Intersil ISL62881BHRTZ Single-phase pwm regulator for imvp-6.5â ¢ mobile cpus and gpus Datasheet

ISL62881, ISL62881B
Features
The ISL62881 is a single-phase PWM buck regulator for
miroprocessor or graphics processor core power supply.
It uses an integrated gate drivers to provide a complete
solution. The PWM modulator of ISL62881 is based on
Intersil's Robust Ripple Regulator (R3) technology™.
Compared with traditional modulators, the R3™
modulator commands variable switching frequency
during load transients, achieving faster transient
response. With the same modulator, the switching
frequency is reduced at light load, increasing the
regulator efficiency.
• Precision Core Voltage Regulation
- 0.5% System Accuracy Over-Temperature
- Enhanced Load Line Accuracy
The ISL62881 can be configured as CPU or graphics
Vcore controller and is fully compliant with IMVP-6.5™
specifications. It responds to DPRSLPVR signals by
entering/exiting diode emulation mode. It reports the
regulator output current through the IMON pin. It senses
the current by using either discrete resistor or inductor
DCR whose variation over-temperature can be thermally
compensated by a single NTC thermistor. It uses
differential remote voltage sensing to accurately regulate
the processor die voltage. The adaptive body diode
conduction time reduction function minimizes the body
diode conduction loss in diode emulation mode.
User-selectable overshoot reduction function offers an
option to aggressively reduce the output capacitors as
well as the option to disable it for users concerned about
increased system thermal stress.
• Superior Noise Immunity and Transient Response
Maintaining all the ISL62881 functions, the ISL62881B
offers VR_TT# function for thermal throttling control. It
also offers the split LGATE function to further improve
light load efficiency.
Applications
• Voltage Identification Input
- 7-Bit VID Input, 0V to 1.500V in 12.5mV Steps
- Supports VID Changes On-The-Fly
• Supports Multiple Current Sensing Methods
- Lossless Inductor DCR Current Sensing
- Precision Resistor Current Sensing
• Current Monitor
• Differential Remote Voltage Sensing
• High Efficiency Across Entire Load Range
• Integrated Gate Driver
• Split LGATE Driver to Increase Light-Load Efficiency
(For ISL62881B)
• Adaptive Body Diode Conduction Time Reduction
• User-selectable Overshoot Reduction Function
• Capable of Disabling the Droop Function
• Audio-filtering for GPU Application
• Small Footprint 28 Ld 4x4 TQFN Package
• Pb-Free (RoHS Compliant)
• Notebook Computers
Ordering Information
PART NUMBER
(Notes 1, 2, 3)
PART MARKING
TEMP. RANGE
(°C)
PACKAGE
(Pb-Free)
PKG.
DWG. #
ISL62881HRTZ*
628 81HRTZ
-10 to +100
28 Ld 4x4 TQFN
L28.4x4
ISL62881BHRTZ*
62881B HRTZ
-10 to +100
32 Ld 5x5 TQFN
L32.5x5E
NOTES:
1. Add “-T” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach
materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both
SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that
meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
3. For Moisture Sensitivity Level (MSL), please see device information page for ISL62881, ISL62881B. For more information on
MSL please see techbrief TB363.
October 26, 2009
FN6924.0
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2009. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
ISL62881, ISL62881B
Single-Phase PWM Regulator for IMVP-6.5™ Mobile
CPUs and GPUs
ISL62881, ISL62881B
Pin Configurations
21 VID1
PGOOD 2
20 VID0
RBIAS 3
19 VCCP
4
FB
VID2
VID3
VID4
VID5
PGOOD 1
24 VID1
RBIAS 2
23 VID0
VR_TT# 3
22 VCCP
18 LGATE
GND PAD
(BOTTOM)
COMP 5
VID6
32 31 30 29 28 27 26 25
CLK_EN# 1
VW
DPRSLPVR
CLK_EN#
VID2
VID3
VID5
VID4
VID6
DPRSLPVR
VR_ON
28 27 26 25 24 23 22
VR_ON
ISL62881B
(32 LD TQFN)
TOP VIEW
ISL62881
(28 LD TQFN)
TOP VIEW
NTC 4
17 VSSP
21 LGATEb
GND PAD
(BOTTOM)
GND 5
20 LGATEa
VW 6
VSEN 7
15 UGATE
COMP 7
18 PHASE
FB 8
17 UGATE
BOOT
Pin Function Description
GND (Bottom Pad)
Signal common of the IC. Unless otherwise stated,
signals are referenced to the GND pin.
CLK_EN#
19 VSSP
BOOT
IMON
VIN
VDD
ISUM+
ISUM-
RTN
9 10 11 12 13 14 15 16
VSEN
IMON
VIN
10 11 12 13 14
VDD
9
ISUM+
8
RTN
16 PHASE
ISUM-
6
COMP
This pin is the output of the error amplifier. Also, a
resistor across this pin and GND adjusts the overcurrent
threshold.
FB
This pin is the inverting input of the error amplifier.
Open drain output to enable system PLL clock; goes
active 13 switching cycles after Vcore is within 10% of
Vboot.
PGOOD
Power-Good open-drain output indicating when the
regulator is able to supply regulated voltage. Pull-up
externally with a 680Ω resistor to VCCP or 1.9kΩ to 3.3V.
VSEN
Remote core voltage sense input. Connect to
microprocessor die.
RTN
Remote voltage sensing return. Connect to ground at
microprocessor die.
RBIAS
ISUM- and ISUM+
A resistor to GND sets internal current reference. A
147kΩ resistor sets the controller for CPU core
application and a 47kΩ resistor sets the controller for
GPU core application.
Droop current sense input.
VR_TT#
VIN
Thermal overload output indicator.
Battery supply voltage, used for feed-forward.
NTC
IMON
Thermistor input to VR_TT# circuit.
An analog output. IMON outputs a current proportional to
the regulator output current.
VW
A resistor from this pin to COMP programs the switching
frequency (8kΩ gives approximately 300kHz).
2
VDD
5V bias power.
BOOT
Connect an MLCC capacitor across the BOOT and the
PHASE pins. The boot capacitor is charged through an
internal boot diode connected from the VCCP pin to the
BOOT pin, each time the PHASE pin drops below VCCP
FN6924.0
October 26, 2009
ISL62881, ISL62881B
minus the voltage dropped across the internal boot
diode.
UGATE
Output of the high-side MOSFET gate driver. Connect the
UGATE pin to the gate of the high-side MOSFET.
