ON CM1224-04MR 2- and 4-channel low capacitance esd protection array Datasheet

2- and 4-Channel Low Capacitance ESD
Protection Arrays
CM1224
Features
•
•
•
•
•
•
•
•
•
•
Two or four channels of ESD protection
Provides ESD protection to IEC61000-4-2 Level 4
•
±8kV contact discharge
Low channel input capacitance of 0.7pF typical
Minimal capacitance change with temperature and
voltage
Channel input capacitance matching of 0.02pF typical
is ideal for differential signals
Zener diode protects supply rail and eliminates the
need for external by-pass capacitors
Low clamping voltage (VCLAMP) at 10V
Low Dynamic resistance (RDYN) at 1.08Ω
Each I/O pin can withstand over 1000 ESD strikes*
Available in SOT and MSOP lead-free packages
Applications
•
•
•
•
•
•
USB 2.0 ports at 480Mbps in desktop PCs, notebooks
and peripherals
IEEE1394 Firewire ports at 400Mbps / 800Mbps
DVI ports, HDMI ports in notebooks, set top boxes,
digital TVs, LCD displays
Serial ATA ports in desktop PCs and hard disk drives
PCI Express ports
General purpose high-speed data line ESD
protection
Product Description
The CM1224 family of diode arrays has been designed to
provide ESD protection for electronic components or subsystems requiring minimal capacitive loading. These
devices are ideal for protecting systems with high data and
clock rates or for circuits requiring low capacitive loading.
Each ESD channel consists of a pair of diodes in series
which steer the positive or negative ESD current pulse to
either the positive (VP) or negative (VN) supply rail. A Zener
diode is embedded between VP and VN, offering two
advantages. First, it protects the VCC rail against ESD
strikes, and second, it eliminates the need for a bypass
capacitor that would otherwise be needed for absorbing
positive ESD strikes to ground. The CM1224 protects
against ESD pulses up to ±8kV per the IEC 61000-4-2
standard.
These devices are particularly well-suited for protecting
systems using high-speed ports such as USB 2.0,
IEEE1394 (Firewire, iLink), Serial ATA, DVI, HDMI and
corresponding ports in removable storage, digital
camcorders, as well as DVD-RW drives and other
applications where extremely low loading capacitance with
ESD protection are required.
The CM1224 family of devices has lead-free finishing in a
small package footprint.
Block Diagram
©2010 SCILLC. All rights reserved.
April 2010 – Rev. 3
Publication Order Number:
CM1224/D
CM1224
Package/Pinout Diagrams
Pin Configuration
PIN
1
2
3
4
PIN
1
2-CHANNEL, 4-LEAD SOT143-4 PACKAGE
NAME
TYPE
DESCRIPTION
VN
GND
Negative voltage supply rail
CH1
I/O
ESD Channel
CH2
I/O
ESD Channel
VP
PWR
Positive voltage supply rail
4-CHANNEL, 6-LEAD SOT23-6 PACKAGES
NAME
TYPE
DESCRIPTION
CH1
I/O
ESD Channel
PIN
1
2
3
4
5
6
7
4-CHANNEL, 10-LEAD MSOP-10 PACKAGES
NAME
TYPE
DESCRIPTION
CH1
I/O
ESD Channel
NC
No Connect
VP
PWR
Positive voltage supply rail
CH2
I/O
ESD Channel
NC
No Connect
CH3
I/O
ESD Channel
NC
No Connect
2
VN
GND
Negative voltage supply rail
8
VN
GND
3
4
5
6
CH2
CH3
VP
CH4
I/O
I/O
PWR
I/O
ESD Channel
ESD Channel
Positive voltage supply rail
ESD Channel
9
CH4
I/O
10
NC
Rev. 3 | Page 2 of 14 | www.onsemi.com
Negative voltage supply
rail
ESD Channel
No Connect
CM1224
Ordering Information
PART NUMBERING INFORMATION
Lead-free Finish
1
# of Channels
Leads
Package
Ordering Part Number
Part Marking
2
4
SOT143-4
CM1224-02SR
L242
4
6
SOT23-6
CM1224-04SO
L244
4
10
MSOP-10
CM1224-04MR
L243
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
UNITS
6.0
V
Operating Temperature Range
–40 to +85
°C
Storage Temperature Range
–65 to +150
°C
(VN - 0.5) to (VP + 0.5)
V
Operating Supply Voltage (VP - VN)
DC Voltage at any channel input
STANDARD OPERATING CONDITIONS
PARAMETER
Operating Temperature Range
Package Power Rating
SOT23-3, SOT143-4,SOT23-5 and SOT23-6 Packages
MSOP-10 Package
Rev. 3 | Page 3 of 14 | www.onsemi.com
RATING
UNITS
–40 to +85
°C
225
400
mW
mW
CM1224
