MICREL MIC5239

MIC5239
Micrel
MIC5239
Low Quiescent Current 500mA µCap LDO Regulator
Advance Information
General Description
Features
The MIC5239 is a low quiescent current, µCap low-dropout
regulator. With a maximum operating input voltage of 30V
and a quiescent current of 23µA, it is ideal for supplying keepalive power in systems with high-voltage batteries.
Capable of 500mA output, the MIC5239 has a dropout
voltage of only 350mV. It can provide high output current for
applications such as USB.
As a µCap LDO, the MIC5239 is stable with either a ceramic
or a tantalum output capacitor. It only requires a 3.3µF output
capacitor for stability.
The MIC5239 includes a logic compatible enable input and an
undervoltage error flag indicator. Other features of the
MIC5239 include thermal shutdown, current-limit, overvoltage shutdown, load-dump protection, reverse leakage protections, and reverse battery protection.
Available in the thermally enhanced SOIC-8, MSOP-8 and
SOT-223, the MIC5239 comes in fixed 3.0V and adjustable
voltages. For other output voltages, contact Micrel.
•
•
•
•
•
•
•
•
•
•
•
•
•
Ultra-low quiescent current (IQ = 23µA @IO = 100µA)
Continuious 500mA output current
Wide input range: 2.3V to 30V
Low dropout voltage:
350mV @500mA;
±1.0% initial output accuracy
Stable with ceramic or tantalum output capacitor
Logic compatible enable input
Low output voltage error flag indicator
Overcurrent protection
Thermal shutdown
Reverse-leakage protection
Reverse-battery protection
High-power SOIC-8, MSOP-8 and SOT-223 packages
Applications
• USB power supply
• Keep-alive supply in notebook and portable personal
computers
• Logic supply from high-voltage batteries
• Automotive electronics
• Battery-powered systems
Typical Application
MIC5239
IN
OUT
VIN
30V
EN
FLG
GROUND CURRENT (µA)
40
VOUT
3.0V/100µA
IGND = 23µA
GND
Regulator with Low IO and Low IQ
35
IOUT = 1mA
IOUT = 100µA
30
25
20
15
10
4
IOUT = 10µA
9
14
19
24
INPUT VOLTAGE (V)
29
Ground Current vs. Input Voltage
Micrel, Inc. • 1849 Fortune Drive • San Jose, CA 95131 • USA • tel + 1 (408) 944-0800 • fax + 1 (408) 944-0970 • http://www.micrel.com
January 2002
1
MIC5239
MIC5239
Micrel
Ordering Information
Part Number *
Voltage
Junction Temp. Range
Package
MIC5239-3.0BMM
3.0V
–40°C to +125°C
8-lead MSOP
MIC5239-3.0BS
3.0V
–40°C to +125°C
SOT-223
MIC5239-3.0BM
3.0V
–40°C to +125°C
8-lead SOIC
MIC5239BMM
ADJ
–40°C to +125°C
8-lead MSOP
MIC5239BM
ADJ
–40°C to +125°C
8-lead SOIC
Pin Configuration
EN 1
8 GND
EN 1
8 GND
FLG 2
7 GND
ADJ 2
7 GND
IN 3
6 GND
IN 3
6 GND
OUT 4
5 GND
OUT 4
5 GND
SOIC-8 (M)
MSOP-8 (MM)
(Fixed)
SOIC-8 (M)
MSOP-8 (MM)
(Adj.)
GND
TAB
1
IN
2
3
GND OUT
SOT-223 (S)
Pin Description
Pin Number
Pin Number
MSOP-8/SOIC-8
SOT-223
Pin Name
Pin Function
2 (Fixed)
-
FLG
Error FLAG (Output): Open-collector output is active low when the output is
out of regulation due to insufficient input voltage or excessive load. An
external pull-up resistor is required.
2 (Adj)
-
ADJ
Adjustable Feedback Input. Connect to voltage divider network.
3
1
IN
4
3
OUT
1
-
EN
5–8
2
GND
MIC5239
Power supply input.
Regulated Output
Enable (Input): Logic low = shutdown; logic high = enabled.
Ground: Pins 5, 6, 7, and 8 are internally connected in common via the
leadframe.
