Fujitsu MB3853PS 1a motor drive ic for motor application Datasheet

FUJITSU SEMICONDUCTOR
DATA SHEET
DS04-29113-4E
ASSP
BIPOLAR
1A Motor Drive IC for Motor Applications
MB3853
■ DESCRIPTION
The FUJITSU MB3853 is a motor drive IC with two power driver channels capable of sink/source operation, for
use in two-channel independent operation or H-type drive operation.
The control system and output system have independent power supplies, allowing the control system to be set
to low-voltage operation to conserve power.
Protective circuits are provided for temperature, overvoltage, and overload current, with an open collector type
monitoring terminal.
The MB3853 is designed for use with motors in AV products, office automation products, or cameras, and is also
an ideal IC for use in automated vending equipment and other unmanned operating devices.
■ FEATURES
• Circuit configuration
Two sets of built-in control circuits and power circuits
Built-in fly-back diode
• Functions
Can drive two motors independently or in H-type drive configurations
Built-in inhibitor function
(Continued)
■ PACKAGE
Plastic SIP, 9 pins
(SIP-9P-M02)
MB3853
(Continued)
• Input/output terminals
Power supply terminals : Independent control system supply terminal and output system supply terminal
Control terminals : TTL level/CMOS level compatible
Monitor terminal : Open collector type
• Space-saving package (SIP9)
■ PIN ASSIGNMENT
(FRONT VIEW)
VCC1
1
IN1
2
IN2
3
OUT2
4
GND
5
OUT1
6
INH
7
VCC2
8
MONITOR
9
(SIP-9P-M02)
■ PIN DESCRIPTION
2
Pin no.
Symbol
I/O
Description
1
VCC1

2
IN1
I
Load control signal input terminal 1
3
IN2
I
Load control signal input terminal 2
4
OUT2
O
Load control output terminal 2
5
GND

Ground terminal
6
OUT1
O
Load control output terminal 1
7
INH
I
Inhibitor signal input terminal
8
VCC2

Output system power supply terminal
9
MONITOR
O
Protective circuit motor signal output terminal (open collector type terminal)
Control system power supply terminal
MB3853
■ BLOCK DIAGRAM
VCC1
1
INH 7
IN1
VCC2
8
Power supply circuit
(ON/OFF)
2
6 OUT1
IN2
3
4 OUT2
Temperature
protection circuit
9 MONITOR
(open collector terminal)
Overvoltage
protection circuit
Overload current
protection circuit
Timer circuit
5
GND
3
MB3853
■ FUNCTIONAL DESCRIPTION
The MB3853 provides two methods for controlling motors. The IC can be connected to two motors and drive
each motor independently, or connected to one motor in an H-type connection and drive the motor in forward
and reverse directions.
1. Sample connection to 2 motors for run-stop control.
(1) Connection diagram
100 µF *1
− +
VCC1
INH
IN1
7
2
1
8
Power supply
circuit
VCC2
M2
SW1
Control circuit
6
SW2
M3
Run-stop
control
OUT1
*2
SW3
IN2
3
Control circuit
4
SW4
OUT2
*2
Protective
circuits
9
M2′
MONITOR
M3′
Run-stop
control
5
GND
*1 : The capacitor should be placed close to the IC terminal.
*2 : When using the M2’ and M3’ terminals, ensure that the OUT1 terminal (pin 6) voltage and
OUT2 terminal (pin 4) voltage do not fall below −0.3 V by connecting the OUT1 and OUT2
terminals to ground through a Shottky barrier diode.
(2) Table of Functions
Input voltage level
Mode
INH
IN1
IN2
OUT1
OUT2
Motor operating mode
M2
OFF
(high impedance)
M3
M2’
M3’
×
×
“L”
“L”
“H”
“H”
Brake
Brake
Run
Run
“L”
“H”
“H”
“L”
Brake
Run
Run
Brake
“H”
“L”
“L”
“H”
Run
Brake
Brake
Run
Mode (4)
“H”
× : May be either “H” or “L” level
“H”
“L”
“L”
Run
Run
Brake
Brake
Inhibit mode
“L”
Mode (1)
Mode (2)
Mode (3)
4
Output terminals
“H”
Continuous operation
MB3853
2. Sample connection to 1 motor for forward-reverse control
(1) Connection diagram
100 µF *1
− +
VCC1
INH
IN1
7
2
1
Power supply
circuit
Control circuit
8
VCC2
SW1
6
SW2
OUT1
*2
M1
SW3
IN2
3
Control circuit
Forward-reverse
control
4
SW4
OUT2
*2
Protective
circuits
9
MONITOR
5
GND
*1 : The capacitor should be placed close to the IC terminal.
*2 : Ensure that the OUT1 terminal (pin 6) voltage and OUT2 terminal (pin 4) voltage do
not fall below −0.3 V by connecting the OUT1 and OUT2 terminals to ground through
a Shot key barrier diode.
(2) Table of functions
Mode
Inhibit mode
Input voltage level
IN1
IN2
“L”
×
×
“L”
“L”
“H”
“H”
Brake
“L”
“H”
“H”
“L”
Forward (reverse)
Mode (3)
“H”
“L”
“L”
“H”
Reverse (forward)
“H”
“H”
“L”
“L”
Brake
“H”
Mode (4)
OUT1
OUT2
Motor mode
INH
Mode (1)
Mode (2)
Output terminals
OFF
(High impedance)
Continuous operation
× : May be either “H” or “L” level
5
MB3853
■ PROTECTIVE CIRCUITS
Circuit
name
Operating description
Timing chart
Detection level
Overvol
tage
protection
circuit
When the Vcc2 supply voltage input exceeds 33 V (Typ.) , the following occurs :
(1) All output transistors are turned off,
and output is set to high impedance
(2) As long as the condition is detected,
the monitoring output from the open
collector terminal is set to “L” level.
During detection
VCC2 = 33 V
(Typ.)
VCC2
Output terminals
Hi-Z *
ON
ON
“H”
Monitor terminal
“L”
Detection level
Temperature
protection
circuit
When the chip temperature exceeds TJ =
+180 °C, the following occurs :
(1) All output transistors are turned off,
and output is set to high impedance
(2) As long as the condition is detected,
the monitoring output from the open
collector terminal is set to “L” level.
During detection
TJ = +180 °C
(Typ.)
Chip
temperature
Output terminals
Hi-Z *
ON
ON
“H”
Monitor terminal
“L”
IO = 2.4 A
(Typ.)
Detection level
During detection
Load status
Monitors VBE of all output transistors.
When any transistor output load current exOvercur ceeds Io = 2.4 A (Typ.) , the following occurs :
rent
protec(1) All output transistors are switched on
tion
and off repeatedly
circuit
(2) As long as the condition is detected,
the monitoring output from the open
collector terminal is set to “L” level.
Output terminals
Hi-Z *
ON
Hi-Z *
“H”
Monitor terminal
“L”
t1
t2
t1
t2
(t1 ≅ 5 µs, t2 ≅ 95 µs)
* : All output transistors are turned off regardless of logic input voltage.
6
ON
MB3853
■ ABSOLUTE MAXIMUM RATINGS
(GND = 0 V)
Parameter
Symbol
Condition
VCC1
VCC2
Supply voltage
Rating
Unit
Min.
Max.


