Maxim MAX16051ETI+ Voltage monitors/sequencer circuits with reverse-sequencing capability Datasheet

19-1013; Rev 1; 7/08
KIT
ATION
EVALU
E
L
B
AVAILA
Voltage Monitors/Sequencer Circuits with
Reverse-Sequencing Capability
Features
The MAX16050 monitors up to 5 voltages and
sequences up to 4 voltages, while the MAX16051 monitors up to 6 voltages and sequences up to 5 voltages.
These devices provide an adjustable delay as each supply is turned on and they monitor each power-supply
voltage. When all of the voltages reach their final values
and the reset delay timer expires, a power-on-reset
(POR) output deasserts allowing the microcontroller (µC)
to operate. If any voltage falls below its threshold, the
reset output asserts and all voltage supplies are turned
off. The MAX16050/MAX16051 can be daisy-chained to
control a higher number of voltages in a system.
o Monitor Up to 6 Voltages/Sequence Up to 5
Voltages
o Pin-Selectable Sequencing Order (MAX16050 Only)
o Reverse-Sequencing Capability on Shutdown
o Overvoltage Monitoring with Independent Output
o ±1.5% Threshold Accuracy
o 2.7V to 13.2V Operating Voltage Range
o Charge Pump to Fully Enhance External
n-Channel FETs
o Capacitor-Adjustable Sequencing Delay
o Fixed or Capacitor-Adjustable Reset Timeout
o Internal 85mA Pulldowns for Discharging
Capacitive Loads Quickly
o Daisy-Chaining Capability to Communicate
Across Multiple Devices
o Small 4mm x 4mm, 28-Pin TQFN Package
OUT1
DISC1
REM
20
OV_OUT
21
SET1
TOP VIEW
RESET
Pin Configurations
FAULT
During a power-down event, the MAX16050/MAX16051
can reverse sequence the outputs. In this situation, each
voltage is turned off sequentially until it reaches a 250mV
level, at which point, the next supply is turned off. The
MAX16050/MAX16051 also provide internal pulldown circuitry that turns on during power-down, to help discharge large output capacitors.
The MAX16050/MAX16051 feature a charge-pump supply output that can be used as a pullup voltage for driving external n-channel MOSFETs and an overvoltage
output that indicates when any of the monitored voltages
exceeds its overvoltage threshold. The MAX16050 also
provides three sequence control inputs for changing the
sequence order, while the MAX16051 has a fixed
sequence order.
The MAX16050/MAX16051 are available in a 28-pin
(4mm x 4mm) thin QFN package and are fully specified
over the -40°C to +85°C extended operating temperature range.
19
18
17
16
15
SHDN 22
14
EN_HOLD
DELAY 23
13
DISC2
TIMEOUT 24
12
OUT2
SEQ1 25
11
SET2
10
DISC3
9
OUT3
8
SET3
MAX16050
SEQ2 26
SEQ3 27
Applications
*EP
+
3
4
Networking Systems
6
7
THIN QFN
(4mm x 4mm)
*EP = EXPOSED PAD
Typical Operating Circuit appears at end of data sheet.
5
DISC4
2
SET4
1
OUT4
Storage Systems
EN
Workstations
ABP
Telecom Equipment
VCC
Servers
GND
CP_OUT 28
Pin Configurations continued at end of data sheet.
Ordering Information
TEMP RANGE
PIN-PACKAGE
MONITORED
VOLTAGES
VOLTAGES
SEQUENCED
MAX16050ETI+
-40°C to +85°C
28 TQFN-EP*
5
4
MAX16051ETI+
-40°C to +85°C
28 TQFN-EP*
6
5
PART
+Denotes lead-free/RoHS-compliant package.
*EP = Exposed pad.
________________________________________________________________ Maxim Integrated Products
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.
1
MAX16050/MAX16051
General Description
MAX16050/MAX16051
Voltage Monitors/Sequencer Circuits with
Reverse-Sequencing Capability
ABSOLUTE MAXIMUM RATINGS
(All voltages referenced to GND.)
VCC .........................................................................-0.3V to +30V
REM, OUT_, DISC_.................................................-0.3V to +30V
RESET, SHDN, SET_, FAULT, EN_HOLD, EN, DELAY,
OV_OUT, ABP, TIMEOUT, SEQ_...........................-0.3V to +6V
CP_OUT.........................................................-0.3V to (VCC + 6V)
RESET Current ....................................................................50mA
DISC_ Current ...................................................................180mA
Input/Output Current (all other pins) ...................................20mA
Continuous Power Dissipation (TA = +70°C)
28-Pin (4mm x 4mm) Thin QFN (derate 28.6mW/°C
above +70°C) ............................................................2285mW*
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature .....................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
*As per JEDEC51 Standard (Multilayer Board).