PHASE
Current return path for the high-side MOSFET gate
driver. Connect the PHASE pin to the node consisting of
the high-side MOSFET source, the low-side MOSFET drain
and the output inductor.
LGATEb (For ISL62881B)
Another output of the low-side MOSFET gate driver. This
gate driver will be pulled low when the DPRSLPVR pin
logic is high. Connect the LGATEb pin to the gate of the
low-side MOSFET that is idle in deeper sleep mode.
VCCP
Input voltage bias for the internal gate drivers. Connect
+5V to the VCCP pin. Decouple with at least 1µF of an
MLCC capacitor to VSSP1 and VSSP2 pins respectively.
VID0, VID1, VID2, VID3, VID4, VID5, VID6
VSSP
VID input with VID0 = LSB and VID6 = MSB.
Current return path for the low-side MOSFET gate driver.
Connect the VSSP pin to the source of the low-side
MOSFET through a low impedance path, preferably in
parallel with the trace connecting the LGATE pin to the
gate of the low-side MOSFET.
VR_ON
LGATE (For ISL62881)
A high level logic signal on this pin puts the ISL62881 in
1-phase diode emulation mode. If RBIAS = 47kΩ (GPU
VR application), this pin also controls Vcore slew rate.
Vcore slews at 5mV/µs for DPRSLPVR = 0 and 10mV/µs
for DPRSLPVR = 1. If RBIAS = 147kΩ (CPU VR
application), this pin doesn’t control Vcore slew rate.
Output of the low-side MOSFET gate driver. Connect the
LGATE pin to the gate of the low-side MOSFET.
LGATEa (For ISL62881B)
Output of the low-side MOSFET gate driver that is always
active. Connect the LGATEa pin to the gate of the lowside MOSFET that is active all the time.
3
Voltage regulator enable input. A high level logic signal
on this pin enables the regulator.
DPRSLPVR
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October 26, 2009
ISL62881, ISL62881B
Block Diagram
VIN VSEN
VR_ON
PGOOD
AND
CLK_EN#
LOGIC
MODE
CONTROL
DPRSLPVR
RBIAS
PROTECTION
6µA 54µA 1.20V
NTC
FLT
ISL62881B
ONLY
VID1
VID3
VR_TT#
1.24V
VID0
VID2
VDD
PGOOD CLK_EN#
WOC OC
VIN
DAC
AND
SOFT
START
CLOCK
VDAC
COMP
VID4
VW
VID5
Σ
RTN
E/A
FB
VIN
COMP
VW
MODULATOR
Idroop
WOC
Imon
IMON
2.5
X
ISUM+
CURRENT
SENSE
ISUM-
VDAC
DRIVER
UGATE
PHASE
SHOOT
THROUGH
PROTECTION
VCCP
DRIVER
LGATEA
COMP
CURRENT
60µA
COMPARATORS
OC
Σ
4
PWM CONTROL LOGIC
BOOT
VID6
VSSP
ISL62881 ONLY
DRIVER
ADJ. OCP
THRESHOLD
LGATEB
COMP
ISL62881B
ONLY
GND
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October 26, 2009
ISL62881, ISL62881B
Absolute Maximum Ratings
Thermal Information
Supply Voltage, VDD. . . . . . . . . . . . . . . . . . . .-0.3V to +7V
Battery Voltage, VIN . . . . . . . . . . . . . . . . . . . . . . . . . +28V
Boot Voltage (BOOT) . . . . . . . . . . . . . . . . . . -0.3V to +33V
Boot to Phase Voltage (BOOT-PHASE) . . . . -0.3V to +7V(DC)
. . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +9V(<10ns)
Phase Voltage (PHASE) . . . . . -7V (<20ns Pulse Width, 10µJ)
UGATE Voltage (UGATE) . . . . . . . PHASE-0.3V (DC) to BOOT
. . . . . . . . . PHASE-5V (<20ns Pulse Width, 10µJ) to BOOT
LGATE Voltage (LGATE) . . . . . . . . -0.3V (DC) to VDD + 0.3V
. . . . . . . . . -2.5V (<20ns Pulse Width, 5µJ) to VDD + 0.3V
All Other Pins. . . . . . . . . . . . . . . . . . -0.3V to (VDD + 0.3V)
Open Drain Outputs, PGOOD, VR_TT#, CLK_EN#
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.3V to +7V
Thermal Resistance (Typical, Notes 4, 5)θJA (°C/W) θJC (°C/W)
28 Ld TQFN Package. . . . . . . . . . .
40
3
32 Ld TQFN Package. . . . . . . . . . .
32
3
Maximum Junction Temperature . . . . . . . . . . . . . . . +150°C
Maximum Storage Temperature Range . . . -65°C to +150°C
Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Recommended Operating Conditions
Supply Voltage, VDD .
Battery Voltage, VIN .
Ambient Temperature
Junction Temperature
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. . . . . +5V ±5%
. . . . +5V to 25V
-10°C to +100°C
-10°C to +125°C
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact
product reliability and result in failures not covered by warranty.
NOTES:
4. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach”
features. See Tech Brief TB379.
5. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside.
Electrical Specifications
PARAMETER
Operating Conditions: VDD = 5V, TA = -10°C to +100°C, fSW = 300kHz, unless otherwise
noted. Boldface limits apply over the operating temperature range, -10°C to
+100°C.
