Freescale MCZ145010EGR2 Photoelectric smoke detector ic with i/o Datasheet

Freescale Semiconductor
Technical Data
MC145010
Rev 7.0, 05/2006
Photoelectric Smoke
Detector IC with I/O
MC145010
The CMOS MC145010 is an advanced smoke detector component containing
sophisticated very-low-power analog and digital circuitry. The IC is used with an
infrared photoelectric chamber. Detection is accomplished by sensing scattered
light from minute smoke particles or other aerosols. When detection occurs, a
pulsating alarm is sounded via on-chip push-pull drivers and an external
piezoelectric transducer.
The variable-gain photo amplifier allows direct interface to IR detectors
(photodiodes). Two external capacitors, C1 and C2, C1 being the larger, determine
the gain settings. Low gain is selected by the IC during most of the standby state.
Medium gain is selected during a local-smoke condition. High gain is used during
push button test. During standby, the special monitor circuit which periodically
checks for degraded chamber sensitivity uses high gain, also.
The I/O pin, in combination with VSS, can be used to interconnect up to 40 units
for common signaling. An on-chip current sink provides noise immunity when the I/
O is an input. A local-smoke condition activates the short-circuit-protected I/O
driver, thereby signaling remote smoke to the interconnected units. Additionally, the
I/O pin can be used to activate escape lights, enable auxiliary or remote alarms,
and/or initiate auto-dialers.
While in standby, the low-supply detection circuitry conducts periodic checks
using a pulsed load current from the LED pin. The trip point is set using two external
resistors. The supply for the MC145010 can be a 9 V battery.
A visible LED flash accompanying a pulsating audible alarm indicates a localsmoke condition. A pulsating audible alarm with no LED flash indicates a remotesmoke condition. A beep or chirp occurring virtually simultaneously with an LED
flash indicates a low-supply condition. A beep occurring half-way between LED
flashes indicates degraded chamber sensitivity. A low-supply condition does not
affect the smoke detection capability if VDD ≥ 6 V. Therefore, the low-supply
condition and degraded chamber sensitivity can be further distinguished by
performing a push button (chamber) test.
Features
•
•
•
•
•
•
•
•
Circuit is designed to operate in smoke detector systems that comply with
UL217 and UL268 Specifications
Operating Voltage Range: 6 to 12 V
Operating Temperature Range: - 10 to 60°C
Average Supply Current: 12 µA
Power-On Reset Places IC in Standby Mode (Non-Alarm State)
Electrostatic Discharge (ESD) and Latch Up Protection Circuitry on All Pins
Chip Complexity: 2000 FETs, 12 NPNs, 16 Resistors, and 10 Capacitors
Ideal for battery powered applications.
ORDERING INFORMATION
Device
Temp. Range
MC145010P
MC145010ED
MC145010DW
MCZ145010EG/EGR2
Case No.
Package
648-08
16 Lead Plastic Dip
751G-04
16 Lead SOICW
-55 to +125°C
© Freescale Semiconductor, Inc., 2006. All rights reserved.
