Mitsubishi FU-48SDF-Y30M55F 1.3 um dfb-ld module with singlemode fiber pigtail Datasheet

JAN06 (1/6)
MITSUBISHI (OPTICAL DEVICES)
FU-48SDF-x30M5yF
1.3 μm DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL
DESCRIPTION
Module type FU-48SDF-x30M5yF is a cooled butterfly
packaged 1.3μm DFB-LD module with single-mode
optical fiber.
This module is suitable for a light source of analog
applications such CATV systems.
FEATURES
• High liniality multi quantum wells (MQW) DFB-LD
• Emission wavelength is in 1.3μm band
• Built-in optical isolator
• Thermo electric cooler for laser temperature control
• With photodiode for optical output monitor
• RoHS (2002/95/EC) compliant
APPLICATION
CATV.
Analog transmission systems
ABSOLUTE MAXIMUM RATINGS (Tld=25°C)
Parameter
Laser diode
Optical output power from fiber end
Symbol
Pf
Conditions
Rating
Unit
CW
-x30M56F
8
mW
-x30M57F
10
-x30M52F
20
-x30M53F
-x30M54F
Forward current
If
CW
150
mA
Reverse voltage
Vrl
2
V
Photodiode
Reverse voltage
Vrd
20
V
Forward current
Ifd
2
mA
Cooler
Voltage
Vpem
2.4
V
(Note)
Current
Ipem
1.2
A
Operating case temperature
Tc
-20 to +65
°C
Storage temperature
Tstg
-40 to +70
°C
Note. Even if the thermo-electric cooler (TEC) is operated within the rated conditions, uncontrolled current loading or
operation without heat sink may easily damage the module by exceeding the storage temperature range. Thermistor
resistance should be properly monitored by the feedback circuit during TEC operation to avoid the catastrophic damage.
Mitsubishi Electric Corporation reserves the right to make changes to the products or information contained herein
without notice. No liability is assumed as a result of their use or application.
MITSUBISHI CONFIDENTIAL
JAN06 (2/6)
MITSUBISHI (OPTICAL DEVICES)
FU-48SDF-x30M5yF
1.3 μm DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL
ELECTRICAL/OPTICAL CHARACTERISTICS
Parameter
Symbol
(Tld=25°C, Tc=25°C, unless otherwise noted)
Condition
Limits
Min.
Typ.
Max.
10
30
Please see
'Type vs. CATV performance'
Threshold Current
Operating Current
Ith
Iop
CW
CW
Operating Voltage
Output Power from
Fiber End
Input impedance
Central Wavelength
Side Mode
Suppression Ratio
Cut-off Frequency
Vop
Pf
CW, If = Iop (Note1)
CW, If = Iop
Zin
λc
Sr
If=Iop
CW, If = Iop
CW, If = Iop
Composite Second Order
Composite Triple
Order
Carrier to Noise Ratio
Optical Modulation Depth
fc(-1.5dB)
CSO
CTB
CNR
RIN (Note 3)
m
Nr
Tracking Error(Note 4)
Differential Efficiency
Er
η
If = Iop
NTSC 79channel loading
55.25MHz~745.25MHz
(6MHz spacing)
If = Iop (Note2)
CW, If = Iop
f=55.25MHz
f=547.25MHz
Tc = -20~65°C, APC, ATC
If(average) = Iop
-
1.3
1.8
Please see
'Type vs. CATV performance'
25
1290
1310
1330
30
35
3
-
4
-
-60
-65
Units
mA
mA
V
mW
Ω
nm
dB
GHz
dBc
dBc
Please see
dB
'Type vs. CATV performance'
3.0
3.5
5.0
%
-160
-155
dB/Hz
-160
-155
0.3
0.5
dB
Please see
mW/mA
'Type vs. CATV performance'
0.1
3
mA
0.1
1
μA
10
20
pF
25
37
dB
Monitor Current
Imon
CW, If = Iop, Vrd = 5V
Dark current( PD )
Id
Vrd = 5V
Capacitance ( PD )
Ct
Vrd = 5V, f = 1MHz
Isolation
Iso
Tc = 0 to 65°C
Note1. If : LD forwad current
Note2. Detailed test condition:
Total loss includes the fiber loss. (Please see 'Type vs. performance'.)
Receiver responsively = 0.9A/W
1/2
Input equivalent noise current = 7pA(Hz)
Optical return loss of the connector should be greater than 40dB in order to get the specification performance.
Note3. Relative intensity noise does not include shot noise of receiver.
Note4. Er = MAX | 10*log(Pf/Pf(25°C))|
TYPE VS. CATV PERFORMANCE (Tld=25°C, Tc=25°C Unless otherwise noted)
Type
Iop[mA]
CNR[dB]
η[mW/mA]
Pf[mW]
Typ.
Max
Min
Min.
Typ.
