AOSMD AOZ8204KI Four-line tvs diode array Datasheet

AOZ8204
Four-line TVS Diode Array
General Description
Features
The AOZ8204 is a transient voltage suppressor diode
array designed to protect data lines from high transient
conditions and ESD.
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This device incorporates four TVS diodes in a single
package. Due to the flexibility of the design, the package
can be configured as a two channel bidirectional TVS
array. During transient conditions, the TVS diodes direct
the transient to ground. They may be used to
meet the ESD immunity requirements of IEC 61000-4-2,
Level 4 (±15kV air, ±8kV contact discharge).
The AOZ8204 comes in an RoHS compliant SC-89
package and is rated over a -40°C to +85°C ambient
temperature range.
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Typical Application
Protects four unidirectional or two bidirectional I/O lines
Low clamping voltage
Low operating voltage: 5.0V
Applications
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The very small 1.7 x 1.7 x 0.6mm SC-89 package makes
it ideal for applications where PCB space is a premium.
The small size and high ESD protection makes it ideal for
protecting high speed video and data communication
interfaces.
ESD protection for high-speed data lines:
– Exceeds: IEC 61000-4-2 (ESD) ±30kV (air),
±30kV (contact)
– Human Body Model (HBM) ±30kV
Small package saves board space
Low insertion loss
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Portable handheld devices
Keypads, data lines
Notebook computers
Digital Cameras
Portable GPS
MP3 players
Pin Configuration
I/O1
I/O2
1
6
2
5
3
4
I/O3
I/O4
Unidirection Protection of Four Lines
Top View
I/O1
I/O2
3
2
1
4
5
6
Bidirection Protection of Two Lines
Rev. 1.3 March 2008
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Page 1 of 6
AOZ8204
Ordering Information
Part Number
Ambient Temperature Range
Package
Environmental
AOZ8204KI
-40°C to +85°C
SC-89
RoHS Compliant
All AOS Products are offering in packaging with Pb-free plating and compliant to RoHS standards.
Please visit www.aosmd.com/web/quality/rohs_compliant.jsp for additional information.
Absolute Maximum Ratings
Exceeding the Absolute Maximum ratings may damage the device.
Parameter
Rating
VP – VN
5V
Peak Pulse Current (IPP), tP = 8/20µs
5A
Storage Temperature (TS)
-65°C to +150°C
ESD Rating per IEC61000-4-2,
Contact(1)
±30kV
ESD Rating per IEC61000-4-2,
Air(1)
±30kV
Model(2)
±30kV
ESD Rating per Human Body
Notes:
1. IEC 61000-4-2 discharge with CDischarge = 150pF, RDischarge = 330Ω.
2. Human Body Discharge per MIL-STD-883, Method 3015 CDischarge = 100pF, RDischarge = 1.5kΩ.
Maximum Operating Ratings
Parameter
Rating
Junction Temperature (TJ)
-40°C to +125°C
Electrical Characteristics
TA = 25°C unless otherwise specified. Specifications in BOLD indicate a temperature range of -40°C to +85°C.
Symbol
VRWM
VBR
Parameter
Reverse Working Voltage
Conditions
Min.
Max.
Units
5.0
V
Between pin 5 and 2(3)
2(4)
Reverse Breakdown Voltage
IT = 1mA, between pins 5 and
IR
Reverse Leakage Current
VRWM = 5V, between pins 5 and 2
VF
Diode Forward Voltage
IF = 15mA
VCL
Channel Clamp Voltage
Positive Transients
Negative Transient
IPP = 15A, tp = 100ns, any I/O pin to Ground
Channel Clamp Voltage
Positive Transients
Negative Transient
IPP = 25A, tp = 100ns, any I/O pin to Ground
Junction Capacitance
VR = 0V, f = 1MHz, any I/O pin to Ground
Cj
Typ.
8.0
0.70
V
0.1
µA
1
V
7.0
-6.75
V
V
7.50
-10.25
V
V
17
pF
0.85
15
Notes:
3. The working peak reverse voltage, VRWM, should be equal to or greater than the DC or continuous peak operating voltage level.