PHOTOELECTRIC SMOKE
DETECTOR IC WITH I/O
P SUFFIX
ED SUFFIX (PB-FREE)
PLASTIC DIP
CASE 648-08
DW SUFFIX
EG SUFFIX (PB-FREE)
SOICW
CASE 751G-04
C1
1
16
Test
C2
2
15
Detect
3
14
Low-Supply
Trip
VSS
Strobe
4
13
R1
VDD
5
12
OSC
IRED
6
11
LED
I/O
7
10
Feedback
Brass
8
9
Silver
Figure 1. Pin Connections
C1 C2
1 2
AMP
OSC
12
R1
Test
Gain
Zero
VDD - 3.5 V
REF
OSC
Gate
On/off
Strobe
4
Low-supply
Trip
15
Smoke
Gate
On/off
Timing
Logic
13
16
Comp
+
7
Alarm
Logic
Low Supply
3
Detect
Horn Modulator
And Driver
VDD - 5.0
VREF
I/O
8
9
Brass
Silver
10
6
Feedback
IRED
11
Comp
+
LED
PIN 5 = VDD
PIN 14 = VSS
Figure 2. Block Diagram
Table 1. Maximum Ratings(1)
(Voltages referenced to VSS)
Rating
Symbol
Value
Unit
DC Supply Voltage
VDD
-0.5 to +15
V
DC Input Voltage
C1, C2, Detect
OSC, Low-Supply Trip
I/O
Feedback
Test
VIN
DC Input Current per Pin
IIN
V
-0.25 to VDD +0.25
-0.25 to VDD +0.25
-0.25 to VDD +10
-15 to +25
-1.0 to VDD +0.25
±10
mA
DC Output Current per Pin
IOUT
±25
mA
DC Supply Current, VDD and VSS Pins
IDD
+25 / -150
mA
Power Dissipation in Still Air
5 Seconds
Continuous
PD
Storage Temperature Range
TSTG
-55 to +125
°C
TL
5.0
°C
Lead Temperature, 1 mm From Case for 10 Seconds
1200(2)
350(3)
mW
1. Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the limits
in the Electrical Characteristics tables.
2. Derating: -12 mW/°C from 25° to 60°C.
3. Derating -3.5 mW/°C from 25° to 60°C.
This device contains circuitry to protect the inputs against damage due to high static voltages or electric fields; however, it is advised normal
precautions be taken to avoid application of any voltage higher than maximum rated voltages to this high impedance circuit. For proper
operation, it is recommended VIN and VOUT be constrained to the range VSS ≤ (VIN or VOUT) ≤ VDD.
MC145010
2
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Freescale Semiconductor
Table 2. Electrical Characteristics
(TA = -10 to 60°C unless otherwise indicated. Voltages referenced to VSS.)
Symbol
VDD/VDC
Min
Typ
Max
Unit
Operating Voltage
VDD
—
6.0
—
12.0
V
Supply Threshold voltage, Low-Supply Alarm
Low-Supply Trip: VIN = VDD/3
VTH
—
6.5
—
7.8
Average Operating Supply Current (per Package)
Standby Configured per Figure 8
IDD
12.0
—
—
12.0
Peak Supply Current (per Package)
During Strobe ON, IRED OFF Configured per Figure 8
During Strobe ON, IRED ON Configured per Figure 8
iDD
12.0
12.0
—
—
—
—
2.0
3.0
Low-Level Input Voltage
I/O
Feedback
Test
VIL
9.0
9.0
9.0
—
—
—
—
—
—
1.5
2.7
7.0
High-Level Input Voltage
I/O
Feedback
Test
VIH
9.0
9.0
9.0
3.2
6.3
8.5
—
—
—
—
—
—
Input Current
OSC, Detect – VIN = VSS or VDD
Low-Supply Trip – VIN = VSS or VDD
Feedback – VIN = VSS or VDD
IIN
12.0
12.0
12.0
—
—
—
—
—
—
±100
±100
±100
Low -Level Input Current
Test – VIN = VSS or VDD
IIL
12.0
—
—
-1.0
Pull-Down Current
Test – VIN = VDD
I/O – No Local Smoke, VIN = VDD
I/O – No Local Smoke, VIN = 17 V
IIH
9.0
9.0
12.0
0.5
25.0
—
—
—
—
10
100
140
6.5
6.5
—
—
—
—
0.6
1.0
6.5
5.5
—
—
—
9.0
—
9.0
VDD – 0.1
VDD – 4.40
—
2.25(1)
—
VDD – 5.30
0.1
3.751
6.5
12.0
-4
—
—
-16
12.0
—
—
±1.0
—
VDD – 4
—
VDD – 2
—
VDD – 3.08
—
VDD – 3.92
Characteristics
Low-Level Output Voltage
LED – IOUT = 10 mA
Silver, Brass – IOUT = 16 mA
VOL
High-Level Output Voltage
Silver, Brass – IOUT = 16 mA
VOH
Output Voltage (For Line Regulations, See Pin Descriptions)
Strobe – Inactive, IOUT = -1 µA
Active, IOUT = 100 µA to 500 µA (Load Regulation)
IRED – Inactive, IOUT = 1 µA
Active, IOUT = 6 µA (Load Regulation)
VOUT
High-Level Output Current
I/O – Local Smoke, VOUT = 4.5 V
I/O – Local Smoke, VOUT = VSS (Short Circuit Current)
