
0: No Color Bin Limitation
R: Amber Color Bins 1, 2, 4, and 6 with VF Maximum of 2.6 V
T: Red Color with VF Maximum of 2.6 V
Maximum Intensity Bin
0: No Iv Bin Limitation
Minimum Intensity Bin
Refer to Device Selection Guide
Color
B: 470 nm Blue
D: 630 nm Red
G: 626 nm Red
L: 590/592 nm Amber
M: 526 nm Green
Package
R: 4 mm 60º x 120º Oval, Parallel
S: 4 mm 60º x 120º Oval, Perpendicular
Absolute Maximum Ratings
TA = 25°C
Parameter
Blue and Green
Amber and Red
30 mA
50 mA
Peak Pulsed Forward Current
100 mA
100 mA
Average Forward Current
30 mA
30 mA
Reverse Voltage (IR = 100 µA)
5V
5V
Power Dissipation
120 mW
120 mW
LED Junction Temperature
130°C
130°C
Operating Temperature Range
–40°C to +80°C
–40°C to +100°C
Storage Temperature Range
–40°C to +100°C
–40°C to +120°C
DC Forward
Current[1]
Note:
1. Derate linearly as shown in Figures 6 and 7.
4
Electrical/Optical Characteristics
TA = 25°C
Parameter
Typical Viewing Angle[1]
Major
Minor
Symbol
2θ1/2
Forward Voltage
Red (λd = 626 nm)
Red (λd = 630 nm)
Amber (λd = 590 nm)
Amber (λd = 592 nm)
Blue (λd = 470 nm)
Green (λd = 526 nm)
Reverse Voltage
Amber and Red
Blue and Green
Peak Wavelength
Red (λd = 626 nm)
Red (λd = 630 nm)
Amber (λd = 590 nm)
Amber (λd = 592 nm)
VF
LED Indicators
Parameter
Blue (λd = 470 nm)
Green (λd = 526 nm)
Spectral Halfwidth
Red (λd = 626/630 nm)
Amber (λd = 590/592 nm)
Blue (λd = 470 nm)
Green (λd = 526 nm)
Capacitance
All Colors
Thermal Resistance
All Colors
Luminous Efficacy[3]
Red (λd = 626 nm)
Red (λd = 630 nm)
Amber (λd = 590 nm)
Amber (λd = 592 nm)
Blue (λd = 470 nm)
Green (λd = 526 nm)
Min.
Typ.
Max.
Units
deg
Test Conditions
V
IF = 20 mA
V
IR = 100 µA
nm
Peak of Wavelength of
Spectral Distribution
at IF = 20 mA
Units
Test Conditions
nm
Wavelength Width at
Spectral Distribution
1/2 Power Point at I = 20 mA
F
pF
VF = 0, F = 1 MHz
°C/W
LED Junction-to-Cathode
Lead
Emitted Luminous Power/
Emitted Radiant Power
120
60
1.9
2.0
2.02
2.15
3.5
3.5
2.4
2.4[2]
2.4
2.4[2]
4.0
4.0
VR
5
5
20
–
λPEAK
635
639
592
594
Symbol
Min.
Typ.
467
524
∆λ1/2
Max.
17
17
20
35
C
40
RθJ-PIN
240
ηv
lm/W
150
155
480
500
70
540
Notes:
1. 2θ1/2 is the off-axis angle where the luminous intensity is the on-axis intensity.
2. For options -xxRxx, -xxTxx, and -xxVxx, maximum forward voltage, VF, is 2.6 V. Please refer to VF Bin Table below.
3. The radiant intensity, Ie, in watts per steradian, may be found from the equation Ie = Iv/ηv, where Iv is the luminous intensity in candelas and ηv is
the luminous efficacy in lumens/watt.
5
1.0
50
GREEN
AMBER
RED
IF – FORWARD CURRENT – mA
RELATIVE INTENSITY
BLUE
0.5
450
500
600
550
700
650
RED
30
20
AMBER
10
0
1.0
0
400
40
1.5
Figure 1. Relative intensity vs. wavelength.
2.5
20
15
10
5
0
2.0
2.8
2.4
3.2
3.6
2.0
1.5
1.0
0.5
0
4.0
VF – FORWARD VOLTAGE
30
Rθj-a = 780° C/W
20
10
0
20
40
60
80
100
TA – AMBIENT TEMPERATURE – °C
Figure 6. Amber, Red maximum forward
current vs. ambient temperature.
6
120
50
Rθj-a = 585° C/W
25
20
15
10
5
0
0
40
0
0
5
10
15
20
25
Figure 5. Blue, Green relative luminous
intensity vs. forward current.
50
Rθj-a = 585° C/W
30
20
Figure 4. Amber, Red relative luminous
intensity vs. forward current.
35
30
10
0.5
IF – FORWARD CURRENT – mA
60
40
0
1.0
IF – FORWARD CURRENT – mA
IF – FORWARD CURRENT – mA
IF – FORWARD CURRENT – mA
Figure 3. Blue, Green forward current vs.
forward voltage.
3.0
1.5
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
IF – FORWARD CURRENT
25
2.5
Figure 2. Amber, Red forward current vs.
forward voltage.