SYMBOL
TEST CONDITIONS
MIN
MAX
(Note 7) TYP (Note 7) UNITS
INPUT POWER SUPPLY
+5V Supply Current
IVDD
4.0
mA
VR_ON = 0V
1
µA
IVIN
VR_ON = 0V
1
µA
VIN Input Resistance
RVIN
VR_ON = 1V
900
Power-On-Reset Threshold
PORr
VDD rising
4.35
PORf
VDD falling
Battery Supply Current
VR_ON = 1V
3.2
4.00
kΩ
4.5
4.15
V
V
SYSTEM AND REFERENCES
System Accuracy
%Error (VCC_CORE) No load; closed loop, active mode range
VID = 0.75V to 1.50V
VID = 0.5V to 0.7375V
VID = 0.3V to 0.4875V
-0.5
+0.5
%
-8
+8
mV
+15
mV
1.1055
V
-15
1.0945
VBOOT
1.100
Maximum Output Voltage
VCC_CORE(max)
VID = [0000000]
1.500
V
Minimum Output Voltage
(Note 6)
VCC_CORE(min)
VID = [1111111]
0
V
RBIAS Voltage
RBIAS = 147kΩ
1.45
1.47
1.49
V
RFSET = 7kΩ, VCOMP = 1V
295
310
325
kHz
200
500
kHz
-0.15
+0.15
mV
CHANNEL FREQUENCY
Nominal Channel Frequency
fSW(nom)
Adjustment Range
AMPLIFIERS
Current-Sense Amplifier
Input Offset
IFB = 0A
Error Amp DC Gain (Note 6)
Av0
Error Amp Gain-Bandwidth
Product (Note 6)
GBW
5
CL = 20pF
90
dB
18
MHz
FN6924.0
October 26, 2009
ISL62881, ISL62881B
Electrical Specifications
PARAMETER
Operating Conditions: VDD = 5V, TA = -10°C to +100°C, fSW = 300kHz, unless otherwise
noted. Boldface limits apply over the operating temperature range, -10°C to
+100°C. (Continued)
SYMBOL
TEST CONDITIONS
MIN
MAX
(Note 7) TYP (Note 7) UNITS
POWER GOOD AND PROTECTION MONITORS
PGOOD Low Voltage
VOL
IPGOOD = 4mA
PGOOD Leakage Current
IOH
PGOOD = 3.3V
PGOOD Delay
tpgd
CLK_ENABLE# LOW to PGOOD HIGH
0.26
0.4
V
1
µA
7.6
8.9
ms
1.0
1.5
Ω
-1
6.3
UGATE DRIVER
UGATE Pull-Up Resistance
(Note 6)
RUGPU
200mA Source Current
UGATE Source Current
(Note 6)
IUGSRC
BOOT - UGATE = 2.5V
UGATE Sink Resistance
(Note 6)
RUGPD
250mA Sink Current
UGATE Sink Current (Note 6)
IUGSNK
UGATE - PHASE = 2.5V
LGATE Pull-Up Resistance
(Note 6)
RLGPU
250mA Source Current
LGATE Source Current
(Note 6)
ILGSRC
VCCP - LGATE = 2.5V
LGATE Sink Resistance
(Note 6)
RLGPD
250mA Sink Current
LGATE Sink Current (Note 6)
ILGSNK
LGATE - VSSP = 2.5V
4.0
A
UGATE to LGATE Deadtime
tUGFLGR
UGATE falling to LGATE rising, no load
23
ns
LGATE to UGATE Deadtime
tLGFUGR
LGATE falling to UGATE rising, no load
28
ns
2.0
1.0
A
1.5
2.0
Ω
A
LGATE DRIVER For ISL62881
1.0
1.5
2.0
0.5
Ω
A
0.9
Ω
LGATE DRIVERS For ISL62881B
LGATEa and b Pull-Up
Resistance (Note 6)
RLGPU
250mA Source Current
LGATEa and b Source
Current (Note 6)
ILGSRC
VCCP - LGATEa and b = 2.5V
LGATEa and b Sink
Resistance (Note 6)
RLGPD
250mA Sink Current
LGATEa and b Sink Current
(Note 6)
ILGSNK
LGATEa and b - VSSP = 2.5V
UGATE to LGATEa and b
Deadtime
tUGFLGR
LGATEa and b to UGATE
Deadtime
tLGFUGR
2.0
3
1.0
1
Ω
A
1.8
Ω
2.0
A
UGATE falling to LGATEa and b rising, no
load
23
ns
LGATEa and b falling to UGATE rising, no
load
28
ns
BOOTSTRAP DIODE
Forward Voltage
VF
PVCC = 5V, IF = 2mA
Reverse Leakage
IR
VR = 25V
0.58
V
0.2
µA
PROTECTION
Overvoltage Threshold
OVH
Severe Overvoltage
Threshold
OVHS
OC Threshold Offset
VSEN rising above setpoint for >1ms
VSEN rising for >2µs
ISUM- pin current
Undervoltage Threshold
UVf
VSEN falling below setpoint for >1.2ms
150
200
240
mV
1.525
1.55
1.575
V
8.2
10.1
12
µA
-355
-295
-235
mV
0.3
V
LOGIC THRESHOLDS
VR_ON Input Low
VIL(1.0V)
6
FN6924.0
October 26, 2009
ISL62881, ISL62881B
Electrical Specifications
PARAMETER
Operating Conditions: VDD = 5V, TA = -10°C to +100°C, fSW = 300kHz, unless otherwise
noted. Boldface limits apply over the operating temperature range, -10°C to
+100°C. (Continued)
SYMBOL
VR_ON Input High
VIH(1.0V)
VID0-VID6 and DPRSLPVR
Input Low
VIL(1.0V)
VID0-VID6 and DPRSLPVR
Input High
VIH(1.0V)
TEST CONDITIONS
MIN
MAX
(Note 7) TYP (Note 7) UNITS
0.7
V
0.3
0.7
V
V
THERMAL MONITOR (For ISL62881B)
NTC Source Current
NTC = 1.3V
Over-Temperature
Threshold
V (NTC) falling
VR_TT# Low Output
Resistance
RTT
I = 20mA
CLK_EN# Low Output
Voltage
VOL
I = 4mA
CLK_EN# Leakage Current
IOH
CLK_EN# = 3.3V
53
60
67
µA
1.18
1.2
1.22
V
6.5
9
Ω
0.26
0.4
V
1
µA
132
µA
CLK_EN# OUTPUT LEVELS
-1
CURRENT MONITOR
IMON Output Current
IIMON
IMON Clamp Voltage
ISUM- pin current = 20µA
108
120
ISUM- pin current = 10µA
51
60
69
ISUM- pin current = 5µA
22
30
37.5
1.1
1.15
VIMONCLAMP
Current Sinking Capability
V
275
µA
-1
0
µA
-1
0
INPUTS
VR_ON Leakage Current
IVR_ON
VR_ON = 0V
VR_ON = 1V
VIDx Leakage Current
IVIDx
VIDx = 0V
0
VIDx = 1V
DPRSLPVR Leakage Current
IDPRSLPVR
DPRSLPVR = 0V
0.45
-1
DPRSLPVR = 1V
1
µA
1
0
0.45
µA
µA
µA
1
µA
6.5
mV/µs
SLEW RATE
Slew Rate (For VID Change)
SR
5
NOTES:
6. Limits established by characterization and are not production tested.
7. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established
by characterization and are not production tested.