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VCC = 2.7V to 13.2V, VEN = VABP, TA = TJ = -40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.) (Note 1)
SYMBOL
CONDITIONS
MIN
Operating Voltage Range
(Note 2)
PARAMETER
VCC
Voltage on VCC to ensure the device is fully
operational
2.7
Operating Voltage
VCCR
VDISC_ = VOUT_ = VRESET = low, voltage on
VCC falling
Regulated Supply Voltage
VABP
IABP = 1mA (external sourcing current from
ABP)
2.45
Minimum voltage on ABP, ABP rising
2.1
Undervoltage Lockout
Undervoltage Lockout Hysteresis
Supply Current
VUVLO
VUVLO_HYS ABP falling
ICC
VCC = 3.3V, all OUT_ = high, no load
VTH
SET_ falling
VTH_HYS
SET_ rising
TYP
MAX
UNITS
13.2
V
1.1
V
2.90
V
2.3
V
100
mV
0.7
1.1
mA
0.5
0.508
V
MONITORED ANALOG INPUTS
SET_ Threshold
SET_ Threshold Hysteresis
0.492
0.5
%VTH
SET1–SET4 Input Current
ISET
VSET_ = 0.5V
-100
+100
nA
SET5 Input Current
ISET5
VSET5 = 0.5V (MAX16051 only)
-100
+100
nA
SET_ rising
0.541
SET_ Threshold Tempco
Overvoltage Threshold
∆VTH/_TC
VTH_OV
Overvoltage Threshold Hysteresis
30
SET_ falling
EN Threshold
VTH_EN
EN_ falling
EN Threshold Hysteresis
VEN_HYS
EN_ rising
IEN
VEN = 0.5V
EN Input Current
0.55
ppm/°C
0.558
0.5
0.492
0.5
0.508
0.5
-100
V
%VTH_OV
V
%VTH_EN
+100
nA
SEQUENCING, CAPACITOR DISCHARGE, AND SEQUENCE TIMING OUTPUTS
VCC = 3.3V, ISINK = 3.2mA
0.3
VCC = 1.8V, ISINK = 100µA
0.3
OUT_ Output Low Voltage
VOL_OUT
OUT_ Leakage Current
ILKG_OUT
VOUT_ = 12V, OUT_ asserted
DISC_ Output Pulldown Current
IOL_DISC
Pulldown current during fault condition or
power-down mode, VDISC_ = 1V
DISC_ Output Leakage Current
ILKG_DISC
VDISC_ = 3.3V, not in power-down mode
DISC_ Power Low Threshold
2
VTH_PL
DISC_ falling
1
85
200
250
_______________________________________________________________________________________
V
µA
mA
1
µA
300
mV
Voltage Monitors/Sequencer Circuits with
Reverse-Sequencing Capability
(VCC = 2.7V to 13.2V, VEN = VABP, TA = TJ = -40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.) (Note 1)
PARAMETER
SYMBOL
DELAY, TIMEOUT Output Source
Current
IDT
DELAY, TIMEOUT Threshold
Voltage
CONDITIONS
VDELAY = VTIMEOUT = 0V
VTH_DT
MIN
TYP
MAX
UNITS
1.6
2.5
3.0
µA
1.218
1.250
1.281
V
0.4
V
DIGITAL INPUTS/OUTPUTS
SHDN, FAULT, EN_HOLD InputLogic Low Voltage
VIL
SHDN, FAULT, EN_HOLD InputLogic High Voltage
VIH
EN_HOLD Input Current
II
EN_HOLD to OUT Delay
tEN_OUT
FAULT, SHDN to ABP Pullup
Resistance
tOUT
RESET Output Low Voltage
VOL
VOL_RF
V
1
3
60
RP
SHDN to OUT_ Delay
REM, FAULT Output Low Voltage
2
100
µs
160
12
0.3
VCC = 1.8V, ISINK = 100µA
0.3
VCC = 3.3V, ISINK = 3.2mA
0.3
tFAULT_PW
SET_ to FAULT Delay Time
tSET_FAULT SET_ falling below respective threshold
1.9
VIH_SEQ
MAX16050 only
VABP 0.35
SEQ1–SEQ3 Logic HighImpedance (No Connect) Level
VIX_SEQ
MAX16050 only
0.92
SEQ1–SEQ3 Logic-Low Level
VIL_SEQ
MAX16050 only
SEQ1–SEQ3 High-Impedance
State Tolerance Current
IIX
MAX16050 (Note 3)
V
V
µs
2.5
SEQ1–SEQ3 Logic-High Level
kΩ
µs
VCC = 3.3V, ISINK = 3.2mA
FAULT Pulse Width
µA
µs
V
-6
1.45
V
0.33
V
+6
µA
1
µA
300
ms
RESET CIRCUIT
RESET, REM, OV_OUT Output
Leakage
ILKG
VRESET = VREM = VOV_OUT = 5V
RESET Timeout Period
tRP
TIMEOUT = ABP
OUT_, FAULT, SHDN to RESET
Delay
tRST
TIMEOUT = unconnected
50
128
3
µs
CHARGE-PUMP OUTPUT
CP_OUT Voltage
VCP_OUT
ICP_OUT = 0.5µA
CP_OUT Source Current
ICP_OUT
VCP_OUT = VCC + 2V
VCC +
4.6
VCC +
5
VCC +
5.8
V
17
25
30
µA
Note 1: Specifications are guaranteed for the stated global conditions, unless otherwise noted. 100% production tested at TA =
+25°C and TA = +85°C. Specifications at TA = -40°C are guaranteed by design.
Note 2: When the voltage is below the VUVLO and above VCCR, OUT_ and RESET are asserted low.
Note 3: SEQ1–SEQ3 are inputs with three logic levels: high, low, and high-impedance.
_______________________________________________________________________________________
3
MAX16050/MAX16051
ELECTRICAL CHARACTERISTICS (continued)
Typical Operating Characteristics
(VCC = 5V; VEN = VABP, TA = +25°C, unless otherwise noted.)