2
January 2002
MIC5239
Micrel
Absolute Maximum Ratings (Note 1)
Operating Ratings (Note 2)
Supply Voltage (VIN) ..................................... –20V to +32V
Enable Input Voltage (VEN) .......................... –0.3V to +32V
Power Dissipation (PD), Note 3 ............... Internally Limited
Junction Temperature (TJ) ....................... –40°C to +125°C
Storage Temperature (TS) ....................... –65°C to +150°C
Lead Temperature (soldering, 5 sec.) ....................... 260°C
ESD Rating, Note 4
Supply Voltage (VIN) ........................................ 2.3V to 30V
Enable Input Voltage (VEN) ................................. 0V to 30V
Junction Temperature (TJ) ....................... –40°C to +125°C
Package Thermal Resistance
MSOP (θJA) ......................................................... 80°C/W
SOT-223 (θJA) ..................................................... 50°C/W
Electrical Characteristics
VIN = VOUT + 1V; VEN ≥ 2.0V; IOUT = 100µA; TJ = 25°C, bold values indicate –40°C ≤ TJ ≤ +125°C; unless noted.
Symbol
Parameter
Conditions
VOUT
Output Voltage Accuracy
variation from nominal VOUT
∆VOUT/VOUT
Line Regulation
VIN = VOUT + 1V to 30V
∆VOUT/VOUT
Load Regulation
∆V
Dropout Voltage, Note 6
IGND
Ground Pin Current
Min
Typ
Max
Units
1
+2
%
%
0.06
0.5
%
IOUT = 100µA to 500mA, Note 5
0.5
1
%
IOUT = 100µA
50
IOUT = 150mA
260
IOUT = 500mA
350
VEN ≥ 2.0V, IOUT = 100µA
23
40
45
µA
µA
VEN ≥ 2.0V, IOUT = 150mA
1.3
5
mA
VEN ≥ 2.0V, IOUT = 500mA
8.5
15
mA
–1
–2
mV
350
400
mV
mV
mV
IGND(SHDN)
Ground Pin in Shutdown
VEN ≤ 0.6V, VIN = 30V
0.1
1
µA
ISC
Short Circuit Current
VOUT = 0V
850
1200
mA
en
Output Noise
10Hz to 100kHz, VOUT = 3.0V, CL = 3.3µF
160
µVrms
Low Threshold
% of VOUT
94
%
High Threshold
% of VOUT
95
%
VOL
FLAG Output Low Voltage
VIN = VOUT(nom) – 0.12VOUT, IOL = 200µA
150
mV
ILEAK
FLAG Output Leakage
VOH = 30V
0.1
µA
VIL
Input Low Voltage
regulator off
VIH
Input High Voltage
regulator on
2.0
IIN
Enable Input Current
VEN = 0.6V, regulator off
–1.0
–2.0
FLAG Output
VFLG
Enable Input
0.6
V
V
0.01
1.0
2.0
µA
µA
VEN = 2.0V, regulator on
0.15
1.0
2.0
µA
µA
VEN = 30V, regulator on
0.5
2.5
5.0
µA
µA
Note 1.
Exceeding the absolute maximum rating may damage the device.
Note 2.
The device is not guaranteed to function outside its operating rating.
Note 3:
The maximum allowable power dissipation of any TA (ambient temperature) is PD(max) = (TJ(max) – TA) ÷ θJA. Exceeding the maximum
allowable power dissipation will result in excessive die termperature, and the regulator will go into thermal shutdown. The θJA of the MIC5239x.xBMM (all versions) is 80°C/W, the MIC5239-x.xBM (all versions) is 63°C/W, and the MIC5239-x.xBS (all versions) is 50°C/W mounted on a
PC board (see “Thermal Characteristics” for further details).
January 2002
3
MIC5239
MIC5239
Micrel
Note 4.
Devices are ESD sensitive. Handling precautions recommended. Human body model, 1.5k in series with 100pF.
Note 5:
Regulation is measured at constant junction temperature using pulse testing with a low duty-cycle. Changes in output voltage due to heating
effects are covered by the specification for thermal regulation.
Note 6:
Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at 1.0V
differential.