7
FN6924.0
October 26, 2009
ISL62881, ISL62881B
Gate Driver Timing Diagram
PWM
tLGFUGR
tFU
tRU
1V
UGATE
1V
LGATE
tFL
tRL
tUGFLGR
Simplified Application Circuits
V+5
R B IA S
V+5
V IN
VDD VCCP
V IN
R B IA S
PGOOD
C LK _E N #
V ID S
D P R S LP V R
VR_ON
PGOOD
C LK _E N #
V ID < 0:6 >
D P R S LP V R
V R _O N
VW
IS L 6 2 8 8 1
V IN
BOOT
RFSET
UGATE
L
PHASE
COM P
FB
LG A T E
VSSP
VO
R SUM
R DROOP
VSEN
IS U M +
CN
RTN
°C
CIS
R IM O N
IM O N
RN
RIS
V C C S EN S E
V S S S EN S E
RI
IM O N
IS U M (B O T T O M P A D )
VSS
FIGURE 1. ISL62881 TYPICAL APPLICATION CIRCUIT USING DCR SENSING
8
FN6924.0
October 26, 2009
ISL62881, ISL62881B
Simplified Application Circuits (Continued)
V+5
V+5
VIN
VDD VCCP VIN
R BIAS
RBIAS
PGOOD
CLK_EN#
VID<0:6>
DPRSLPVR
VR_ON
PGOOD
CLK_EN#
VIDS
DPRSLPVR
VR_ON
VW
ISL62881
BOOT
RFSET
VIN
UGATE
L
RSEN
PHASE
COMP
FB
VO
LGATE
VSSP
R DROOP
VSEN
R SUM
ISUM+
RIS
VCC SENSE
VSS SENSE
CN
RTN
CIS
R IMON
RI
IMON
ISUMIMON
(BOTTOM PAD)
VSS
FIGURE 2. ISL62881 TYPICAL APPLICATION CIRCUIT USING RESISTOR SENSING
V+5
R B IA S
V+5
V IN
V DD V CCP
R B IA S
V IN
N TC
OC
VR_TT#
PGOOD
CLK_EN#
V ID < 0 :6 >
D P R S LP V R
VR_ON
V R _ TT #
PGOOD
C LK _ E N #
V ID S
D P R S LP V R
VR_ON
VW
IS L 6 2 8 8 1 B
BOOT
RFSET
V IN
UGATE
CO M P
FB
L
PHASE
LG A T E B
LG A TE A
VSSP
VO
RSUM
R DROOP
V SE N
IS U M +
RIS
V C C S EN S E
V S S S EN S E
CN
RTN
RN
CIS
R IM O N
IM O N
OC
RI
IM O N
ISU M GND
FIGURE 3. ISL62881B TYPICAL APPLICATION CIRCUIT USING DCR SENSING
9
FN6924.0
October 26, 2009
ISL62881, ISL62881B
Simplified Application Circuits (Continued)
V+5
R BIAS
V+5
V IN
V DD VCCP
R BIAS
V IN
NTC
OC
VR_TT#
PGOOD
CLK_EN#
VID<0:6>
DPRSLPVR
VR_ON
VR_TT#
PGOOD
CLK_EN#
VIDS
DPRSLPVR
VR_ON
VW
ISL62881B
V IN
BOOT
RFSET
UGATE
COMP
FB
L
RSEN
PHASE
LGATEB
LGATEA
VSSP
VO
R DROOP
VSEN
RSUM
ISUM+
RIS
VCCSENSE
VSS SENSE
CN
RTN
CIS
R IMON
IMON
RI
IMON
ISUMVSS
FIGURE 4. ISL62881B TYPICAL APPLICATION CIRCUIT USING RESISTOR SENSING
10
FN6924.0
October 26, 2009
ISL62881, ISL62881B
Theory of Operation
The ISL62881 is a single-phase regulator implementing
Intel® IMVP-6.5™ protocol. It uses Intersil patented
R3™(Robust Ripple Regulator™) modulator. The R3™
modulator combines the best features of fixed frequency
PWM and hysteretic PWM while eliminating many of their
shortcomings. Figure 5 conceptually shows the ISL62881
R3™ modulator circuit, and Figure 6 shows the operation
principles.
Multiphase R3™ Modulator
MASTER CLOCK CIRCUIT
VW
MASTER
CLOCK
COMP
VCRM
CLOCK
CRM
GMVO
SLAVE CIRCUIT
VW
CLOCK
VCRS
S PWM
Q
R
PHASE
L
IL
VO
CO
GM
CRS
FIGURE 5. R3™ MODULATOR CIRCUIT
VW
H Y S T E R E T IC
W IN D O W
VCRM
COM P
C LO C K
PW M
VW
VCRS
FIGURE 6. R3™ MODULATOR OPERATION PRINCIPLES
IN STEADY STATE
A current source flows from the VW pin to the COMP pin,
creating a voltage window set by the resistor between
between the two pins. This voltage window is called VW
window in the following discussion.
Inside the IC, the modulator uses the master clock circuit
to generate the clocks for the slave circuit. The
modulator discharges the ripple capacitor Crm with a
current source equal to gmVo, where gm is a gain factor.
Crm voltage Vcrm is a sawtooth waveform traversing
between the VW and COMP voltages. It resets to VW
when it hits COMP, and generates a one-shot clock
signal.
The slave circuit has its own ripple capacitor Crs, whose
voltage mimics the inductor ripple current. A gm
amplifier converts the inductor voltage into a current
source to charge and discharge Crs. The slave circuit
turns on its PWM pulse upon receiving the clock signal,
and the current source charges Crs. When Crs voltage
VCrs hits VW, the slave circuit turns off the PWM pulse,
and the current source discharges Crs.
Since the ISL62881 works with Vcrs, which is largeamplitude and noise-free synthesized signal, the
ISL62881 achieves lower phase jitter than conventional
hysteretic mode and fixed PWM mode controllers. Unlike
conventional hysteretic mode converters, the ISL62881
has an error amplifier that allows the controller to
maintain a 0.5% output voltage accuracy.
Figure 7 shows the operation principles during load
insertion response. The COMP voltage rises during load
insertion, generating the clock signal more quickly, so the
PWM pulse turns on earlier, increasing the effective
switching frequency, which allows for higher control loop
bandwidth than conventional fixed frequency PWM
controllers. The VW voltage rises as the COMP voltage
rises, making the PWM pulse wider. During load release
response, the COMP voltage falls. It takes the master
clock circuit longer to generate the next clock signal so
the PWM pulse is held off until needed. The VW voltage
falls as the VW voltage falls, reducing the current PWM
pulse width. This kind of behavior gives the ISL62881
excellent response speed.
