ON MC100EL11DTR2G 5.0 v ecl 1:2 differential fanout buffer Datasheet

MC10EL11, MC100EL11
5.0 VECL 1:2 Differential
Fanout Buffer
The MC10EL/100EL11 is a differential 1:2 fanout buffer. The device
is functionally similar to the E111 device but with higher performance
capabilities. The within-device skew and propagation delay is
significantly improved over the E111.
The differential inputs of the EL11 employ clamping circuitry to
maintain stability under open input conditions. If the inputs are left open
(pulled to VEE) the Q outputs will go LOW.
The 100 Series contains temperature compensation.
MARKING
DIAGRAMS*
8
8
Features
1
265 ps Propagation Delay
5 ps Skew Between Outputs
PECL Mode Operating Range: VCC = 4.2 V to 5.7 with VEE = 0 V
NECL Mode Operating Range: VCC = 0 V with VEE = −4.2 V to −5.7 V
Internal Input Pulldown Resistors
8
VCC
Q0
2
7
D
Q1
6
5
4
DFN8
MN SUFFIX
CASE 506AA
D
1
8
HL11
ALYWG
G
1
H = MC10
K = MC100
4Q = MC10
2E = MC100
A = Assembly Location
VEE
1
KL11
ALYWG
G
4
L
Y
W
M
G
1
4
= Wafer Lot
= Year
= Work Week
= Date Code
= Pb−Free Package
(Note: Microdot may be in either location)
*For additional marking information, refer to
Application Note AND8002/D.
Table 1. PIN DESCRIPTION
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
PIN
FUNCTION
D, D
Q0, Q0; Q1, Q1
VCC
VEE
EP
ECL Data Inputs
ECL Data Outputs
Positive Supply
Negative Supply
Exposed pad must be connected to a
sufficient thermal conduit. Electrically
connect to the most negative supply or
leave floating open.
December, 2006− Rev. 9
8
TSSOP−8
DT SUFFIX
CASE 948R
Figure 1. Logic Diagram and Pinout Assignment
© Semiconductor Components Industries, LLC, 2006
1
2E M G
G
1
KEL11
ALYW
G
1
1
Q0
3
SOIC−8
D SUFFIX
CASE 751
8
Pb−Free Packages are Available
Q1
8
HEL11
ALYW
G
4Q M G
G
•
•
•
•
•
•
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1
Publication Order Number:
MC10EL11/D
MC10EL11, MC100EL11
Table 2. ATTRIBUTES
Characteristics
Value
Internal Input Pulldown Resistor
75 KW
Internal Input Pullup Resistor
N/A
ESD Protection
Human Body Model
Machine Model
> 1 KV
> 100 V
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)
Flammability Rating
Level 1
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
Transistor Count
44
Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
1. For additional information, see Application Note AND8003/D.
Table 3. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Unit
VCC
PECL Mode Power Supply
VEE = 0 V
8
V
VEE
NECL Mode Power Supply
VCC = 0 V
−8
V
VI
PECL Mode Input Voltage
NECL Mode Input Voltage
VEE = 0 V
VCC = 0 V
6
−6
V
V
Iout
Output Current
Continuous
Surge
50
100
mA
mA
TA
Operating Temperature Range
−40 to +85
°C
Tstg
Storage Temperature Range
−65 to +150
°C
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
SOIC−8
SOIC−8
190
130
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
SOIC−8
41 to 44
°C/W
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
TSSOP−8
TSSOP−8
185
140
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
TSSOP−8
41 to 44 ± 5%
°C/W
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
DFN8
DFN8
129
84
°C/W
°C/W
Tsol
Wave Solder
<2 to 3 sec @ 248°C
<2 to 3 sec @ 260°C
265
265
°C
Pb
Pb−Free
VI VCC
VI VEE
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
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2
MC10EL11, MC100EL11
Table 4. 10EL SERIES PECL DC CHARACTERISTICS VCC = 5.0 V; VEE = 0.0 V (Note 2)
−40°C
Symbol
Characteristic
Min
25°C
Typ
Max
26
31
Min
85°C
Typ
Max
26
31
Min
Typ
Max
Unit
26
31
mA
IEE
Power Supply Current
VOH
Output HIGH Voltage (Note 3)
3920
4010
4110
4020
4105
4190
4090
4185
4280
mV
VOL
Output LOW Voltage (Note 3)
3050
3200
3350
3050
3210
3370
3050
3227
3405
mV
VIH
Input HIGH Voltage (Single−Ended)
3770
4110
3870
4190
3940
4280
mV
VIL
Input LOW Voltage (Single−Ended)
3050
3500
3050
3520
3050
3555
mV
VIHCMR
Input HIGH Voltage Common Mode
Range (Differential) (Note 4)