ELECTRICAL OPERATING CHARACTERISTICS
SYMBOL PARAMETER
CONDITIONS
VP
Operating Supply Voltage (VP-VN)
IP
Operating Supply Current
(VP-VN)=3.3V
VF
Diode Forward Voltage
Top Diode
Bottom Diode
IF = 8mA; TA=25°C
ILEAK
Channel Leakage Current
TA=25°C; VP=5V, VN=0V
CIN
Channel Input Capacitance
At 1 MHz, VP=3.3V, VN=0V,
VIN=1.65V
∆C
Channel Input Capacitance Matching
At 1 MHz, VP=3.3V, VN=0V,
VIN=1.65V
VESD
ESD Protection - Peak Discharge Voltage at
any channel input, in system
Contact discharge per IEC 61000-4-2
standard
RDYN
MIN
0.60
0.60
IN
VCL
(SEE NOTE 1)
Notes 2 and 3; TA=25°C
Channel Clamp Voltage
Positive Transients
Negative Transients
TA=25°C, IPP = 1A,
tP = 8/20µS; Note 3
Dynamic Resistance
Positive Transients
Negative Transients
IPP = 1A, tP = 8/20µS
Any I/O pin to Ground;
Note 3
Note 1: All parameters specified at TA = –40°C to +85°C unless otherwise noted.
Note 2: Standard IEC 61000-4-2 with CDischarge = 150pF, RDischarge = 330Ω, VP = 3.3V, VN grounded.
Note 3: These measurements performed with no external capacitor on VP (VP floating).
Rev. 3 | Page 4 of 14 | www.onsemi.com
0.60
TYP
MAX
UNITS
3.3
5.5
V
8.0
µA
0.80
0.80
0.95
0.95
V
V
±0.1
±1.0
µA
0.70
0.80
pF
0.02
pF
kV
±8
+10.0
–1.8
V
V
V
1.08
0.66
Ω
Ω
CM1224
Performance Information
Input Channel Capacitance Performance Curves
Rev. 3 | Page 5 of 14 | www.onsemi.com
CM1224
Performance Information (cont’d)
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 1. Insertion Loss (S21) VS. Frequency (0V DC Bias, VP=3.3V)
Figure 2. Insertion Loss (S21) VS. Frequency (2.5V DC Bias, VP=3.3V)
Rev. 3 | Page 6 of 14 | www.onsemi.com
CM1224
Application Information
Design Considerations
To realize the maximum protection against ESD pulses, care must be taken in the PCB layout to minimize
parasitic series inductances on the Supply/ Ground rails as well as the signal trace segment between the signal
input (typically a connector) and the ESD protection device. Application of Positive ESD Pulse between Input
Channel and Ground illustrates an example of a positive ESD pulse striking an input channel. The parasitic
series inductance back to the power supply is represented by L1 and L2. The voltage VCL on the line being
protected is:
VCL
=
Fwd
+ L2 x d(IESD) / dt
voltage
drop
of
D1
+
VSUPPLY
+
L1
x
d(IESD)
/
dt
where IESD is the ESD current pulse, and VSUPPLY is the positive supply voltage.
An ESD current pulse can rise from zero to its peak value in a very short time. As an example, a level 4 contact
discharge per the IEC61000-4-2 standard results in a current pulse that rises from 0 to 30 Amps in 1ns. Here
-9
d(IESD)/dt can be approximated by ∆IESD/∆t, or 30/(1x10 ). So just 10nH of series inductance (L1 and L2 combined)
will lead to a 300V increment in VCL!
Similarly for negative ESD pulses, parasitic series inductance from the VN pin to the ground rail will lead to
drastically increased negative voltage on the line being protected.
The CM1224 has an integrated Zener diode between VP and VN. This greatly reduces the effect of supply rail
inductance L2 on VCL by clamping VP at the breakdown voltage of the Zener diode. However, for the lowest
possible VCL, especially when VP is biased at a voltage significantly below the Zener breakdown voltage, it is
recommended that a 0.22µF ceramic chip capacitor be connected between VP and the ground plane.
As a general rule, the ESD Protection Array should be located as close as possible to the point of entry of
expected electrostatic discharges. The power supply bypass capacitor mentioned earlier should be as close to
the VP pin of the Protection Array as possible, with minimum PCB trace lengths to the power supply, ground
planes and between the signal input and the ESD device to minimize stray series inductance.
Additional Information
See also California Micro Devices Application Note AP209, “Design Considerations for ESD Protection,” in the
Applications section at www.calmicro.com.
