ATMEL AT49F010-70TC 1-megabit 128k x 8 5-volt only cmos flash memory Datasheet

Features
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Single Voltage Operation
- 5V Read
- 5V Reprogramming
Fast Read Access Time - 45 ns
Internal Program Control and Timer
8K bytes Boot Block With Lockout
Fast Erase Cycle Time - 10 seconds
Byte By Byte Programming - 10 µs/Byte
Hardware Data Protection
DATA Polling For End Of Program Detection
Low Power Dissipation
- 30 mA Active Current
- 100 µA CMOS Standby Current
Typical 10,000 Write Cycles
Description
The AT49F010/HF010 are 5-volt-only in-system programmable and erasable Flash
Memories. Their 1-megabit of memory is organized as 131,072 words by 8 bits. Manufactured with Atmel’s advanced nonvolatile CMOS technology, the devices offer access times to 45 ns (HF version) with a power dissipation of just 165 mW over the
commercial temperature range. When the device is deselected, the CMOS standby
current is less than 100 µA.
To allow for simple in-system reprogrammability, the AT49F010/HF010 does not require high input voltages for programming. Five-volt-only commands determine the
read and programming operation of the device. Reading data out of the device is
similar to reading from an EPROM. Reprogramming the AT49F010/HF010 is performed by erasing the entire 1 megabit of memory and then programming on a byte
by byte basis. The byte programming time is a fast 50 µs. The end of a program cycle
can be optionally detected by the DATA polling feature. Once the end of a byte pro-
1-Megabit
(128K x 8)
5-volt Only
CMOS Flash
Memory
AT49F010
AT49HF010
AT49F010/HF010
Pin Configurations
Pin Name
Function
A0 - A16
Addresses
CE
Chip Enable
OE
Output Enable
WE
Write Enable
DIP Top View
(continued)
I/O0 - I/O7 Data Inputs/Outputs
NC
No Connect
PLCC Top View
TSOP Top View
Type 1
0852AX–5/97
gram cycle has been detected, a new access for a read or
program can begin. The typical number of program and
erase cycles is in excess of 10,000 cycles.
The optional 8K bytes boot block section includes a reprogramming write lock out feature to provide data integrity.
The boot sector is designed to contain user secure code,
Block Diagram
Device Operation
READ: The AT49F010/HF010 is accessed like an
EPROM. When CE and OE are low and WE is high, the
data stored at the memory location determined by the address pins is asserted on the outputs. The outputs are put
in the high impedance state whenever CE or OE is high.
This dual-line control gives designers flexibility in preventing bus contention.
ERASURE: Before a byte can be reprogrammed, the
128K bytes memory array (or 120K bytes if the boot block
featured is used) must be erased. The erased state of the
memory bits is a logical “1". The entire device can be
erased at one time by using a 6-byte software code. The
chip erase code consists of 6-byte load commands to specific address locations with a specific data pattern (please
refer to the Chip Erase Cycle Waveforms).
After the chip erase has been initiated, the device will internally time the erase operation so that no external clocks
are required. The maximum time needed to erase the
whole chip is tEC. If the boot block lockout feature has
been enabled, the data in the boot sector will not be
erased.
BYTE PROGRAMMING: Once the memory array is
erased, the device is programmed (to a logical “0") on a
byte-by-byte basis. Please note that a data ”0" cannot be
programmed back to a “1"; only erase operations can convert ”0"s to “1"s. Programming is accomplished via the internal device command register and is a 4 bus cycle operation (please refer to the Command Definitions table).
The device will automatically generate the required internal program pulses.
The program cycle has addresses latched on the falling
edge of WE or CE, whichever occurs last, and the data
latched on the rising edge of WE or CE, whichever occurs
first. Programming is completed after the specified tBP cy2
AT49F010/HF010
cle time. The DATA polling feature may also be used to
indicate the end of a program cycle.
BOOT BLOCK PROGRAMMING LOCKOUT: The device has one designated block that has a programming
lockout feature. This feature prevents programming of
data in the designated block once the feature has been
enabled. The size of the block is 8K bytes. This block, referred to as the boot block, can contain secure code that
is used to bring up the system. Enabling the lockout feature will allow the boot code to stay in the device while data
in the rest of the device is updated. This feature does not
have to be activated; the boot block’s usage as a write
protected region is optional to the user. The address range
of the boot block is 00000H to 01FFFH.
Once the feature is enabled, the data in the boot block can
no longer be erased or programmed. Data in the main
memory block can still be changed through the regular
programming method. To activate the lockout feature, a
series of six program commands to specific addresses
with specific data must be performed. Please refer to the
Command Definitions table.