FU-48SDF-x30M56F
2~4
35
80
49
0.03
0.10
FU-48SDF-x30M57F
4~6
35
80
48
0.11
0.20
FU-48SDF-x30M52F
6~8
40
70
49.5
0.15
0.23
FU-48SDF-x30M53F
8~10
40
70
50
0.2
0.30
FU-48SDF-x30M54F
10~12
45
70
50.5
0.2
0.30
Total loss[dB]
Fiber length
5
5km
8.5
15km
8.5
15km
12
26.5km
12
26.5km
Mitsubishi Electric Corporation reserves the right to make changes to the products or information contained herein
without notice. No liability is assumed as a result of their use or application.
MITSUBISHI CONFIDENTIAL
JAN06 (3/6)
MITSUBISHI (OPTICAL DEVICES)
FU-48SDF-x30M5yF
1.3 μm DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL
THERMAL CHARACTERISTICS (Tld=25°C,Tc=-20~+65°C)
Parameter
Symbol
Conditions
Thermistor resistance
B constant of
thermistor resistance
Cooling capacity
Cooler current
Cooler voltage
Rth
B
Tld=25°C
-
Min.
9.5
-
ΔT
Ipe
Vpe
Tc=65°C
ΔT=40K
ΔT=40K
40
-
OPTICAL FIBER SPECIFICATION
Parameter
Type
Mode filed diameter
Cladding diameter
Jacket diameter
Connector type
Fiber pintail length
Optical return loss to connector
Units
Limits
Typ.
10
3950
Max.
10.5
-
KΩ
K
0.6
1.2
1
2
K
A
V
Limits
SM
9.5±1
125±2
900 typ.
Pigtail without fiber, SC/PC, SC/APC, FC/APC
Please see ' FC/APC connector specification'
Lfiber = 1000+200/-0
(Lfiber is defined in the outline drawing.)
SC/PC
: 50dB min
SC/APC and FC/APC : 60dB min
Unit
μm
μm
μm
mm
-
FC/APC CONNECTOR SPECIFICATION
(1) FC/APC CONNECTOR PARTS
Part
FC connector
Ferrule
Maker
SEIKOH
GIKEN
Part No.
PF11A
FF3A
(2) FERRULE ENDFACE GEOMETRY
Reference
EB
EO
rEP
EQ
Dimensions
8°
50μmMAX
5~12mm
±0.1μm
Mitsubishi Electric Corporation reserves the right to make changes to the products or information contained herein
without notice. No liability is assumed as a result of their use or application.
MITSUBISHI CONFIDENTIAL
JAN06 (4/6)
MITSUBISHI (OPTICAL DEVICES)
FU-48SDF-x30M5yF
1.3 μm DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL
DOCUMENTATION
z
Threshold current(Ith) at Tc=25°C
z
Operating current(Iop) at Tc=25°C
z
Optical output power form fiber end(Pf) at Tc=25°C
z
Central wavelength(λc) at Tc=25°C
z
Monitor current(Imon) at Tc=25°C
z
Differential efficiency(η) at Tc=25°C
z
Side mode suppression ratio(Sr) at Tc=25°C
z
Optical modulation(m) at Tc=25°C
z
RF input power(RFin) at Tc=25°C
z
Composite second order(CSOL2, CSOH41, CSOH78) at Tc=25°C
z
Composite triple order(CTB2, CTB41, CTB78) at Tc=25°C
z
Carrier to noise ratio(CNR2, CNR41, CNR78) at Tc=25°C
z
Relative intensity noise(Nr2, Nr78) at Tc=25°C
z
Pf - If graph at Tc=-20, 25, 65°C
z
If - Vf graph at Tc=25°C
z
dPf/dIf - If graph at Tc=25°C
z
If - Imon graph at Tc=25°C
ORDERING INFORMATION
FU - 48SDF – _ 30M5_ F
6
7
2
3
4
W
L
Y
Output Power Range
2~4mW
4~6mW
6~8mW
8~10mW
10~12mW
Connector
SC/PC
SC/APC
FC/APC
Mitsubishi Electric Corporation reserves the right to make changes to the products or information contained herein
without notice. No liability is assumed as a result of their use or application.
MITSUBISHI CONFIDENTIAL
JAN06 (5/6)
MITSUBISHI (OPTICAL DEVICES)
FU-48SDF-x30M5yF
1.3 μm DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL
OUTLINE DIAGRAM
Unless otherwise noted +/-0.5mm
(Unit : mm)
FU-48SDF-x30M5yF
Mitsubishi Electric Corporation reserves the right to make changes to the products or information contained herein
without notice. No liability is assumed as a result of their use or application.
MITSUBISHI CONFIDENTIAL
JAN06 (6/6)
MITSUBISHI (OPTICAL DEVICES)
FU-48SDF-x30M5yF
1.3 μm DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL
Safety Cautions for Use of Optoelectronic Devices
General:
Although the manufacturer is always striving to improve the reliability of its product, problems and errors may occur with
semiconductor products. Therefore, the user's products are required to be designed with full safety regard to prevent any accidents that
results in injury, death, fire or environmental damage even when semiconductor products happen to error. Especially it is recommended
to take in consideration about redundancy, fire prevention, error prevention safeguards. And the following requirements must be strictly
observed.