TA = +25°C
600
550
TA = -40°C
500
500
4.2
5.7
7.2
8.7
10.2
11.7
1.002
1.001
1.000
0.999
0.998
0.997
0.996
-15
10
35
85
60
-40
-15
10
35
60
TEMPERATURE (°C)
TEMPERATURE (°C)
NORMALIZED SEQUENCE DELAY
vs. TEMPERATURE
SEQUENCE DELAY vs. CDELAY
NORMALIZED RESET TIMEOUT PERIOD
vs. TEMPERATURE
1.15
1.10
CDELAY = OPEN
1.00
0.95
250
1.10
200
NORMALIZED RESET TIMEOUT PERIOD
MAX16050/51 toc04
NORMALIZED AT TA = +25°C
150
100
0.90
50
CDELAY = 0.1µF
0.85
NORMALIZED AT TA = +25°C
1.08
1.06
1.04
TIMEOUT = OPEN
1.02
1.00
0.98
0.96
TIMEOUT = ABP
0.94
0.92
0.80
0.90
0
-40
-15
10
35
60
85
0
100
TEMPERATURE (°C)
200
300
-40
500
400
35
150
100
50
60
MAX16050/51 toc08
11
10
9
CP_OUT VOLTAGE (V)
200
10
TEMPERATURE (°C)
CP_OUT VOLTAGE
vs. CP_OUT CURRENT
MAX16050/51 toc07
250
RESET TIMEOUT PERIOD (ms)
-15
CDELAY (nF)
RESET TIMEOUT PERIOD
vs. CTIMEOUT
8
7
6
5
4
3
2
1
0
0
0
100
200
300
CTIMEOUT (nF)
4
85
SUPPLY VOLTAGE (V)
1.20
1.05
1.003
0.995
-40
13.2
SEQUENCE DELAY (ms)
2.7
MAX16050/51 toc03
MAX16050/51 toc02
650
NORMALIZED AT TA = +25°C
VSET_ FALLING
1.004
MAX16050/51 toc06
550
TA = +85°C
700
1.005
NORMALIZED SET_ THRESHOLD VOLTAGE
650
VCC = 5V
ALL OUT_ = HIGH
NO LOAD
MAX16050/51 toc05
SUPPLY CURRENT (µA)
700
750
SUPPLY CURRENT (µA)
MAX16050/51 toc01
750
600
NORMALIZED SET_ THRESHOLD VOLTAGE
vs. TEMPERATURE
SUPPLY CURRENT
vs. TEMPERATURE
SUPPLY CURRENT
vs. SUPPLY VOLTAGE
NORMALIZED SEQUENCE DELAY
MAX16050/MAX16051
Voltage Monitors/Sequencer Circuits with
Reverse-Sequencing Capability
400
500
0
5
10
15
CP_OUT CURRENT (µA)
_______________________________________________________________________________________
20
25
85
Voltage Monitors/Sequencer Circuits with
Reverse-Sequencing Capability
OV_OUT LOW VOLTAGE
vs. SINK CURRENT
0.5
0.4
0.3
0.2
0.6
0.5
0.4
0.3
0.2
0.1
4
8
12
16
20
0.6
0.5
0.4
0.3
0.2
0
0
0
0.7
0.1
0.1
0
MAX16050/51 toc11
0.7
0.8
RESET LOW VOLTAGE (V)
0.6
MAX16050/51 toc10
OV_OUT LOW VOLTAGE (V)
0.7
0.8
OUT_ LOW VOLTAGE (V)
MAX16050/51 toc09
0.8
RESET LOW VOLTAGE
vs. SINK CURRENT
OUT_ LOW VOLTAGE
vs. SINK CURRENT
0
SINK CURRENT (mA)
4
8
12
16
20
0
4
REVERSE SEQUENCE POWER-DOWN USING SHDN
(CDELAY = CTIMEOUT = OPEN)
8
20
MAX1650/51 toc13
SHDN
5V/div
V1
5V/div
EN
5V/div
V1
5V/div
V2
5V/div
V2
5V/div
V3
5V/div
V3
5V/div
V4
5V/div
V4
5V/div
40µs/div
40µs/div
DAISY-CHAINING TWO DEVICES
WITH SHDN RISING (FIGURE 7)
DAISY-CHAINING TWO DEVICES
WITH SHDN FALLING (FIGURE 7)
MAX1650/51 toc14a
100µs/div
16
SIMULTANEOUS POWER-DOWN USING EN
(CDELAY = CTIMEOUT = OPEN)
MAX1650/51 toc12
CDELAY (U1) = CDELAY (U2) = 100pF
SHDN = 5V/div
V1–V7 = 5V/div
12
SINK CURRENT (mA)
SINK CURRENT (mA)
MAX1650/51 toc14b
SHDN
SHDN
V1
V1
V2
V2
V3
V3
V4
V4
V5
V5
V6
V6
V7
V7
10µs/div
CDELAY (U1) = CDELAY (U2) = 100pF
SHDN = 5V/div
V1–V7 = 5V/div
_______________________________________________________________________________________
5
MAX16050/MAX16051
Typical Operating Characteristics (continued)
(VCC = 5V; VEN = VABP, TA = +25°C, unless otherwise noted.)
MAX16050/MAX16051
Voltage Monitors/Sequencer Circuits with
Reverse-Sequencing Capability
Pin Description
PIN
NAME
FUNCTION
MAX16050
MAX16051
1
1
VCC
Device Power-Supply Input. Connect to 2.7V to 13.2V. Bypass VCC to GND with a 0.1µF
capacitor.
2
2
GND
Ground
3
3
ABP
Internal Supply Bypass Input. Connect a 1µF capacitor from ABP to GND. ABP is an
internally generated voltage and must not be used to supply more than 1mA to external
circuitry.
4
4
EN
Analog Enable Input. Connect a resistive divider at EN to monitor a voltage. The EN
threshold is 0.5V.
5
5
SET4
Set Monitored Threshold 4 Input. Monitor a voltage by setting the threshold with an
external resistive divider. The SET4 threshold is 0.5V.
6
6
OUT4
Open-Drain Output 4. When the voltage at SET3* is above 0.5V, OUT4 goes high
impedance. OUT4 requires an external pullup resistor and can be pulled up to 13.2V.
7
7
DISC4
Discharge Pulldown Input 4. During normal operation, DISC4 is high impedance. During a
fault condition or power-down, DISC4 provides an 85mA sink current.