30
V


30
V
tr ≥ 1 ms, ts ≤ 200 ms

60
V
Surge voltage
VCC (S)
Output current
IO
10 ms or less per terminal

1.8
A
Power consumption
PD
TC ≤ +75 °C

18
W
Operating temperature
TC

−40
+85
°C
Tstg

−55
+150
°C
Storage temperature
WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current,
temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings.
■ RECOMMENDED OPERATING CONDITIONS
(GND = 0 V)
Parameter
Supply voltage
Symbol
Conditions
Values
Min.
Typ.
Max.
Unit
VCC1
Control system supply voltage
4.5
5
30
V
VCC2
Output system supply voltage

24
30
V
2.0

VCC1 + 0.3
V
−0.3

0.8
V
0
25
70
°C
“H” level input voltage
VIH
“L” level input voltage
VIL
Operating temperature
TC
IN1, IN2, INH terminals

WARNING: The recommended operating conditions are required in order to ensure the normal operation of the
semiconductor device. All of the device’s electrical characteristics are warranted when the device is
operated within these ranges.
Always use semiconductor devices within their recommended operating condition ranges. Operation
outside these ranges may adversely affect reliability and could result in device failure.
No warranty is made with respect to uses, operating conditions, or combinations not represented on
the data sheet. Users considering application outside the listed conditions are advised to contact their
FUJITSU representatives beforehand.
7
MB3853
■ ELECTRICAL CHARACTERISTICS
(TC = +25 °C, GND = 0 V, VCC1 = 5 V, VCC2 = 24 V)
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit
“L” level input current
IIL
VIL = 0.4 V


100
µA
“H” level input current
IIH
VIH = 2.4 V


100
µA
“L” level output current
VOL
IO = 1 A

1.0
1.4
V
“H” level output current
VOH
IO = −1 A
22.5
23.0

V
Diode forward voltage
VF
IO = 1.8 A

2.2

V
Overcurrent detection current
ICS

1.8
2.4
3.5
A
Overcurrent detection voltage
VSD

30.5
33.0
35.5
V
“L” level monitoring output voltage
VOL
IO = 1 mA

0.2
0.4
V
“H” level monitoring output current
IOH
VOH = 24 V


0.01
mA
IN1 = IN2 = “H”

