Rohm BR24C21F-E2 Standard eeproms plug & play eeprom Datasheet

Datasheet
Standard EEPROMs
Plug & Play EEPROMs
(for Display)
BR24C21xxx Series (1K)
●General Description
TM
TM
BR24C21F,BR24C21FJ,BR24C21FV are serial EEPROMs that support DDC1 /DDC2 interfaces for Plug and Play
displays
●Packages W(Typ.) x D(Typ.) x H(Max.)
●Features
TM
TM
„ Compatible with both DDC1 /DDC2
„ Operating voltage range: 2.5V to 5.5V
„ Page write function: 8bytes
„ Low power consumption
¾
Active (at 5V)
: 1.5mA (typ)
¾
Stand-by (at 5V) : 0.1µA (typ)
„ Address auto increment function during Read
operation
„ Data security
¾ Write enable feature (VCLK)
¾ Write protection at low Vcc
„ Initial data=FFh
„ Data retention: 10years
„ Rewriting possible up to 100,000 times
SOP8
DIP-T8
9.30mm x 6.50mm x 7.10mm
5.00mm x 6.20mm x 1.71mm
SOP- J8
4.90mm x 6.00mm x 1.65mm
●BR24C21xxx series
Capacity
Type
1Kbit
BR24C21
Power source Voltage
2.5V to 5.5V
●Absolute Maximum Ratings
Parameter
Symbol
Supply Voltage
VCC
DIP-T8
●
SOP8
●
Ratings
Unit
-0.3 to +6.5
V
800(DIP-T8)
Power Dissipation
Pd
Tstg
Operating Temperature
Terminal Voltage
SSOP-B8
●
Remarks
When using at Ta=25℃ or higher 8.0mW to be reduced per 1℃.
450 (SOP8)
mW
450 (SOP-J8)
350(SSOP-B8)
Storage Temperature
SOP-J8
●
SSOP-B8
3.00mm x 6.40mm x 1.35mm
When using at Ta=25℃ or higher 4.5mW to be reduced per 1℃.
When using at Ta=25℃ or higher 4.5mW to be reduced per 1℃.
When using at Ta=25℃ or higher 3.5mW to be reduced per 1℃.
-65 to +125
℃
Topr
-40 to +85
℃
‐
-0.3 to Vcc+0.3
V
●Memory cell characteristics
Parameter
Write/Erase Cycle
Data Retention
Min.
100,000
10
Limits
Typ.
-
-
○Product structure:Silicon monolithic integrated circuit
.www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・14・001
Max
-
-
Unit
Times
Years
○This product is not designed protection against radioactive rays
1/18
TSZ02201-0R2R0G100270-1-2
30.Oct.2012 Rev.002
Datasheet
BR24C21xxx Series (1K)
●Recommended Operating Ratings
Parameter
Symbol
Supply Voltage
VCC
Input voltage
VIN
Ratings
2.5 to 5.5
0 to Vcc
Unit
V
●Electrical characteristics
DC (Unless otherwise specified, Ta=-40℃ to +85℃、VCC=2.5V to 5.5V)
Parameter
“H” Input Voltage 1
“L” Input Voltage 1
“H” Input Voltage 2
“L” Input Voltage 2
“L” Input Voltage 3
“L” Output Voltage
Input Leakage Current
Output Leakage Current
Operating Current
Standby Current
Symbol
VIH1
VIL1
VIH2
VIL2
VIL3
VOL
ILI
ILO
ICC
ISB
Limits
Min.
Typ.
Max.
0.7VCC
2.0
-1
-1
-
10
0.3VCC
0.8
0.2VCC
0.4
1
1
3.0
100
Unit
V
V
V
V
V
V
µA
µA
mA
µA
Condition
SCL, SDA
SCL, SDA
VCLK
VCLK, VCC≧4.0V
VCLK, VCC<4.0V
SDA, IOL=3.0mA
SCL, VCLK, VIN=0V to VCC
SDA, VOUT=0V to VCC
VCC=5.5V, fSCL=400kHz
VCC=5.5V, SDA=SCL=VCC,VCLK=GND *1
*1 Transmit-Only Mode - After power on, the BR24C21/F/FJ/FV is in Standby mode and does not provide the clock to the VCLK pin.