8
8
SET3
Set Monitored Threshold 3 Input. Monitor a voltage by setting the threshold with an
external resistive divider. The SET3 threshold is 0.5V.
9
9
OUT3
Open-Drain Output 3. When the voltage at SET2* is above 0.5V, OUT3 goes high
impedance. OUT3 requires an external pullup resistor and can be pulled up to 13.2V.
10
10
DISC3
Discharge Pulldown Input 3. During normal operation, DISC3 is high impedance. During a
fault condition or power-down, DISC3 provides an 85mA sink current.
11
11
SET2
Set Monitored Threshold 2 Input. Monitor a voltage by setting the threshold with an
external resistive divider. The SET2 threshold is 0.5V.
12
12
OUT2
Open-Drain Output 2. When the voltage at SET1* is above 0.5V, OUT2 goes high
impedance. OUT2 requires an external pullup resistor and can be pulled up to 13.2V.
13
13
DISC2
Discharge Pulldown Input 2. During normal operation, DISC2 is high impedance. During a
fault condition or power-down, DISC2 provides an 85mA sink current.
14
14
15
15
REM
Open-Drain Bus Removal Output. REM goes high impedance when all DISC_ inputs are
below the DISC_ power low threshold (VTH_PL). REM goes low when any DISC_ input goes
above VTH_PL. REM requires an external pullup resistor and can be pulled up to 13.2V.
16
16
DISC1
Discharge Pulldown Input 1. During normal operation, DISC1 is high impedance. During a
fault condition or power-down, DISC1 provides an 85mA sink current.
17
17
OUT1
Open-Drain Output 1. When the voltage at EN* is above 0.5V, OUT1 goes high
impedance. OUT1 requires an external pullup resistor and can be pulled up to 13.2V.
Enable Hold Input. When EN_HOLD is low, the device does not start the reverseEN_HOLD sequencing process regardless of the status of the SHDN input. Reverse sequencing is
allowed when this input is pulled high. Connect to ABP if unused.
*This applies to the MAX16051. For the MAX16050, see Table 1 for the output sequence order.
6
_______________________________________________________________________________________
Voltage Monitors/Sequencer Circuits with
Reverse-Sequencing Capability
PIN
NAME
MAX16050
MAX16051
18
18
SET1
19
19
OV_OUT
20
20
FUNCTION
Set Monitored Threshold 1 Input. Monitor a voltage by setting the threshold with an
external resistive divider. The SET1 threshold is 0.5V.
Open-Drain Overvoltage Output. When any of the SET_ voltages exceed their 0.55V
overvoltage threshold, OV_OUT goes low. When all of the SET_ voltages are below their
overvoltage threshold, OV_OUT goes high impedance after a short propagation delay.
RESET
Open-Drain Reset Output. When any of the monitored voltages (including EN) falls below
its threshold, SHDN is pulled low, or FAULT is pulled low, RESET asserts and stays
asserted for at least the minimum reset timeout period after all of these conditions are
removed. The reset timeout is 128ms (typ) when TIMEOUT is connected to ABP or can be
adjusted by connecting a capacitor from TIMEOUT to GND.
21
21
FAULT
FAULT Synchronization Input/Output. While EN = SHDN = high, FAULT is pulled low when
any of the SET_ voltages falls below their respective threshold. Pull FAULT low manually to
assert a simultaneous power-down. FAULT is internally pulled up to ABP by a 100kΩ
resistor.
22
22
SHDN
Active-Low Shutdown Input. When SHDN is pulled low, the device will reverse sequence
for power-down operation. SHDN is internally pulled up to ABP by a 100kΩ resistor.
23
23
DELAY
Adjustable Sequence Delay Timing Input. Connect a capacitor from DELAY to GND to set
the sequence delay between each OUT_. Leave DELAY unconnected for a 10µs (typ)
delay.
24
24
TIMEOUT
Adjustable Reset Timeout Input. Connect a capacitor from TIMEOUT to GND to set the
reset timeout period. Connect TIMEOUT to ABP for the fixed timeout of 128ms (typ). Leave
TIMEOUT unconnected for a 10µs (typ) delay.
25
—
SEQ1
26
—
SEQ2
27
—
SEQ3
28
28
CP_OUT
Charge-Pump Output. An internal charge pump boosts CP_OUT to (VCC + 5V ) to provide
a pullup voltage that can be used to drive external n-channel MOSFETs. CP_OUT sources
up to 25µA.
—
25
DISC5
Discharge Pulldown Input 5. During normal operation, DISC5 is high impedance. During a
fault condition or power-down, DISC5 provides an 85mA sink current.
—
26
OUT5
Open-Drain Output 5. When the voltage at SET4 is above 0.5V, OUT5 goes high
impedance. OUT5 requires an external pullup resistor and can be pulled up to 13.2V.
—
27
SET5
External Set Monitored Threshold 5. Monitor a voltage by setting the threshold with an
external resistive divider. The SET5 threshold is 0.5V.
—
—
EP
Sequence Order Select Inputs. SEQ1, SEQ2, and SEQ3 allow the order of sequencing for
each supply to be programmable (Table 1).
Exposed Pad. EP is internally connected to GND. Connect EP to the GND plane for
improved heat dissipation. Do not use EP as the only ground connection.
_______________________________________________________________________________________
7
MAX16050/MAX16051
Pin Description (continued)
MAX16050/MAX16051
Voltage Monitors/Sequencer Circuits with
Reverse-Sequencing Capability
Functional Diagram
VCC
MAX16050
MAX16051
INTERNAL
VCC/UVLO
CHARGE
PUMP
ABP
OUT1–OUT4
(OUT1–OUT5)
CP_OUT
DISC1–DISC4
(DISC1–DISC5)
COMP
250mV
SET1–SET4
(SET1–SET5)
COMP
85mA
RESET
VREF
CONTROL
LOGIC
OV_OUT
FAULT
EN
COMP
REM
EN_HOLD
SEQ1–SEQ3
(MAX16050 ONLY)
( ) ARE FOR MAX16051 ONLY.