IOH
Off-State Output Leakage Current
LED – VOUT = VSS or VDD
IOZ
Common Mode
C1, C2, Detect, Voltage Range – Local Smoke, Push Button
Test, or Chamber Sensitivity Test
VIC
Smoke Comparator
Internal Reference Voltage – Local Smoke, Push Button
Test, or Chamber Sensitivity Test
VREF
V
µA
mA
V
V
nA
µA
µA
V
V
V
mA
ΧA
V
V
1. TA = 25°C only.
MC145010
Sensors
Freescale Semiconductor
3
Table 3. AC Electrical Characteristics
Reference Timing Diagram Figure 6 and Figure 7. (TA = 25°C, VDD = 9.0 V, Component values from Figure 8: R1 = 100.0 KΩ,
C3 = 1500.0 pF, R2 = 10.0 MΩ.)
No.
1
Characteristics
Oscillator Period(1)
Free-Running Sawtooth Measured at Pin 12
2
3
4
LED Pulse Period
No Local Smoke, and No Remote Smoke
Remote Smoke, but No Local Smoke
Local Smoke or Push Button Test
5
LED Pulse Width and Strobe Pulse Width
6
7
8
IRED Pulse Period
Smoke Test
Chamber Sensitivity Test without Local Smoke
Push Button Test
9
IRED Pulse Width
10
IRED Rise Time
IRED Fall Time
11
Silver and Brass Modulation Period
Local or Remote Smoke
Symbol
Clocks
Min
Max
Unit
1/fOSC
1
9.5
11.5
ms
4096
—
64
38.9
—
0.60
47.1
—
0.74
1
9.5
11.5
1024
4096
32
9.67
38.9
0.302
11.83
47.1
0.370
tw(IRED)
Tf1
94
116
µs
tr
tf
—
—
—
—
30
200
µs
—
297
363
—
73
77
4096
38.9
47.1
1
9.5
11.5
—
—
800
1024
4096
4096
—
9.67
38.9
38.9
0.302
11.83
47.1
47.1
0.370
tLED
tw(LED),
tw(STB)
tIRED
tMOD
11
12
Silver and Brass Duty Cycle
Local or Remote Smoke
13
Silver and Brass Chirp Pulse Period
Low Supply or Degraded Chamber Sensitivity
tCH
Silver and Brass Chirp Pulse Width
Low Supply or Degraded Chamber Sensitivity
tw(CH)
14
15
16
17
18
19
tON/tMOD
Rising Edge on I/O to Smoke Alarm Response Time
Remote Smoke, No Local Smoke
tRR
Strobe Out Pulse Period
Smoke Test
Chamber Sensitivity Test without Local Smoke
Low Supply Test without Local Smoke
Push Button Test
tSTB
s
ms
s
ms
%
s
ms
ms
s
1. Oscillator Period T (= Tr + Tf) is determined by the external components R1, R2, and C3 where Tr = (0.6931) R2 x C3 and
Tf = (0.6031) R1 x C3.
The other timing characteristics are some multiple of the oscillator timing shown in the table.
MC145010
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Freescale Semiconductor
Table 4. Pin Description
Pin
Symbol
Description
1
C1
A capacitor connected to this pin, shown in Figure 8, determines the gain of the on-chip photo amplifier during push button
test and chamber sensitivity test (high gain). The capacitor value is chosen such that the alarm is tripped from background
reflections in the chamber during push button test.
Av ª 1 + (C1/10) where C1 is in pF. CAUTION: The value of the closed-loop gain should not exceed 10,000.