35
30
2.0
VF – FORWARD VOLTAGE – V
WAVELENGTH – nm
0
20
40
60
80
TA – AMBIENT TEMPERATURE – °C
Figure 7. Blue, Green maximum forward
current vs. ambient temperature.
100
30
1.0
Intensity Bin Limits
(mcd at 20 mA)
RELATIVE INTENSITY
0.8
0.6
0.4
0.2
0
-90
-75
-60
-45
-30
-15
0
15
30
45
60
75
90
ANGULAR DISPLACEMENT – DEGREES
Figure 8a. Representative spatial radiation pattern for major axis.
Bin Name
Min.
Max.
D
65
85
E
85
110
F
110
140
G
140
180
H
180
240
J
240
310
K
310
400
L
400
520
M
520
680
N
680
880
P
880
1150
Tolerance for each bin limit is ± 15%.
1.0
VF Bin Table[2]
RELATIVE INTENSITY
0.8
Bin Name
VA
VB
VC
0.6
0.4
Max.
2.2
2.4
2.6
Tolerance for each bin is ± 0.05 V.
0.2
0
-90
Min.
2.0
2.2
2.4
-75
-60
-45
-30
-15
0
15
30
45
60
75
90
ANGULAR DISPLACEMENT – DEGREES
Note:
1. Bin categories are established for
classification of products. Products may
not be available in all bin categories.
Figure 8b. Representative spatial radiation pattern for minor axis.
Color Bin Limits
(nm at 20 mA)
Blue
Color Range (nm)
Bin
Min.
Max.
1
460.0
464.0
2
464.0
468.0
3
468.0
472.0
4
472.0
476.0
5
476.0
480.0
Tolerance for each bin limit is ± 0.5 nm.
Green
Bin ID
1
2
3
4
5
Color Range (nm)
Min.
Max.
520.0
524.0
524.0
528.0
528.0
532.0
532.0
536.0
536.0
540.0
Amber
Bin ID
1
2
4
6
Color Range (nm)
Min.
Max.
584.5
587.0
587.0
589.5
589.5
592.0
592.0
594.5
Tolerance for each bin limit is ± 0.5 nm.
Tolerance for each bin limit is ± 0.5 nm.
Note:
1. All bin categories are established for
classification of products. Products may
not be available in all bin categories.
Please contact your Avago representatives for further information.
7
Precautions
Lead Forming
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering into PC board.
• If lead forming is required before soldering, care must
be taken to avoid any excessive mechanical stress
induced to LED package. Otherwise, cut the leads of
LED to length after soldering process at room
temperature. The solder joint formed will absorb the
mechanical stress of the lead cutting from traveling to
the LED chip die attach and wirebond.
• It is recommended that tooling made to precisely
form and cut the leads to length rather than rely upon
hand operation.
Soldering Conditions
• The closest LED is allowed to solder on board is 1.59
mm below the body (encapsulant epoxy) for those
parts without standoff.
• Recommended soldering conditions:
Pre-heat Temperature
Pre-heat Time
Peak Temperature
Dwell Time
TEMPERATURE – °C
Manual Solder
Dipping
–
–
260 °C Max.
5 sec Max.
LAMINAR WAVE
HOT AIR KNIFE
TURBULENT WAVE
250
• Proper handling is imperative to avoid excessive
thermal stresses to LED components when heated.
Therefore, the soldered PCB must be allowed to cool
to room temperature, 25°C, before handling.
• Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size
and component orientation to assure solderability.
LED Component
Lead Size
0.457 x 0.457 mm
(0.018 x 0.018 inch)
0.508 x 0.508 mm
(0.020 x 0.020 inch)
BOTTOM SIDE
OF PC BOARD
200
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150°C (100°C PCB)
SOLDER WAVE TEMPERATURE = 245°C
AIR KNIFE AIR TEMPERATURE = 390°C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40°
SOLDER: SN63; FLUX: RMA
150
FLUXING
100
0
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE EXERTING
MECHANICAL FORCE.
PREHEAT
10
20
30
40
50
60
70
80
TIME – SECONDS
Figure 9. Recommended wave soldering profile.
90
100
Diagonal
0.646 mm
(0.025 inch)
0.718 mm
(0.028 inch)
Plated Through
Hole Diameter
0.976 to 1.078 mm
(0.038 to 0.042 inch)
1.049 to 1.150 mm
(0.041 to 0.045 inch)
Note: Refer to application note AN1027 for more
information on soldering LED components.
TOP SIDE OF
PC BOARD
50
30
8
• If necessary, use fixture to hold the LED component
in proper orientation with respect to the PCB during
soldering process.
• Recommended PC board plated through hole sizes for
LED component leads:
• Care must be taken during PCB assembly and
soldering process to prevent damage to LED
component.
Wave Soldering
105 °C Max.
30 sec Max.
250 °C Max.
3 sec Max.
• Wave soldering parameter must be set and
maintained according to recommended temperature
and dwell time in the solder wave. Customer is
advised to periodically check on the soldering profile
to ensure the soldering profile used is always
conforming to recommended soldering condition.
For product information and a complete list of distributors, please go to our website:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.
Data subject to change. Copyright © 2006 Avago Technologies Limited. All rights reserved. Obsoletes 5989-2793EN
5989-4174EN May 21, 2006
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