VW
COMP
VCRM
CLOCK
PWM
VW
VCRS
FIGURE 7. R3™ MODULATOR OPERATION PRINCIPLES
IN LOAD INSERTION RESPONSE
11
FN6924.0
October 26, 2009
ISL62881, ISL62881B
Diode Emulation and Period Stretching
VDD
5mV/µs
VR_ON
2.5mV/µs
90%VBOOT
800µs
PHASE
UGATE
VID
COMMAND
VOLTAGE
DAC
13 SWITCHING CYCLES
LGATE
CLK_EN#
~7ms
PGOOD
IL
FIGURE 8. DIODE EMULATION
ISL62881 can operate in diode emulation (DE) mode to
improve light load efficiency. In DE mode, the low-side
MOSFET conducts when the current is flowing from
source to drain and doesn’t not allow reverse current,
emulating a diode. As shown in Figure 8, when LGATE is
on, the low-side MOSFET carries current, creating
negative voltage on the phase node due to the voltage
drop across the ON-resistance. The ISL62881 monitors
the current through monitoring the phase node voltage.
It turns off LGATE when the phase node voltage reaches
zero to prevent the inductor current from reversing the
direction and creating unnecessary power loss.
If the load current is light enough, as Figure 9 shows, the
inductor current will reach and stay at zero before the
next phase node pulse, and the regulator is in
discontinuous conduction mode (DCM). If the load
current is heavy enough, the inductor current will never
reach 0A, and the regulator is in CCM although the
controller is in DE mode.
CCM/DCM BOUNDARY
VW
VCRS
IL
VW
LIGHT DCM
VCRS
FIGURE 10. SOFT-START WAVEFORMS FOR CPU VR
APPLICATION
VDD
VR_ON
5mV/µs
90%
120µs
VID COMMAND VOLTAGE
DAC
13 SWITCHING CYCLES
CLK_EN#
PGOOD
~7ms
FIGURE 11. SOFT-START WAVEFORMS FOR GPU VR
APPLICATION
Figure 9 shows the operation principle in diode emulation
mode at light load. The load gets incrementally lighter in
the three cases from top to bottom. The PWM on-time is
determined by the VW window size, therefore is the
same, making the inductor current triangle the same in
the three cases. The ISL62881 clamps the ripple
capacitor voltage Vcrs in DE mode to make it mimic the
inductor current. It takes the COMP voltage longer to hit
Vcrs, naturally stretching the switching period. The
inductor current triangles move further apart from each
other such that the inductor current average value is
equal to the load current. The reduced switching
frequency helps increase light load efficiency.
Start-up Timing
IL
VW
DEEP DCM
VCRS
IL
FIGURE 9. PERIOD STRETCHING
12
With the controller's VDD voltage above the POR
threshold, the start-up sequence begins when VR_ON
exceeds the 3.3V logic high threshold.
Figure 10 shows the typical start-up timing when the
ISL62881 is configured for CPU VR application. The
ISL62881 uses digital soft-start to ramp up DAC to the
boot voltage of 1.1V at about 2.5mV/µs. Once the output
voltage is within 10% of the boot voltage for 13 PWM
cycles (43µs for frequency = 300kHz), CLK_EN# is
pulled low and DAC slews at 5mV/µs to the voltage set
by the VID pins. PGOOD is asserted high in
approximately 7ms. Similar results occur if VR_ON is tied
FN6924.0
October 26, 2009
ISL62881, ISL62881B
to VDD, with the soft-start sequence starting 120µs after
VDD crosses the POR threshold.
Figure 11 shows the typical start-up timing when the
ISL62881 is configured for GPU VR application. The
ISL62881 uses digital soft-start to ramp-up DAC to the
voltage set by the VID pins at 5mV/µs. Once the output
voltage is within 10% of the target voltage for 13 PWM
cycles (43µs for frequency = 300kHz), CLK_EN# is
pulled low. PGOOD is asserted high in approximately
7ms. Similar results occur if VR_ON is tied to VDD, with
the soft-start sequence starting 120µs after VDD crosses
the POR threshold.
Voltage Regulation and Load Line
Implementation
After the start sequence, the ISL62881 regulates the
output voltage to the value set by the VID inputs per
Table 1. The ISL62881 will control the no-load output
voltage to an accuracy of ±0.5% over the range of
0.75V to 1.5V. A differential amplifier allows voltage
sensing for precise voltage regulation at the
microprocessor die.
TABLE 1. VID TABLE
VID6 VID5 VID4 VID3 VID2 VID1 VID0
VO
(V)
TABLE 1. VID TABLE (Continued)
VID6 VID5 VID4 VID3 VID2 VID1 VID0
VO
(V)
0
0
1
1
0
0
1
1.1875
0
0
1
1
0
1
0
1.1750
0
0
1
1
0
1
1
1.1625
0
0
1
1
1
0
0
1.1500
0
0
1
1
1
0
1
1.1375
0
0
1
1
1
1
0
1.1250
0
0
1
1
1
1
1
1.1125
0
1
0
0
0
0
0
1.1000
0
1
0
0
0
0
1
1.0875
0
1
0
0
0
1
0
1.0750
0
1
0
0
0
1
1
1.0625
0
1
0
0
1
0
0
1.0500