After the clock is provided to VCLK, the device is switched from Standby to Transmit-Only Mode, and the operating current flows.
Bi-directional Mode - The BR24C21/F/FJ/FV is in Standby mode after each command is performed.
AC (Unless otherwise specified, Ta=-40℃ to +85℃,VCC=2.5V to 5.5V)
Parameter
Fast-mode
VCC=2.5V to 5.5V
Symbol
Standard-mode
VCC=2.5V to 5.5V
Unit
Min.
Typ.
Max.
Min.
Typ.
Max.
fSCL
-
-
400
-
-
100
kHz
Data Clock High Period
Data Clock Low Period
SDA and SCL Rise Time
SDA and SCL Fall Time
Start Condition Hold Time
Start Condition Setup Time
Input Data Hold Time
tHIGH
tLOW
tR
tF
tHD:STA
tSU:STA
tHD:DAT
0.6
1.3
0.6
0.6
0
-
0.3
0.3
-
4.0
4.7
4.0
4.7
0
-
1.0
0.3
-
µs
Input Data Setup Time
tSU:DAT
100
-
-
250
-
-
ns
Output Data Delay Time(SCL)
Stop Condition Setup Time
Bus Free Time
Write Cycle Time
Noise Spike Width (SDA and SCL)
tPD
tSU:STO
tBUF
tWR
tI
0.6
1.3
-
-
0.9
10
0.1
0.2
4.0
4.7
-
-
3.5
10
0.1
µs
µs
µs
ms
µs
-
1.0
0.5
0.1
4.0
4.7
0
4.0
0
-
-
2.0
1.0
0.1
µs
µs
µs
µs
µs
µs
µs
µs
Clock Frequency
µs
µs
µs
µs
µs
ns
AC OPERATING CHARACTERISTICS (Transmit-Only Mode)
Output Data Delay Time(VCLK)
VCLK High Period
VCLK Low Period
VCLK Setup Time
VCLK Hold Time
Mode Transition Time
Transmit-Only Powerup Time
Noise Spike Width (VCLK)
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
tVPD
tVHIGH
tVLOW
tVSU
tVHD
tVHZ
tVPU
tVI
0.6
1.3
0
0.6
0
-
2/18
TSZ02201-0R2R0G100270-1-2
30.Oct.2012 Rev.002
Datasheet
BR24C21xxx Series (1K)
●Block Diagram
N.C. 1
1 Kbit
EEPROM
ARRAY
ADDRESS
SLAVE・WORD
7bit
DECODER
DATA
ADDRESS REGISTER
START
N.C. 3
VCC
7
VCLK
6
SCL
5
SDA
8bit
7bit
N.C. 2
8
REGISTER
STOP
CONTROL LOGIC
ACK
GND 4
HIGH VOLTAGE
VCC LEVEL DETECT
●Pin Configuration
(TOP VIEW)
VCC
VCLK
SCL
SDA
BR24C21
BR24C21F
BR24C21FJ
BR24C21FV
N.C.
N.C.
N.C.
GND
●Pin Descriptions
Pin Name
I/O
VCC
-
Power Supply
Functions
GND
-
Ground (0V)
N.C.
-
No Connection
SCL
IN
SDA
IN/OUT
VCLK
IN
Serial Clock Input for Bi-directional Mode
Slave and Word Address,
*1
Serial Data Input, Serial Data Output
Clock Input (Transmit-Only Mode)
Write Enable (Bi-directional Mode)
*1 An open drain output requires a pull-up resistor.
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
3/18
TSZ02201-0R2R0G100270-1-2
30.Oct.2012 Rev.002
Datasheet
BR24C21xxx Series (1K)
●Synchronous data timing
tR
tF
t HIGH
SCL
SCL
t SU:DAT
t HD:STA
t LOW
t HD:DAT
SDA
SDA
(IN)
D0
ACK
tWR
WRITE DATA(n)
t BUF
t PD
STOP CONDITION
SDA
(OUT)
Figure 2.
