Precision Edge™ 3.3V/5V 3GHz PECL/ECL 2:1 MULTIPLEXER Micrel Precision Edge™ SY89208V SY89208V FEATURES ■ 2:1 PECL/ECL multiplexer ■ Guaranteed AC-performance over temperature/ voltage • >3GHz fMAX (toggle) • <200ps rise/fall time • <420ps propagation delay (D-to-Q) ■ Low jitter performance • <1ps(rms) random jitter • <15ps(pk-pk) deterministic jitter • <10ps(pk-pk) total jitter (clock) ■ Flexible supply voltage: 3V to 5.5V 100k ECL/PECL compatible output ■ Wide operating temperature range: –40°C to +85°C ■ Available in ultra-small 8-pin MLF™ (2mm x 2mm) package Precision Edge™ DESCRIPTION The SY89208V is a 3.3V/5V precision high-speed 2:1 multiplexer. It is functionally equivalent to the SY100EP58V but in an ultra-small 8-lead MLF™ package that features a 70% smaller footprint. The signal-path inputs (Da and Db) are single-ended PECL/ECL compatible, and can accept a signal swing as low as 150mV. All I/O pins are 10k/100k EP ECL/PECL compatible. AC-performance is guaranteed over the industrial –40°C to +85°C temperature range and 3.0V to 5.5V supply voltage range. Maximum throughput (fMAX) is guaranteed to be 3GHz with a differential output swing ≥400mV. In addition, these multiplexers are optimized for low-jitter applications. The SY89208V is designed to operate in either ECL/PECL or PECL/LVPECL mode. The SY89208V is internally temperature compensated, thus is 100k EP ECL/PECL compatible—I/O logic levels remain constant over temperature. The SY89208V is part of Micrel’s high-speed, Precision Edge™ timing and distribution family. For applications that require a differential I/O combination, consult the Micrel website at www.micrel.com , and choose from a comprehensive product line of high-speed, low skew fanout buffers, translators, and clock dividers. APPLICATIONS ■ ■ ■ ■ SONET Gig Ethernet Fibre Channel Transponders TYPICAL PERFORMANCE Single-Ended PECL Da 1 Q Single-Ended PECL Db 0 /Q Output Swing (60mV/div.) FUNCTIONAL BLOCK DIAGRAM SEL (PECL/ECL) TIME (50ps/div.) 2.7Gbps, 223 – 1PRBS Precision Edge is a trademark of Micrel, Inc. MicroLeadFrame and MLF are trademarks of Amkor Technology, Inc. Rev.: A 1 Amendment: /0 Issue Date: June 2003 Precision Edge™ SY89208V Micrel PACKAGE/ORDERING INFORMATION Ordering Information NC 1 8 VCC Part Number DA 2 7 Q SY89208VMITR* DB 3 6 /Q SEL 4 5 VEE Package Type Operating Range Package Marking MLF-8 Industrial 208 *Tape and Reel 8-Pin MLF™ Ultra-Small Outline (2mm x 2mm) PIN DESCRIPTION Pin Number Pin Name Type 2, 3 DA, DB 100k ECL Input Pin Function Single-ended PECL/ECL Inputs: The signal inputs include internal 75kΩ pull-down resistors. Default condition is LOW when left floating. The input signal should be terminated externally. 4 SEL 100k ECL Input Single-ended PECL/ECL Input: PECL/ECL compatible 2:1 mux select. See Truth Table. Includes internal 75kΩ pull-down resistor. Default condition is LOW when left floating. 5 VEE Exposed Pad Negative Power Supply 6, 7 /Q, Q 100k ECL Output 8 VCC Power 1 NC Negative Power Supply: VEE and Exposed pad must be tied to most negative supply. For PECL/LVPECL connect to ground. Differential PECL/LVPECL Output: 100k ECL/ output defaults to LOW if D inputs left open. See “Output Interface Applications” section for recommendations on terminations. Positive Power Supply: Bypass with 0.1µF//0.01µF low ESR capacitors. Not connected. MUX SELECT TRUTH TABLE SEL DATA OUT (Q, /Q) L DB Input Selected H DA Input Selected 2 Precision Edge™ SY89208V Micrel Absolute Maximum Ratings(Note 1) Operating Ratings(Note 2) Supply Voltage (VCC) ................................. –0.5V to + 6.0V Input Voltage (VIN) ......................................... –0.5V to VCC LVPECL Output Current (IOUT) Continuous ............................................................. 