MITSUBISHI CR05AS

MITSUBISHI SEMICONDUCTOR 〈THYRISTOR〉
CR05AS
LOW POWER USE
NON-INSULATED TYPE, PLANAR PASSIVATION TYPE
CR05AS
OUTLINE DRAWING
Dimensions
in mm
4.4±0.1
1.6±0.2
3
2.5±0.1
2
3.9±0.3
0.8 MIN
1
1.5±0.1
0.5±0.07
0.4 +0.03
–0.05
0.4±0.07
1.5±0.1 1.5±0.1
(Back side)
2
1 T1 TERMINAL
2 T2 TERMINAL
3 GATE TERMINAL
3
1
• IT (AV) ........................................................................ 0.5A
• VDRM ..............................................................200V/400V
• IGT ......................................................................... 100µA
SOT-89
APPLICATION
Solid state relay, strobe flasher, ignitor, hybrid IC
MAXIMUM RATINGS
Symbol
Voltage class
Parameter
4 (marked “CB”)
8 (marked “CD”)
Unit
VRRM
Repetitive peak reverse voltage
200
400
V
VRSM
Non-repetitive peak reverse voltage
300
500
V
VR (DC)
DC reverse voltage
160
320
V
VDRM
Repetitive peak off-state voltage
✽1
200
400
V
VD (DC)
DC off-state voltage
✽1
160
320
V
Symbol
Conditions
Parameter
IT (RMS)
RMS on-state current
IT (AV)
Average on-state current
Commercial frequency, sine half wave, 180° conduction, Ta=57°C ✽2
ITSM
Surge on-state current
60Hz sine half wave 1 full cycle, peak value, non-repetitive
I2t
I2t
Value corresponding to 1 cycle of half wave 60Hz, surge on-state
current
PGM
Peak gate power dissipation
PG (AV)
Average gate power dissipation
VFGM
for fusing
Ratings
Unit
0.79
A
0.5
A
10
A
0.4
A2s
0.1
W
0.01
W
Peak gate forward voltage
6
V
VRGM
Peak gate reverse voltage
6
V
IFGM
Peak gate forward current
0.1
Tj
Junction temperature
–40 ~ +125
–40 ~ +125
Storage temperature
Tstg
—
Weight
Typical value
48
A
°C
°C
mg
✽1. With Gate-to-cathode resistance RGK =1kΩ
Feb.1999
MITSUBISHI SEMICONDUCTOR 〈THYRISTOR〉
CR05AS
LOW POWER USE
NON-INSULATED TYPE, PLANAR PASSIVATION TYPE
ELECTRICAL CHARACTERISTICS
Symbol
Parameter
Limits
Test conditions
Min.
Typ.
Max.
Unit
IRRM
Repetitive peak reverse current
Tj=125°C, V RRM applied
—
—
0.1
mA
IDRM
Repetitive peak off-state current
Tj=125°C, V DRM applied, RGK=1kΩ
—
—
0.1
mA
VTM
On-state voltage
Ta=25°C, I TM=1.5A, instantaneous value
—
—
1.9
V
VGT
Gate trigger voltage
Ta=25°C, V D =6V, IT =0.1A ✽4
—
—
0.8
V
VGD
Gate non-trigger voltage
Tj=125°C, VD=1/2VDRM, RGK=1kΩ
0.2
—
—
IGT
Gate trigger current
Tj=25°C, VD =6V, IT=0.1A ✽4
1
—
IH
Holding current
Tj=25°C, VD=12V, RGK=1kΩ
—
—
3
mA
R th (j-a)
Thermal resistance
Junction to ambient ✽2
—
—
70
°C/W
100 ✽3
V
µA
✽2. Soldering with ceramic plate (25mm × 25mm × t0.7).
✽3. If special values of I GT are required, choose at least two items from those listed in the table below. (Example: AB, BC)
Item
A
B
C
IGT (µA)
1 ~ 30
20 ~ 50
40 ~ 100
The above values do not include the current flowing through the 1kΩ resistance between the gate and cathode.
✽4. IGT, VGT measurement circuit.
A1
3V
DC
IGS
IGT
A3
A2
60Ω
TUT
6V
DC
V1
RGK
1 2
VGT
1kΩ
SWITCH
SWITCH 1 : IGT measurement
SWITCH 2 : VGT measurement
(Inner resistance of voltage meter is about 1kΩ)
MAXIMUM ON-STATE CHARACTERISTICS
102
7 Ta = 25°C
5
3
2
101
7
5
3
2
100
7
5
3
2
10–1
0
1
2
3
4
ON-STATE VOLTAGE (V)
5
RATED SURGE ON-STATE CURRENT
10
SURGE ON-STATE CURRENT (A)
ON-STATE CURRENT (A)
PERFORMANCE CURVES
9
8
7
6
5
4
3
2
1
0
100
2 3 4 5 7 101
2 3 4 5 7 102
CONDUCTION TIME
(CYCLES AT 60Hz)
Feb.1999
MITSUBISHI SEMICONDUCTOR 〈THYRISTOR〉
CR05AS
LOW POWER USE
NON-INSULATED TYPE, PLANAR PASSIVATION TYPE
GATE TRIGGER CURRENT VS.