START CONDITION
Write Cycle Timing
START BIT
STOP BIT
SCL
SCL
tSU:STA
tHD:STA
tSU:STO
SDA
SDA
STOP BIT
START BIT
VCLK
Figure 1. Synchronous Data Timing
・SDA data is latched into the chip at the rising edge of the SCL clock.
・Output data toggles at the falling edge of the SCL clock.
WRITE COMMAND
tVSU
Figure 3.
t VHD
Write Enable Timing
●Transmit-only mode
・After power is on, the BR24C21/F/FJ/FV is in Transmit-Only Mode. In this mode data can be output by providing the clock
to the VCLK pin.
・When the power is on, the SCL pin needs to be set to VCC(High level).
・SDA is at high-impedance during input of the first 9 clocks. At the 10th rising clock edge of VCLK data is output. After
power on, the output data is as follows:
00h address data → 01h address data → 02h address data → …
The address is incremented by one, after every 9 clocks of VCLK. All addresses are output in this mode.
When the counter reaches the last address, the next output data is 00h address data. (See Figure 4.)
・In this mode, the NULL bit (High data) is output between the address data and the next address data. (See Figure 5.)
・The read operation is in Transmit-Only Mode and can be started after the power is stabilized.
tVHIGH tVLOW
Vcc
VCLK
SCL
tVPD
9
1
10
SDA
VCLK
D1
ADDRESS n
DATA
tVPU
D7
SDA
D6
D5
D4
D0
D7
NULL BIT
DATA=1
D6
ADDRESS n+1
DATA
D3
00h ADDRESS DATA
Figure 4.
Transmit Only Mode
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
Figure 5.
4/18
Null Bit
TSZ02201-0R2R0G100270-1-2
30.Oct.2012 Rev.002
Datasheet
BR24C21xxx Series (1K)
●Bi-directional mode
○Bi-directional Mode and Recovery Function
・The BR24C21/F/FJ/FV can be switched from Transmit-Only Mode to Bi-directional Mode by providing a valid High to Low
transition at the SCL pin, while the state of SDA is at high-impedance.
・After a valid high to low transition on the SCL pin, the BR24C21/F/FJ/FV begins to count the VCLK clock. If the VCLK
counter reaches 128 clocks without the command for Bi-directional Mode, the device reverts to Transmit-Only Mode
(Recovery function). The VCLK counter is reset by providing a valid high to low transition at the SCL pin. After reversal to
Transmit-Only Mode the device begins to output data (00h address data) with the 129th rising clock edge of VCLK.
・If the BR24C21/F/FJ/FV is switched from Transmit-Only Mode and receives the command for Bi-directional
Mode and responds with an Acknowledge, it is impossible to revert to Transmit-Only Mode. (Power down is the only
way to revert to Transmit-Only Mode.) Unless the input device code is “1010”, the device does not respond with an
Acknowledge. If the VCLK counter reaches 128 clocks afterwards, it is possible to revert to Transmit-Only Mode for
Recovery function. If the Master generates a STOP condition during the Slave address, before an Acknowledge is input,
it is possible to revert to Transmit-Only Mode.
・When the device is switched from Transmit-Only Mode to Bi-direction Mode, the period of tVHZ needs to be held.
Tra nsm it -o nl y
Bi-d
irectional
Bi-directional
T r a Transition
n s i t i o n Mode
M o dwith
e wpossibility
i t h p o s stoi b i l i t y
t o rreturn
e t u n to
e Transmit-Only
t o T r a n s mMode
it-Only Mode
MODE Transmit-only
1
2
3
4
Tra nsm it - On l y
Tra nsm it -o nl y
BBi-directional
i-directional
TTransition
ransitio
n M
o dpossibility
e w i t h p to
ossibility
Mode
with
treturn
o r e tto
u nTransmit-Only
e t o T r a nMode
smit-Only Mode
Transmit-oOnly
Transmit-Only
MODE
127 128 129
1
VCLK
2
B i - d i rBi-directional
ectional
p a r m parmanently
anently
n<128
n
VCLK
SCL
SCL
ADDRESS 00h
ADDRESS 00h
tVHZ
tVHZ
D7 D6 D5 D4
S
SDA
1
0
1
0
*
*
* R/W ACK
SDA
*Don’t care
Figure 7. Mode Change
Figure 6. Recovery Mode
○Bi-directional Mode
START Condition
・All commands are proceeded by the START condition, which is a High to Low transition of SDA when SCL is High.
