ULTRA-PRECISION DIFFERENTIAL LVPECL 2:1 MUX with INTERNAL TERMINATION Micrel Precision Edge™ SY58018U Precision Edge™ SY58018U FEATURES ■ Guaranteed AC performance over temperature and voltage: • DC to 5Gbps data throughput • DC to > 4GHz fMAX (clock) • < 260ps propagation delay • < 110ps tr / tf times ■ Ultra-low crosstalk-induced jitter: 0.7psrms ■ Ultra-low jitter design: • < 1psrms random jitter • < 10psp-p deterministic jitter • < 10psp-p total jitter (clock) ■ Unique input termination and VT pin accepts DCcoupled and AC-coupled inputs (CML, PECL, LVDS) ■ 800mV (100k) LVPECL output swing ■ Power supply 2.5V ±5% or 3.3V ±10% ■ –40°C to +85°C temperature range ■ Available in 16-pin (3mm × 3mm) MLF™ package Precision Edge™ DESCRIPTION The SY58018U is a 2.5V/3.3V precision, high-speed, 2:1 differential MUX capable of handling clocks up to 4GHz and data up to 5Gbps. The differential input includes Micrel’s unique, 3-pin input termination architecture that allows customers to interface to any differential signal (AC- or DC-coupled) as small as 100mV without any level shifting or termination resistor networks in the signal path. The outputs are 800mV, 100k compatible, LVPECL, with extremely fast rise/fall times guaranteed to be less than 110ps. The SY58018U operates from a 2.5V ±5% supply or a 3.3V ±10% supply and is guaranteed over the full industrial temperature range of –40°C to +85°C. For applications that require CML outputs, consider the SY58017U or for 400mV LVPECL outputs the SY58019U. The SY58018U is part of Micrel’s high-speed, Precision Edge™ product line. All support documentation can be found on Micrel’s web site at www.micrel.com. APPLICATIONS ■ ■ ■ ■ Redundant clock distribution SONET/SDH clock/data distribution Loopback Fibre Channel distribution FUNCTIONAL BLOCK DIAGRAM TYPICAL PERFORMANCE IN0 50Ω VT0 50Ω 5Gbps Output 0 /IN0 IN1 Output Swing (200mV/div.) Q0 MUX /Q0 50Ω VT1 50Ω 1 S /IN1 SEL (TTL/CMOS) TIME (25ps/div.) (223—1PRBS) Precision Edge is a trademark of Micrel, Inc. AnyGate is a registered trademark of Micrel, Inc. MicroLeadFrame and MLF are trademarks of Amkor Technology, Inc. M0643-012704 Rev.: A 1 Amendment: /0 Issue Date: Jan. 2004 Precision Edge™ SY58018U Micrel PACKAGE/ORDERING INFORMATION VT0 GND GND VCC Ordering Information(1) Part Number Package Type Operating Range Package Marking Q SY58018UMI MLF-16 Industrial 018U GND GND /Q SY58018UMITR(2) MLF-16 Industrial 018U 16 15 14 13 IN0 1 12 /IN0 2 11 IN1 /IN1 3 4 10 9 Notes: 1. Contact factory for die availability. Dice are guaranteed at TA = 25°C, DC electricals only. 5 6 7 8 VT1 SEL NC VCC 2. Tape and Reel. 16-Pin MLF™ PIN DESCRIPTION Pin Number Pin Name Pin Function 1, 2 3, 4 IN0, /IN0 IN1, /IN1 Differential Input: These input pairs are the differential signal inputs to the device. They accept differential AC- or DC-coupled signals as small as 100mV. Each pin of a pair internally terminates to a VT pin through 50Ω. Note that these inputs will default to an indeterminate state if left open. Please refer to the “Input Interface Applications” section for more details. 16, 5 VT0, VT1 Input Termination Center-Tap: Each side of the differential input pair terminates to a VT pin. The VT0 and VT1 pins provide a center-tap to a termination network for maximum interface flexibility. See “Input Interface Applications” section for more details. 6 SEL This single-ended TTL/CMOS compatible input selects the inputs to the multiplexer. Note that this input is internally connected to a 25kΩ pull-up resistor and will default to a logic HIGH state if left open. No connect. 7 NC 8, 13 VCC Positive Power Supply: Bypass with 0.1µF0.01µF low ESR capacitors. 0.01µF capacitor should be as close to VCC pin as possible. 