MIC5239
4
January 2002
MIC5239
Micrel
Typical Characteristics (VO = 3V)
Power Supply
Rejection Ratio
450
DROPOUT VOLTAGE (mV)
ILOAD = 500mA
40
30
20
10
0
0.01
0.1
1
10
100
FREQUENCY (Hz)
350
300
250
200
150
100
50
0
0
1000
1.5
ILOAD = 500mA
1
0.5
6000
5000
4000
3000
2000
1000
0
0
Ground Pin Current
vs. Temperature
3
GROUND CURRENT (mA)
80
75
70
65
60
55
ILOAD = 10mA
50
-40 -20 0
VIN = 4V
GROUND CURRENT (µA)
2
GROUND CURRENT (µA)
100
Ground Pin Current
vs. Output Current
7000
0
0 0.5 1 1.5 2 2.5 3 3.5 4
INPUT VOLTAGE (V)
20 40 60 80 100 120
100 200 300 400 500
OUTPUT CURRENT (mA)
Ground Pin Current
vs. Temperature
2.9
2.8
2.5
2.4
2.3
2.2
2.1
2
-40 -20 0
20 40 60 80 100 120
TEMPERATURE (°C)
GROUND CURRENT (mA)
80
70
20
10
0
1.5
January 2002
IOUT = 100µA
IOUT = 10µA
2
2.5
3
3.5
INPUT VOLTAGE (V)
22
20
18
16
14
12
10
0
4
IOUT=500mA
6.4
IOUT = 250mA
2.4
0.4
1.5
100 200 300 400 500
OUTPUT CURRENT (µA)
Ground Pin Current
vs. Temperature
ILOAD = 500mA
9.5
9
8.5
8
7.5
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (°C)
40
8.4
4.4
VIN = 4V
VIN = 12V
Ground Pin Current
vs. Input Voltage
12.4
10.4
VIN = 30V
VIN = 24V
10
14.4
IOUT = 10mA
40
30
26
24
Ground Pin Current
vs. Input Voltage
Ground Pin Current
vs. Input Voltage
60
50 IOUT = 1mA
30
28
10.5
ILOAD = 250mA
2.7
2.6
TEMPERATURE (°C)
GROUND CURRENT (µA)
200
0
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (°C)
GROUND CURRENT (mA)
2.5 I
LOAD = 250mA
GROUND CURRENT (µA)
OUTPUT VOLTAGE (V)
ILOAD = 100µA
IOUT = 500mA
300
100 200 300 400 500
OUTPUT CURRENT (mA)
8000
Dropout Voltage
vs. Temperature
400
9000
3.5
100
90
500
Ground Pin Current
vs. Output Current
Dropout
Characteristics
3
600
400
GROUND CURRENT (µA)
PSRR (dB)
50
Dropout Voltage
vs. Output Current
DROPOUT VOLTAGE (mV)
60
2
2.5
3
3.5
INPUT VOLTAGE (V)
5
4
35
IOUT = 1mA
IOUT = 100µA
30
25
20
15
10
4
IOUT = 10µA
9
14
19
24
INPUT VOLTAGE (V)
29
MIC5239
MIC5239
Micrel
3.05
100
3.04
3.03
80
60
40
20
0
-20
VEN = 5V
RLOAD = 30Ω
-10
0
SUPPLY VOLTAGE (V)
Output Voltage
vs. Temperature
ILOAD = 100µA
3.02
3.01
3
2.99
2.98
2.97
2.96
2.95
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (°C)
10
SHORT CIRCUIT CURRENT (mA)
120
OUTPUT VOLTAGE (V)
INPUT CURRENT (mA)
Input Current
900
Short Circuit
Current
800
700
600
500
400
300
200
100
VIN = 4V
0
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (°C)
OUTPUT CURRENT OUTPUT VOLTAGE
(500mA/div.)
(500mV/div.)
Load Transient Response
500mA
0mA
VIN = 4V
VOUT = 3V
COUT = 4.7µF ceramic
TIME (400µs/div.)
MIC5239
6
January 2002
MIC5239
Micrel
Functional Diagram
IN
OUT
EN
ENABLE
FLAG
VREF
GND
Block Diagram - Fixed Voltages
OUT
IN
EN
R1
ENABLE
ADJ
R2
GND
Block Diagram - Adjustable Voltages
January 2002
7
MIC5239
MIC5239
Micrel
Error Detection Comparator Output
The FLAG pin is an open collector output which goes low
when the output voltage drops 5% below it’s internally programmed level. It senses conditions such as excessive load
(current limit), low input voltage, and over temperature conditions. Once the part is disabled via the enable input, the
error flag output is not valid. Overvoltage conditions are not
reflected in the error flag output. The error flag output is also
not valid for input voltages less than 2.3V.