・The BR24C21/F/FJ/FV continuously monitors the SDA and SCL lines for the START condition and will not respond to
any commands until this condition has been met.
(See Figure 1 Synchronous Data Timing)
STOP Condition
・All commands must be terminated by a STOP condition, which is a Low to High transition of SDA when SCL is High.
・The STOP condition causes the internal write cycle to write data into the memory array after a write sequence.
・The STOP condition is also used to place the device into standby power mode after read sequences.
・A STOP condition can only be issued after the transmitting device has released the bus.
(See Figure 1 Synchronous Data Timing)
Device Addressing
・Following the START condition, the Master outputs the device address of the Slave to be accessed. The most significant
four bits of Slave address are the “device type indentifier,” For the BR24C21/F/FJ/FV this is fixed as “1010.”
・The next three bits of the slave address are inconsequential.
・The last bit of the stream determines the operation to be performed. When set to “1”, a READ operation is selected.
When set to “0”, a WRITE operation is initiated.
R/W set to "0" ・ ・ ・ ・ ・ ・ ・ ・ WRITE (This bit is also set to "0" for random read operation)
R/W set to "1" ・ ・ ・ ・ ・ ・ ・ ・ READ
1010
*
*
*
_
R/W
*:Don’t care
○Write Protect Function
・Write Enable (VCLK)
When using the BR24C21/F/FJ/FV in Bi-directional Mode, the VCLK pin can be used as a write enable pin. Setting VCLK
High allows normal write operations, while setting VCLK low prevents writing to any location in the array.
(See Figure 3 Write Enable Timing)
Changing VCLK from High to Low during the self-timed program operation will not halt programming of the device.
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
5/18
TSZ02201-0R2R0G100270-1-2
30.Oct.2012 Rev.002
Datasheet
BR24C21xxx Series (1K)
●Bidirectional mode command
○Byte Write
When the Master generates a STOP condition, the BR24C21/F/FJ/FV begins the internal write cycle to the nonvolatile array.
S
T
A
R
T
SDA
LINE
W
R
I
T
E
SLAVE
ADDRESS
1 0 1 0 * *
WORD
ADDRESS
DATA
WA
0
WA
* 6
*
R A
/ C
W K
S
T
O
P
D7
D0
A
C
K
A
C
K
VCLK
*:Don’t care
Figure 8. Byte Write Cycle Timing
○Page Write
If the Master transmits the next data instead of generating a STOP condition during the byte write cycle, the
BR24C21/F/FJ/FV transfers from byte write function to page write function. After receipt of each word, the three lower
order address bits are internally incremented by one, while the high order four bits of the word address remains constant.
If the master transmits more than eight words, prior to generating the STOP condition, the address counter will “roll over,”
and the previous transmitted data will be overwritten.
S
T
A
R
T
SDA
LINE
W
R
I
T
E
SLAVE
ADDRESS
WORD
ADDRESS
( )
WA
* 6
1 0 1 0 ***
DATA(n)
WA
0
RA
/ C
WK
S
T
O
P
DATA(n+7)
D7
D0
D0
A
C
K
A
C
K
A
C
K
VCLK
*:Don’t c are
Figure 9. Page Write Cycle Timing
○Current Read
The BR24C21/F/FJ/FV contains an internal address counter which maintains the address of the last word accessed,
incremented by one. If the last accessed address is address “n” in a Read operation, the next Read operation will access
data from address “n+1” and increment the current address counter. If the last accessed address is address
”n” in a Write operation, the next Read operation will access data from address “n”. If the Master does not transfer an
Acknowledge, but does generate a STOP condition, the current address read operation will only provide a single byte of
data. At this point, the device discontinues transmission.