50mA Surge .................................................................... 100mA Input Current Source or sink current on D, /D ............................ ±50mA Lead Temperature (soldering, 10 sec.) ................... +220°C Storage Temperature (TS) ....................... –65°C to +150°C Supply Voltage (|VCC–VEE|) .. LVPECL/LVECL 3.0V to 3.6V .............................................. PECL/ECL 4.5V to 5.5V Ambient Temperature (TA) ......................... –40°C to +85°C Package Thermal Resistance Note 3 MLF™ (θJA) Still-Air ................................................................. 93°C/W 500lfpm ............................................................... 87°C/W MLF™ (ΨJB), Junction-to-Board ................................................ 60°C/W DC ELECTRICAL CHARACTERISTICS(Note 4) Symbol Parameter VCC Power Supply Voltage IEE Supply Current IIH Input HIGH Current IIL Input LOW Current CIN Input Capacitance Condition Min Typ Max Units 4.5 3.0 –5.5 –3.6 5.0 — –5.0 –3.3 5.5 3.6 –4.5 –3.0 V V V V No load — 35 50 mA VIN = VIH — — 80 µA VIN = VIL 0.5 — — µA — 1.0 — pF (PECL) (LVPECL) (ECL) (LVECL) All Inputs PECL/ECL (100K) DC ELECTRICAL CHARACTERISTICS(Note 4) VCC = +3.3V±10% or +5V±10% and VEE = 0V; VCC = 0V and VEE = –3.3V±10% or –5V±10%; TA = –40°C to +85°C unless otherwise noted. Symbol Parameter Condition Min Typ Max Units VOH Output HIGH Voltage Note 5 VCC–1.145 — VCC–0.895 V VOL Output LOW Voltage Note 5 VCC–1.945 — VCC–1.695 V VIH Input HIGH Voltage VCC–1.225 — VCC–0.88 V VIL Input LOW Voltage VCC–1.945 — VCC–1.625 V VIHCMR Input HIGH Voltage Common Mode Range VEE+2.0 — VCC V VBB Bias Voltage Note 6 VCC–1.525 VCC–1.425 VCC–1.325 3 V Precision Edge™ SY89208V Micrel AC ELECTRICAL CHARACTERISTICS VCC = +3.3V±10% or +5V±10% and VEE = 0V; VCC = 0V and VEE = –3.3V±10% or –5V±10%; TA = –40°C to +85°C unless otherwise noted. Symbol Parameter Condition Min Typ Max Units fMAX Max. Toggle Frequency Note 7 3 — — GHz tpd Propagation Delay (Differential) SEL to Q, /Q; D to Q, /Q 170 230 420 ps tSKEW Part-to-Part Skew Note 8 — — 200 ps tJITTER Cycle-to-Cycle Jitter (rms) Note 9 — — 1 ps(rms) Random Jitter Note 10 — — 1 ps(rms) Deterministic Jitter @1.25Gbps @2.5Gbps Note 11 Note 10 — — 7 10 — — ps(pk-pk) ps(pk-pk) Total Jitter Note 12 — — 10 ps(pk-pk) VIN Differential Input Voltage Range 150 800 1200 mV tr, tf Output Rise/Fall Time (20% to 80%) 90 140 200 ps Q, /Q Note 1. Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. This is a stress rating only and functional operation is not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to ABSOLUTE MAXIMUM RATlNG conditions for extended periods may affect device reliability. Note 2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings. Note 3. Package Thermal Resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB. Note 4. The device is guaranteed to meet the DC specifications, shown in the table above, after thermal equilibrium has been established. Note 5. Output loaded with 50Ω to VCC–2V. Note 6. Note 7. Note 