8
GND
ABP
ABP
TIMEOUT
DELAY
_______________________________________________________________________________________
Voltage Monitors/Sequencer Circuits with
Reverse-Sequencing Capability
MAX16050/MAX16051
VTH_EN
EN
SHDN
tDELAY
VTH
VTH_PL
V1
tDELAY
VTH
V2
tDELAY
VTH
V3
tDELAY
V4
VTH
tRP
RESET
REM
Figure 1. Sequencing Timing Diagram with Reverse Order Power-Down Using SHDN
_______________________________________________________________________________________
9
MAX16050/MAX16051
Voltage Monitors/Sequencer Circuits with
Reverse-Sequencing Capability
VTH_EN
VTH_EN
EN
SHDN
tDELAY
VTH
VTH_PL
V1
tDELAY
VTH
V2
tDELAY
VTH
V3
tDELAY
VTH
V4
tRP
RESET
REM
Figure 2. Sequencing Timing Diagram with Simultaneous Order Power-Down Using EN
10
______________________________________________________________________________________
Voltage Monitors/Sequencer Circuits with
Reverse-Sequencing Capability
MAX16050/MAX16051
tFAULT-PW
FAULT
tDELAY
V1
VTH_PL
V2
V3
VTH_PL
V4
RESET
REM
Figure 3. Sequencing Timing Diagram During a System Fault
______________________________________________________________________________________
11
MAX16050/MAX16051
Voltage Monitors/Sequencer Circuits with
Reverse-Sequencing Capability
...
PART DOES NOT RESPOND TO EN FALLING
...
UNTIL EN_HOLD GOES HIGH
EN
EN_HOLD
CONNECTED TO REM OF THE SECOND IC
V1
V2
V3
V4
Figure 4. Power-Down Characteristics when REM of the Second IC is Connected to EN_HOLD of the First IC
12
______________________________________________________________________________________
Voltage Monitors/Sequencer Circuits with
Reverse-Sequencing Capability
combinations (Table 1). In the default mode (SEQ1 =
SEQ2 = SEQ3 = High Impedance), the power-up
sequence is OUT1→OUT2→OUT3→OUT4. The
MAX16051 features an additional channel and the
sequence order is fixed at OUT1→OUT2→OUT3
→OUT4→OUT5. For complex systems with a large
number of power supplies, the MAX16050/MAX16051
can be used in a daisy-chain configuration. Reverse
sequencing in the daisy-chained configuration is still
possible.
The MAX16050/MAX16051 keep all OUT_ low (all of the
supplies in the off-state) until four conditions are met.
1) The voltage at ABP exceeds the undervoltage lockout threshold.
2) The voltage at the analog enable input (EN) is
above its threshold.
3) The shutdown input, SHDN, is not asserted.
4) All DISC_ voltages must be below 250mV.
The MAX16050 monitors up to 5 voltages (Figure 5) with
the ability to sequence up to 4 voltages, while the
MAX16051 monitors up to 6 voltages with the ability to
sequence up to 5 voltages. These devices control system power-up and power-down in a particular
sequence order. The MAX16050/MAX16051 turn off all
supplies and assert a reset to the processor when any
of the voltages falls below its respective threshold. The
MAX16050/MAX16051 offer an 85mA pulldown feature
that helps discharge the output capacitance of DC-DC
converters to ensure timely power-down. In addition, the
MAX16050/MAX16051 also reverse sequence, monitoring each power-supply output voltage present at the
associated DISC_ input and ensuring that the voltage
falls below 250mV before turning off the next supply.
The MAX16050 provides three sequence logic inputs,
which select the sequence order from 24 possible
VBUS
V1
DC-DC
EN
V2
DC-DC
EN
V3
DC-DC
EN
V4
DC-DC
EN
DISC4
SET4
OUT4
DISC3
SET3
OUT3
DISC2
SET2
OUT2
DISC1
SET1
OUT1
VPU
VCC
RESET
OV_OUT
EN
MAX16050
FAULT
REM
DELAY
TIMEOUT
ABP
EN_HOLD
SEQ3
SEQ2
SHDN
SEQ1
OFF
CP_OUT
GND
ON
Figure 5. Typical Connection for Sequencing Four DC-DC Converters
______________________________________________________________________________________
13
MAX16050/MAX16051
Detailed Description
MAX16050/MAX16051
Voltage Monitors/Sequencer Circuits with
Reverse-Sequencing Capability
When all of these conditions are met, the device starts
the power-sequencing process by turning on
OUT1–OUT_ in the sequence order. The sequence
delay between each OUT_ is the time required for the
power-supply voltage to exceed the undervoltage
threshold plus the additional time delay set by the
external delay capacitor; if no capacitor is connected to
the sequence delay timing input (DELAY), only a short
propagation delay (10µs) occurs. As each voltage
meets its respective threshold, the next OUT_ in the
sequence goes high impedance (open-drain output),
allowing the next power supply to turn on, which is then
monitored by the next input stage. When all of the voltages exceed their respective thresholds, the reset output (RESET) deasserts after a reset timeout period to
allow the system controller to start operating.
After sequencing is complete, if any SET_ input drops
below its threshold, a fault is detected. All power supplies are simultaneously turned off by the OUT_ outputs
asserting low, the RESET output asserting, the DISC_
current pulldown turning on, and the FAULT output
pulling low for at least 1.9µs. The MAX16050/MAX16051
will then be ready to power on again. Sequencing
begins as soon as the four startup conditions are met.