2
C2
A capacitor connected to this pin as shown in Figure 8 determines the gain of the on-chip photo amplifier except during
push button or chamber sensitivity tests. Av ≈ 1 + (C2/10) where C2 is in pF. This gain increases about 10% during the
IRED pulse, after two consecutive local smoke detections.
Resistor R14 must be installed in series with C2. R14 ≈ [1/(12√C2)] - 680 where R14 is in ohms and C2 is in farads.
3
DETECT This input to the high-gain pulse amplifier is tied to the cathode of an external photodiodes. The photodiodes should have
low capacitance and low dark leakage current. The diode must be shunted by a load resistor and is operated at zero bias.
The Detect input must be ac/dc decoupled from all other signals, VDD, and VSS. Lead length and/or foil traces to this pin
must be minimized, also. See Figure 9.
4
STROBE This output provides a strobed, regulated voltage referenced to VDD. The temperature coefficient of this voltage is ± 0.2%/
°C maximum from - 10° to 60°C. The supply-voltage coefficient (line regulation) is ± 0.2%/V maximum from 6 to 12 V.
Strobe is tied to external resistor string R8, R9, and R10.
5
VDD
This pin is connected to the positive supply potential and may range from +6 to +12 V with respect to VSS. CAUTION: In
battery-powered applications, reverse-polarity protection must be provided externally.
6
IRED
This output provides pulsed base current for external NPN transistor Q1 used as the infrared emitter driver. Q1 must have
β ≥ 100. At 10 mA, the temperature coefficient of the output voltage is typically + 0.5%/°C from - 10° to 60°C. The supplyvoltage coefficient (line regulation) is ± 0.2%/V maximum from 6 to 12 V. The IRED pulse width (active-high) is determined
by external components R1 and C3. With a 100 kΩ/1500 pF combination, the nominal width is 105 µs. To minimize noise
impact, IRED is not active when the visible LED and horn outputs are active. IRED is active near the end of Strobe pulses
for Smoke Tests, Chamber Sensitivity Test, and Push button Test.
7
I/O
This pin can be used to connect up to 40 units together in a wired-OR configuration for common signaling. VSS is used as
the return. An on-chip current sink minimizes noise pick up during non-smoke conditions and eliminates the need for an
external pull-down resistor to complete the wired-OR. Remote units at lower supply voltages do not draw excessive current
from a sending unit at a higher supply voltage.
I/O can also be used to activate escape lights, auxiliary alarms, remote alarms, and/or auto-dialers.
As an input, this pin feeds a positive-edge-triggered flip-flop whose output is sampled nominally every 625 ms during
standby (using the recommended component values). A local-smoke condition or the push button-test mode forces this
current-limited output to source current. All input signals are ignored when I/O is sourcing current. I/O is disabled by the
on-chip power-on reset to eliminate nuisance signaling during battery changes or system power-up. If unused, I/O must
be left unconnected.
8
BRASS
This half of the push-pull driver output is connected to the metal support electrode of a piezoelectric audio transducer and
to the horn-starting resistor. A continuous modulated tone from the transducer is a smoke alarm indicating either local or
remote smoke. A short beep or chirp is a trouble alarm indicating a low supply or degraded chamber sensitivity.
9
SILVER
This half of the push-pull driver output is connected to the ceramic electrode of a piezoelectric transducer and to the hornstarting capacitor.
10
FEEDBA This input is connected to both the feedback electrode of a self-resonating piezoelectric transducer and the horn-starting
CK
resistor and capacitor through current-limiting resistor R4. If unused, this pin must be tied to VSS or VDD.
11
LED
This active-low open-drain output directly drives an external visible LED at the pulse rates indicated below. The pulse width
is equal to the OSC period.
The load for the low-supply test is applied by this output. This low-supply test is non-coincident with the smoke tests,
chamber sensitivity test, push button test, or any alarm signals.