JUNCTION TEMPERATURE
102
VFGM = 6V
101
7
5
3
2
PGM = 0.1W
PG(AV) = 0.01W
VGT = 0.8V
100
7
5
3
2
IGT = 100µA
(Tj = 25°C)
10–1
7
5
3
2
VGD = 0.2V
IFGM = 0.1A
GATE CURRENT (Tj = t°C)
GATE CURRENT (Tj = 25°C)
100 (%)
10–2
10–2 2 3 5 710–12 3 5 7 100 2 3 5 7 101 2 3 5 7 102
101
7
5
3
2
100
–60 –40 –20 0 20 40 60 80 100 120 140
GATE TRIGGER VOLTAGE VS.
JUNCTION TEMPERATURE
TYPICAL EXAMPLE
IGT (25°C)
# 1 32µA
# 2 9µA
#1
#2
120
100
80
60
40
See ∗3
20
1.0
0.9
,,,,,,,,,,,
,,,,,,,,,,,
,,,,,,,,,,,
,,,,,,,,,,,
,,,,,,,,,,,
,,,,,,,,,,,
,,,,,,,,,,,
,,,,,,,,,,,
,,,,,,,,,,,
DISTRIBUTION
0.8
0.7
TYPICAL EXAMPLE
0.6
0.5
0.4
0.3
0.2
0.1
0
–40 –20 0 20 40 60 80 100 120 140 160
0
–40 –20 0 20 40 60 80 100 120 140 160
JUNCTION TEMPERATURE (°C)
JUNCTION TEMPERATURE (°C)
MAXIMUM TRANSIENT THERMAL
IMPEDANCE CHARACTERISTICS
(JUNCTION TO AMBIENT)
100
103
23 5
7 101
23 5
7 102
23 5
7 103
7 25 25 t0.7
5 ALUMINUM BOARD
3 WITH SOLDERING
2
102
7
5
3
2
101
7
5
3
2
100
10–3 2 3 5 710–2 2 3 5 710–1 2 3 5 7 100
TIME (s)
AVERAGE POWER DISSIPATION (W)
TRANSIENT THERMAL IMPEDANCE (°C/W)
102
7
5
3
2
GATE CURRENT VS.
JUNCTION TEMPERATURE
180
140
TYPICAL EXAMPLE
JUNCTION TEMPERATURE (°C)
200
160
103
7
5
3
2
GATE CURRENT (mA)
GATE TRIGGER VOLTAGE (V)
GATE VOLTAGE (V)
7
5
3
2
GATE TRIGGER CURRENT (Tj = t°C)
GATE TRIGGER CURRENT (Tj = 25°C)
100 (%)
GATE CHARACTERISTICS
MAXIMUM AVERAGE POWER DISSIPATION
(SINGLE-PHASE HALF WAVE)
1.5
θ = 30° 60° 90° 120°
180°
1.0
0.5
θ
360°
0
0
RESISTIVE, INDUCTIVE LOADS
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
AVERAGE ON-STATE CURRENT (A)
Feb.1999
MITSUBISHI SEMICONDUCTOR 〈THYRISTOR〉
CR05AS
LOW POWER USE
ALLOWABLE AMBIENT TEMPERATURE VS.
AVERAGE ON-STATE CURRENT
(SINGLE-PHASE HALF WAVE)
160
25 25 t0.7
140 ALUMINUM BOARD
θ
WITH SOLDERING
360°
120
RESISTIVE,
100
INDUCTIVE
LOADS
80
NATURAL
CONVECTION
60
θ = 30°
90°
180°
40
60° 120°
20
0
0
0.2
0.4
MAXIMUM AVERAGE POWER DISSIPATION
(SINGLE-PHASE FULL WAVE)
AVERAGE POWER DISSIPATION (W)
AMBIENT TEMPERATURE (°C)
NON-INSULATED TYPE, PLANAR PASSIVATION TYPE
0.8
0.6
1.5
180°
1.0
0.5
θ
0
100
80
60
40
60°
θ = 30°
20
0
0
0.2
120°
90°
0.4
180°
0.6
DC
1.0
360°
0
θ = 30° 60°
20
0
120°
270°
90° 180°
0
0.2
0.4
0.6
0.8
AVERAGE ON-STATE CURRENT (A)
0
RESISTIVE,
INDUCTIVE
LOADS
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
AVERAGE ON-STATE CURRENT (A)
BREAKOVER VOLTAGE VS.