BOOT BLOCK LOCKOUT DETECTION: A software
method is available to determine if programming of the
boot block section is locked out. When the device is in the
software product identification mode (see Software Product Identification Entry and Exit sections) a read from address location 00002H will show if programming the boot
block is locked out. If the data on I/O0 is low, the boot
block can be programmed; if the data on I/O0 is high, the
program lockout feature has been activated and the block
cannot be programmed. The software product identification code should be used to return to standard operation.
AT49F010/HF010
PRODUCT IDENTIFICATION: The product identification
mode identifies the device and manufacturer as Atmel. It
may be accessed by hardware or software operation. The
hardware operation mode can be used by an external programmer to identify the correct programming algorithm for
the Atmel product.
T O G G L E B I T : I n a d d i t i o n t o DATA p o l l i n g t h e
AT49F010/HF010 provides another method for determining the end of a program or erase cycle. During a program
or erase operation, successive attempts to read data from
the device will result in I/O6 toggling between one and
zero. Once the program cycle has completed, I/O6 will
stop toggling and valid data will be read. Examining the
toggle bit may begin at any time during a program cycle.
For details, see Operating Modes (for hardware operation)
or Software Product Identification. The manufacturer and
device code is the same for both modes.
HARDWARE DATA PROTECTION: Hardware features
protect against inadvertent programs to the
AT49F010/HF010 in the following ways: (a) VCC sense: if
VCC is below 3.8V (typical), the program function is inhibited. (b) Program inhibit: holding any one of OE low, CE
high or WE high inhibits program cycles. (c) Noise filter:
Pulses of less than 15 ns (typical) on the WE or CE inputs
will not initiate a program cycle.
DATA POLLING: The AT49F010/HF010 features DATA
polling to indicate the end of a program cycle. During a
program cycle an attempted read of the last byte loaded
will result in the complement of the loaded data on I/O7.
Once the program cycle has been completed, true data is
valid on all outputs and the next cycle may begin. DATA
polling may begin at any time during the program cycle.
Command Definition (in Hex)
Command Bus
Sequence Cycles
1st Bus
Cycle
Addr
Data
2nd Bus
Cycle
3rd Bus
Cycle
4th Bus
Cycle
5th Bus
Cycle
6th Bus
Cycle
Addr
Data
Addr
Data
Addr
Data
Addr
Data
Addr
Data
2AAA
55
5555
10
2AAA
55
5555
40
Read
1
Addr
DOUT
Chip Erase
6
5555
AA
2AAA
55
5555
80
5555
AA
Byte
Program
4
5555
AA
2AAA
55
5555
A0
Addr
DIN
Boot Block
(1)
Lockout
6
5555
AA
2AAA
55
5555
80
5555
AA
Product ID
Entry
3
5555
AA
2AAA
55
5555
90
Product ID
(2)
Exit
3
5555
AA
2AAA
55
5555
F0
Product ID
(2)
Exit
1
XXXX
F0
Notes: 1. The 8K byte boot sector has the address range 00000H to 01FFFH.
2. Either one of the Product ID exit commands can be used.
Absolute Maximum Ratings*
Temperature Under Bias................. -55°C to +125°C
Storage Temperature...................... -65°C to +150°C
All Input Voltages
(including NC Pins)
with Respect to Ground ................... -0.6V to +6.25V
All Output Voltages
with Respect to Ground .............-0.6V to V CC + 0.6V
Voltage on OE
with Respect to Ground ................... -0.6V to +13.5V
*NOTICE: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the
device at these or any other conditions beyond those indicated in the operational sections of this specification is not
implied. Exposure to absolute maximum rating conditions
for extended periods may affect device reliability.
3
DC and AC Operating Range
AT49HF010-45 AT49HF010-55
Operating
Temperature (Case)
Com.
Ind.
AT49F010-70
AT49F010-90
AT49F010-12
0°C - 70°C
0°C - 70°C
0°C - 70°C
0°C - 70°C
0°C - 70°C
-40°C - 85°C
-40°C - 85°C
-40°C - 85°C
-40°C - 85°C
-40°C - 85°C
5V ± 10%
5V ± 10%
5V ± 10%
5V ± 10%
5V ± 10%
VCC Power Supply
Operating Modes
Mode
Read
CE
OE
WE
Ai
I/O
DOUT
VIL
VIL
VIH
Ai
(2)
VIL
VIH
VIL
Ai
DIN
Standby/Write Inhibit
VIH
X (1)
X
X
High Z
Program Inhibit
X
X
VIH
Program Inhibit
X
VIL
X
Output Disable
X
VIH
X
Program
High Z
Product Identification
Hardware
VIL
VIL
A1 - A16 = VIL, A9 = VH, (3)
A0 = VIL
A1 - A16 = VIL, A9 = VH, (3)
A0 = VIH
VIH
Software (5)
Notes: 1. X can be VIL or VIH.