(See Figure 12 Sequential Read Cycle Timing)
S
T
A
R
T
SDA
LINE
R
E
A
D
SLAVE
ADRESS
1 0 1 0 * * *
DATA
D7
R A
/ C
W K
S
T
O
P
D0
*:Don’t care
A
C
K
Figure 10. Current Read Cycle Timing
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
6/18
TSZ02201-0R2R0G100270-1-2
30.Oct.2012 Rev.002
Datasheet
BR24C21xxx Series (1K)
○Random Read
The Random read operation allows the Master to access any memory location. This operation involves a two-step
process. First, the Master issues a Write command that includes the START condition and the Slave address field (with
R/W set to “0”) followed by the word address of the word to be read. This procedure sets the internal address counter of
the BR24C21/F/FJ/FV to the desired address. After the word address Acknowledge is received by the Master, the
Master immediately re-issues a START condition followed by the Slave address field with R/W set to “1.” The device will
respond with an Acknowledge and then transmit the 8-data bits stored at the addressed location. If the Master does not
acknowledge the transmission but does generate the STOP condition, the IC will discontinue transmission.
S
T
A
R
T
SDA
LINE
SLAVE
ADDRESS
W
R
I
T
E
S
T
A
R
T
WORD
ADDRESS(n)
WA
0
WA
* 6
1 0 1 0 * * *
R A
/ C
W K
SLAVE
ADDRESS
R
E
A
D
DATA(n)
D7
1 0 1 0 * * *
A
C
K
S
T
O
P
D0
A
C
K
R A
/ C
W K
*:Don’t care
Figure 11. Random Read Cycle Timing
○Sequential Read
・If the Master does not transfer an Acknowledge and does not generate a STOP condition during the current Read
operation, the BR24C21/F/FJ/FV continues to output the next address data in sequence. For Read operations, all bits
in the address counter are incremented, allowing the entire array to be read during a single operation. When the
counter reaches the top of the array, it will “roll over” to the bottom of the array and continue to transmit data.
・If the Master does not acknowledge the transmission but does generate a STOP condition, at this point the device
discontinues transmission.
・The sequential Read operation can be performed with both Current Read and Random Read.
S
T
A
R
T
SDA
LINE
R
E
A
D
SLAVE
ADDRESS
1 0 1 0 * * *
R A
/ C
W K
DATA(n+x)
DATA(n)
D7
S
T
O
P
D0
D7
A
C
K
A
C
K
D0
*:Don’t care
A
C
K
Figure 12. Sequential Read Cycle Timing
(Current Read)
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
7/18
TSZ02201-0R2R0G100270-1-2
30.Oct.2012 Rev.002
Datasheet
BR24C21xxx Series (1K)
●Software Reset
Execute software reset in case the device is at an unexpected state after power up and/or the command input needs to be
reset. The following figures (Figure 13-(a), Figure 13-(b), Figure 13-(c))
During dummy clock, please release SDA BUS (tied to Vcc by pull up resistor).
During that time, the device may pull the SDA line Low for acknowledge or outputting read data. If the master controls the
SDA line High, it will conflict with the device output Low then it makes a current overload. It may cause instantaneous power
down and may damage the device.
Dummy Clock×14
SCL
1
2
13
Start×2
COMMAND
14
SDA
COMMAND
Figure 13-(a) Dummy Clock×14+Start+Start
SCL
Start
Dummy Clock×9
Start
1
2
9
8
COMMAND
SDA
COMMAND
Figure 13-(b) Start+Dummy Clock×9+Start
Start×9
SCL
1
2
3
9
8
7
COMMAND
SDA
COMMAND
Figure 13-(c) Start×9
●Acknowledge Polling
Since the device ignores all input commands during the internal write cycle, no ACK will be returned. When the master sends
the next command following the write command, and the device returns the ACK, it means that the program is completed. If no
ACK is returned, it means that the device is still busy. By using Acknowledge polling, the waiting time is minimized to less than
tWR=5ms. To prevent operating Write or Current Read immediately after Write, first send the slave address (R/W is "High" or
"Low"). After the device returns the ACK, continue word address input or data output, respectively.