Figure 3. Application of Positive ESD Pulse between Input Channel and Ground
Rev. 3 | Page 7 of 14 | www.onsemi.com
CM1224
Mechanical Details
The CM1224 is available in SOT143-4, SOT23-6, and MSOP-10 packages with a lad-free finishing option. The
various package drawings are presented below.
SOT143-4 Mechanical Specifications
Dimensions for CM1224-02SR devices supplied in 4-pin SOT143 packages are presented below.
PACKAGE DIMENSIONS
Package
SOT143
Pins
4
Dimensions
Millimeters
Inches
Min
Max
Min
Max
A
0.80
1.22
0.031
0.048
A1
0.05
0.15
0.002
0.006
b
0.30
0.50
0.012
0.019
b2
0.76
0.89
0.030
0.035
c
0.08
0.20
0.003
0.008
D
2.80
3.04
0.110
0.119
E
2.10
2.64
0.082
0.103
E1
1.20
1.40
e
1.92 BSC
e1
0.20 BSC
L
L1
# per tape
and reel
0.4
0.055
0.075 BSC
0.008 BSC
0.6
0.54 REF
0.047
0.016
0.024
0.021 REF
3000 pieces
Package Dimensions for SOT143
Controlling dimension: millimeters
Rev. 3 | Page 8 of 14 | www.onsemi.com
CM1224
Tape and Reel Specifications
PACKAGE SIZE
PART NUMBER (mm)
CM1224-02SR
2.92 X 2.37 X 1.01
POCKET SIZE (mm)
B0 X A0 X K0
TAPE WIDTH REEL
W
DIAMETER
QTY PER
REEL
P0
P1
2.60 X 3.15 X 1.20
8mm
3000
4mm
4mm
Rev. 3 | Page 9 of 14 | www.onsemi.com
178mm (7")
CM1224
Mechanical Details (cont’d)
SOT23-6 Mechanical Specifications
CM1224-04SO devices are packaged in 6-pin SOT23 packages. Dimensions are presented below.
PACKAGE DIMENSIONS
Package
SOT23-6 (JEDEC name is MO-178)
Pins
6
Dimensions
Millimeters
Inches
Min
Max
Min
Max
A
--
1.45
--
0.0571
A1
0.00
0.15
0.0000
0.0059
b
0.30
0.50
0.0118
0.0197
c
0.08
0.22
0.0031
0.0087
D
2.75
3.05
0.1083
0.1201
E
2.60
3.00
0.1024
0.1181
E1
1.45
1.75
0.0571
0.0689
e
0.95 BSC
0.0374 BSC
e1
1.90 BSC
0.0748 BSC
L
L1
# per tape
and reel
0.30
0.60
0.60 REF
0.0118
0.0236
0.0236 REF
3000 pieces
Controlling dimension: millimeters
Package Dimensions for SOT23-6
Rev. 3 | Page 10 of 14 | www.onsemi.com
CM1224
Tape and Reel Specifications
PART NUMBER
PACKAGE SIZE
(mm)
POCKET SIZE (mm)
B0 X A0 X K0
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
P0
P1
CM1224-04SO
2.90 X 2.80 X 1.45
3.20 X 3.20 X 1.40
8mm
178mm (7")
3000
4mm
4mm
Rev. 3 | Page 11 of 14 | www.onsemi.com
CM1224
Mechanical Details (cont’d)
MSOP-10 Mechanical Specifications, 10 pin
The CM1224-04MR 10-lead MSOP package dimensions are presented below.
PACKAGE DIMENSIONS
Package
MSOP
Pins
10
Dimensions
Millimeters
Inches
Min
Max
Min
Max
A
0.75
0.95
0.028
0.038
A1
0.05
0.15
0.002
0.006
B
0.17
0.27
0.007
0.013
C
0.13
0.23
0.005
0.009
D
2.90
3.10
0.114
0.122
E
2.90
3.10
0.114
0.122
e
0.50 BSC
0.0196 BSC
H
4.90 BSC
0.193 BSC
L
# per tape
and reel
0.40
0.70
0.0137
0.029
4000
Controlling dimension: millimeters
Package Dimensions for MSOP-10
Rev. 3 | Page 12 of 14 | www.onsemi.com
CM1224
Tape and Reel Specifications
PART NUMBER
PACKAGE SIZE
(mm)
POCKET SIZE (mm)
B0 X A0 X K0
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
P0
P1
CM1224-04MR
3.00 X 3.00 X 0.85
3.30 X 5.30 X 1.30
12mm
330mm (13")
4000
4mm
8mm
Rev. 3 | Page 13 of 14 | www.onsemi.com
CM1224
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are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any
products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising
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Rev. 3 | Page 14 of 14 | www.onsemi.com
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