MOTOROLA MMQA5V6T1 Sc-59 quad transient voltage suppressor 5.6 volt Datasheet

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by MMQA5V6T1/D
SEMICONDUCTOR TECHNICAL DATA
Motorola Preferred Devices
Transient Voltage Suppressor
for ESD Protection
SC-59 QUAD
TRANSIENT VOLTAGE
SUPPRESSOR
5.6 VOLTS (4)
24 WATTS PEAK POWER
This quad monolithic silicon voltage suppressor is designed for applications
requiring transient overvoltage protection capability. It is intended for use in
voltage and ESD sensitive equipment such as computers, printers, business
machines, communication systems, medical equipment, and other applications. Its quad junction common anode design protects four separate lines
using only one package. These devices are ideal for situations where board
space is at a premium.
6
Specification Features:
1
• SC-59 Package Allows Four Separate Unidirectional Configurations
• Peak Power — 24 Watts @ 1.0 ms (Unidirectional), per Figure 7 Waveform
2
5
4
3
CASE 318F-01
STYLE 1
SC-59 PLASTIC
• Maximum Clamping Voltage @ Peak Pulse Current
• Low Leakage < 2.0 µA
• ESD Rating of Class N (exceeding 16 kV) per the Human Body Model
Mechanical Characteristics:
1
• Void Free, Transfer-Molded, Thermosetting Plastic Case
• Corrosion Resistant Finish, Easily Solderable
3
2
• Package Designed for Optimal Automated Board Assembly
4
5
• Small Package Size for High Density Applications
6
• Available in 8 mm Tape and Reel
Use the Device Number to order the 7 inch/3,000 unit reel. Replace
with “T3” in the Device Number to order the 13 inch/10,000 unit reel.
PIN 1.
2.
3.
4.
5.
6.
CATHODE
ANODE
CATHODE
CATHODE
ANODE
CATHODE
THERMAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic
Symbol
Value
Unit
Peak Power Dissipation @ 1.0 ms (1)
@ TA ≤ 25°C
Ppk
24
Watts
Total Power Dissipation on FR-5 Board (2) @ TA = 25°C
Derate above 25°C
°PD°
°225
1.8
°mW°
mW/°C
Thermal Resistance Junction to Ambient
RθJA
556
°C/W
Total Power Dissipation on Alumina Substrate (3) @ TA = 25°C
Derate above 25°C
°PD°
°300
2.4
°mW
mW/°C
Thermal Resistance Junction to Ambient
RθJA
417
°C/W
Junction and Storage Temperature Range
TJ
Tstg
°– 55 to +150°
°C
TL
260
°C
Lead Solder Temperature — Maximum (10 Second Duration)
1.
2.
3.
4.
Non-repetitive current pulse per Figure 7 and derate above TA = 25°C per Figure 8.
FR-5 = 1.0 x 0.75 x 0.62 in.
Alumina = 0.4 x 0.3 x 0.024 in., 99.5% alumina
Other voltages are available
Thermal Clad is a trademark of the Bergquist Company
Preferred devices are Motorola recommended choices for future use and best overall value.
Rev 3
 Motorola, Inc. 1996
MMQA5V6T1 MMQA20VT1
MOTOROLA
1
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
UNIDIRECTIONAL (Circuit tied to pins 1, 2, and 5; Pins 2, 3, and 5; Pins 2, 4, and 5; or Pins 2, 5, and 6) (VF = 0.9 V Max @ IF = 10 mA)
Breakdown Voltage
VZT(3)
(V)
Max Reverse
Leakage Current
Max Zener Impedance (5)
IR @ VR
(µA)
(V)
ZZT @ IZT
(Ω)
(mA)
Max
Reverse
Surge
Current
IRSM(4)
(A)
Max Reverse
Voltage @
IRSM(4)
(Clamping
Voltage)
VRSM
(V)
Maximum
Temperature
Coefficient of
VZ
(mV/°C)
Min
Nom
Max
@ I ZT
(mA)
1
5.32
5.6
5.88
1.0
2.0
3.0
400
3.0
8.0
1.26
19
20
21
1.0
0.1
15
125
0.84
28.6
20.07
(3) VZ measured at pulse test current IT at an ambient temperature of 25°C.
(4) Surge current waveform per Figure 5 and derate per Figure 6.
(5) ZZT is measured by dividing the AC voltage drop across the device by the AC current supplied. The specfied limits are IZ(AC) = 0.1 IZ(DC), with AC frequency = 1 kHz.