During the internal write
cycle,
no ACK will be returned.
THE FIRST WRITE COMMAND
S
T WRITE COMMAND
A
R
T
S
T
O
P
S
T SLAVE
A
R ADDRESS
T
S
A
T SLAVE
C
A
K
R ADDRESS H
T
A
C
K
H
tWR
…
THE SECOND WRITE COMMAND
…
S
T
SLAVE
A
R ADDRESS
T
A
C
K
H
S
T SLAVE
A
R ADDRESS
T
tWR
A
C
K
L
WORD
ADDRESS
A
C
K
L
DATA
A
C
K
L
S
T
O
P
After the internal write cycle
is completed ACK will be returned
(ACK=Low). Then input next
Word Address and data.
Figure 14. Successive Write Operation By Acknowledge Polling
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
8/18
TSZ02201-0R2R0G100270-1-2
30.Oct.2012 Rev.002
Datasheet
BR24C21xxx Series (1K)
●Command Cancellation By Start And Stop Condition
During a command input, command is canceled by the successive inputs of start condition and stop condition (Figure 15.).
However, during ACK or data output, the device may output the SDA line Low. In such cases, operation of start and stop
condition is impossible, making the reset inoperable. Execute the software reset in the cases. (Figure 13.)
Operating the command cancel by start and stop condition during the command of Random Read or Sequential Read or
Current Read, internal address counter is not confirmed. Therefore operation of Current Read after this is not valid. Operate
a Random Read in this case.
SCL
SDA
1
1
0
0
Start
Condition
Stop
Condition
Figure 15. Command Cancellation
●I/O Circuit
○SDA Pin Pull-up Resister
The pull up resister is needed because SDA is NMOS open drain. Choose the correct value of this resister(RPU), by
considering VIL, IL characteristics of a controller which control the device and VOH, IOL characteristics of the device. If
large RPU is chosen, clock frequency needs to be slow. In case of small RPU, the operating current increases.
○Maximum Rpu
Maximum value of RPU is determined by following factors:
①SDA rise time determined by RPU and the capacitance of bus line(CBUS) must be less than tR.
1)
Other timing must keep the conditions of AC spec.
A of SDA bus determined by a total input leak(IL) of the all devices connected to
②When SDA bus is High, the voltage ○
the bus. RPU must be significantly higher than the High level input of a controller and the device, including a noise
margin 0.2VCC.
VCC-ILRPU-0.2 VCC ≧ VIH
MICRO
COMPUTER
0.8Vcc-VIH
≦
∴
RPU
RPU
IL
SDA PIN
A
Examples: When VCC=3V IL=10µA VIH=0.7VCC
According to ②
0.8x3-0.7x3
≦
RPU
10x10-6
≦
300 [kΩ]
IL
IL
THE CAPACITANCE OF
BUS LINE (CBUS)
Figure 16. I/O Circuits
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
9/18
TSZ02201-0R2R0G100270-1-2
30.Oct.2012 Rev.002
Datasheet
BR24C21xxx Series (1K)
○Minimum RPU
The minimum value of RPU is determined by following factors:
①Meets the condition that VOLMAX=0.4V, IOLMAX=3mA when the output is Low.
VCC -VOL
≦ IOL
R PU
VCC -VOL
IOL
② VOLMAX=0.4V must be lower than the input Low level of the microcontroller and the EEPROM
including the recommended noise margin of 0.1VCC.
VOLMAX ≦ VIL-0.1 VCC
Examples: VCC=3V, VOL=0.4V, IOL=3mA, the VIL of the controller and
According to ①
R PU
∴
RPU ≧
≧
3-0.4
3×10 -3
≧ 867 [Ω]
the EEPROM is VIL=0.3VCC,
and
VOL=0.4[V]
VIL=0.3×3
=0.9[V]
so that condition② is met
○SCL Pin Pull-up Resister
When SCL is controlled by the CMOS output the pull-up resistor at SCL is not required.