Sequencing
The MAX16050 features three three-state sequence
logic inputs that select one of the 24 possible
sequence orders (Table 1). These inputs allow the
sequence order to be changed even after the board
layout is finalized. The MAX16051 offers five channels
and the device powers up in a fixed order from OUT1
to OUT5.
Table 1. MAX16050 Sequencing Table Logic
14
SEQUENCE ORDER
SEQ1
SEQ2
SEQ3
High-Z
High-Z
High-Z
High-Z
High-Z
Low
OUT1
OUT2
OUT4
OUT3
High-Z
High-Z
High
OUT1
OUT3
OUT2
OUT4
High-Z
Low
High-Z
OUT1
OUT3
OUT4
OUT2
High-Z
Low
Low
OUT1
OUT4
OUT2
OUT3
FIRST SUPPLY
SECOND SUPPLY
THIRD SUPPY
FOURTH SUPPLY
OUT1
OUT2
OUT3
OUT4
High-Z
Low
High
OUT1
OUT4
OUT3
OUT2
High-Z
High
High-Z
OUT2
OUT1
OUT3
OUT4
High-Z
High
Low
OUT2
OUT1
OUT4
OUT3
High-Z
High
High
OUT2
OUT3
OUT1
OUT4
Low
High-Z
High-Z
OUT2
OUT3
OUT4
OUT1
Low
High-Z
Low
OUT2
OUT4
OUT1
OUT3
Low
High-Z
High
OUT2
OUT4
OUT3
OUT1
Low
Low
High-Z
OUT3
OUT1
OUT2
OUT4
Low
Low
Low
OUT3
OUT1
OUT4
OUT2
Low
Low
High
OUT3
OUT2
OUT1
OUT4
Low
High
High-Z
OUT3
OUT2
OUT4
OUT1
Low
High
Low
OUT3
OUT4
OUT1
OUT2
Low
High
High
OUT3
OUT4
OUT2
OUT1
High
High-Z
High-Z
OUT4
OUT1
OUT2
OUT3
High
High-Z
Low
OUT4
OUT1
OUT3
OUT2
High
High-Z
High
OUT4
OUT2
OUT1
OUT3
High
Low
High-Z
OUT4
OUT2
OUT3
OUT1
High
Low
Low
OUT4
OUT3
OUT1
OUT2
High
Low
High
OUT4
OUT3
OUT2
OUT1
______________________________________________________________________________________
Voltage Monitors/Sequencer Circuits with
Reverse-Sequencing Capability
Disabling Channels
If any channel is not used, connect the associated SET_
input to ABP. Connect DISC_ of the disabled channel to
GND or leave it unconnected. The channel exclusion
feature adds more flexibility to the device in a variety of
different applications.
SHDN and EN Inputs
The shutdown input (SHDN) initiates a reverse
sequencing event. When SHDN is brought low, the
device will sequentially power down in reverse order.
During this period, all DISC_ inputs are monitored to
make sure the voltage of each supply falls below
250mV before allowing the next supply to shut down.
The next OUT_ goes low as soon as the previous DISC_
input drops below 250mV without any capacitor-adjusted delay. This continues until all supplies are turned off.
SHDN is internally pulled up to ABP.
When EN falls below its threshold, the device performs
a simultaneous power-down and does not reverse
sequence. When either SHDN or EN initializes the
power-down event, the reset output (RESET) immediately asserts. At the end of the power-down event,
when all DISC_ voltages are below 250mV, the bus
removal output (REM) goes high impedance.
Reset Output (RESET)
The MAX16050/MAX16051 include a reset output.
RESET is an open-drain output and requires an external
pullup resistor.
When any of the monitored voltages falls below its
threshold, SHDN is pulled low, EN falls below its threshold, or FAULT is pulled low, RESET asserts and stays
asserted for at least the minimum reset timeout period
after all of these conditions are removed. Connect a
capacitor from TIMEOUT to GND to adjust the reset
timeout period. Connect TIMEOUT to ABP for the fixed
timeout of 128ms (typ). Leave TIMEOUT unconnected
for a 10µs (typ) timeout period.
FAULT Input/Output
The FAULT input/output asserts to signal a fault if any of
the SET_ monitored voltages falls below its threshold
while EN = SHDN = high. FAULT is internally pulled up
to ABP by a 100kΩ resistor. FAULT also can be used as
an input. Pull FAULT low to simultaneously shut down
the OUT_ outputs .
For multichip solutions, all of the FAULT input/outputs
can be connected together. In case of a fault condition,
all outputs on every device are turned off and the internal pulldown circuitry is activated simultaneously.
Overvoltage Fault Output (OV_OUT)
The MAX16050/MAX16051 include an overvoltage fault
output. OV_OUT is an open-drain output and requires
an external pullup resistor. When any of the SET_ voltages exceed their 0.55V overvoltage threshold,
OV_OUT goes low. When all of the SET_ voltages are
below their overvoltage threshold, OV_OUT goes high
impedance after a short propagation delay.
Discharge Inputs (DISC_)
The discharge inputs (DISC_) discharge power-supply
capacitors during a power-down or fault event and monitor power-supply output voltages during reverse
sequencing. When an OUT_ output goes low, the associated DISC_ activates an 85mA pulldown current to discharge any output capacitors. This helps the
power-supply output drop below the 250mV level so the
next power supply can be turned off. During normal
operation, DISC_ is high impedance and will not load
the circuit.