The LED also provides a visual indication of the detector status as follows, assuming the component values shown in
Figure 8: Standby (includes low-supply and chamber sensitivity tests) - Pulses every 43 seconds (nominal) Local Smoke
- Pulses every 0.67 seconds (nominal) Remote Smoke - No pulses
Push button Test - Pulses every 0.67 seconds (nominal)
12
OSC
This pin is used in conjunction with external resistor R2 (10 MΩ) to VDD and external capacitor C3 (1500 pF) to VDD to
form an oscillator with a nominal period of 10.5 ms.
13
R1
14
VSS
15
This pin is used in conjunction with resistor R1 (100 kΩ) to pin 12 and C3 (1500 pF, see pin 12 description) to determine
the IRED pulse width. With this RC combination, the nominal pulse width is 105 µs.
This pin is the negative supply potential and the return for the I/O pin. Pin 14 is usually tied to ground.
LOWThis pin is connected to an external voltage which determines the low-supply alarm threshold. The trip voltage is obtained
SUPPLY through a resistor divider connected between the VDD and LED pins. The low-supply alarm threshold voltage (in volts) ≈
TRIP
(5R7/R6) + 5 where R6 and R7 are in the same units.
MC145010
Sensors
Freescale Semiconductor
5
Table 4. Pin Description
(Continued)
Symbol
Description
16
TEST
This input has an on-chip pull-down device and is used to manually invoke a test mode. The Push Button Test mode is
initiated by a high level at pin 16 (usually depression of a S.P.S.T. normally-open push button switch to VDD). After one
oscillator cycle, IRED pulses approximately every 336 ms, regardless of the presence of smoke. Additionally, the amplifier
gain is increased by automatic selection of C1. Therefore, the background reflections in the smoke chamber may be
interpreted as smoke, generating a simulated-smoke condition. After the second IRED pulse, a successful test activates
the horn-driver and I/O circuits. The active I/O allows remote signaling for system testing. When the Push Button Test
switch is released, the Test input returns to VSS due to the on-chip pull-down device. After one oscillator cycle, the amplifier
gain returns to normal, thereby removing the simulated-smoke condition. After two additional IRED pulses, less than a
second, the IC exits the alarm mode and returns to standby timing.
AC Parameter (Normalized To 9.0 V Value)
Pin
1.04
1.02
Pulse width of IRED
1.00
Period or pulse width
of other parameters
0.98
0.96
6.0
7.0
8.0
9.0
10.0
VDD, Power Supply Voltage (V)
11.0
12.0
Figure 3. AC Characteristics vs. Supply
AC Parameter (Normalized To 25°C Value)
1.02
1.01
Pulse width of IRED
1.00
Period or pulse width
of other parameters
0.99
VDD = 9.0 V
0.98
-10
0
10
20
30
40
50
60
TA, Ambient Temperature (°C)
Figure 4. AC Characteristics vs. Temperature
Component Value (Normalized To
25°C Value)
1.03
1.02
1.01
10 MΩ Carbon composition
1.00
100 kΩ Metal Film
1500 pF Dipped MICA
0.99
0.98
-10
0
10
20
30
40
TA, Ambient Temperature (°C)
50
60
Note: These components were used to generate
Figure 3.
Figure 5. RC Component Variation Overtemperature
MC145010
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Freescale Semiconductor
Figure 6. Standby Timing Diagram
MC145010
Sensors
Freescale Semiconductor
7
16
6
Power-on
Reset
2
17
No Low Supply
Chamber Sensitivity OK
6
7
Notes: Numbers refer to the AC Electrical Characteristics Table.
Illustration is not to scale.
Silver, Brass
Enable
(Internal)
LED
(Pin 11)
Strobe
(Pin 4)
(Pin 6)
IRED
Smoke Test
(Internal)
Chamber Test
(Internal)
Low Supply Test
(Internal)
OSC
(Pin 12)
1
9
5
Chirps
Indicate
Low Supply
13
18
14
Chirps
Indicate
Degraded
Chamber
Sensitivity
13
Figure 7. Smoke Timing Diagram
MC145010
8
Sensors
Freescale Semiconductor
5
12
90%
10%
11
11
Local Smoke
(Remote Smoke = Don't Care)
5
6
10
Notes: Numbers refer to the AC Electrical Characteristics Table.