However, should SCL be set to Hi-Z, connection of a pull-up resistor between SCL and VCC is recommended.
Several kΩ are recommended for the pull-up resistor in order to drive the output port of the microcontroller.
●Notes For Power Supply
VCC rises through the low voltage region in which the internal circuit of the IC and the controller are unstable. Therefore, the
device may not work properly due to an incomplete reset of the internal circuit. To prevent this, the device has a P.O.R. and
LVCC feature. At power up, maintain the following conditions to ensure functions of P.O.R and LVCC.
1. "SDA='H'" and "SCL='L' or 'H'".
2. Follow the recommended conditions of tR, tOFF, Vbot for the P.O.R. function during power up.
tR
VCC
Recommended conditions of tR, tOFF, Vbot
tOFF
tR
Below 10ms
Below 100ms
Vbot
tOFF
Above 10ms
Above 10ms
Vbot
Below 0.3V
Below 0.2V
0
Fig.33
Figure
17. Vcc rising wave from
3. Prevent SDA and SCL from being "Hi-Z".
In case conditions 1 and/or 2 cannot be met, take following actions:
A)If unable to keep condition 1 ( SDA is "Low" during power up):
→Control SDA ,SCL to be "High" as shown in figure below.
VCC
tLOW
SCL
SDA
After Vcc becoms stable
After Vcc becoms stable
tDH
tSU:DAT
tSU:DAT
Figure
18. SCL="H" and SDA="L"
Figure
19. SCL="L" and SDA="L"
Fig.34
Fig.35
B)If unable to keep condition 2.
→After power becomes stable, execute software reset. (See Figure 13.)
C)If unable to keep both conditions 1 and 2.
→Follow the instruction A first, then the instruction B.
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
10/18
TSZ02201-0R2R0G100270-1-2
30.Oct.2012 Rev.002
Datasheet
BR24C21xxx Series (1K)
●LVCC Circuit
LVCC circuit inhibits write operation at low voltage, and prevents an inadvertent write. Write operation is inhibited below the
LVCC voltage (Typ.=1.2V).
●Vcc NOISE
○Bypass Condenser
Noise and surges on power line may cause abnormal function. It is recommended that the bypass condensers (0.1µF) are
attached on the Vcc and GND line beside the device. It is also recommended to attach bypass condensers on the board
close to the connector.
●Notes for Use
1) Described numeric values and data are design representative values, and the values are not guaranteed.
2) We believe that application circuit examples are recommendable, however, in actual use, confirm characteristics further
sufficiently. In the case of use by changing the fixed number of external parts, make your decision with sufficient margin in
consideration of static characteristics and transition characteristics and fluctuations of external parts and our LSI.
3) Absolute maximum ratings
If the absolute maximum ratings such as impressed voltage and operating temperature range and so forth are exceeded,
LSI may be destructed. Do not impress voltage and temperature exceeding the absolute maximum ratings. In the case of
fear exceeding the absolute maximum ratings, take physical safety countermeasures such as fuses, and see to it that
conditions exceeding the absolute maximum ratings should not be impressed to LSI.
4) GND electric potential
Set the voltage of GND terminal lowest at any action condition. Make sure that each terminal voltages is lower than that
of GND terminal.
5) Heat design
In consideration of permissible dissipation in actual use condition, carry out heat design with sufficient margin.
6) Terminal to terminal shortcircuit and wrong packaging
When to package LSI onto a board, pay sufficient attention to LSI direction and displacement. Wrong packaging may
destruct LSI. And in the case of shortcircuit between LSI terminals and terminals and power source, terminal and GND
owing to foreign matter, LSI may be destructed.
7) Use in a strong electromagnetic field may cause malfunction, therefore, evaluated design sufficiently
Status of this document
The Japanese version of this document is formal specification. A customer may use this translation version only for a reference
to help reading the formal version.
