Infineon BGS13AL12 Sp3t antenna switch with antenna termination port Datasheet

BGS13AL12
SP3T Antenna Switch with Antenna Termination Port
Data Sheet
Revision 1.1, 2009-06-25
Preliminary
Industrial & Multimarket
Edition 2009-06-25
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2009 Infineon Technologies AG
All Rights Reserved.
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The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
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and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
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BGS13AL12
SP3T RF Switch
BGS13AL12, SP3T Antenna Switch with Antenna Termination Port
Revision History: 2009-06-25, Revision 1.1
Previous Revision: 2009-05-04, Revision 1.0
Page
Subjects (major changes since last revision)
Converted to the new IFX FrameMaker Template.
9
Pin13 Pin Description
11,12
Electrical Specifications
13
Application Board, Deembedding Board
14
Pin Marking
Trademarks of Infineon Technologies AG
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GOLDMOS™, HITFET™, HybridPACK™, ISAC™, ISOFACE™, IsoPACK™, my-d™, MIPAQ™, ModSTACK™,
NovalithIC™, OmniTune™, OmniVia™, OPTIVERSE™, OptiMOS™, ORIGA™, PROFET™, PRO-SIL™,
PrimePACK™, RASIC™, ReverSave™, SCEPTRE™, SEROCCO™, SICOFI™, SMARTi™, SMINT™,
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Other Trademarks
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licensed by AUTOSAR development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum.
COLOSSUS™, FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of
Epcos AG. FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium.
HYPERTERMINAL™ of Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of
Infrared Data Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION.
MATLAB™ of MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of
Mentor Graphics Corporation. Mifare™ of NXP. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc.,
USA. muRata™ of MURATA MANUFACTURING CO. OmniVision™ of OmniVision Technologies, Inc.
Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc. RFMD™ RF Micro Devices, Inc. SIRIUS™ of
Sirius Sattelite Radio Inc. SOLARIS™ of Sun Microsystems, Inc. SPANSION™ of Spansion LLC Ltd. Symbian™
of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™
of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™ of X/Open Company Limited. VERILOG™,
PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas Instruments Incorporated. VXWORKS™,
WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes Zetex Limited.
Last Trademarks Update 2009-05-27
Preliminary Data Sheet
3
Revision 1.1, 2009-06-25
BGS13AL12
SP3T RF Switch
Table of Contents
Table of Contents
Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
List of Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
List of Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2
Signals Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3
3.1
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Electrical Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4
4.1
Application Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Deembedding Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5
Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Preliminary Data Sheet
4
Revision 1.1, 2009-06-25
BGS13AL12
SP3T RF Switch
List of Figures
List of Figures
Figure 1
Figure 2
Figure 3
Figure 4
Figure 5
Figure 6
Figure 7
Functional Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Pin Configuration (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Application Board with External Parallel Inductor L1 (15 nH) at Ant Port . . . . . . . . . . . . . . . . . . . . 13
Deembedding Board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Pin Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Land Pattern and Stencil Mask. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Preliminary Data Sheet
5
Revision 1.1, 2009-06-25
BGS13AL12
SP3T RF Switch
List of Tables
List of Tables
Table 1
Table 2
Table 3
Table 4
Table 5
Table 6
Table 7
Pin Description (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Truth Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
ESD Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Electrical Characteristics (cont’d) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Preliminary Data Sheet
6
Revision 1.1, 2009-06-25
SP3T RF Switch
6
5
4
GND
7
3
Term
ANT
8
2
RF3
GND
9
1
GND
11
12
CTRLB
10
CTRLA
•
•
•
•
•
•
•
•
•
•
3 high-linearity Rx ports with power handling capability of up to
30 dBm
Antenna Termination Port
No external decoupling components required
Small leadless package TSLP12
High ESD robustness
Low harmonic generation
Low insertion loss
High port-to-port-isolation
0.1 to 3.0 GHz coverage
On-chip control logic supporting logic levels from 1.4 V to 3.0 V
Lead and halogen free package (RoHS and WEEE compliant)
Vdd
•
RF2
Main Features:
GND
Features
RF1
1
BGS13AL12
Applications
•
•
•
•
WCDMA diversity
CDMA diversity
Analog and Digital Tuner
Band Switching
Product Name
Product Type
Package
SP3T RF Switch
BGS13AL12
PG-TSLP-12-3
Preliminary Data Sheet
7
Revision 1.1, 2009-06-25
BGS13AL12
SP3T RF Switch
Features
Description
The BGS13AL12 RF MOS switch is specifically designed for WCDMA diversity applications. An additional 4th port
allows proper termination of the antenna when turned off.