Typical Characteristics
23
VZ @ IT
VZ, BREAKDOWN VOLTAGE (VOLTS)
VZ, BREAKDOWN VOLTAGE (VOLTS)
8
MMQA5V6T1
7
6
5
4
– 50
0
50
100
21
20
UNIDIRECTIONAL
19
18
17
– 40
150
0
25
150
TA, AMBIENT TEMPERATURE (°C)
TA, AMBIENT TEMPERATURE (°C)
Figure 1. Typical Breakdown Voltage
versus Temperature
Figure 2. Typical Breakdown Voltage
versus Temperature
70
10000
60
C, CAPACITANCE (pF)
IR, REVERSE LEAKAGE CURRENT (nA)
MMQA20VT1
22
1000
MMQA20VT1
50
40
30
UNIDIRECTIONAL
20
10
100
– 50
0
50
100
150
0
0
2
4
6
8
10
12
14
TA, AMBIENT TEMPERATURE (°C)
REVERSE VOLTAGE (V)
Figure 3. Typical Leakage Current
versus Temperature
Figure 4. Typical Capacitance versus
Reverse Voltage
MOTOROLA
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16
MMQA5V6T1 MMQA20VT1
Typical Characteristics
300
PD , POWER DISSIPATION (mW)
MMQA5V6T1
225
200
UNIDIRECTIONAL
175
150
125
100
75
50
25
0
0
0.5
1
1.5
2.5
150
100
FR-5 BOARD
50
0
3
0
25
50
75
100
125
150
175
Figure 5. Typical Capacitance versus
Reverse Voltage
Figure 6. Steady State Power Derating Curve
PULSE WIDTH (tP) IS DEFINED
AS THAT POINT WHERE THE
PEAK CURRENT DECAYS TO 50%
OF IRSM.
tr ≤ 10 µs
PEAK VALUE — IRSM
VALUE (%)
50
tP
0
ALUMINA SUBSTRATE
200
TA, AMBIENT TEMPERATURE (°C)
IRSM
HALF VALUE —
2
0
250
REVERSE VOLTAGE (V)
tr
100
2
1
2
3
4
PEAK PULSE DERATING IN % OF PEAK POWER
OR CURRENT @ TA = 25 ° C
C, CAPACITANCE (pF)
300
275
250
100
90
80
70
60
50
40
30
20
10
0
0
25
50
75
100
125
150
t, TIME (ms)
TA, AMBIENT TEMPERATURE (°C)
Figure 7. Pulse Waveform
Figure 8. Pulse Derating Curve
175 200
100
Ppk PEAK SURGE POWER (W)
RECTANGULAR
WAVEFORM, TA = 25°C
10
UNIDIRECTIONAL
1.0
0.1
1.0
10
100
1000
PW, PULSE WIDTH (ms)
Figure 9. Maximum Non-repetitive Surge
Power, Ppk versus PW
Power is defined as VRSM x IZ(pk) where VRSM
is the clamping voltage at IZ(pk).
MMQA5V6T1 MMQA20VT1
MOTOROLA
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TYPICAL COMMON ANODE APPLICATIONS
A quad junction common anode design in a SC-59 package protects four separate lines using only one package.
This adds flexibility and creativity to PCB design especially
when board space is at a premium. Two simplified examples
of MMQA5V6T1 and MMQA20VT1 applications are illustrated below.
Computer Interface Protection
A
KEYBOARD
TERMINAL
PRINTER
ETC.
B
C
I/O
D
FUNCTIONAL
DECODER
GND
MMQA5V6T1
MMQA20VT1
Microprocessor Protection
VDD
VGG
ADDRESS BUS
RAM
ROM
DATA BUS
CPU
I/O
CLOCK
CONTROL BUS
GND
MMQA5V6T1
MMQA20VT1
MOTOROLA
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MMQA5V6T1 MMQA20VT1
INFORMATION FOR USING THE SC-59 6 LEAD SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
face between the board and the package. With the correct
pad geometry, the packages will self-align when subjected to
a solder reflow process.
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor packages must
be the correct size to ensure proper solder connection inter0.094
2.4
0.037
0.95
0.074
1.9
0.037
0.95
0.028
0.7
0.039
1.0
inches
mm
SC-59 6 LEAD
SC-59 6 LEAD POWER DISSIPATION
The power dissipation of the SC-59 6 Lead is a function of
the pad size. This can vary from the minimum pad size for
soldering to a pad size given for maximum power dissipation.
Power dissipation for a surface mount device is determined
by T J(max), the maximum rated junction temperature of the
die, RθJA, the thermal resistance from the device junction to
ambient, and the operating temperature, TA . Using the
values provided on the data sheet for the SC-59 6 Lead
package, PD can be calculated as follows:
PD =
TJ(max) – TA
RθJA
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values into
the equation for an ambient temperature TA of 25°C, one can
calculate the power dissipation of the device which in this
case is 225 milliwatts.
PD =
150°C – 25°C
= 225 milliwatts
556°C/W
The 556°C/W for the SC-59 6 Lead package assumes the
use of the recommended footprint on a glass epoxy printed
circuit board to achieve a power dissipation of 225 milliwatts.
There are other alternatives to achieving higher power
dissipation from the SC-59 6 Lead package. Another alternative would be to use a ceramic substrate or an aluminum
core board such as Thermal Clad. Using a board material
such as Thermal Clad, an aluminum core board, the power
dissipation can be doubled using the same footprint.