3.7
7.4
mA
IN1/IN2 = “H/L”

2.8
5.6
mA
IN1 = IN2 = “L”

1.9
3.8
mA
IN1 = IN2 = “H”


1.0
mA
IN1/IN2 = “H/L”

13
20
mA
IN1 = IN2 = “L”

26
40
mA
ICC0
ICC1 + ICC2 INH = “L”


1.0
mA
θJ-C
Infinite heat dissipation

4

°C/W
IO = 1 A

1.2

W
IO = 0 mA (braking)

300

mW
IO = 1 A

2.4

W
ICC1
Supply current
ICC2
Package thermal resistance
Power consumption
OUT1 or OUT2, per terminal
In H-type drive configuration
8
Conditions
PD
MB3853
■ TYPICAL CHARACTERISTIC
Supply voltage vs. supply current
(VCC1 - ICC1)
Supply current vs. inhibitor terminal input voltage
6
6
VCC1 = 5 V
VCC2 = 24 V
5
Supply current ICC1 (mA)
Supply current ICC1 (mA)
5
VIN1 = 2.4 V, VIN2 = 2.4 V
4
VIN1 = 2.4 V, VIN2 = 0 V or
VIN1 = 0 V, VIN2 = 2.4 V
3
VIN1 = 0 V, VIN2 = 0 V
2
1
VIN1 = 2.4 V, VIN2 = 2.4 V
4
VIN1 = 0 V, VIN2 = 2.4 V or
VIN1 = 2.4 V, VIN2 = 0 V
3
VIN1 = 0 V, VIN2 = 0 V
2
1
0
0
0
2
3
4
6
1
5
Inhibitor signal input voltage VINH (V)
0
Supply voltage vs. supply current
(VCC2 - ICC1)
VIN1 = 0 V, VIN2 = 0 V
10
8
VIN1 = 0 V, VIN2 = 2.4 V or
VIN1 = 2.4 V, VIN2 = 0 V
6
VIN1 = 2.4 V, VIN2 = 2.4 V
4
VIN1 = 0 V, VIN2 = 0 V
2
5
10
15
20
25
Supply voltage VCC1 (V)
30
Supply voltage vs. supply current
(VCC2 - ICC2)
35
VCC1 = 5 V
VINH = 2.4 V
VCC1 = 5 V
VINH = 2.4 V
30
Supply current ICC2 (mA)
12
Supply current ICC1 (mA)
VCC2 = 24 V
VINH = 2.4 V
VIN1 = 0 V, VIN2 = 0 V
25
20
VIN1 = 0 V, VIN2 = 2.4 V or
VIN1 = 2.4 V, VIN2 = 0 V
15
10
5
0
0
5
10
15
20
25
Supply voltage VCC2 (V)
30
VIN1 = 2.4 V, VIN2 = 2.4 V
0
0
5
10
15
20
25
Supply voltage VCC2 (V)
30
(Continued)
9
MB3853
Supply voltage vs. supply current
(VCC1 - ICC2)
VCC2 = 24 V
VINH = 2.4 V
Supply current ICC2 (mA)
30
VIN1 = 0 V, VIN2 = 0 V
25
20
15
VIN1 = 0 V, VIN2 = 2.4 V or
VIN1 = 2.4 V, IN2 = 0 V
10
25
Saturation voltage VOL (V)
35
Saturation voltage vs.
pull side drive load current
VCC1 = 5 V
VCC2 = 24 V
VINH = 2.4 V
VIN1 = 2.4 V
VIN2 = 2.4 V
20
15
10
5
0
0
0.5
1.0
1.5
2.0
2.5
Pull side drive load current IO (A)
5
VIN1 = 2.4 V, VIN2 = 2.4 V
0
0
5
10
15
20
25
Supply voltage VCC1 (V)
30
Standby supply voltage vs. supply current
(VCC2 - ICC2)
Saturation voltage vs.
push side drive load current
VCC1 = 5 V
VCC2 = 24 V
VINH = 2.4 V
VIN1 = 0 V
VIN2 = 0 V
VCC2
−0.5
VCC2
−1.0
VCC2
−1.5
VCC2
−2.0
200
Supply current ICC2 (µA)
Saturation voltage VOH (V)
VCC2
VCC2
−2.5
3.0
VCC1 = 5 V
VINH = 0 V
150
100
50
0
0
5
10
15
20
25
30
Supply voltage VCC2 (V)
0
0.5
1.0
1.5
2.0
2.5
3.0
Push side drive load current IO (A)
(Continued)
10
MB3853
Flyback diode voltage vs. reverse surge current
0.30
5
0.25
Diode voltage VF (V)
Monitoring terminal output voltage VOL (V)
Monitoring terminal output current vs. output voltage
VCC2 = 36 V
0.20
0.15
0.10
0.05
VCC1 = 5 V
VCC2 = 24 V
VINH = 2.4 V
VIN1 = 0 V
VIN2 = 0 V
4
3
2
1
0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
Reverse surge current IO (A)
0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
Monitoring terminal output current IO (mA)
Input current vs. voltage characteristics
at maximum applied voltage
(Inhibitor terminal, function input terminals)
Input current vs. input voltage
(Inhibitor terminal, function input terminals)
1.6
VCC1 = 5 V
VCC2 = 24 V
200
150
VINH – IINH
100
VIN1 – IIN1 or
VIN2 – IIN2
50
0
0
1
2
3
4
5
Input voltage VIN1, VIN2, VINH (V)
6
Input current IIN1, IIN2, IINH (mA)
Input current IIN1, IIN2, IINH (µA)
250
VCC1 = 30 V
VCC2 = 30 V
1.4
1.2
VINH – IINH
1.0
0.8
0.6
0.4
VIN1 – IIN1 or
VIN2 – IIN2
0.2
0
0
5
10
15
20
25
30
35
Input voltage VIN1, VIN2, VINH (V)
(Continued)
11
MB3853
(Continued)
Allowable loss vs. Ambient temperature