0
1
0
0
1
0
1
1.0375
0
1
0
0
1
1
0
1.0250
0
1
0
0
1
1
1
1.0125
0
1
0
1
0
0
0
1.0000
0
1
0
1
0
0
1
0.9875
0
0
0
0
0
0
0
1.5000
0
1
0
1
0
1
0
0.9750
0
0
0
0
0
0
1
1.4875
0
1
0
1
0
1
1
0.9625
0
0
0
0
0
1
0
1.4750
0
1
0
1
1
0
0
0.9500
0
0
0
0
0
1
1
1.4625
0
1
0
1
1
0
1
0.9375
0
0
0
0
1
0
0
1.4500
0
1
0
1
1
1
0
0.9250
0
0
0
0
1
0
1
1.4375
0
1
0
1
1
1
1
0.9125
0
0
0
0
1
1
0
1.4250
0
1
1
0
0
0
0
0.9000
0
0
0
0
1
1
1
1.4125
0
1
1
0
0
0
1
0.8875
0
0
0
1
0
0
0
1.4000
0
1
1
0
0
1
0
0.8750
0
0
0
1
0
0
1
1.3875
0
1
1
0
0
1
1
0.8625
0
0
0
1
0
1
0
1.3750
0
1
1
0
1
0
0
0.8500
0
0
0
1
0
1
1
1.3625
0
1
1
0
1
0
1
0.8375
0
0
0
1
1
0
0
1.3500
0
1
1
0
1
1
0
0.8250
0
0
0
1
1
0
1
1.3375
0
1
1
0
1
1
1
0.8125
0
0
0
1
1
1
0
1.3250
0
1
1
1
0
0
0
0.8000
0
0
0
1
1
1
1
1.3125
0
1
1
1
0
0
1
0.7875
0
0
1
0
0
0
0
1.3000
0
1
1
1
0
1
0
0.7750
0
0
1
0
0
0
1
1.2875
0
1
1
1
0
1
1
0.7625
0
0
1
0
0
1
0
1.2750
0
1
1
1
1
0
0
0.7500
0
0
1
0
0
1
1
1.2625
0
1
1
1
1
0
1
0.7375
0
0
1
0
1
0
0
1.2500
0
1
1
1
1
1
0
0.7250
0
0
1
0
1
0
1
1.2375
0
1
1
1
1
1
1
0.7125
0
0
1
0
1
1
0
1.2250
1
0
0
0
0
0
0
0.7000
0
0
1
0
1
1
1
1.2125
1
0
0
0
0
0
1
0.6875
0
0
1
1
0
0
0
1.2000
1
0
0
0
0
1
0
0.6750
13
FN6924.0
October 26, 2009
ISL62881, ISL62881B
TABLE 1. VID TABLE (Continued)
VID6 VID5 VID4 VID3 VID2 VID1 VID0
TABLE 1. VID TABLE (Continued)
VO
(V)
VID6 VID5 VID4 VID3 VID2 VID1 VID0
VO
(V)
1
0
0
0
0
1
1
0.6625
1
1
0
1
0
1
1
0.1625
1
0
0
0
1
0
0
0.6500
1
1
0
1
1
0
0
0.1500
1
0
0
0
1
0
1
0.6375
1
1
0
1
1
0
1
0.1375
1
0
0
0
1
1
0
0.6250
1
1
0
1
1
1
0
0.1250
1
0
0
0
1
1
1
0.6125
1
1
0
1
1
1
1
0.1125
1
0
0
1
0
0
0
0.6000
1
1
1
0
0
0
0
0.1000
1
0
0
1
0
0
1
0.5875
1
1
1
0
0
0
1
0.0875
1
0
0
1
0
1
0
0.5750
1
1
1
0
0
1
0
0.0750
1
0
0
1
0
1
1
0.5625
1
1
1
0
0
1
1
0.0625
1
0
0
1
1
0
0
0.5500
1
1
1
0
1
0
0
0.0500
1
0
0
1
1
0
1
0.5375
1
1
1
0
1
0
1
0.0375
1
0
0
1
1
1
0
0.5250
1
1
1
0
1
1
0
0.0250
1
0
0
1
1
1
1
0.5125
1
1
1
0
1
1
1
0.0125
1
0
1
0
0
0
0
0.5000
1
1
1
1
0
0
0
0.0000
1
0
1
0
0
0
1
0.4875
1
1
1
1
0
0
1
0.0000
1
0
1
0
0
1
0
0.4750
1
1
1
1
0
1
0
0.0000
1
0
1
0
0
1
1
0.4625
1
1
1
1
0
1
1
0.0000
1
0
1
0
1
0
0
0.4500
1
1
1
1
1
0
0
0.0000
1
0
1
0
1
0
1
0.4375
1
1
1
1
1
0
1
0.0000
1
0
1
0
1
1
0
0.4250
1
1
1
1
1
1
0
0.0000
1
0
1
0
1
1
1
0.4125
1
1
1
1
1
1
1
0.0000
1
0
1
1
0
0
0
0.4000
1
0
1
1
0
0
1
0.3875
1
0
1
1
0
1
0
0.3750
1
0
1
1
0
1
1
0.3625
1
0
1
1
1
0
0
0.3500
1
0
1
1
1
0
1
0.3375
1
0
1
1
1
1
0
0.3250
1
0
1
1
1
1
1
0.3125
1
1
0
0
0
0
0
0.3000
1
1
0
0
0
0
1
0.2875
1
1
0
0
0
1
0
0.2750
1
1
0
0
0
1
1
0.2625
1
1
0
0
1
0
0
0.2500
1
1
0
0
1
0
1
0.2375
1
1
0
0
1
1
0
0.2250
1
1
0
0
1
1
1
0.2125
1
1
0
1
0
0
0
0.2000
1
1
0
1
0
0
1
0.1875
1
1
0
1
0
1
0
0.1750
14
R DROOP
VCC SENSE
FB
VDROOP
VR LOCAL VO
“CATCH”
RESISTOR
IDROOP
COMP
E/A
Σ
VIDS
VDAC
DAC
RTN
INTERNAL TO IC
X1
VID<0:6>
VSSSENSE
VSS
“CATCH”
RESISTOR
FIGURE 12. DIFFERENTIAL SENSING AND LOAD LINE
IMPLEMENTATION
As the load current increases from zero, the output
voltage will droop from the VID table value by an amount
proportional to the load current to achieve the load line.
The ISL62881 can sense the inductor current through the
intrinsic DC Resistance (DCR) resistance of the inductors
as shown in Figure 1 or through resistors in series with
the inductors as shown in Figure 2. In both methods,
capacitor Cn voltage represents the inductor total
currents. A droop amplifier converts Cn voltage into an
internal current source with the gain set by resistor Ri.
FN6924.0
October 26, 2009
ISL62881, ISL62881B
The current source is used for load line implementation,
current monitor and overcurrent protection.
Figure 12 shows the load line implementation. The
ISL62881 drives a current source Idroop out of the FB
pin, described by Equation 1.
2xV Cn
I droop = -----------------Ri
(EQ. 1)
When using inductor DCR current sensing, a single NTC
element is used to compensate the positive temperature
coefficient of the copper winding thus sustaining the load
line accuracy with reduced cost.
Idroop flows through resistor Rdroop and creates a
voltage drop as shown in Equation 2.
Vdroop is the droop voltage required to implement load
line. Changing Rdroop or scaling Idroop can both change
the load line slope. Since Idroop also sets the overcurrent
protection level, it is recommended to first scale Idroop
based on OCP requirement, then select an appropriate
Rdroop value to obtain the desired load line slope.