2. Refer to AC Programming Waveforms.
3. VH = 12.0V ± 0.5V.
Manufacturer Code (4)
Device Code (4)
A0 = VIL, A1 - A16 = VIL
Manufacturer Code (4)
A0 = VIH, A1 - A16 = VIL
Device Code (4)
4. Manufacturer Code: 1FH, Device Code: 17H
5. See details under Software Product Identification Entry/Exit.
DC Characteristics
Symbol
Condition
Min
Max
Units
ILI
Input Load Current
VIN = 0V to VCC
10
µA
ILO
Output Leakage Current
VI/O = 0V to VCC
10
µA
ISB1
VCC Standby Current CMOS
CE = VCC - 0.3V to VCC
Com.
100
µA
Ind.
300
µA
ISB2
VCC Standby Current TTL
CE = 2.0V to VCC
3
mA
Com.
30
mA
Ind.
40
mA
0.8
V
ICC (1)
VCC Active Current
VIL
Input Low Voltage
VIH
Input High Voltage
VOL
Output Low Voltage
IOL = 2.1 mA
VOH1
Output High Voltage
IOH = -400 µA
2.4
V
VOH2
Output High Voltage CMOS
IOH = -100 µA; VCC = 4.5V
4.2
V
Note:
4
Parameter
1. In the erase mode, ICC is 90 mA.
AT49F010/HF010
f = 5 MHz; IOUT = 0 mA
2.0
V
.45
V
AT49F010/HF010
AC Read Characteristics
AT49HF010-45 AT49HF010-55
Symbol
Parameter
tACC
tCE (1)
tOE (2)
tDF (3, 4)
Address to Output Delay
CE to Output Delay
OE to Output Delay
CE or OE to Output Float
Output Hold from OE,
CE or Address,
whichever occurred first
tOH
Min
Max
0
45
45
25
25
0
Min
Max
0
55
55
30
25
0
AT49F010-70
Min
Max
0
70
70
35
25
0
AT49F010-90
Min
Max
0
0
90
90
40
25
0
AT49F010-12
Min
Max
0
0
120
120
50
30
0
Units
ns
ns
ns
ns
ns
AC Read Waveforms (1, 2, 3, 4)
Notes: 1. CE may be delayed up to tACC - tCE after the address
transition without impact on tACC .
2. OE may be delayed up to tCE - tOE after the falling
edge of CE without impact on tCE or by tACC - tOE
after an address change without impact on tACC .
3. tDF is specified from OE or CE whichever occurs first
(CL = 5 pF).
4. This parameter is characterized and is not 100% tested.
Input Test Waveforms and
Measurement Level
Output Test Load
45 ns / 55 ns
70/90/120 ns
tR, tF < 5 ns
Pin Capacitance (f = 1 MHz, T = 25°C) (1)
Typ
Max
Units
CIN
4
6
pF
VIN = 0V
COUT
8
12
pF
VOUT = 0V
Note:
Conditions
1. This parameter is characterized and is not 100% tested.
5
AC Byte Load Characteristics
Symbol
Parameter
tAS, tOES
Address, OE Set-up Time
0
ns
tAH
Address Hold Time
50
ns
tCS
Chip Select Set-up Time
0
ns
tCH
Chip Select Hold Time
0
ns
tWP
Write Pulse Width (WE or CE)
90
ns
tDS
Data Set-up Time
50
ns
tDH, tOEH
Data, OE Hold Time
0
ns
tWPH
Write Pulse Width High
90
ns
AC Byte Load Waveforms
WE Controlled
CE Controlled
6
AT49F010/HF010
Min
Max
Units
AT49F010/HF010
Program Cycle Characteristics
Symbol
Parameter
Min
Typ
Max
Units
tBP
Byte Programming Time
10
50
µs
tAS
Address Set-up Time
0
ns
tAH
Address Hold Time
50
ns
tDS
Data Set-up Time
50
ns
tDH
Data Hold Time
0
ns
tWP
Write Pulse Width
90
ns
tWPH
Write Pulse Width High
90
ns
tEC
Erase Cycle Time
10
seconds
Program Cycle Waveforms
Chip Erase Cycle Waveforms
Note:
OE must be high only when WE and CE are both low.
7
Data Polling Characteristics
(1)
Symbol
Parameter
Min
Typ
Max
tDH
Data Hold Time
10
ns
tOEH
OE Hold Time
10
ns
Delay (2)
tOE
OE to Output
tWR
Write Recovery Time
Units
ns
0
ns
Notes: 1. These parameters are characterized and not 100% tested.