2.5
4.6
2.5
4.6
2.5
4.6
V
IIH
Input HIGH Current
150
mA
IIL
Input LOW Current
150
0.5
150
0.5
0.3
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
2. Input and output parameters vary 1:1 with VCC. VEE can vary +0.25 V / −0.5 V.
3. Outputs are terminated through a 50 W resistor to VCC − 2.0 V.
4. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal. Normal operation is obtained if the HIGH level falls within the specified range and the peak-to-peak voltage lies between VPPmin
and 1 V.
Table 5. 10EL SERIES NECL DC CHARACTERISTICS VCC = 0.0 V; VEE = −5.0 V (Note 5)
−40°C
Symbol
Characteristic
Min
25°C
Typ
Max
26
31
Min
85°C
Typ
Max
26
31
Min
Typ
Max
Unit
26
31
mA
IEE
Power Supply Current
VOH
Output HIGH Voltage (Note 6)
−1080
−990
−890
−980
−895
−810
−910
−815
−720
mV
VOL
Output LOW Voltage (Note 6)
−1950
−1800
−1650
−1950
−1790
−1630
−1950
−1773
−1595
mV
VIH
Input HIGH Voltage (Single−Ended)
−1230
−890
−1130
−810
−1060
−720
mV
VIL
Input LOW Voltage (Single−Ended)
−1950
−1500
−1950
−1480
−1950
−1445
mV
VIHCMR
Input HIGH Voltage Common Mode
Range (Differential) (Note 7)
−2.5
−0.4
−2.5
−0.4
−2.5
−0.4
V
IIH
Input HIGH Current
150
mA
IIL
Input LOW Current
150
0.5
150
0.5
0.3
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
5. Input and output parameters vary 1:1 with VCC. VEE can vary +0.25 V / −0.5 V.
6. Outputs are terminated through a 50 W resistor to VCC − 2.0 V.
7. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal. Normal operation is obtained if the HIGH level falls within the specified range and the peak-to-peak voltage lies between VPPmin
and 1 V.
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MC10EL11, MC100EL11
Table 6. 100EL SERIES PECL DC CHARACTERISTICS VCC = 5.0 V; VEE = 0.0 V (Note 8)
−40°C
Symbol
Characteristic
Min
25°C
Typ
Max
26
31
Min
85°C
Typ
Max
26
31
Min
Typ
Max
Unit
30
36
mA
IEE
Power Supply Current
VOH
Output HIGH Voltage (Note 9)
3915
3995
4120
3975
4045
4120
3975
4050
4120
mV
VOL
Output LOW Voltage (Note 9)
3170
3305
3445
3190
3295
3380
3190
3295
3380
mV
VIH
Input HIGH Voltage (Single−Ended)
3835
4120
3835
4120
3835
4120
mV
VIL
Input LOW Voltage (Single−Ended)
3190
3525
3190
3525
3190
3525
mV
VIHCMR
Input HIGH Voltage Common Mode
Range (Differential) (Note 10)
2.5
4.6
2.5
4.6
2.5
4.6
V
IIH
Input HIGH Current
150
mA
IIL
Input LOW Current
150
0.5
150
0.5
0.5
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
8. Input and output parameters vary 1:1 with VCC. VEE can vary +0.8 V / −0.5 V.
9. Outputs are terminated through a 50 W resistor to VCC − 2.0 V.
10. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal. Normal operation is obtained if the HIGH level falls within the specified range and the peak-to-peak voltage lies between VPPmin
and 1 V.
