ON MURD530T4G Switchmode power rectifier Datasheet

MURD530
SWITCHMODE
Power Rectifier
DPAK Surface Mount Package
http://onsemi.com
These state−of−the−art devices are designed for use in switching
power supplies, inverters and as free wheeling diodes.
ULTRAFAST RECTIFIER
5.0 AMPERES, 300 VOLTS
Features
•
•
•
•
Ultrafast 50 Nanosecond Recovery Time
Low Forward Voltage Drop
Low Leakage
Pb−Free Package is Available
1
4
3
Mechanical Characteristics
• Case: Epoxy, Molded
• Weight: 0.4 Gram (Approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
•
•
Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
Available in 16 mm Tape and Reel, 2500 Units Per Reel,
by Adding a “T4’’ Suffix to the Part Number
MARKING
DIAGRAM
4
1 2
AYWW
U
530G
DPAK
CASE 369C
3
A
Y
WW
G
= Assembly Location
= Year
= Work Week
= Pb−Free Package
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
300
V
Average Rectified Forward Current
(Rated VR, TC = 165°C)
IF(AV)
5.0
A
Peak Repetitive Forward Current
(Rated VR, Square Wave,
20 kHz, TC = 165°C)
IFRM
10
A
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load
Conditions Halfwave, 60 Hz)
IFSM
75
A
TJ, Tstg
−65 to +175
°C
Operating Junction and Storage
Temperature Range
ORDERING INFORMATION
Device
MURD530T4G
Package
Shipping†
DPAK
(Pb−Free)
2500/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
© Semiconductor Components Industries, LLC, 2011
January, 2011 − Rev. 3
1
Publication Order Number:
MURD530/D
MURD530
THERMAL CHARACTERISTICS
Rating
Symbol
Value
Unit
Thermal Resistance − Junction−to−Case (Note 1)
RqJC
3
°C/W
Thermal Resistance − Junction−to−Ambient (Note 2)
RqJA
92
°C/W
RqJA
57
°C/W
Thermal Resistance − Junction−to−Ambient (Note 3)
ELECTRICAL CHARACTERISTICS
Maximum Instantaneous Forward Voltage Drop (Note 4)
(iF = 3 A, TJ = 25°C)
(iF = 3 A, TJ = 125°C)
(iF = 5 A, TJ = 25°C)
(iF = 5 A, TJ = 125°C)
vF
Maximum Instantaneous Reverse Current (Note 4)
(TJ = 25°C, Rated dc Voltage)
(TJ = 125°C, Rated dc Voltage)
iR
Maximum Reverse Recovery Time
(IF = 1 Amp, di/dt = 50 A/ms, VR = 30 V, TJ = 25°C)
trr
1.
2.
3.
4.
0.95
0.80
1.05
0.90
Volts
mA
5.0
150
ns
50
Rating applies for one diode leg.
Rating applies when for both diode legs when mounted on 130 mm2 pad size.
Rating applies for both diode legs when mounted on 1 in pad size.
Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%.