If there are any differences in translation version of this document formal version takes priority.
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
11/18
TSZ02201-0R2R0G100270-1-2
30.Oct.2012 Rev.002
Datasheet
BR24C21xxx Series (1K)
●Ordering Information
Product Code Description
B
R
2 4
C
2
1
x
x
-
xx
BUS type
24:I2C
Product type
Capacity
21=1K
Package
Blank
:DIP-T8
F
:SOP8
FJ
:SOP-J8
FV
:SSOP-B8
Packaging and forming specification
None :Tube
(DIP-T8)
E2
:Embossed tape and reel
(SOP8,SOP-J8, SSOP-B8)
●Lineup
Package
Capacity
1K
Type
Quantity
DIP-T8
Tube of 2000
SOP8
SOP-J8
Reel of 2500
SSOP-B8
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
12/18
TSZ02201-0R2R0G100270-1-2
30.Oct.2012 Rev.002
Datasheet
BR24C21xxx Series (1K)
●Physical Dimension Tape and Reel Information
DIP-T8
<Tape and Reel information>
Container
Tube
Quantity
2000pcs
Direction of feed
Direction of products is fixed in a container tube
∗ Order quantity needs to be multiple of the minimum quantity.
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
13/18
TSZ02201-0R2R0G100270-1-2
30.Oct.2012 Rev.002
Datasheet
BR24C21xxx Series (1K)
●Physical Dimension Tape and Reel Information - Continued
SOP8
<Tape and Reel information>
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
Direction of feed
1pin
Reel
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
)
∗ Order quantity needs to be multiple of the minimum quantity.
14/18
TSZ02201-0R2R0G100270-1-2
30.Oct.2012 Rev.002
Datasheet
BR24C21xxx Series (1K)
●Physical Dimension Tape and Reel Information - Continued
SOP-J8
<Tape and Reel information>
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
Direction of feed
1pin
Reel
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
)
∗ Order quantity needs to be multiple of the minimum quantity.
15/18
TSZ02201-0R2R0G100270-1-2
30.Oct.2012 Rev.002
Datasheet
BR24C21xxx Series (1K)
●Physical Dimension Tape and Reel Information - Continued
SSOP-B8
SSOP-B8
SSOP-B8
3.0±0.2
(MAX 3.35 include BURR)
7
6
5
1
2
3
4
0.1
1.15±0.1
0.3MIN
6.4 ± 0.3
4.4 ± 0.2
8
0.15±0.1
S
(0.52)
0.65
0.1 S
+0.06
0.22 −0.04
0.08
M
(Unit : mm)
<Tape and Reel information>
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
Direction of feed
1pin
Reel
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
)
∗ Order quantity needs to be multiple of the minimum quantity.
16/18
TSZ02201-0R2R0G100270-1-2
30.Oct.2012 Rev.002
Datasheet
BR24C21xxx Series (1K)
●Marking Diagrams
DIP-T8 (TOP VIEW)
SOP8(TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
LOT Number
1PIN MARK
SOP-J8(TOP VIEW)
SSOP-B8(TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
LOT Number
1PIN MARK
1PIN MARK
●Marking Information
Capacity
Product Name
Marking
BR24C21
1K
Package
Type
DIP-T8
SOP8
C21
SOP-J8
SSOP-B8
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
17/18
TSZ02201-0R2R0G100270-1-2
30.Oct.2012 Rev.002
Datasheet
BR24C21xxx Series (1K)
●Revision History
Date
Revision
10.Jul.2012
30.Oct.2012
001
0002
Changes
New Release
P10 The expression of ② is corrected
Figure 17, Figure 18 and Figure 19 is corrected
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
18/18
TSZ02201-0R2R0G100270-1-2
30.Oct.2012 Rev.002
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
BR24C21F - Web Page
Buy
Distribution Inventory
Part Number
Package
Unit Quantity
Minimum Package Quantity
Packing Type
Constitution Materials List
RoHS
BR24C21F
SOP8
2500
2500
Taping
inquiry
Yes
Similar pages