This SP3T offers low insertion loss and high robustness against interferer signals at the antenna port, while
maintaining a very small size of only 2.0 x 2.0 mm² and a maximum height of only 0.4 mm
The on-chip controller integrates CMOS logic and level shifters, driven by control inputs from 1.4 to 3.0 V. Unlike
GaAs technology, external DC blocking capacitors at the RF Ports are only required if DC voltage is applied
externally.
The BGS13AL12 RF Switch is manufactured in Infineon’s patented MOS technology, offering the performance of
GaAs with the economy and integration of conventional CMOS including the inherent higher ESD robustness.
Ant
RF1
RF2
Rext
RF3
Decoder
+ESD
GND
Vdd
Ctrl A
Ctrl B
BGS 13A_F unctional_ D iagram m .vsd
Figure 1
Functional Diagram
Preliminary Data Sheet
8
Revision 1.1, 2009-06-25
BGS13AL12
SP3T RF Switch
Signals Description
2
Signals Description
Table 1
Pin Description (top view)
Buffer Type
Function
1
GND
GND
Ground
2
RF3
I/O
Rx RF port 3
3
Term
I/O
Ext. Term Port
4
RF2
I/O
Rx RF port 2
5
GND
GND
Ground
6
RF1
I/O
Rx RF port 1
7
GND
GND
Ground
8
Ant
I/O
Antenna port
9
GND
GND
Ground
10
Vdd
PWR
Vdd supply
11
CTRL A
I
Control pin A
12
CTRL B
I
Control pin B
13
NC
NC
For thermal reasons recommended to connect
to Ground
RF2
Pin Type
GND
Name
RF1
Pin No.
6
5
4
GND
7
3
Term
ANT
8
2
RF3
GND
9
1
GND
12
CTRLB
11
CTRLA
Vdd
10
BGS 13A _Pinout.vsd
Figure 2
Pin Configuration (top view)
Table 2
Truth Table
Function
Ctrl A
Ctrl B
Ant → RF1
H
H
Ant → RF2
L
H
Ant → RF3
H
L
Ant → Term
L
L
Preliminary Data Sheet
9
Revision 1.1, 2009-06-25
BGS13AL12
SP3T RF Switch
Electrical Characteristics
3
Electrical Characteristics
Table 3
Absolute Maximum Ratings
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit
Note /
Test Condition
Storage Temperature Range
Tstg
-65
–
150
°C
–
DC Voltage at all pins to GND
VDC
–
–
3.2
V
–
–
–
32
dBm
–
Unit
Note /
Test Condition
Max RF power at antenna port, any RF port on PAnt IN max
Table 4
Operating Ranges
Parameter
Symbol
Values
Min.
Typ.
Max.
Ambient Temperature
TA
-30
–
85
°C
–
RF Frequency
f
0.1
–
3
GHz
–
Control Voltage low
VCtrlL
-0.3
–
0.3
V
–
Control Voltage high
VCtrlH
1.4
–
Vdd
V
–
Supply Voltage
Vdd
2.70
–
3.0
V
–
Max. Input (Reverse) Power at antenna pin
Pin
–
–
30
dBm
–
Unit
Note /
Test Condition
Table 5
ESD Ratings
Parameter
Symbol
Values
Min.
Typ.
Max.
Human Body-Model IEC 61340-3-1, all pins
Vmax
–
–
500
V
–
Human Body-Model IEC 61340-3-1, antenna
port
Vmax
–
–
1000
V
–
ESD robustness of antenna port can be increased to 8 kV IEC-61000-4-2 with external protection circuit.
Attention: Stresses above the max. values listed here may cause permanent damage to the device.
Exposure to absolute maximum rating conditions for extended periods may affect device
reliability. Maximum ratings are absolute ratings; exceeding only one of these values may
cause irreversible damage to the integrated circuit.
Preliminary Data Sheet
10
Revision 1.1, 2009-06-25
BGS13AL12
SP3T RF Switch
Electrical Characteristics
3.1
Electrical Specification
Test Conditions:
•
•
•
•
•
Termination port impedance: Z0 = 50 Ω
Temperature range: TA = -30 °C...+85 °C
Supply Voltage: Vdd = 2.8 V
Pin = 15 dBm
Across operating range of control voltages: VCtrH = 1.4...2.8 V
Table 6
Electrical Characteristics
Parameter
Symbol
Values
Unit
Min.
Typ.
Max.