Bus Removal Output (REM)
The MAX16050/MAX16051 include an open-drain bus
removal output (REM) that indicates when it is safe to
disconnect the input power after a controlled powerdown operation. REM monitors DISC_ voltages and
goes low when any DISC_ input voltage goes above the
DISC_ power low threshold (VTH_PL). REM goes high
when all DISC_ inputs are below the DISC_ power low
threshold (VTH_PL). For a visual signal of when it is
unsafe to remove a powered board from the bus, connect an LED to REM.
______________________________________________________________________________________
15
MAX16050/MAX16051
Charge-Pump Output (CP_OUT)
The MAX16050/MAX16051 feature an on-chip charge
pump that drives its output voltage to 5V above VCC,
and it can be used as a pullup voltage to drive one or
more external n-channel MOSFETs (see the Typical
Operating Circuit). The charge-pump output can be
modeled as a 25µA current source with a compliance
voltage of (VCC + 5V); the slew rate can be controlled
by connecting a capacitor from the gate of the MOSFET
to ground. When using CP_OUT to provide the pullup
voltage for multiple MOSFETs, ensure that the voltage
is enough to enhance a MOSFET despite the load of
the other pullup resistors (which may be connected to
outputs that are deasserted low).
MAX16050/MAX16051
Voltage Monitors/Sequencer Circuits with
Reverse-Sequencing Capability
Enable Hold Input (EN_HOLD)
When EN_HOLD is low, a high-to-low transition on
SHDN or on EN is ignored. EN_HOLD must be high for
SHDN or EN to disable the device. This feature is used
when multiple MAX16050/MAX16051s are daisychained (see Figure 7). Connect EN_HOLD to ABP if
not used.
Delay Time Input (DELAY)
Connect a capacitor (CDELAY) between DELAY and
GND to adjust the sequencing delay period (tDELAY)
that occurs between sequenced channels. Use the following formula to estimate the delay:
tDELAY = 10µs + (500kΩ x CDELAY)
equation to estimate the value of the resistors based on
the amount of acceptable error:
e × V1TH
R1 = A
ISET
where eA is the fraction of the maximum acceptable
absolute resistive divider error attributable to the input
leakage current (use 0.01 for ±1%), V1TH is the powergood threshold for the power supply being monitored,
and ISET is the worst-case SET_ input leakage current
(see the Electrical Characteristics table). Calculate R2
as follows:
where tDELAY is in seconds and CDELAY is in Farads.
Leave DELAY unconnected for the default 10µs (typ)
delay.
R2 =
VTH × R1
V1TH − VTH
Reset Timeout Input (TIMEOUT)
Pullup Resistor Values
Connect a capacitor (C TIMEOUT ) from TIMEOUT to
GND to set the reset timeout period. After all SET_
inputs exceed their thresholds (VTH), RESET remains
low for the programmed timeout period, tRP, before
deasserting (see Figure 1). Use the following formula to
estimate the reset timeout period:
tRP = 10µs + (500kΩ x CTIMEOUT)
where tRP is in seconds and CTIMEOUT is in Farads.
Leave TIMEOUT unconnected for the default 10µs (typ)
timeout delay or connect TIMEOUT to ABP to enable a
fixed 128ms (typ) timeout.
The exact value of the pullup resistors for the opendrain outputs is not critical, but some consideration
should be made to ensure the proper logic levels when
the device is sinking current. For example, if VCC =
3.3V and the pullup voltage is 5V, keep the sink current
less than 3.2mA as shown in the Electrical
Characteristics table. As a result, the pullup resistor
should be greater than 1.6kΩ. For a 13.2V pullup, the
resistor should be larger than 4.1kΩ.
Extra care must be taken when using CP_OUT as the
pullup voltage. If multiple pullup resistors are connected to CP_OUT and one or more of the connected OUT_
outputs are asserted, the current drawn can drop the
CP_OUT voltage enough to prevent an enabled
MOSFET from turning on completely.
Applications Information
Resistor Value Selection
The MAX16050/MAX16051 feature four and five SET_
inputs, respectively, and the threshold voltage (VTH) at
each SET_ input is 0.5V (typ). To monitor a voltage
V1TH, connect a resistive divider network to the circuit
as shown in Figure 6, and use the following equation to
calculate the monitored threshold voltage:
⎛ R1 ⎞
V1TH = VTH × ⎜1 +
⎟
⎝ R2 ⎠
Balance accuracy and power dissipation when choosing the external resistors. The input to the voltage monitor is a high-impedance input with a small 100nA
leakage current. This leakage current contributes to the
overall error of the threshold voltage, and this error is
proportional to the value of the resistors used to set the
threshold. Small-valued resistors reduce the error but
increase the power consumption. Use the following
16
V1TH
VBUS
R1
VCC
SET_
RESET
R2
MAX16050
MAX16051
GND
Figure 6. Setting the SET_ Input
______________________________________________________________________________________
Voltage Monitors/Sequencer Circuits with
Reverse-Sequencing Capability
MOSFET Selection
The external pass MOSFET connects in series with the
sequenced power-supply source. Since the load current and the MOSFET drain-to-source impedance
(RDSON) determine the voltage drop, the on-characteristics of the MOSFET affect the load supply accuracy.
For highest supply accuracy and lowest voltage drop,
select a MOSFET with an appropriate drain-to-source
on-resistance with a gate-to-source bias of 4.5V to 6.0V
(see Table 2).
In Figure 7, SHDN is pulled low to initiate the powerdown sequence. When all of the supply voltages monitored by U2 are off, the bus removal output (REM) goes
high, thereby allowing U1 to start sequencing down.
REM normally is at a logic-low state when all voltages
are good. Connect U2’s REM to U1’s EN_HOLD to
force U1 to stay on even if EN and SHDN are pulled
low. This enable-and-hold circuitry allows the system to
power down correctly.