(1) Infinite heat dissipation plate
(2) 900 cm2 × 2 mm Al plate
(3) 400 cm2 × 2 mm Al plate
(4) 200 cm2 × 2 mm Al plate
(5) 100 cm2 × 2 mm Al plate
(6) No dissipation plate
(1)
(4)
(2)
Allowable loss PD (W)
20
15
(3)
(5)
10
Junction temperature vs. duty ratio
100
Drive current
0.3 A
80
Duty ratio (%)
25
0.5 A
60
1A
40
5
20
(6)
0
25
50
75
100
125
150
Ambient temperature Ta (°C)
0
−40
0
40
80
120
160
Junction temperature TJ (°C)
Notes : • For stable operation over periods of extended usage, the duty ratio should be kept below
the characteristic curve.
• Junction temperature should be maintained at TJ ≤ +150 °C.
(Tj calculation)
TJ = TC + ∆T
∆T = 4 ( °C/W) × PDI
PDI = VCC × ICC + ∆VO × IO
∆VO = (VCC − VOH) +VOL
TC : case temperature, ∆T : difference between case and junction temperature
PDI : IC power consumption (W)
■ ORDERING INFORMATION
Part Number
MB3853PS
12
Package
Plastic SIP, 9 pins
(SIP-9P-M02)
Remarks
MB3853
■ PACKAGE DIMENSION
9-pin plastic SIP
(SIP-9P-M02)
23.60(.929)MAX
23.40(.921)MAX
8.00(.315)
3.30(.130)MAX
8.00(.315)
3.90(.154)
Ø3.40(.134)
0.60±0.10
(.024±.004)
3.40(.134)
11.10(.437)
14.20(.559)
MAX
6.40(.252)
1 PIN INDEX
0.80(.031)
5.80(.228)MIN
2.54(.100)
TYP
C
+0.30
1.20 –0
.047
+.012
–0
0.70±0.10
(.028±.004)
0.60±0.10
(.024±.004)
1994 FUJITSU LIMITED S09003S-3C-3
Dimensions in mm (inches) .
13
MB3853
FUJITSU LIMITED
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The contents of this document are subject to change without notice.
Customers are advised to consult with FUJITSU sales
representatives before ordering.
The information and circuit diagrams in this document are
presented as examples of semiconductor device applications, and
are not intended to be incorporated in devices for actual use. Also,
FUJITSU is unable to assume responsibility for infringement of
any patent rights or other rights of third parties arising from the use
of this information or circuit diagrams.
The products described in this document are designed, developed
and manufactured as contemplated for general use, including
without limitation, ordinary industrial use, general office use,
personal use, and household use, but are not designed, developed
and manufactured as contemplated (1) for use accompanying fatal
risks or dangers that, unless extremely high safety is secured, could
have a serious effect to the public, and could lead directly to death,
personal injury, severe physical damage or other loss (i.e., nuclear
reaction control in nuclear facility, aircraft flight control, air traffic
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extremely high reliability (i.e., submersible repeater and artificial
satellite).
Please note that Fujitsu will not be liable against you and/or any
third party for any claims or damages arising in connection with
above-mentioned uses of the products.
Any semiconductor devices have an inherent chance of failure. You
must protect against injury, damage or loss from such failures by
incorporating safety design measures into your facility and
equipment such as redundancy, fire protection, and prevention of
over-current levels and other abnormal operating conditions.
If any products described in this document represent goods or
technologies subject to certain restrictions on export under the
Foreign Exchange and Foreign Trade Law of Japan, the prior
authorization by Japanese government will be required for export
of those products from Japan.
F0107
 FUJITSU LIMITED Printed in Japan
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