The error output has a low voltage of 400mV at a current of
200µA. In order to minimize the drain on the source used for
the pull-up, a value of 200k to 1MΩ is suggested for the error
flag pull-up. This will guarantee a maximum low voltage of
0.4V for a 30V pull-up potential. An unused error flag can be
left unconnected.
Application Information
The MIC5239 provides all of the advantages of the MIC2950:
wide input voltage range, load dump (positive transients up to
60V), and reversed-battery protection, with the added advantages of reduced quiescent current and smaller package.
Additionally, when disabled, quiescent current is reduced to
0.1µA.
Enable
A low on the enable pin disables the part, forcing the quiescent current to less than 0.1µA. Thermal shutdown and the
error flag are not functional while the device is disabled. The
maximum enable bias current is 2µA for a 2.0V input. An open
collector pull-up resistor tied to the input voltage should be set
low enough to maintain 2V on the enable input. Figure 1
shows an open collector output driving the enable pin through
a 200k pull-up resistor tied to the input voltage.
In order to avoid output oscillations, slow transitions from low
to high should be avoided.
200k
VIN
5V
4.75V
Output
Voltage
VALID ERROR
Error FLAG
Output
Input
Voltage
VOUT
200k
FLG
GND
COUT
5V
1.3V
0V
Thermal Shutdown
The MIC5239 has integrated thermal protection. This feature
is only for protection purposes. The device should never be
intentionally operated near this temperature as this may have
detrimental effects on the life of the device. The thermal
shutdown may become inactive while the enable input is
transitioning a high to a low. When disabling the device via the
enable pin, transition from a high to low quickly. This will
insure that the output remains disabled in the event of a
thermal shutdown.
Current Limit
Figure 4 displays a method for reducing the steady state
short circuit current. The duration that the supply delivers
current is set by the time required for the error flag output to
discharge the 4.7µF capacitor tied to the enable pin. The off
time is set by the 200K resistor as it recharges the 4.7µF
capacitor, enabling the regulator. This circuit reduces the
short circuit current from 800mA to 40mA while allowing for
regulator restart once the short is removed.
Figure 1. Remote Enable
Input Capacitor
An input capacitor may be required when the device is not
near the source power supply or when supplied by a battery.
Small, surface mount, ceramic capacitors can be used for
bypassing. Larger values may be required if the source
supply has high ripple.
Output Capacitor
The MIC5239 has been designed to minimize the effect of the
output capacitor ESR on the closed loop stability. As a result,
ceramic or film capacitors can be used at the output. Figure 2
displays a range of ESR values for a 10µF capacitor. Virtually
any 10µF capacitor with an ESR less than 3.4Ω is sufficient
for stability over the entire input voltage range. Stability can
also be maintained throughout the specified load and line
conditions with 4.7µF film or ceramic capacitors.
OUTPUT CAPACITOR ESR (Ω)
NOT
VALID
Figure 3. Error FLAG Output Timing
SHUTDOWN
ENABLE
5
1N4148
4
200k
3
MIC5239
IN
OUT
VIN
5V
Stable Region
2
1
0
TJ = 25°C
VOUT = 10µF
5
10
15
SHUTDOWN
ENABLE
20
25
VERR
VOUT
200k
EN
FLG
GND
COUT
4.7µF
30
Figure 4. Remote Enable with Short-Circuit
Current Foldback
INPUT VOLTAGE (V)
Figure 2. Output Capacitor ESR
MIC5239
NOT
VALID
VERR
MIC5239
IN
OUT
EN
0V
8
January 2002
MIC5239
Micrel
Thermal Characteristics
The MIC5239 is a high input voltage device, intended to
provide 500mA of continuous output current in two very small
profile packages. The power MSOP-8 allow the device to
dissipate about 50% more power than their standard equivalents.