8. VIHCMR(min) varies 1:1 with VEE, (max) varies 1:1 with VCC. Measured with 750mV input signal, 50% duty cycle. Output swing ≥ 400mV. All loading with a 50Ω to VCC –2.0V. Skew is measured between outputs under identical transitions. Duty cycle skew is defined only for differential operation when the delays are measured from the cross point of the inputs to the cross point of the outputs. Note 9. The variation in period between adjacent cycles over a random sample of adjacent cycle pairs. tJITTER_CC = tn– tn + 1, where t is the time between rising edges of the output signal. Note 10. Random jitter is measured with a K28.7 comma detect character pattern, measured at 1.25Gbps and 2.5Gbps. Note 11. Deterministic jitter is measured at 1.25Gbps and 2.5Gbps, with both K28.5 and 223–1 PRBS pattern. Note 12. Total Jitter definition with an ideal clock input, no more than 1 output edge in 1012 output edges will deviate by more than specified peak-to-peak jitter value. 4 Precision Edge™ SY89208V Micrel TYPICAL OPERATING CHARACTERISTICS VCC = 3.3V, VEE = GND, TA = 25°C, unless otherwise stated. Output Amplitude vs. Frequency Propagation Delay vs. Temperature PROPAGATION DELAY (ps) OUTPUT AMPLITUDE (mV) 1000 900 800 700 VIN = 800mV 600 500 400 100 600 1100 1600 2100 2600 3100 FREQUENCY (MHz) 300 290 280 270 VIN = 800mV 260 250 240 230 220 210 200 -40 -20 0 20 40 60 80 100 TEMPERATURE (°C) 1.5GHz Output 500MHz Output VIN = 800mV /Q Output Swing (200mV/div.) Output Swing (200mV/div.) VIN = 800mV Q /Q Q TIME (300ps/div.) TIME (100ps/div.) 2.5GHz Output 3.0GHz Output VIN = 800mV Output Swing (200mV/div.) Output Swing (200mV/div.) VIN = 800mV /Q Q TIME (60ps/div.) /Q Q TIME (55ps/div.) 5 Precision Edge™ SY89208V Micrel LVPECL OUTPUT INTERFACE APPLICATIONS VCC VCC R1 R1 VCC VCC ZO = 50Ω VCC ZO = 50Ω ZO = 50Ω ZO = 50Ω 50Ω VCC —2V R2 50Ω R2 VCC = 3.3V; Rpd = 50Ω VCC = 5V; Rpd = 100Ω VCC = 3.3V; R1 = 130Ω, R2 = 82Ω VCC = 5V; R1 = 83Ω, R2 = 125Ω VCC —2V Figure 1b. Three Resistor “Y Termination” Figure 1a. Parallel Thevenin-Equivalent Termination VCC VCC VCC R1 R3 R1 VCC ZO = 50Ω R2 VCC —2V Rpd R4 R2 VCC —1.3V VCC = 3.3V; R1 = 130Ω, R2 = 82Ω, R3 = 1kΩ, R4 = 1.6kΩ, VCC = 5V; R1 = 83Ω, R2 = 125Ω, R3 = 1kΩ, R4 = 2.8kΩ, Figure 1c. Terminating Unused I/O 6 C (Optional) 0.01µF Precision Edge™ SY89208V Micrel 8 LEAD ULTRA-SMALL EPAD-MicroLeadFrame™ (MLF-8) Package EP- Exposed Pad Die CompSide Island Heat Dissipation Heat Dissipation VEE Heavy Copper Plane VEE Heavy Copper Plane PCB Thermal Consideration for 8-Pin MLF™ Package Package Notes: Note 1. Package meets Level 2 qualification. Note 2. All parts are dry-packaged before shipment. Note 3. Exposed pads must be soldered to the most negative supply plane, equivalent to VEE for proper thermal management. MICREL, INC. TEL 1849 FORTUNE DRIVE SAN JOSE, CA 95131 + 1 (408) 944-0800 FAX + 1 (408) 944-0970 WEB USA http://www.micrel.com The information furnished by Micrel in this datasheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use. Micrel reserves the right to change circuitry and specifications at any time without notification to the customer. Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser’s use or sale of Micrel Products for use in life support appliances, devices or systems is at Purchaser’s own risk and Purchaser agrees to fully indemnify Micrel for any damages resulting from such use or sale. © 2003 Micrel, Incorporated. 7