Differential Sensing
Figure 12 also shows the differential voltage sensing
scheme. VCCSENSE and VSSSENSE are the remote
voltage sensing signals from the processor die. A unity
gain differential amplifier senses the VSSSENSE voltage
and adds it to the DAC output. The error amplifier
regulates the inverting and the non-inverting input
voltages to be equal, therefore:
VCC SENSE + V
droop
= V DAC + VSS SENSE
(EQ. 3)
Rewriting Equation 3 and substituting Equation 2 gives:
VCC SENSE – VSS SENSE = V DAC – R droop × I droop
(EQ. 4)
Equation 4 is the exact equation required for load line
implementation.
The VCCSENSE and VSSSENSE signals come from the
processor die. The feedback will be open circuit in the
absence of the processor. As shown in Figure 12, it is
recommended to add a “catch” resistor to feed the VR
local output voltage back to the compensator, and add
another “catch” resistor to connect the VR local output
ground to the RTN pin. These resistors, typically
10Ω~100Ω, will provide voltage feedback if the system is
powered up without a processor installed.
CCM Switching Frequency
The RFSET resistor between the COMP and the VW pins
sets the VW windows size, which therefore sets the
switching frequency. When the ISL62881 is in continuous
conduction mode (CCM), the switching frequency is not
absolutely constant due to the nature of the R3™
modulator. As explained in “Multiphase R3™ Modulator”
on page 11, the effective switching frequency will
increase during load insertion and will decrease during
15
(EQ. 5)
R FSET ( kΩ ) = ( Period ( μs ) – 0.29 ) × 2.65
Modes of Operation
TABLE 2. ISL62881 MODES OF OPERATION
(EQ. 2)
V droop = R droop × I droop
load release to achieve fast response. On the other hand,
the switching frequency is relatively constant at steady
state. Variation is expected when the power stage
condition, such as input voltage, output voltage, load,
etc. changes. The variation is usually less than 15% and
doesn’t have any significant effect on output voltage
ripple magnitude. Equation 5 gives an estimate of the
frequency-setting resistor Rfset value. 8kΩ RFSET gives
approximately 300kHz switching frequency. Lower
resistance gives higher switching frequency.
CONFIGURATION DPRSLPVR
CPU VR Application
GPU VR Application
OPERATIONAL VOLTAGE
MODE
SLEW RATE
0
1-phase CCM
5mV/µs
1
1-phase DE
0
1-phase CCM
5mV/µs
1
1-phase DE
10mV/µs
Table 2 shows the ISL62881 operational modes,
programmed by the logic status of the DPRSLPVR pin.
The ISL62881 enters 1-phase DE mode when there is
DPRSLPVR = 1.
When the ISL62881 is configured for GPU VR application,
DPRSLPVR logic status also controls the output voltage
slew rate. The slew rate is 5mV/µs for DPRSLPVR = 0
and is 10mV/µs for DPRSLPVR = 1.
Dynamic Operation
When the ISL62881 is configured for CPU VR application,
it responds to VID changes by slewing to the new voltage
at 5mV/µs slew rate. As the output approaches the VID
command voltage, the dv/dt moderates to prevent
overshoot. Geyserville-III transitions commands one LSB
VID step (12.5mV) every 2.5µs, controlling the effective
dv/dt at 5mv/µs. The ISL62881 is capable of 5mV/µs
slew rate.
When the ISL62881 is configured for GPU VR application,
it responds to VID changes by slewing to the new voltage
at a slew rate set by the logic status on the DPRSLPVR
pin. The slew rate is 5mV/µs when DPRSLPVR = 0 and is
10mV/µs when DPRSLPVR = 1.
When the ISL62881 is in DE mode, it will actively drive
the output voltage up when the VID changes to a higher
value. It’ll resume DE mode operation after reaching the
new voltage level. If the load is light enough to warrant
DCM, it will enter DCM after the inductor current has
crossed zero for four consecutive cycles. The ISL62881
will remain in DE mode when the VID changes to a lower
value. The output voltage will decay to the new value and
the load will determine the slew rate.
The R3™ modulator intrinsically has voltage feed
forward. The output voltage is insensitive to a fast slew
rate input voltage change.
FN6924.0
October 26, 2009
ISL62881, ISL62881B
Protections
The ISL62881 provides overcurrent, undervoltage, and
overvoltage protections.
The ISL62881 determines overcurrent protection (OCP)
by comparing the average value of the droop current
Idroop with an internal current source threshold. It
declares OCP when Idroop is above the threshold for
120µs. A resistor Rcomp from the COMP pin to GND
programs the OCP current source threshold, as well as
the overshoot reduction function (to be discussed in
later sections), as Table 3 shows. It is recommended to
use the nominal Rcomp value. The ISL62881 detects the
Rcomp value at the beginning of start-up, and sets the
internal OCP threshold accordingly. It remembers the
Rcomp value until the VR_ON signal drops below the
POR threshold.
TABLE 3. ISL62881 OCP THRESHOLD AND
OVERSHOOT REDUCTION FUNCTION
Rcomp
NOMINAL
(kΩ)
MAX
(kΩ)
OCP
THRESHOLD
(µA)
OVERSHOOT
REDUCTION
FUNCTION
none
none
20
Disabled
305
400
410
22.67
205
235
240
20.67
155
165
170
18
104
120
130
20
78
85
90
62
66
45
50
MIN
(kΩ)
VR_ON low or by bringing VDD below the POR threshold.
When VR_ON and VDD return to their high operating
levels, a soft-start will occur.
The second level of overvoltage protection is different. If
the output voltage exceeds 1.55V, the ISL62881 will
immediately declare an OV fault, de-assert PGOOD, and
turn on the low-side power MOSFETs. The low-side power
MOSFETs remain on until the output voltage is pulled
down below 0.85V when all power MOSFETs are turned
off. If the output voltage rises above 1.55V again, the
protection process is repeated. This behavior provides
the maximum amount of protection against shorted
high-side power MOSFETs while preventing output
ringing below ground. Resetting VR_ON cannot clear the
1.55V OVP. Only resetting VDD will clear it. The 1.55V
OVP is active all the time when the controller is enabled,
even if one of the other faults have been declared. This
ensures that the processor is protected against high-side
power MOSFET leakage while the MOSFETs are
commanded off.
Table 4 summarizes the fault protections.
TABLE 4. FAULT PROTECTION SUMMARY
FAULT
PROTECTI
DURATION
ON
BEFORE
ACTION
PROTECTION
FAULT TYPE
Overcurrent
120µs
22.67
Way-Overcurrent
(2.5xOC)
<2µs
68
20.67
Overvoltage +200mV
1ms
55
18
Undervoltage -300mV
Enabled
The default OCP threshold is the value when Rcomp is
not populated. It is recommended to scale the droop
current Idroop such that the default OCP threshold gives
approximately the desired OCP level, then use Rcomp to
fine tune the OCP level if necessary.