12, 9 Q, /Q Differential Outputs: This 100k compatible LVPECL output pair is the output of the device. Normally terminate with 50Ω to VCC – 2V. See “Output Interface Applications” section. It is a logic function of the IN0, IN1, and SEL inputs. Please refer to the “Truth Table” for details. 10, 11, 14, 15 GND, Exposed Pad Ground. Ground pins and exposed pad must be connected to the same ground plane. TRUTH TABLE SEL Output 0 CH0 Input Selected 1 CH1 Input Selected M0643-012704 2 Precision Edge™ SY58018U Micrel Absolute Maximum Ratings(1) Operating Ratings(2) Power Supply Voltage (VCC ) ...................... –0.5V to +4.0V Input Voltage (VIN) ......................................... –0.5V to VCC LVPECL Output Current (IOUT) Continuous ............................................................. 50mA Surge .................................................................... 100mA Termination Current(3) Source or Sink Current on VT pin ....................... ±100mA Input Current Source or Sink Current on IN, /IN pin ................... ±50mA Lead Temperature (soldering, 10 sec.) ..................... 265°C Storage Temperature Range (TS ) ........... –65°C to +150°C Power Supply Voltage (VCC) ............... +2.375V to +2.625V ............................................................ +3.0V to +3.6V Ambient Temperature Range (TA) ............. –40°C to +85°C Package Thermal Resistance(4) MLF™ (θJA) Still-Air ............................................................. 60°C/W MLF™ (ψJB) Junction-to-Board ............................................ 38°C/W DC ELECTRICAL CHARACTERISTICS(5) TA= –40°C to +85°C, unless otherwise stated. Symbol Parameter Condition Min Typ Max Units VCC Power Supply Voltage VCC = 2.5V VCC = 3.3V 2.375 3.0 2.5 3.3 2.625 3.6 V V ICC Power Supply Current No load, max. VCC 50 65 mA RDIFF_IN Differential Input Resistance (IN0-to-/IN0, IN1-to-/IN1) 80 100 120 Ω RIN Input Resistance (IN0-to-VT0, /IN0-to-VT0, IN1-to-VT1, /IN1-to-VT1) 40 50 60 Ω VIH Input HIGH Voltage (IN0, /IN0, IN1, /IN1) VCC − 1.6 VCC V VIL Input LOW Voltage (IN0, /IN0, IN1, /IN1) 0 VIH – 0.1 V VIN Input Voltage Swing (IN0, /IN0, IN1, /IN1) See Figure 1a 100 1700 mV VDIFF_IN Differential Input Voltage Swing |IN0, /IN0|, |IN1, /IN1| See Figure 1b 200 VT IN IN to VT (IN0, /IN0, IN1, /IN1) Note 6 mV 1.28 V Notes: 1. Permanent device damage may occur if “Absolute Maximum Ratings” are exceeded. This is a stress rating only and functional operation is not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to “Absolute Maximum Ratings” conditions for extended periods may affect device reliability. 2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings. 3. Due to the limited drive capability, use for input of the same package only. 4. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the device’s most negative potential (GND) on the PCB. ψJB uses 4-layer θJA in still-air number, unless otherwise stated. 5. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. 6. VIH (min) not lower than 1.2V. M0643-012704 3 Precision Edge™ SY58018U Micrel LVPECL OUTPUT DC ELECTRICAL CHARACTERISTICS(7) VCC = 2.5V ±5% or 3.3V ±10%; TA= –40°C to +85°C; RL = 50Ω to VCC–2V, unless otherwise stated. Symbol Parameter Condition Min Typ Max Units VOH Output HIGH Voltage Q, /Q VCC – 1.145 VCC – 0.895 V VOL Output LOW Voltage Q, /Q VCC – 1.945 VCC – 1.695 V VOUT Output Differential Swing Q, /Q See Figure 1a 550 800 mV VDIFF_OUT Differential Output Voltage Swing Q, /Q See Figure 1b 1100 1600 mV Min Typ LVTTL/CMOS DC ELECTRICAL CHARACTERISTICS(7) VCC = 2.5V ±5% or 3.3V ±10%; TA= -40°C to 85°C Symbol Parameter Condition VIH Input HIGH Voltage VIL Input LOW Voltage 0.8 V IIH Input HIGH Current 40 µA IIL Input LOW Current 2.0 –300 Note: 7. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. M0643-012704 Max 4 Units V µA Precision Edge™ SY58018U Micrel AC ELECTRICAL CHARACTERISTICS(8) VCC = 2.5V ±5% or 3.3V ±10%; TA= –40°C to 85°C, RL = 50Ω to VCC – 2V, unless otherwise stated. Symbol Parameter Condition fMAX Maximum Operating Frequency Min NRZ Data VOUT ≥ 400mV tpd tpd Tempco tJITTER 110 50 Input-to-Input Skew Data Clock 190 180 GHz 240 350 75 Note 9 Units Gbps 4 Differential Propagation Delay Temperature Coefficient tSKEW Max 5 Clock Differential Propagation Delay (IN0 or IN1-to-Q) (SEL-to-Q) Typ 4 ps ps fs/°C 15 ps Part-to-Part Skew Note 10 100 ps Random Jitter Note 11 1 psrms Deterministic Jitter Note 12 10 psp-p Cycle-to-Cycle Jitter Note 13 1 psrms Total Jitter Note 14 10 psp-p Note 15 0.7 psrms 110 ps Crosstalk-Induced Jitter tr, tf Output Rise/Fall Time 20% to 80%, at full swing 35 75 Notes: 8. High frequency AC parameters are guaranteed by design and characterization. 9. Input-to-input skew is the difference in time from and input-to-output in comparison to any other input-to-output. In addition, the input-to-input skew does not include the output skew. 10. Part-to-part skew is defined for two parts with identical power supply voltages at the same temperature and with no skew of the edges at the respective inputs. 11. RJ is measured with a K28.7 comma detect character pattern, measured at 10.7Gbps and 2.5Gbps/3.2Gbps. 12. DJ is measured at 2.5Gbps/3.2Gbps, with both K28.5 and 223 – 1 PRBS pattern. 13. Cycle-to-cycle jitter definition: the variation of periods between adjacent cycles, Tn – Tn–1 where T is the time between rising edges of the output signal. 14. Total jitter definition: with an ideal clock input of frequency ≤ fMAX no more than one output edge in 1012 output edges will deviate by more than the specified peak-to-peak jitter value. 15. Crosstalk is measured at the output while applying two similar frequencies that are asynchronous with respect to each other at the inputs. M0643-012704 5 Precision Edge™ SY58018U Micrel SINGLE-ENDED AND DIFFERENTIAL SWINGS VDIFF_IN, VDIFF_OUT 1600mV (Typ.) VIN, VOUT 800mV (Typ.) Figure 1a. Single-Ended Voltage Swing Figure 1b. Differential Voltage Swing TIMING DIAGRAMS IN0 /IN0 tpd Q /Q SEL tpd tpd Q /Q M0643-012704 6 Precision Edge™ SY58018U Micrel TYPICAL OPERATING CHARACTERISTICS VCC = 3.3V, VIN = 100mV, TA = 25°C, unless otherwise stated. Propagation Delay vs. Input Voltage Swing Propagation Delay vs. Temperature 166 PROPAGATION DELAY (ps) PROPAGATION DELAY (ps) 188 186 184 182 180 178 176 174 172 170 -40 -20 0 164 163 162 161 160 100 200 300 400 500 600 700 800 20 40 60 80 100 120 INPUT VOLTAGE SWING (mV) TEMPERATURE (°C) Output Amplitude vs. Frequency OUTPUT AMPLITUDE (mV) 800 700 600 500 400 300 200 100 0 0 1 2 3 4 5 6 7 8 9 10 FREQUENCY (GHz) M0643-012704 165 7 Precision Edge™ SY58018U Micrel TYPICAL OPERATING CHARACTERISTICS VCC = 3.3V, VIN = 100mV, TA = 25°C, unless otherwise stated. Output Swing (200mV/div.) 1.25GHz Output Output Swing (200mV/div.) 200MHz Output TIME (100ps/div.) 2.5Gbps Output 3.2Gbps Output Output Swing (200mV/div.) Output Swing (200mV/div.) TIME (600ps/div.) TIME (100ps/div.) (223—1PRBS) TIME (100ps/div.) (223—1PRBS) Output Swing (200mV/div.) 5Gbps Output TIME (25ps/div.) (223—1PRBS) M0643-012704 8 Precision Edge™ SY58018U Micrel INPUT AND OUTPUT STAGES VCC VCC IN 50Ω VT GND 50Ω /Q /IN Q Figure 2a. Simplified Differential Input Stage Figure 2b. Simplified LVPECL Output Stage INPUT INTERFACE APPLICATIONS VCC VCC VCC IN LVPECL IN /IN SY58018U IN PECL CML /IN /IN GND VCC Rpd VT 0.01µF Rpd SY58018U GND GND Rpd GND For VCC = 3.3V, Rpd = 50Ω For VCC = 2.5V, Rpd = 19Ω Figure 3a. DC-Coupled LVPECL Interface VCC —1.4V VT For 3.3V, Rpd = 100Ω For 2.5V, Rpd = 50Ω Figure 3b. AC-Coupled