Warning!
1. Eye safety : Seminductor laser radiates laser light during operation. Laser light is very dangerous when shot directly into human
eyes. Don't look at laser light directly, or through optics such as a lens. The laser light should be observed using the ITV camera, IRviewer, or other appropriate instruments.
2. Product handling : The product contains GaAs (gallium arsenide). It is safe for regular use, but harmful to the human body if
made into powder or steam. Be sure to avoid dangerous process like smashing, burning, chemical etching. Never put this product in
one's mouth or swallow it.
3. Product disposal : This product must be disposed of as special industrial waste. It is necessary to separate it from general
industrial waste and general garbage.
Handling Cautions for Optoelectronic Devices
1. General:
(1) The products described in this specification are designed and manufactured for use in general communication systems or
electronic devices, unless their applications or reliability are otherwise specified. Therefore, they are not designed or manufactured for
installation in devices or systems that may affect human life or that are used in social infrastructure requiring high reliability.
(2) When the customer is considering to use the products in special applications, such as transportation systems (automobiles, trains,
vessels), medical equipments, aerospace, nuclear power control, and submarine repeaters or systems, please contact Mitsubishi
Electric or an authorized distributor.
2. Shipping Conditions:
(1) During shipment, place the packing boxes in the correct direction, and fix them firmly to keep them immovable. Placing the boxes
upside down, tilting, or applying abnormal pressure onto them may cause deformation in the electrode terminals, breaking of optical
fiber, or other problems.
(2) Never throw or drop the packing boxes. Hard impact on the boxes may cause break of the devices.
(3) Take strict precautions to keep the devices dry when shipping under rain or snow.
3. Storage Conditions:
When storing the products, it is recommended to store them following the conditions described below without opening the packing. Not
taking enough care in storing may result in defects in electrical characteristics, soldering quality, visual appearance, and so on. The
main points are described below (if special storage conditions are given to the product in the specification sheet, they have priority over
the following general cautions):
(1) Appropriate temperature and humidity conditions, i.e., temperature range between 5~30°C, and humidity between 40~60 percent
RH, should be maintained in storage locations. Controlling the temperature and humidity within this range is particularly important in
case of long-term storage for six months or more.
(2) The atmosphere should be particularly free from toxic gases and dust.
(3) Do not apply any load on the product.
(4) Do not cut or bend the leads of the devices which are to be stored. This is to prevent corrosion in the cut or bent part of the lead
causing soldering problems in the customer’s assembling process.
(5) Sudden change in temperature may cause condensation in the product or packing, therefore, such locations should be avoided for
storing. Temperature in storage locations should be stable.
(6) When storing ceramic package products for extended periods of time, the leads may turn reddish due to reaction with sulfur in the
atmosphere.
(7) Storage conditions for bare chip and unsealed products shall be stated separately because bare chip and unsealed products
require stricter controls than package sealed products.
4. Design Conditions and Environment under Use:
(1) Avoid use in locations where water or organic solvents adhere directly to the product, or where there is any possibility of the
generation of corrosive gas, explosive gas, dust, salinity, or other troublesome conditions. Such environments will not only significantly
lower the reliability, but also may lead to serious accidents.
(2) Operation in excess of the absolute maximum ratings can cause permanent damage to the device. The customers are requested
to design not to exceed those ratings even for a short time.
5. ESD Safety Cautions:
The optoelectronic devices are sensitive to static electricity (ESD, electro-static discharge). The product can be broken by ESD. When
handling this product, please observe the following countermeasures:
<Countermeasures against Static Electricity and Surge>
To prevent break of devices by static electricity or surge, please adopt the following countermeasures in the assembly line:
(1) Ground all equipments, machinery jigs, and tools in the process line with earth wires installed in them. Take particular care with hot
plates, solder irons and other items for which the commercial power supplies are prone to leakage.
(2) Workers should always use earth bands. Use of antistatic clothing, electric conductive shoes, and other safety equipment while at
work is highly recommended.
(3) Use conductive materials for this product’s container, etc.
(4) It is recommended that grounding mats be placed on the surfaces of assembly line workbench and the surrounding floor in work
area, etc.
(5) When mounting this product in parts or materials which can be electrically charged (printed wiring boards, plastic products, etc.),
pay close attention to the static electricity in those parts. ESD may damage the product.
(6) Humidity in working environment should be controlled to be 40 percent RH or higher.
These countermeasures are most general, and there is a need to carefully confirm the line before starting mass production using this
product (in the trial production, etc.). It is extremely important to prevent surge, eliminate it rapidly, and prevent it from spreading.
Mitsubishi Electric Corporation reserves the right to make changes to the products or information contained herein
without notice. No liability is assumed as a result of their use or application.
MITSUBISHI CONFIDENTIAL
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