Illustration is not to scale.
No
Smoke
Silver, Brass
Enable (Internal)
I/O
(Pin 7)
LED
(Pin 11)
Strobe
(Pin 4)
IRED
(Pin 6)
Chamber Test
(Internal)
Low Supply Test
(Internal)
IRED
9
(As Output)
(Not Performed)
(Not Performed)
4
No Smoke
15
Pushbutton
Test
(As Output)
Remote Smoke
4
(No Local Smoke)
(As Input)
(No Pulses)
3
19
8
C1
0.047 µF
+
1 TO 22 µF
C4**
9.0 V
B1
D1
Reverse Polarity
Protection
Circuit
SW1
C2*
4700 pF
1
R6
100 k
R14
560 Ω
R8
8.2 k
2
R11 250 k
R9†
5.0 k
3
R10
4.7 k
D2
IR Detector
4
Low-supply 15
Trip
C2
VSS
Detect
MC145010
Strobe
R1
R7
47 k
14
13
R1
100 k
R12
1.0 k
C5
100 µF
Test
C1
Pushbutton
Test
16
D3
IR EMITTER
+
6
Q1
IR
CURRENT
To Other
MC145010(s),
Escape Light(S),
Auxiliary Alarm(S),
Remote Alarm(S),
And/or Auto-dialer
5
R13*
4.7 TO 22
7
8
VDD
OSC
IRED
LED
I/O
Brass
Feedback
Silver
12
R2
10 M
C3
1500 pF
D4
Visible
LED
R3
11
470
10
R4!
9
100 k
0.01 µF
C6 !
Horn
X1
2.2 M
R5 !
!Values for R4, R5, and C6 may differ depending on type of piezoelectric horn used.
* C2 and R13 are used for coarse sensitivity adjustment. Typical values are shown.
† R9 is for fine sensitivity adjustment (optional). If fixed resistors are used, R8 = 12 k, R10 is 5.6 k to 10 k, and R9 is eliminated.
When R9 is used, noise pickup is increased due to antenna effects. Shielding may be required.
**C4 should be 22 µF if B1 is a carbon battery. C4 could be reduced to 1 µF when an alkaline battery is used.
Figure 8. Typical Battery-Powered Application
CALIBRATION
To facilitate checking the sensitivity and calibrating smoke
detectors, the MC145010 can be placed in a calibration
mode. In this mode, certain device pins are controlled/
reconfigured as shown in Table 5. To place the part in the
calibration mode, pin 16 (Test) must be pulled below the VSS
pin with 100 µA continuously drawn out of the pin for at least
one cycle on the OSC pin. To exit this mode, the Test pin is
floated for at least one OSC cycle.
In the calibration mode, the IRED pulse happens at every
clock cycle and strobe is always on (active low). Also, Low
Battery and supervisory tests are disabled in this mode.
MC145010
Sensors
Freescale Semiconductor
9
Table 5. Configuration of Pins in the Calibration Mode
Description
Pin
Comment
I/O
7
Disabled as an output. Forcing this pin high places the photo amp output on pin 1 or 2, as determined by
Low-Supply Trip. The amp's output appears as pulses and is referenced to VDD.
Low-Supply Trip
15
If the I/O pin is high, pin 15 controls which gain capacitor is used. Low: normal gain, amp output on pin 1.
High: supervisory gain, amp output on pin 2.
Feedback
10
Driving this input high enables hysteresis (10% gain increase) in the photo amp; pin 15 must be low.
OSC
12
Driving this input high brings the internal clock high. Driving the input low brings the internal clock low. If
desired, the RC network for the oscillator may be left intact; this allows the oscillator to run similar to the
normal mode of operation.
Silver
9
This pin becomes the smoke comparator output. When the OSC pin is toggling, positive pulses indicate that
smoke has been detected. A static low level indicates no smoke.
