Infineon BBY58-03W Silicon tuning diode Datasheet

BBY58...
Silicon Tuning Diodes
• Excellent linearity
• High Q hyperabrupt tuning diode
• Low series resistance
• Designed for low tuning voltage operation
for VCO's in mobile communications equipment
• For low frequency control elements
such as TCXOs and VCXOs
• Very low capacitance spread
• Pb-free (RoHS compliant) package1)
• Qualified according AEC Q101
BBY58-02L/V
BBY58-02W
BBY58-03W
BBY58-05W
BBY58-06W
!
, !
,
Type
BBY58-02L
BBY58-02V
BBY58-02W
BBY58-03W
BBY58-05W
BBY58-06W
, ,
Package
TSLP-2-1
SC79
SCD80
SOD323
SOT323
SOT323
Configuration
single, leadless
single
single
single
common cathode
common anode
LS(nH)
0.4
0.6
0.6
0.6
1.4
1.4
Marking
88
8
88
8 yel.
B5s
B6s
Maximum Ratings at TA = 25°C, unless otherwise specified
Parameter
Symbol
Diode reverse voltage
VR
10
V
Forward current
IF
20
mA
Operating temperature range
Top
-55 ... 150
°C
Storage temperature
Tstg
-55 ... 150
1Pb-containing
Value
Unit
package may be available upon special request
1
2007-09-19
BBY58...
Electrical Characteristics at T A = 25°C, unless otherwise specified
Symbol
Parameter
Values
min.
typ.
Unit
max.
DC Characteristics
Reverse current
IR
nA
VR = 8 V
-
-
10
VR = 8 V, TA = 85 °C
-
-
100
AC Characteristics
Diode capacitance
pF
CT
VR = 1 V, f = 1 MHz
17.5
18.3
19.3
VR = 2 V, f = 1 MHz
11.4
12.35
13.3
VR = 3 V, f = 1 MHz
7.8
8.6
9.3
VR = 4 V, f = 1 MHz
5.5
6
6.6
VR = 6 V, f = 1 MHz
3.8
4.7
5.5
CT1/C T3
1.9
2.15
2.4
CT1/C T4
2.7
3.05
3.5
CT4/C T6
1.15
1.3
1.45
Capacitance ratio
-
VR = 1 V, VR = 3 V, f = 1 MHz
Capacitance ratio
VR = 1 V, VR = 4 V, f = 1 MHz
Capacitance ratio
VR = 4 V, VR = 6 V, f = 1 MHz
Series resistance
Ω
rS
VR = 1 V, f = 470 MHz, BBY58-02L, -07L4
-
0.3
-
VR = 1 V, f = 470 MHz, all other
-
0.25
-
2
2007-09-19
BBY58...
Diode capacitance CT = ƒ (VR)
Normalized diode capacitance
f = 1MHz
C(TA)/C(25°C)= ƒ(TA)
f = 1MHz, VR = Parameter
1.05
32
-
pF
1V
1.03
CTA/C25
CT
24
20
4V
1.02
1.01
1
16
0.99
12
0.98
8
0.97
4
0
0
0.96
0.5
1
1.5
2
2.5
3
3.5
4
V
0.95
-30
5
VR
-10
10
30
50
70
°C
100
TA
Temperature coefficient of the diode
capacitance TCc = ƒ (VR)
TCC
10 -3
1/°C
10 -4
0
0.5
1
1.5
2
2.5
3
3.5
4
V
5
VR
3
2007-09-19
Package SC79
BBY58...
Package Outline
0.2
M
A
+0.05
0.13 -0.03
0.8 ±0.1
0.2 ±0.05
10˚MAX.
1.6 ±0.1
1
0.3 ±0.05
Cathode
marking
10˚MAX.
1.2 ±0.1
A
2
0.55 ±0.04
0.35
1.35
Foot Print
0.35
Marking Layout (Example)
2005, June
Date code
BAR63-02V
Type code
Cathode marking
Laser marking
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø180 mm = 8.000 Pieces/Reel (2 mm Pitch)
Reel ø330 mm = 10.000 Pieces/Reel
Cathode
marking
0.4
0.93
0.2
8
1.96
Reel with 2 mm Pitch
2
1.33
Standard
4
Cathode
marking
4
0.66
2007-09-19
Package SCD80
BBY58...
Package Outline
0.2
M
A
+0.05
0.13 -0.03
0.8 ±0.1
0.2 ±0.05
10˚MAX.