Layout and Bypassing
For better noise immunity, bypass VCC to GND with a
0.1µF capacitor installed as close to the device as possible. Bypass ABP to GND with a 1µF capacitor
installed as close to the device as possible; ABP is an
internally generated voltage and must not be used to
supply more than 1mA to external circuitry. Connect the
exposed pad (EP) to the ground plane for improved
heat dissipation. Do not use EP as the only ground connection for the device.
Table 2. Recommended MOSFETs
MANUFACTURER
Fairchild
Vishay
PART
VDS
(V)
VGSth
(V)
RDSON AT VGS = 4.5V
(mΩ)
IMAX AT 50mV
VOLTAGE DROP (A)
Qg (nC)
(TYP)
FOOTPRINT
FDC633N
30
0.67
42
1.19
11
Super
SOT-6
FDP8030L
FDB8030L
30
1.5
4.5
11.11
120
TO-220
TO-263AB
FDD6672A
30
1.2
9.5
5.26
33
TO-252
FDS8876
30
2.5
(max)
17
2.94
15
SO-8
Si7136DP
20
3
4.5
11.11
24.5
SO-8
Si4872DY
30
1
10
5
27
SO-8
SUD50N02-09P
20
3
17
2.94
10.5
TO-252
Si1488DH
20
0.95
49
1.02
6
SOT-363
SC70-6
IRL3716
20
3
4.8
10.4
53
TO220AB
D2PAK
TO-262
IRL3402
20
0.7
10
5
78 (max)
TO-220AB
IRL3715Z
20
2.1
15.5
3.22
7
TO220AB
D2PAK
TO-262
IRLML2502
20
1.2
45
1.11
8
SOT23-3
Micro3
International
Rectifier
______________________________________________________________________________________
17
MAX16050/MAX16051
Daisy-Chaining the MAX16050/MAX16051
The MAX16050/MAX16051 can be daisy-chained to
sequence and monitor a large number of voltages
(Figure 7). When a fault occurs on any of the monitored
inputs, FAULT goes low, signaling a fast power-down.
Connect all FAULT pins of the MAX16050/MAX16051
together to ensure that all power supplies are turned off
during a fault.
VBUS
VBUS
EN
PULL SHDN LOW TO
INITIATE A REVERSE
ORDER SHUTDOWN
OF ALL 8 SUPPLIES
Figure 7. Daisy-Chaining Two Devices to Sequence Up to 8 Voltages
18
______________________________________________________________________________________
SET4
FAULT
DELAY
TIMEOUT
EN_HOLD
OV_OUT
SEQ3
ABP
MAX16050
SEQ1
FAULT
RESET
U2
REM
GND
DISC4
OUT4
SET3
DISC3
SET2
DISC2
OUT2
SET1
DISC1
CP_OUT
VCC
OV_OUT
DELAY
SEQ3
SEQ2
SEQ1
REM
SHDN
ABP
TIMEOUT
MAX16050
GND
OUT1
DISC4
SET4
RESET
U1
V8
DC-DC
EN
SHDN
EN
EN_HOLD
OUT4
DISC3
SET3
OUT3
DISC2
SET2
OUT2
SET1
DISC1
CP_OUT
V7
DC-DC
EN
V4
DC-DC
EN
VCC
V6
DC-DC
EN
V3
DC-DC
EN
OUT3
V2
DC-DC
EN
V5
DC-DC
EN
SEQ2
V1
DC-DC
EN
OUT1
MAX16050/MAX16051
Voltage Monitors/Sequencer Circuits with
Reverse-Sequencing Capability
VPU
Voltage Monitors/Sequencer Circuits with
Reverse-Sequencing Capability
VBUS
V4
V1
DC-DC
EN
V2
DC-DC
EN
V3
VPU
DISC4
SET4
OUT4
DISC3
SET3
OUT3
DISC2
SET2
OUT2
DISC1
SET1
OUT1
DC-DC
EN
CP_OUT
VCC
EN
RESET
MAX16050
OV_OUT
GND
DELAY
TIMEOUT
ABP
SEQ3
SEQ2
SHDN
SEQ1
ON
OFF
EN_HOLD
FAULT
REM
______________________________________________________________________________________
19
MAX16050/MAX16051
Typical Operating Circuit
Voltage Monitors/Sequencer Circuits with
Reverse-Sequencing Capability
MAX16050/MAX16051
Pin Configurations (continued)
Chip Information
OUT1
DISC1
REM
20
OV_OUT
RESET
21
SET1
FAULT
PROCESS: BiCMOS
TOP VIEW
19
18
17
16
15
SHDN 22
14
EN_HOLD
DELAY 23
13
DISC2
TIMEOUT 24
12
OUT2
DISC5 25
11
SET2
PACKAGE TYPE
PACKAGE CODE
DOCUMENT NO.
10
DISC3
28 TQFN
T2844-1
21-0139
9
OUT3
8
SET3
MAX16051
OUT5 26
SET5 27
*EP
+
1
2
3
4
5
6
7
VCC
GND
ABP
EN
SET4
OUT4
DISC4
CP_OUT 28
Package Information
For the latest package outline information and land patterns, go
to www.maxim-ic.com/packages.
THIN QFN
(4mm x 4mm)
*EP = EXPOSED PAD
20
______________________________________________________________________________________
Voltage Monitors/Sequencer Circuits with
Reverse-Sequencing Capability
REVISION
NUMBER
REVISION
DATE
0
11/07
Initial release
1
7/08
Revised Electrical Characteristics and Disabling Channels sections.
DESCRIPTION
PAGES
CHANGED
—
2, 3, 15
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 21
© 2008 Maxim Integrated Products
is a registered trademark of Maxim Integrated Products, Inc.
MAX16050/MAX16051
Revision History
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