–
0.45/0.751) 0.65/1.01) dB
Note /
Test Condition
Insertion Loss
824<f<960 MHz
1)
–
1)
1.0/0.9
dB
–
1710<f<1980 MHz
–
0.8/0.7
1980<f<2170 MHz
–
0.9/0.81)
1.1/1.01)
dB
–
Inband ripple Rx ports (high bands)
–
–
0.2
dB
–
Inband ripple Rx ports (low bands)
–
–
0.2
dB
–
All ports @ 0.9 GHz
14
–
–
dB
–
All ports @ 2 GHz
12
–
–
dB
–
0.9 GHz
20
–
–
dB
–
2 GHz
20
–
–
dB
–
0.9 GHz
20
–
–
–
2 GHz
20
–
–
–
0.9 GHz
20
–
–
dB
–
2 GHz
20
–
–
dB
–
1)
Return Loss
Isolation Ant – RF1,2,3
Isolation RF1,2,3 – RF1,2,3
Isolation RF Ports – Vdd, Vctrl
1) With external parallel Inductor (15 nH) at Ant port
Preliminary Data Sheet
11
Revision 1.1, 2009-06-25
BGS13AL12
SP3T RF Switch
Electrical Characteristics
Table 7
Electrical Characteristics (cont’d)
Parameter
Symbol
Values
Unit
Note /
Test Condition
Min.
Typ.
Max.
Tx=10 dBm@ ant port, Int= -15 dBm @ant port
(TX Freq = 824 - 915 MHz)
–
-115
-100
dBm
–
Tx=10 dBm@ ant port, Int= -15 dBm @ant port
(TX Freq=1710 - 1980 MHz)
–
-110
-100
dBm
–
Tx=10 dBm@ ant port, Int= -15 dBm @ant
port(TX Freq = 824 - 915 MHz)
–
-110
-107
dBm
–
Tx=10 dBm@ ant port, Int= -15 dBm @ant port
(TX Freq=1710 - 1980 MHz)
–
-110
-107
dBm
–
Tx1=21.5 dBm, Tx2=21.5 dBm, Int=-30 dBm
(650 MHz - 900 MHz)
–
-83
–
dBc
–
Tx1=21.5 dBm, Tx2=21.5 dBm, Int=-30 dBm
(1710 MHz - 2155 MHz)
–
-82
–
dBc
–
Pin (UMTS) = 23 dBm, Duty Cyle = 100%,
unused RF pins = any load, VSWR = 4:1
–
–
–
–
–
1 GHz
–
–
-46
dBm
–
2 GHz
–
–
-46
dBm
–
1)
Input Intercept Point Requirements - IMD2
Input Intercept Point Requirements – IMD31)
Triple Beat Ratio
Harmonic Generation RF ports up to 12.75 GHz
Harmonic Generation Termination port up to 12.75 GHz
Pin (UMTS) = 30 dBm at low band, 22 dBm at
high band, Duty Cycle = 25%
–
–
–
–
–
1 GHz, Second Harmonic
–
–
-40
dBm
–
1 GHz, all other Harmonics up to 12.75GHz
–
–
-46
dBm
2 GHz
–
–
-44
dBm
On/Off Switching Time (10-90%) RF
–
–
5
μs
Current Consumption at Vdd Pin
–
200
500
μA
–
Current Consumption at Vctrl Pins
–
<1
30
μA
–
–
Switching Time and Current Consumtion
1) With external parallel Inductor (15 nH) at Ant port
Preliminary Data Sheet
12
Revision 1.1, 2009-06-25
BGS13AL12
SP3T RF Switch
Application Board
4
Application Board
XXX X
13
L1
Vdd V1
V2 GND
BGS 13AL12 _application _board .vsd
Figure 3
Application Board with External Parallel Inductor L1 (15 nH) at Ant Port
4.1
Deembedding Board
BGS 13AL 12_D eem bedding _ board.vsd
Figure 4
Deembedding Board
Preliminary Data Sheet
13
Revision 1.1, 2009-06-25
BGS13AL12
SP3T RF Switch
Package Outlines
5
Package Outlines
Package_Outlines.vsd
Figure 5
Package Outlines
Figure 6
Pin Marking
Preliminary Data Sheet
14
Revision 1.1, 2009-06-25
BGS13AL12
SP3T RF Switch
Package Outlines
Land_ Pattern_Stencil_M ask.vsd
Figure 7
Land Pattern and Stencil Mask
Preliminary Data Sheet
15
Revision 1.1, 2009-06-25
w w w . i n f i n e o n . c o m
Published by Infineon Technologies AG
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