Power MSOP-8 Thermal Characteristics
400
300
200
0.25 0.50 0.75 1.00 1.25 1.50
POWER DISSIPATION (W)
Figure 6. Copper Area vs. Power-MSOP
Power Dissipation (∆
(∆TJA)
Figure 6 shows copper area versus power dissipation with
each trace corresponding to a different temperature rise
above ambient.
From these curves, the minimum area of copper necessary
for the part to operate safely can be determined. The maximum allowable temperature rise must be calculated to determine operation along which curve.
∆T = TJ(max) – TA(max)
TJ(max) = 125°C
TA(max) = maximum ambient operating temperature
For example, the maximum ambient temperature is 50°C, the
∆T is determined as follows:
∆T = 125°C – 50°C
∆T = 75°C
Using Figure 6, the minimum amount of required copper can
be determined based on the required power dissipation.
Power dissipation in a linear regulator is calculated as follows:
PD = (VIN – VOUT) IOUT + VIN · IGND
If we use a 3V output device and a 28V input at moderate
output current of 25mA, then our power dissipation is as
follows:
PD = (28V – 3V) × 25mA + 28V × 250µA
PD = 625mW + 7mW
PD = 632mW
From Figure 6, the minimum amount of copper required to
operate this application at a ∆T of 75°C is 110mm2.
Quick Method
Determine the power dissipation requirements for the design
along with the maximum ambient temperature at which the
device will be operated. Refer to Figure 7, which shows safe
operating curves for three different ambient temperatures:
25°C, 50°C and 85°C. From these curves, the minimum
amount of copper can be determined by knowing the maximum power dissipation required. If the maximum ambient
temperature is 50°C and the power dissipation is as above,
639mW, the curve in Figure 7 shows that the required area of
copper is 110mm2.
The θJA of this package is ideally 80°C/W, but it will vary
depending upon the availability of copper ground plane to
which it is attached.
θJA
ground plane
heat sink area
AMBIENT
printed circuit board
Figure 5. Thermal Resistance
Using the power MSOP-8 reduces the θJC dramatically and
allows the user to reduce θCA. The total thermal resistance,
θJA (junction-to-ambient thermal resistance) is the limitingfactor in calculating the maximum power dissipation capability of the device. Typically, the power MSOP-8 has a θJC of
80°C/W, this is significantly lower than the standard MSOP-8
which is typically 200°C/W. θCA is reduced because pins 5
through 8 can now be soldered directly to a ground plane
which significantly reduces the case-to-sink thermal resistance and sink to ambient thermal resistance.
Low-dropout linear regulators from Micrel are rated to a
maximum junction temperature of 125°C. It is important not
to exceed this maximum junction temperature during operation of the device. To prevent this maximum junction temperature from being exceeded, the appropriate ground plane heat
sink must be used.
January 2002
500
0
0
MSOP-8
θCA
600
100
One of the secrets of the MIC5239’s performance is its power
MSOP-8 package featuring half the thermal resistance of a
standard MSOP-8 package. Lower thermal resistance means
more output current or higher input voltage for a given
package size.
Lower thermal resistance is achieved by joining the four
ground leads with the die attach paddle to create a singlepiece electrical and thermal conductor. This concept has
been used by MOSFET manufacturers for years, proving
very reliable and cost effective for the user.
Thermal resistance consists of two main elements, θJC
(junction-to-case thermal resistance) and θCA (case-to-ambient thermal resistance). See Figure 5. θJC is the resistance
from the die to the leads of the package. θCA is the resistance
from the leads to the ambient air and it includes θCS (case-tosink thermal resistance) and θSA (sink-to-ambient thermal
resistance).
θJC
700
100°C
COPPER AREA (mm2)
800
40°C
50°C
55°C
65°C
75°C
85°C
900
9
MIC5239
MIC5239
Micrel
Power SOIC-8 Thermal Characteristics
900
COPPER AREA (mm2)
800
700
T = 125°C
J
85°C
The power-SOIC-8 package follows the same idea as the
power-MSOP-8 package, using four ground leads with the
die attach paddle to create a single-piece electrical and
thermal conductor, reducing thermal resistance and increasing power dissipation capability.