Table 7. 100EL SERIES NECL DC CHARACTERISTICS VCC = 0.0 V; VEE = −5.0 V (Note 11)
−40°C
Symbol
Characteristic
Min
25°C
Typ
Max
26
31
Min
85°C
Typ
Max
26
31
Min
Typ
Max
Unit
30
36
mA
IEE
Power Supply Current
VOH
Output HIGH Voltage (Note 12)
−1085
−1005
−880
−1025
−955
−880
−1025
−955
−880
mV
VOL
Output LOW Voltage (Note 12)
−1830
−1695
−1555
−1810
−1705
−1620
−1810
−1705
−1620
mV
VIH
Input HIGH Voltage (Single−Ended)
−1165
−880
−1165
−880
−1165
−880
mV
VIL
Input LOW Voltage (Single−Ended)
−1810
−1475
−1810
−1475
−1810
−1475
mV
VIHCMR
Input HIGH Voltage Common Mode
Range (Differential) (Note 13)
−2.5
−0.4
−2.5
−0.4
−2.5
−0.4
V
IIH
Input HIGH Current
150
mA
IIL
Input LOW Current
150
0.5
150
0.5
0.5
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
11. Input and output parameters vary 1:1 with VCC. VEE can vary +0.8 V / −0.5 V.
12. Outputs are terminated through a 50 W resistor to VCC − 2.0 V.
13. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal. Normal operation is obtained if the HIGH level falls within the specified range and the peak-to-peak voltage lies between VPPmin
and 1 V.
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MC10EL11, MC100EL11
Table 8. AC CHARACTERISTICS VCC = 5.0 V; VEE = 0.0 V or VCC = 0.0 V; VEE = −5.0 V (Note 14)
−40°C
Symbol
Characteristic
Min
fmax
Maximum Toggle Frequency
tPLH
tPHL
Propagation Delay to Output
tSKEW
Within-Device Skew (Note 15)
Duty Cycle Skew (Note 16)
tJITTER
Random Clock Jitter (RMS)
VPP
Input Swing (Note 17)
150
tr
tf
Output Rise/Fall Times Q
(20% − 80%)
100
Typ
25°C
Max
Min
85°C
Typ
Max
Min
Typ
Max
1.5
135
260
385
190
5
5
GHz
265
340
5
5
20
20
215
29*0
365
ps
5
5
20
20
ps
0.6
225
1000
150
350
100
Unit
ps
225
1000
150
350
100
225
1000
mV
350
ps
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
14. 10 Series: VEE can vary +0.25 V / −0.5 V.
100 Series: VEE can vary +0.8 V / −0.5 V.
15. Within-device skew defined as identical transitions on similar paths through a device.
16. Duty cycle skew is the difference between a tPLH and tPHL propagation delay through a device.
17. VPP(min) is minimum input swing for which AC parameters guaranteed. The device has a DC gain of ≈ 40.
Q
Zo = 50 W
D
Receiver
Device
Driver
Device
Q
D
Zo = 50 W
50 W
50 W
VTT
VTT = VCC − 3.0 V
Figure 2. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D − Termination of ECL Logic Devices.)
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5
MC10EL11, MC100EL11
ORDERING INFORMATION
Package
Shipping†
SOIC−8
98 Units / Rail
MC10EL11DG
SOIC−8
(Pb−Free)
98 Units / Rail
MC10EL11DR2
SOIC−8
2500 / Tape & Reel
MC10EL11DR2G
SOIC−8
(Pb−Free)
2500 / Tape & Reel
MC10EL11DT
TSSOP−8
100 Units / Rail
MC10EL11DTG
TSSOP−8
(Pb−Free)
100 Units / Rail
MC10EL11DTR2
TSSOP−8
2500 / Tape & Reel
MC10EL11DTR2G
TSSOP−8
(Pb−Free)
2500 / Tape & Reel
MC10EL11MNR4
TSSOP−8
2500 / Tape & Reel
MC10EL11MNR4G
TSSOP−8
(Pb−Free)
2500 / Tape & Reel
SOIC−8
98 Units / Rail
MC100EL11DG
SOIC−8
(Pb−Free)
98 Units / Rail
MC100EL11DR2
SOIC−8
2500 / Tape & Reel
MC100EL11DR2G
SOIC−8
(Pb−Free)
2500 / Tape & Reel
MC100EL11DT
TSSOP−8
100 Units / Rail
MC100EL11DTG