2. See tOE spec in AC Read Characteristics.
Data Polling Waveforms
Toggle Bit Characteristics
(1)
Symbol
Parameter
Min
Typ
Max
Units
tDH
Data Hold Time
10
ns
tOEH
OE Hold Time
10
ns
tOE
OE to Output Delay (2)
tOEHP
OE High Pulse
tWR
Write Recovery Time
ns
150
ns
0
ns
Notes: 1. These parameters are characterized and not 100% tested.
2. See tOE spec in AC Read Characteristics.
(1, 2, 3)
Toggle Bit Waveforms
Notes: 1. Toggling either OE or CE or both OE and CE will
operate toggle bit. The tOEHP specification must be
met by the toggling input(s).
8
AT49F010/HF010
2. Beginning and ending state of I/O6 will vary.
3. Any address location may be used but the address
should not vary.
AT49F010/HF010
Software Product (1)
Identification Entry
Boot Block Lockout
(1)
Feature Enable Algorithm
LOAD DATA AA
TO
ADDRESS 5555
LOAD DATA AA
TO
ADDRESS 5555
LOAD DATA 55
TO
ADDRESS 2AAA
LOAD DATA 55
TO
ADDRESS 2AAA
LOAD DATA 90
TO
ADDRESS 5555
LOAD DATA 80
TO
ADDRESS 5555
ENTER PRODUCT
IDENTIFICATION
MODE (2, 3, 5)
LOAD DATA AA
TO
ADDRESS 5555
LOAD DATA 55
TO
ADDRESS 2AAA
Software Product (1)
Identification Exit
LOAD DATA AA
TO
ADDRESS 5555
LOAD DATA 55
TO
ADDRESS 2AAA
OR
LOAD DATA 40
TO
ADDRESS 5555
LOAD DATA F0
TO
ANY ADDRESS
EXIT PRODUCT
IDENTIFICATION
MODE (4)
LOAD DATA F0
TO
ADDRESS 5555
PAUSE 1 second (2)
Notes for boot block lockout feature enable:
1. Data Format: I/O7 - I/O0 (Hex);
Address Format: A14 - A0 (Hex).
2. Boot block lockout feature enabled.
EXIT PRODUCT
IDENTIFICATION
MODE (4)
Notes for software product identification:
1. Data Format: I/O7 - I/O0 (Hex);
Address Format: A14 - A0 (Hex).
2. A1 - A16 = VIL.
Manufacture Code is read for A0 = VIL;
Device Code is read for A0 = VIH.
3. The device does not remain in identification mode if
powered down.
4. The device returns to standard operation mode.
5. Manufacturer Code: 1FH
Device Code: 17H
9
Ordering Information (1)
ICC (mA)
tACC
(ns)
Active
Standby
45
30
55
70
90
120
Note:
Ordering Code
Package
0.1
AT49HF010-45JC
AT49HF010-45PC
AT49HF010-45TC
32J
32P6
32T
Commercial
(0° to 70°C)
40
0.1
AT49HF010-45JI
AT49HF010-45PI
AT49HF010-45TI
32J
32P6
32T
Industrial
(-40° to 85°C)
30
0.1
AT49HF010-55JC
AT49HF010-55PC
AT49HF010-55TC
32J
32P6
32T
Commercial
(0° to 70°C)
40
0.1
AT49HF010-55JI
AT49HF010-55PI
AT49HF010-55TI
32J
32P6
32T
Industrial
(-40° to 85°C)
30
0.1
AT49F010-70JC
AT49F010-70PC
AT49F010-70TC
32J
32P6
32T
Commercial
(0° to 70°C)
40
0.3
AT49F010-70JI
AT49F010-70PI
AT49F010-70TI
32J
32P6
32T
Industrial
(-40° to 85°C)
30
0.1
AT49F010-90JC
AT49F010-90PC
AT49F010-90TC
32J
32P6
32T
Commercial
(0° to 70°C)
40
0.3
AT49F010-90JI
AT49F010-90PI
AT49F010-90TI
32J
32P6
32T
Industrial
(-40° to 85°C)
30
0.1
AT49F010-12JC
AT49F010-12PC
AT49F010-12TC
32J
32P6
32T
Commercial
(0° to 70°C)
40
0.3
AT49F010-12JI
AT49F010-12PI
AT49F010-12TI
32J
32P6
32T
Industrial
(-40° to 85°C)
1. The AT49F010/HF010 has as optional boot block feature. The part number shown in the Ordering Information table is for
devices with the boot block in the lower address range (i.e., 00000H to 01FFFH). Users requiring the boot block to be in
the higher address range should contact Atmel.
Package Type
10
Operation Range
32J
32 Lead, Plastic, J-Leaded Chip Carrier Package (PLCC)
32P6
32 Lead, 0.600" Wide, Plastic Dual Inline Package (PDIP)
32T
32 Lead, Thin Small Outline Package (TSOP)
AT49F010/HF010
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