Quick Method
Determine the power dissipation requirements for the design
along with the maximum ambient temperature at which the
device will be operated. Refer to Figure 9, which shows safe
operating curves for three different ambient temperatures,
25°C, 50°C, and 85°C. From these curves, the minimum
amount of copper can be determined by knowing the maximum power dissipation required. If the maximum ambient
temperature is 50°C, and the power dissipation is 632mW,
the curve in Figure 9 shows that the required area of copper
is less than 100mm2,when using the power SOIC-8.
Adjustable Regulator Application
50°C 25°C
600
500
400
300
200
100
0
0
0.25 0.50 0.75 1.00 1.25 1.50
POWER DISSIPATION (W)
Figure 7. Copper Area vs. Power-MSOP
Power Dissipation (TA)
700
∆TJA =
100°C
COPPER AREA (mm2)
800
40°C
50°C
55°C
65°C
75°C
85°C
900
600
500
400
300
200
MIC5239BM/MM
100
0
0
VIN
0.25 0.50 0.75 1.00 1.25 1.50
POWER DISSIPATION (W)
2
4
3
IN
EN
ADJ
GND
Figure 8. Copper Area vs. Power-SOIC
∆TJA)
Power Dissipation (∆
VOUT
OUT
1
R1
1µF
R2
5-8
COPPER AREA (mm2)
900
800
TJ = 125°C
700
85°C
Figure 10. Adjustable Voltage Application
50°C 25°C
The MIC5239BM can be adjusted from 1.24V to 20V by using
two external resistors (Figure 10). The resistors set the output
voltage based on the following equation:
600
500
400
300
R1
)
R2
Where VREF = 1.23V.
Feeback resistor R2 should be no larger than 300kΩ.
VOUT = VREF (1 +
200
100
0
0
0.25 0.50 0.75 1.00 1.25 1.50
POWER DISSIPATION (W)
Figure 9. Copper Area vs. Power-SOIC
Power Dissipation (TA)
The same method of determining the heat sink area used for
the power-MSOP-8 can be applied directly to the powerSOIC-8. The same two curves showing power dissipation
versus copper area are reproduced for the power-SOIC-8
and they can be applied identically.
MIC5239
10
January 2002
MIC5239
Micrel
Package Information
3.15 (0.124)
2.90 (0.114)
CL
3.71 (0.146) 7.49 (0.295)
3.30 (0.130) 6.71 (0.264)
CL
2.41 (0.095)
2.21 (0.087)
1.04 (0.041)
0.85 (0.033)
4.7 (0.185)
4.5 (0.177)
0.10 (0.004)
0.02 (0.0008)
DIMENSIONS:
MM (INCH)
6.70 (0.264)
6.30 (0.248)
1.70 (0.067)
16°
1.52 (0.060)
10°
10°
MAX
0.38 (0.015)
0.25 (0.010)
0.84 (0.033)
0.64 (0.025)
0.91 (0.036) MIN
SOT-223 (S)
0.122 (3.10)
0.112 (2.84)
0.199 (5.05)
0.187 (4.74)
DIMENSIONS:
INCH (MM)
0.120 (3.05)
0.116 (2.95)
0.036 (0.90)
0.032 (0.81)
0.043 (1.09)
0.038 (0.97)
0.012 (0.30) R
0.012 (0.03)
0.0256 (0.65) TYP
0.008 (0.20)
0.004 (0.10)
5° MAX
0° MIN
0.007 (0.18)
0.005 (0.13)
0.012 (0.03) R
0.039 (0.99)
0.035 (0.89)
0.021 (0.53)
8-Lead MSOP (MM)
January 2002
11
MIC5239
MIC5239
Micrel
0.026 (0.65)
MAX)
PIN 1
0.157 (3.99)
0.150 (3.81)
DIMENSIONS:
INCHES (MM)
0.020 (0.51)
0.013 (0.33)
0.050 (1.27)
TYP
0.064 (1.63)
0.045 (1.14)
45°
0.0098 (0.249)
0.0040 (0.102)
0.197 (5.0)
0.189 (4.8)
0°–8°
SEATING
PLANE
0.010 (0.25)
0.007 (0.18)
0.050 (1.27)
0.016 (0.40)
0.244 (6.20)
0.228 (5.79)
8-Lead SOIC (M)
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TEL
USA
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other rights of third parties resulting from its use. No license is granted by implication or otherwise under any patent or patent right of Micrel Inc.
© 2002 Micrel Incorporated
MIC5239
12
January 2002