TSSOP−8
(Pb−Free)
100 Units / Rail
MC100EL11DTR2
TSSOP−8
2500 / Tape & Reel
MC100EL11DTR2G
TSSOP−8
(Pb−Free)
2500 / Tape & Reel
MC100EL11MNR4
TSSOP−8
2500 / Tape & Reel
MC100EL11MNR4G
TSSOP−8
(Pb−Free)
2500 / Tape & Reel
Device
MC10EL11D
MC100EL11D
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
Resource Reference of Application Notes
AN1405/D
− ECL Clock Distribution Techniques
AN1406/D
− Designing with PECL (ECL at +5.0 V)
AN1503/D
− ECLinPSt I/O SPiCE Modeling Kit
AN1504/D
− Metastability and the ECLinPS Family
AN1568/D
− Interfacing Between LVDS and ECL
AN1672/D
− The ECL Translator Guide
AND8001/D
− Odd Number Counters Design
AND8002/D
− Marking and Date Codes
AND8020/D
− Termination of ECL Logic Devices
AND8066/D
− Interfacing with ECLinPS
AND8090/D
− AC Characteristics of ECL Devices
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6
MC10EL11, MC100EL11
PACKAGE DIMENSIONS
SOIC−8 NB
CASE 751−07
ISSUE AH
−X−
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
A
8
5
S
B
1
0.25 (0.010)
M
Y
M
4
−Y−
K
G
C
N
DIM
A
B
C
D
G
H
J
K
M
N
S
X 45 _
SEATING
PLANE
−Z−
H
0.10 (0.004)
D
0.25 (0.010)
M
Z Y
S
X
M
J
S
SOLDERING FOOTPRINT*
1.52
0.060
7.0
0.275
4.0
0.155
0.6
0.024
1.270
0.050
SCALE 6:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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7
MILLIMETERS
MIN
MAX
4.80
5.00
3.80
4.00
1.35
1.75
0.33
0.51
1.27 BSC
0.10
0.25
0.19
0.25
0.40
1.27
0_
8_
0.25
0.50
5.80
6.20
INCHES
MIN
MAX
0.189
0.197
0.150
0.157
0.053
0.069
0.013
0.020
0.050 BSC
0.004
0.010
0.007
0.010
0.016
0.050
0 _
8 _
0.010
0.020
0.228
0.244
MC10EL11, MC100EL11
PACKAGE DIMENSIONS
TSSOP−8
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948R−02
ISSUE A
8x
0.15 (0.006) T U
0.10 (0.004)
S
2X
L/2
L
8
5
1
PIN 1
IDENT
0.15 (0.006) T U
K REF
S
M
T U
V
S
0.25 (0.010)
B
−U−
4
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
5. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
6. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE −W−.
S
M
A
−V−
F
DETAIL E
C
0.10 (0.004)
−T− SEATING
PLANE
D
−W−
G
DETAIL E
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8
DIM
A
B
C
D
F
G
K
L
M
MILLIMETERS
MIN
MAX
2.90
3.10
2.90
3.10
0.80
1.10
0.05
0.15
0.40
0.70
0.65 BSC
0.25
0.40
4.90 BSC
0_
6_
INCHES
MIN
MAX
0.114
0.122
0.114
0.122
0.031
0.043
0.002
0.006
0.016
0.028
0.026 BSC
0.010
0.016
0.193 BSC
0_
6_
MC10EL11, MC100EL11
PACKAGE DIMENSIONS
DFN8
CASE 506AA−01
ISSUE D
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994 .
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A
B
PIN ONE
REFERENCE
2X
0.10 C
2X
ÇÇÇÇ
ÇÇÇÇ
ÇÇÇÇ
ÇÇÇÇ
0.10 C
TOP VIEW
0.08 C
SEATING
PLANE
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.20 REF
0.20
0.30
2.00 BSC
1.10
1.30
2.00 BSC
0.70
0.90
0.50 BSC
0.20
−−−
0.25
0.35
A
0.10 C
8X
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
E
(A3)
SIDE VIEW
A1
C
D2
e
e/2
4
1
8X
L
E2
K
8
5
8X
b
0.10 C A B
0.05 C
NOTE 3
BOTTOM VIEW
ECLinPS is a trademark of Semiconductor Components INdustries, LLC (SCILLC).
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
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