100
TJ = 175°C
85°C
125°C
1
25°C
−40°C
0.1
0
0.5
1.0
1.5
85°C
25°C
1
−40°C
0.1
2.0
125°C
0
0.5
1.0
1.5
vF, INSTANTANEOUS VOLTAGE (V)
vF, INSTANTANEOUS VOLTAGE (V)
Figure 2. Typical Forward Voltage
125°C
10
85°C
1.0
25°C
0.1
0.01
−40°C
0.001
50
2.0
1000
175°C
100
0
0
175°C
10
Figure 1. Maximum Forward Voltage
1000
IR, REVERSE CURRENT (mA)
IF, FORARD CURRENT (A)
10
IR, REVERSE CURRENT (A)
IF, FORARD CURRENT (A)
100
100
150
200
vR, REVERSEE VOLTAGE (V)
250
125°C
10
85°C
1.0
0.1
25°C
0.01
−40°C
0.001
0
0
300
175°C
100
Figure 3. Maximum Reverse Voltage
50
100
150
200
250
vR, REVERSEE VOLTAGE (V)
Figure 4. Typical Reverse Voltage
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2
300
MURD530
5
15
10
dc
SQUARE WAVE
5
80
90
dc
SQUARE WAVE
0
100 110 120 130 140 150 160 170 180
80
90
100 110 120 130 140 150 160 170 18
TC, CASE TEMPERATURE (°C)
TA, AMBIENT TEMPERATURE (°C)
Figure 5. Typical Current Derating, Case
Figure 6. Typical Current Derating, Ambient
8
1000
TJ = 25°C
7
6
5
C, CAPACITANCE (pF)
PFO, AVERAGE POWER DISSIPATION (W)
0
Rated Voltage Applied
RqJA = 57°C/W
IF, AVERAGE FORWARD CURRENT
(mA)
IF, AVERAGE FORWARD CURRENT
(mA)
Rated Voltage Applied
RqJA = 3°C/W
SQUARE WAVE
4
dc
3
2
100
10
1
0
0
1
2
3
4
5
6
7
8
1
9
0
50
100
150
200
IO, AVERAGE FORWARD CURRENT (A)
VR, REVERSE VOLTAGE (V)
Figure 7. Forward Power Dissipation
Figure 8. Typical Capacitance
250
10
R(t), (°C/W)
D = 0.5
1
0.2
0.1
0.05
0.1
0.01
Single Pulse
0.01
0.000001
0.00001
0.0001
0.001
0.01
0.1
1
10
PULSE TIME (s)
Figure 9. R(t) on an Infinite Heatsink Power (J1) 0.800 W Power (J2) 0.800 W
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3
100
1000
MURD530
100
D = 0.5
0.2
0.1
R(t), (°C/W)
10
0.05
1
0.01
0.1
Single Pulse
0.01
0.001
0.000001
0.00001
0.0001
0.001
0.01
0.1
1
10
100
PULSE TIME (s)
Figure 10. PCB Cu Area 650 mm2 PCB Cu thk 1 oz Power (J1) 0.800 W Power (J2) 0.800 W
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4
1000
MURD530
PACKAGE DIMENSIONS
DPAK (SINGLE GAUGE)
CASE 369C−01
ISSUE D
A
E
b3
c2
B
Z
D
1
L4
A
4
L3
b2
e
2
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. THERMAL PAD CONTOUR OPTIONAL WITHIN DIMENSIONS b3, L3 and Z.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL
NOT EXCEED 0.006 INCHES PER SIDE.
5. DIMENSIONS D AND E ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY.
6. DATUMS A AND B ARE DETERMINED AT DATUM
PLANE H.
C
H
DETAIL A
3
c
b
0.005 (0.13)
M
H
C
L2
GAUGE
PLANE
C
L
SEATING
PLANE
A1
L1
DETAIL A
ROTATED 905 CW
DIM
A
A1
b
b2
b3
c
c2
D
E
e
H
L
L1
L2
L3
L4
Z
INCHES
MIN
MAX
0.086 0.094
0.000 0.005
0.025 0.035
0.030 0.045
0.180 0.215
0.018 0.024
0.018 0.024
0.235 0.245
0.250 0.265
0.090 BSC
0.370 0.410
0.055 0.070
0.108 REF
0.020 BSC
0.035 0.050
−−− 0.040
0.155
−−−
MILLIMETERS
MIN
MAX
2.18
2.38
0.00
0.13
0.63
0.89
0.76
1.14
4.57
5.46
0.46
0.61
0.46
0.61
5.97
6.22
6.35
6.73
2.29 BSC
9.40 10.41
1.40
1.78
2.74 REF
0.51 BSC
0.89
1.27
−−−
1.01
3.93
−−−
SOLDERING FOOTPRINT*
6.20
0.244
2.58
0.102
5.80
0.228
3.00
0.118
1.60
0.063
6.17
0.243
SCALE 3:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
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MURD530/D
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