Brass
8
This pin becomes the smoke integrator output. That is, two consecutive smoke detections are required for
ON (static high level) and two consecutive no-detections for “off” (static low level).
Do Not Run Any
Additional Traces
In This Region
C2
R14
C2
Pin 16
C1
Pin 1
R8
R11
MOUNTED IN
CHAMBER
Pin 9
R10
D2
Pin 8
NOTES:
Illustration is bottom view of layout using a Dip. Top view for SOIC layout is mirror image. Optional potentionmeter R9 is not illustrated.
Drawing is not to scale.
Leads on D2, R11, R8, and R10 and their associated traces must be kept as short as possible. This practice minimizes noise pick-up.
Pin 3 must be decoupled from all other traces.
Figure 9. Recommended PCB Layout
MC145010
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Freescale Semiconductor
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
-A16
9
1
8
B
F
C
L
S
SEATING
PLANE
-TK
H
G
D
M
J
16 PL
0.25 (0.010)
M
T A
STYLE 1:
PIN 1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
M
CATHODE
CATHODE
CATHODE
CATHODE
CATHODE
CATHODE
CATHODE
CATHODE
ANODE
ANODE
ANODE
ANODE
ANODE
ANODE
ANODE
ANODE
STYLE 2:
PIN 1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
INCHES
MILLIMETERS
MIN
MAX MIN MAX
0.740
0.770 18.80 19.55
0.250
0.270
6.35
6.85
0.145
0.175
3.69
4.44
0.015
0.021
0.39
0.53
0.040
0.70
1.02
1.77
0.100 BSC
2.54 BSC
0.050 BSC
1.27 BSC
0.008
0.015
0.21
0.38
0.110
0.130
2.80
3.30
0.295
0.305
7.50
7.74
0
10
0
10
0.020
0.040
0.51
1.01
DIM
A
B
C
D
F
G
H
J
K
L
M
S
COMMON DRAIN
COMMON DRAIN
COMMON DRAIN
COMMON DRAIN
COMMON DRAIN
COMMON DRAIN
COMMON DRAIN
COMMON DRAIN
GATE
SOURCE
GATE
SOURCE
GATE
SOURCE
GATE
SOURCE
CASE 648-08
ISSUE R
16-LEAD PLASTIC DIP
0.25
8X
PIN'S
NUMBER
M
B
A
10.55
10.05
2.65
2.35
0.25
0.10
16X
16
1
0.49
0.35
0.25
6
M
T A B
PIN 1 INDEX
14X
10.45
4 10.15
A
A
8
1.27
9
7.6
7.4
SEATING
PLANE
T
B
16X
0.1 T
5
0.75
0.25
X45˚
0.32
0.23
1.0
0.4
SECTION A-A
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
3. DATUMS A AND B TO BE DETERMINED AT THE
PLANE WHERE THE BOTTOM OF THE LEADS
EXIT THE PLASTIC BODY.
4. THIS DIMENSION DOES NOT INCLUDE MOLD
FLASH, PROTRUSION OR GATE BURRS. MOLD
FLASH, PROTRUSTION OR GATE BURRS SHALL
NOT EXCEED 0.15mm PER SIDE. THIS
DIMENSION IS DETERMINED AT THE PLANE
WHERE THE BOTTOM OF THE LEADS EXIT
THE PLASTIC BODY.
5. THIS DIMENSION DOES NOT INCLUDE
INTER-LEAD FLASH OR PROTRUSIONS.
INTER-LEAD FLASH AND PROTRUSIONS
SHALL NOT EXCEED 0.25mm PER SIDE. THIS
DIMENSION IS DETERMINED AT THE PLANE
WHERE THE BOTTOM OF THE LEADS EXIT
THE PLASTIC BODY.
6. THIS DIMENSION DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL NOT CAUSE
THE LEAD WIDTH TO EXCEED 0.62mm.
7˚
0˚
CASE 751G-04
ISSUE D
16-LEAD SOIC
MC145010
Sensors
Freescale Semiconductor
11
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MC145010
Rev. 7.0
04/2006
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