1.7 ±0.1
1
0.3 ±0.05
Cathode
marking
7˚ ±1.5˚
1.3 ±0.1
A
2
0.7 ±0.1
0.35
1.45
Foot Print
0.35
Marking Layout (Example)
2005, June
Date code
BAR63-02W
Type code
Cathode marking
Laser marking
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø180 mm = 8.000 Pieces/Reel (2 mm Pitch)
Reel ø330 mm = 10.000 Pieces/Reel
Reel with 2 mm Pitch
2
0.2
2.5
8
1.45
Standard
4
Cathode
marking
0.4
0.9
Cathode
marking
5
0.7
2007-09-19
BBY58...
Date Code marking for discrete packages with
one digit (SCD80, SC79, SC75 1) ) CES-Code
Month 2 0 03
2 0 04
2005
2006
2 0 07
2008
2009
2010
2011
2012
2 0 13
2014
01
a
p
A
P
a
p
A
P
a
p
A
P
02
b
q
B
Q
b
q
B
Q
b
q
B
Q
03
c
r
C
R
c
r
C
R
c
r
C
R
04
d
s
D
S
d
s
D
S
d
s
D
S
05
e
t
E
T
e
t
E
T
e
t
E
T
06
f
u
F
U
f
u
F
U
f
u
F
U
07
g
v
G
V
g
v
G
V
g
v
G
V
08
h
x
H
X
h
x
H
X
h
x
H
X
09
j
y
J
Y
j
y
J
Y
j
y
J
Y
10
k
z
K
Z
k
z
K
Z
k
z
K
Z
11
l
2
L
4
l
2
L
4
l
2
L
4
12
n
3
N
5
n
3
N
5
n
3
N
5
1) New Marking Layout for SC75, implemented at October 2005.
.
6
2007-09-19
Package SOD323
BBY58...
Package Outline
0.9 +0.2
-0.1
+0.2
1.25 -0.1
0 ±0.05
A
1.7 +0.2
-0.1
Cathode
marking
0.45 ±0.15
2.5 ±0.2
2
1
0.3 +0.1
-0.05
+0.05
0.3 -0.2
0.15 +0.1
-0.06
0.25 M A
0.8
1.7
0.8
Foot Print
0.6
Marking Layout (Example)
BAR63-03W
Type code
Cathode marking
Laser marking
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
0.2
2
2.9
8
4
Cathode
marking
0.65
1.35
7
1
2007-09-19
Package SOT323
BBY58...
Package Outline
0.9 ±0.1
2 ±0.2
0.3 +0.1
-0.05
0.1 MAX.
3x
0.1
M
0.1
A
1
2
1.25 ±0.1
0.1 MIN.
2.1 ±0.1
3
0.15 +0.1
-0.05
0.65 0.65
0.2
M
A
Foot Print
0.8
1.6
0.6
0.65
0.65
Marking Layout (Example)
Manufacturer
2005, June
Date code (YM)
BCR108W
Type code
Pin 1
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
0.2
2.3
8
4
Pin 1
2.15
1.1
8
2007-09-19
Package TSLP-2-1
BBY58...
Package Outline
Top view
Bottom view
0.4 +0.1
0.6 ±0.05
0.05 MAX.
1
1)
1)
0.5 ±0.035
Cathode
marking
0.25 ±0.035
2
1
1 ±0.05
0.65±0.05
2
1) Dimension applies to plated terminal
Foot Print
0.6
0.275
For board assembly information please refer to Infineon website "Packages"
Copper
Solder mask
0.375
0.275
0.35
1
0.3
0.925
0.35
0.45
Stencil apertures
Marking Layout (Example)
BAS16-02L
Type code
Cathode marking
Laser marking
Standard Packing
Reel ø180 mm = 15.000 Pieces/Reel
Reel ø330 mm = 50.000 Pieces/Reel (optional)
0.5
1.16
Cathode
marking
8
4
0.76
9
2007-09-19
BBY58...
Edition 2006-02-01
Published by
Infineon Technologies AG
81726 München, Germany
© Infineon Technologies AG 2007.
All Rights Reserved.
Attention please!
The information given in this dokument shall in no event be regarded as a guarantee
of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any
examples or hints given herein, any typical values stated herein and/or any information
regarding the application of the device, Infineon Technologies hereby disclaims any
and all warranties and liabilities of any kind, including without limitation warranties of
non-infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices
please contact your nearest Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest
Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or
systems with the express written approval of Infineon Technologies, if a failure of
such components can reasonably be expected to cause the failure of that
life-support device or system, or to affect the safety or effectiveness of that
device or system.
Life support devices or systems are intended to be implanted in the human body,
or to support and/or maintain and sustain and/or protect human life. If they fail,
it is reasonable to assume that the health of the user or other persons
may be endangered.
10
2007-09-19
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