4. VBR is measured at the pulse test current IT.
Rev. 1.3 March 2008
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Page 2 of 6
AOZ8204
Typical Performance Characteristics
Clamping Voltage vs. Peak Pulse Current
Clamping Voltage vs. Current
(tperiod = 100ns, tr = 1ns)
14
12
11
10
9
8
7
6
5
4
3
2
1
0
Clamping Voltage (V)
Clamping Voltage, VCL (V)
(tperiod = 100ns, tr = 1ns)
12
10
8
6
4
2
0
5
10
15
20
25
30
5
10
I/O – Gnd Insertion Loss (S21) vs. Frequency
20
25
30
Capacitance vs. Reverse Bias
(Vp = 3.3V)
5
20
0
18
Capacitance (pF)
Insertion Loss (dB)
15
Current (A)
Peak Pulse Current, IPP (A)
-5
-10
-15
16
14
12
10
-20
8
6
-25
1
10
100
1000
10000
Rev. 1.3 March 2008
0
1
2
3
4
5
Reverse Bias (Volts)
Frequency (MHz)
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Page 3 of 6
AOZ8204
Applications Information
Device Connection for Protection of Four Data Lines
These devices are designed to protect up to four
unidirectional data lines. The device is connected as
follows.
1. Unidirectional protection of four I/O lines is achieved
by connecting pins 1, 3, 4, and 6 to the data lines.
Connect pin 2 to ground. The ground connection
should be made directly to the ground plane for best
results. The path length is kept as short as possible
to reduce the effects of parasitic inductance in the
board traces.
Device Connection for Protection of Two
Bidirectional Data Lines
These devices are designed to protect up to two
bidirectional data lines. The device is connected as
follows.
1. Bidirectional protection of two I/O lines is achieved by
connecting pins 1 and 3 to the data lines. Connect
pin 4 and 6 to ground. The ground connection should
be made directly to the ground plane for best results.
The path length is kept as short as possible to
reduce the effects of parasitic inductance in the
board traces.
I/O1
I/O2
1
3
4
1
6
2
5
3
4
6
I/O3
2
Circuit Diagram
I/O4
Protection of Four Unidirectional Lines
I/O1
I/O2
1
3
4
6
Circuit Diagram
1
6
2
5
3
4
Protection of Two Bidirectional Lines
Circuit Board Layout Recommendations for
Suppression of ESD
Good circuit board layout is critical for the suppression of
ESD induced transients. The following guidelines are
recommended:
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Place the TVS near the input terminals or connectors
to restrict transient coupling.
Minimize the path length between the TVS and the
protected line.
Minimize all conductive loops including power and
ground loops.
The ESD transient return path to ground should be
kept as short as possible.
Never run critical signals near board edges.
Use ground planes whenever possible.
Rev. 1.3 March 2008
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Page 4 of 6
AOZ8204
Package Dimensions, SC-89
D
E1
E
c
e
b
A1
L1
L
A
RECOMMENDED LAND PATTERN
0.50
1.25
0.45
0.30
UNIT: mm
Dimensions in millimeters
Symbols
A
A1
b
Min.
0.53
0.00
0.15
c
D
E
E1
e
L
0.10
1.50
1.50
1.10
L1
Nom.
0.58
—
0.20
Dimensions in inches
Max.
0.62
0.10
0.30
Symbols
A
A1
b
Min.
0.021
0.000
0.006
0.11
1.60
1.60
1.20
0.50 BSC
0.25
0.35
0.18
1.70
1.70
1.30
0.004
0.059
0.059
0.043
0.45
c
D
E
E1
e
L
0.13
0.27
L1
0.005
0.20
Nom.
0.023
—
0.008
Max.
0.024
0.004
0.012
0.004 0.007
0.063 0.067
0.063 0.067
0.047 0.051
0.020 BSC
0.010 0.014 0.018
0.008
0.011
Notes:
1. Dimension D does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.15mm
per end. Dimension E1 does not include interlead flash or protrusion.
2. Dimensions D and E1 are determinded at the outmost extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs
and interlead flash, but including any mismatch between the top and bottom of the plastic body.
3. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.
4. All dimensions are in millimeters.
Rev. 1.3 March 2008
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Page 5 of 6
AOZ8204
Package Marking
AOZ8204KI
(SC-89)
LWP
Assembly Lot & Location Code
Part Number Code
Week & Year Code
This data sheet contains preliminary data; supplementary data may be published at a later date.
Alpha & Omega Semiconductor reserves the right to make changes at any time without notice.
LIFE SUPPORT POLICY
ALPHA & OMEGA SEMICONDUCTOR PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS.
As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant into
the body or (b) support or sustain life, and (c) whose
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
reasonably expected to result in a significant injury of
the user.
Rev. 1.3 March 2008
2. A critical component in any component of a life
support, device, or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
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