SOLDER STENCIL GUIDELINES
Prior to placing surface mount components onto a printed
circuit board, solder paste must be applied to the pads.
Solder stencils are used to screen the optimum amount.
These stencils are typically 0.008 inches thick and may be
made of brass or stainless steel. For packages such as the
SC-59, SC-59 6 Lead, SC-70/SOT-323, SOD-123, SOT-23,
SOT-143, SOT-223, SO-8, SO-14, SO-16, and SMB/SMC
diode packages, the stencil opening should be the same as
the pad size or a 1:1 registration.
SOLDERING PRECAUTIONS
The melting temperature of solder is higher than the rated
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within a
short time could result in device failure. Therefore, the
following items should always be observed in order to minimize the thermal stress to which the devices are subjected.
• Always preheat the device.
• The delta temperature between the preheat and
soldering should be 100°C or less.*
MMQA5V6T1 MMQA20VT1
• When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering method,
the difference should be a maximum of 10°C.
* Soldering a device without preheating can cause excessive
thermal shock and stress which can result in damage to the
device.
MOTOROLA
5
• The soldering temperature and time should not exceed
260°C for more than 10 seconds.
• When shifting from preheating to soldering, the
maximum temperature gradient should be 5°C or less.
• After soldering has been completed, the device should
be allowed to cool naturally for at least three minutes.
Gradual cooling should be used since the use of forced
cooling will increase the temperature gradient and will
result in latent failure due to mechanical stress.
• Mechanical stress or shock should not be applied during
cooling.
TYPICAL SOLDER HEATING PROFILE
For any given circuit board, there will be a group of control
settings that will give the desired heat pattern. The operator
must set temperatures for several heating zones and a figure
for belt speed. Taken together, these control settings make
up a heating “profile” for that particular circuit board. On
machines controlled by a computer, the computer remembers these profiles from one operating session to the next.
Figure 8 shows a typical heating profile for use when
soldering a surface mount device to a printed circuit board.
This profile will vary among soldering systems, but it is a
good starting point. Factors that can affect the profile include
the type of soldering system in use, density and types of
components on the board, type of solder used, and the type
of board or substrate material being used. This profile shows
temperature versus time. The line on the graph shows the
STEP 1
PREHEAT
ZONE 1
“RAMP”
200°C
STEP 2 STEP 3
VENT
HEATING
“SOAK” ZONES 2 & 5
“RAMP”
DESIRED CURVE FOR HIGH
MASS ASSEMBLIES
actual temperature that might be experienced on the surface
of a test board at or near a central solder joint. The two
profiles are based on a high density and a low density board.
The Vitronics SMD310 convection/infrared reflow soldering
system was used to generate this profile. The type of solder
used was 62/36/2 Tin Lead Silver with a melting point
between 177 –189°C. When this type of furnace is used for
solder reflow work, the circuit boards and solder joints tend to
heat first. The components on the board are then heated by
conduction. The circuit board, because it has a large surface
area, absorbs the thermal energy more efficiently, then
distributes this energy to the components. Because of this
effect, the main body of a component may be up to 30
degrees cooler than the adjacent solder joints.
STEP 4
HEATING
ZONES 3 & 6
“SOAK”
STEP 5
HEATING
ZONES 4 & 7
“SPIKE”
STEP 6
VENT
STEP 7
COOLING
205° TO 219°C
PEAK AT
SOLDER JOINT
170°C
160°C
150°C
150°C
140°C
100°C
100°C
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
(DEPENDING ON
MASS OF ASSEMBLY)
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
50°C
TIME (3 TO 7 MINUTES TOTAL)
TMAX
Figure 10. Typical Solder Heating Profile
MOTOROLA
6
MMQA5V6T1 MMQA20VT1
OUTLINE DIMENSIONS
A
L
6
5
4
2
3
B
S
1
D
G
M
J
C
0.05 (0.002)
H
K
CASE 318F-01
ISSUE A
SC-59 6 LEAD
MMQA5V6T1 MMQA20VT1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE
MATERIAL.
INCHES
MILLIMETERS
DIM
MIN
MAX
MIN
MAX
3.10
0.1063 0.1220
A
2.70
1.70
B
0.0512 0.0669
1.30
1.30
0.0394 0.0511
C
1.00
0.50
0.0138 0.0196
D
0.35
1.05
G
0.0335 0.0413
0.85
H
0.0005 0.0040 0.013 0.100
0.26
J
0.0040 0.0102
0.10
0.60
0.0079 0.0236
K
0.20
1.65
L
0.0493 0.0649
1.25
10_
M
0_
10_
0_
S
0.0985 0.1181
3.00
2.50
STYLE 1:
PIN 1.
2.
3.
4.
5.
6.
CATHODE
ANODE
CATHODE
CATHODE
ANODE
CATHODE
MOTOROLA
7
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit,
and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters can and do vary in different
applications. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does
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associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part.
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MOTOROLA
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◊
*MMQA5V6T1/D*
MMQA5V6T1/D
MMQA5V6T1 MMQA20VT1
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