JUNCTION TEMPERATURE
100 (%)
40
θ
0.5
160
BREAKOVER VOLTAGE (T j = t°C)
BREAKOVER VOLTAGE (T j = 25°C)
AMBIENT TEMPERATURE (°C)
DC
90° 180°
θ = 30° 60° 120° 270°
1.5
AVERAGE ON-STATE CURRENT (A)
60
RESISTIVE LOADS
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
MAXIMUM AVERAGE POWER DISSIPATION
(RECTANGULAR WAVE)
0.8
ALLOWABLE AMBIENT TEMPERATURE VS.
AVERAGE ON-STATE CURRENT
(RECTANGULAR WAVE)
160
25 25 ± t0.7
140 ALUMINUM BOARD
θ
WITH SOLDERING
360°
120
NATURAL
CONVECTION RESISTIVE,
100
INDUCTIVE
LOADS
80
0
AVERAGE ON-STATE CURRENT (A)
AVERAGE POWER DISSIPATION (W)
AMBIENT TEMPERATURE (°C)
RESISTIVE
LOADS
NATURAL
CONVECTION
θ
360°
AVERAGE ON-STATE CURRENT (A)
ALLOWABLE AMBIENT TEMPERATURE VS.
AVERAGE ON-STATE CURRENT
(SINGLE-PHASE FULL WAVE)
160
25 25 t0.7
140 ALUMINUM BOARD
θ θ
WITH SOLDERING
360°
120
90°
θ = 30° 60° 120°
120
TYPICAL EXAMPLE
140
100
RGK = 1kΩ
80
60
40
20
0
–40 –20 0 20 40 60 80 100 120 140 160
JUNCTION TEMPERATURE (°C)
Feb.1999
MITSUBISHI SEMICONDUCTOR 〈THYRISTOR〉
CR05AS
LOW POWER USE
80
60
40
20
0
10–1 2 3 5 7100 2 3 5 7101 2 3 5 7 102
80
60
#2
40 TYPICAL EXAMPLE
# 1 IGT (25°C)= 10µA
20 # 2 IGT (25°C)= 66µA
Tj = 125°C, RGK = 1kΩ
#1
0
100 2 3 5 7101 2 3 5 7 102 2 3 5 7 103
HOLDING CURRENT VS.
JUNCTION TEMPERATURE
HOLDING CURRENT VS.
GATE TO CATHODE RESISTANCE
102
7
5
3
2
101
7
5
3
2
100
7
5
3
2
Tj = 25°C
IH (25°C) = 1mA
IGT (25°C) = 25µA
DISTRIBUTION TYPICAL
EXAMPLE
,,,,,,,,,,,
,,,,,,,,,,,
,,,,,,,,,,,
,,,,,,,,,,,
,,,,,,,,,,,
500
TYPICAL EXAMPLE
IGT (25°C) IH (1kΩ)
# 1 13µA
1.6mA
# 2 59µA
1.8mA
400
#1
300
#2
200
100
Tj = 25°C
0
10–1 2 3 5 7 100 2 3 5 7101 2 3 5 7102
GATE TO CATHODE RESISTANCE (kΩ)
REPETITIVE PEAK REVERSE VOLTAGE VS.
JUNCTION TEMPERATURE
160
TYPICAL EXAMPLE
140
GATE TRIGGER CURRENT VS.
GATE CURRENT PULSE WIDTH
120
100 (%)
JUNCTION TEMPERATURE (°C)
GATE TRIGGER CURRENT (tw)
GATE TRIGGER CURRENT (DC)
100 (%)
100
RATE OF RISE OF OFF-STATE VOLTAGE (V/µs)
10–1
–60 –40 –20 0 20 40 60 80 100 120 140
REPETITIVE PEAK REVERSE VOLTAGE (Tj = t°C)
REPETITIVE PEAK REVERSE VOLTAGE (Tj = 25°C)
BREAKOVER VOLTAGE VS.
RATE OF RISE OF OFF-STATE VOLTAGE
120
GATE TO CATHODE RESISTANCE (kΩ)
100 (%)
HOLDING CURRENT (mA)
BREAKOVER VOLTAGE (RGK = rkΩ)
BREAKOVER VOLTAGE (RGK = 1kΩ)
100
TYPICAL EXAMPLE
Tj = 125°C
BREAKOVER VOLTAGE (dv/dt = vV/µs )
BREAKOVER VOLTAGE (dv/dt = 1V/µs )
120
HOLDING CURRENT (RGK = rkΩ)
HOLDING CURRENT (RGK = 1kΩ)
100 (%)
BREAKOVER VOLTAGE VS.
GATE TO CATHODE RESISTANCE
100 (%)
NON-INSULATED TYPE, PLANAR PASSIVATION TYPE
100
80
60
40
20
0
–40 –20 0 20 40 60 80 100 120 140 160
JUNCTION TEMPERATURE (°C)
103
7
5
4
3
2
TYPICAL EXAMPLE
IGT (25°C)
# 1 10µA
#2
# 2 66µA
#1
102
7
5
4
3
2
Tj = 25°C
101
100
2 3 4 5 7 101
2 3 4 5 7 102
GATE CURRENT PULSE WIDTH (µs)
Feb.1999