LVPECL Interface VCC IN CML IN /IN LVDS SY58018U /IN GND SY58018U VT GND NC Figure 3d. AC-Coupled CML Interface M0643-012704 NC VT (Option: May connect VT to VCC) VCC VCC —1.4V SY58018U VT Figure 3e. LVDS Interface 9 Figure 3c. DC-Coupled CML Interface Precision Edge™ SY58018U Micrel OUTPUT INTERFACE APPLICATIONS +3.3V +3.3V +3.3V ZO = 50Ω R1 130Ω +3.3V Z = 50Ω R1 130Ω +3.3V Z = 50Ω ZO = 50Ω 50Ω R2 82Ω source R2 82Ω Destination For 3.3V, Rb = 50Ω For 2.5V, Rb = 19Ω Figure 4a. Parallel Thevenin-Equivalent Termination 50Ω Rb VCC C1 0.01µF (optional) Figure 4b. Three-Resistor “Y” Termination +3.3V +3.3V R1 130Ω ZO = 50Ω R2 82Ω Figure 4c. Terminating Unused I/O RELATED MICREL PRODUCTS AND SUPPORT DOCUMENTATION Part Number Function Data Sheet Link SY58016L 3.3V 10Gbps Differential CML Line Driver/Receiver with Internal I/O Termination http://www.micrel.com/product-info/products/sy58016l.shtml SY58017U Ultra Precision Differential CML 2:1 Mux with Internal I/O Termination http://www.micrel.com/product-info/products/sy58017u.shtml SY58019U Ultra Precision Differential 400mV LVPECL 2:1 Mux with Internal Termination http://www.micrel.com/product-info/products/sy58019u.shtml SY58025U 10.7Gbps Dual 2:1 CML Mux with Internal I/O Termination http://www.micrel.com/product-info/products/sy58025u.shtml SY58026U 5Gbps Dual 2:1 Mux with Internal Termination http://www.micrel.com/product-info/products/sy58026u.shtml SY58027U 10.7Gbps Dual 2:1 400mV LVPECL Mux with Internal Termination http://www.micrel.com/product-info/products/sy58027u.shtml SY58051U 10.7Gbps AnyGate® with Internal Input and Output Termination http://www.micrel.com/product-info/products/sy58051u.shtml SY58052U 10Gbps Clock/Data Retimer with 50Ω Input Termination http://www.micrel.com/product-info/products/sy58052u.shtml MLF™ Application Note www.amkor.com/products/notes_papers/MLF_AppNote_0902.pdf HBW Solutions New Products and Applications M0643-012704 www.micrel.com/product-info/products/solutions.shtml 10 Precision Edge™ SY58018U Micrel 16 LEAD MicroLeadFrame™ (MLF-16) 0.42 +0.18 –0.18 0.23 +0.07 –0.05 0.85 +0.15 –0.65 0.01 +0.04 –0.01 3.00BSC 1.60 +0.10 –0.10 0.65 +0.15 –0.65 0.42 0.20 REF. 2.75BSC PIN 1 ID +0.18 –0.18 N 16 1 1 0.50 DIA 2 2 2.75BSC 3.00BSC 3 3 1.60 +0.10 –0.10 4 4 12° max 0.5 BSC 0.42 +0.18 –0.18 SEATING PLANE 0.40 +0.05 –0.05 1.5 REF BOTTOM VIEW TOP VIEW CC 0.23 +0.07 –0.05 CL 4 0.01 +0.04 –0.01 SECTION "C-C" SCALE: NONE 0.5BSC 1. 2. 3. 4. DIMENSIONS ARE IN mm. DIE THICKNESS ALLOWABLE IS 0.305mm MAX. PACKAGE WARPAGE MAX 0.05mm. THIS DIMENSION APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.20mm AND 0.25mm FROM TIP. 5. APPLIES ONLY FOR TERMINALS FOR EVEN TERMINAL/SIDE Rev. 02 Package EP- Exposed Pad Die CompSide Island Heat Dissipation Heat Dissipation VEE Heavy Copper Plane VEE Heavy Copper Plane PCB Thermal Consideration for 16-Pin MLF™ Package (Always solder, or equivalent, the exposed pad to the PCB) Package Notes: 1. Package meets Level 2 qualification. 2. All parts are dry-packaged before shipment. 3. Exposed pads must be soldered to a ground for proper thermal management. MICREL, INC. 1849 FORTUNE DRIVE SAN JOSE, CA 95131 TEL + 1 (408) 944-0800 FAX + 1 (408) 944-0970 WEB USA http://www.micrel.com The information furnished by Micrel in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use. Micrel reserves the right to change circuitry and specifications at any time without notification to the customer. Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser’s use or sale of Micrel Products for use in life support appliances, devices or systems is at Purchaser’s own risk and Purchaser agrees to fully indemnify Micrel for any damages resulting from such use or sale. © 2003 Micrel, Incorporated. M0643-012704 11