For overcurrent condition above 2.5x the OCP level, the
PWM output will immediately shut off and PGOOD will go
low to maximize protection. This protection is also
referred to as way-overcurrent protection or fastovercurrent protection, for short-circuit protections.
The ISL62881 will declare undervoltage (UV) fault and
latch off if the output voltage is less than the VID set
value by 300mV or more for 1ms. It’ll turn off the PWM
output and de-assert PGOOD.
The ISL62881 has two levels of overvoltage protections.
The first level of overvoltage protection is referred to as
PGOOD overvoltage protection. If the output voltage
exceeds the VID set value by +200mV for 1ms, the
ISL62881 will declare a fault and de-assert PGOOD.
The ISL62881 takes the same actions for all of the above
fault protections: deassertion of PGOOD and turn-off of
the high-side and low-side power MOSFETs. Any residual
inductor current will decay through the MOSFET body
diodes. These fault conditions can be reset by bringing
16
Overvoltage 1.55V
Immediately
PWM tristate,
PGOOD
latched low
FAULT
RESET
VR_ON
toggle or
VDD
toggle
Low-side
VDD
MOSFET on toggle
until Vcore
<0.85V,
then PWM
tri-state,
PGOOD
latched low.
Current Monitor
The ISL62881 provides the current monitor function. The
IMON pin outputs a high-speed analog current source
that is 3 times of the droop current flowing out of the FB
pin. Thus as shown by Equation 6.
I IMON = 3 × I droop
(EQ. 6)
As Figures 1 and 2 show, a resistor Rimon is connected to
the IMON pin to convert the IMON pin current to voltage.
A capacitor can be paralleled with Rimon to filter the
voltage information. The IMVP-6.5™ specification
requires that the IMON voltage information be referenced
to VSSSENSE.
The IMON pin voltage range is 0V to 1.1V. A clamp circuit
prevents the IMON pin voltage from going above 1.1V.
FN6924.0
October 26, 2009
ISL62881, ISL62881B
Adaptive Body Diode Conduction Time
Reduction
at a high repetitive rate. User discretion is advised when
this function is enabled.
In DCM, the controller turns off the low-side MOSFET
when the inductor current approaches zero. During
on-time of the low-side MOSFET, phase voltage is
negative and the amount is the MOSFET RDS(ON) voltage
drop, which is proportional to the inductor current. A
phase comparator inside the controller monitors the
phase voltage during on-time of the low-side MOSFET
and compares it with a threshold to determine the
zero-crossing point of the inductor current. If the
inductor current has not reached zero when the low-side
MOSFET turns off, it’ll flow through the low-side MOSFET
body diode, causing the phase node to have a larger
voltage drop until it decays to zero. If the inductor
current has crossed zero and reversed the direction when
the low-side MOSFET turns off, it’ll flow through the
high-side MOSFET body diode, causing the phase node to
have a spike until it decays to zero. The controller
continues monitoring the phase voltage after turning off
the low-side MOSFET and adjusts the phase comparator
threshold voltage accordingly in iterative steps such that
the low-side MOSFET body diode conducts for
approximately 40ns to minimize the body diode-related
loss.
Key Component Selection
Overshoot Reduction Function
The ISL62881 has an optional overshoot reduction
function, enabled or disabled by the resistor from the
COMP pin to GND, as shown in Table 3.
When a load release occurs, the energy stored in the
inductors will dump to the output capacitor, causing
output voltage overshoot. The inductor current
freewheels through the low-side MOSFET during this
period of time. The overshoot reduction function turns off
the low-side MOSFET during the output voltage
overshoot, forcing the inductor current to freewheel
through the low-side MOSFET body diode. Since the body
diode voltage drop is much higher than MOSFET RDS(ON)
voltage drop, more energy is dissipated on the low-side
MOSFET therefore the output voltage overshoot is lower.
If the overshoot reduction function is enabled, the
ISL62881 monitors the COMP pin voltage to determine
the output voltage overshoot condition. The COMP
voltage will fall and hit the clamp voltage when the
output voltage overshoots. The ISL62881 will turn off
LGATE when COMP is being clamped. The low-side
MOSFET in the power stage will be turned off. When the
output voltage has reached its peak and starts to come
down, the COMP voltage starts to rise and is no longer
clamped. The ISL62881 will resume normal PWM
operation.
While the overshoot reduction function reduces the
output voltage overshoot, energy is dissipated on the
low-side MOSFET, causing additional power loss. The
more frequent the transient event, the more power loss
is dissipated on the low-side MOSFET. The MOSFET may
face severe thermal stress when transient events happen
17
RBIAS
The ISL62881 uses a resistor (1% or better tolerance is
recommended) from the RBIAS pin to GND to establish
highly accurate reference current sources inside the IC.
Using RBIAS = 147kΩ sets the controller for CPU core
application and using Rbias = 47kΩ sets the controller for
GPU core application. Do not connect any other
components to this pin. Do not connect any capacitor to
the RBIAS pin as it will create instability.
Care should be taken in layout that the resistor is placed
very close to the RBIAS pin and that a good quality
signal ground is connected to the opposite side of the
RBIAS resistor.
Ris and Cis
As Figures 1 and 2 show, the ISL62881 needs the
Ris - Cis network across the ISUM+ and the ISUM- pins to
stabilize the droop amplifier. The preferred values are
Ris = 82.5Ω and Cis = 0.01µF. Slight deviations from the
recommended values are acceptable. Large deviations
may result in instability.
Inductor DCR Current-Sensing Network
PHASE
ISUM+
RSUM
L
RNTCS
RP
DCR
+
CN VCN
-
RNTC
RI
ISUM-
IO
FIGURE 13. DCR CURRENT-SENSING NETWORK
Figure 13 shows the inductor DCR current-sensing
network for a 2-phase solution. An inductor current flows
through the DCR and creates a voltage drop. The
inductor has a resistors in Rsum connected to the phasenode-side pad and a PCB trace connected to the outputside pad to accurately sense the inductor current by
sensing the DCR voltage drop. The sensed current
information is fed to the NTC network (consisting of
Rntcs, Rntc and Rp) and capacitor Cn. Rntc is a negative
temperature coefficient (NTC) thermistor, used to
temperature-compensate the inductor DCR change. The
inductor current information is presented to the capacitor
Cn. Equations 7 through 11 describe the frequency-
FN6924.0
October 26, 2009
ISL62881, ISL62881B
domain relationship between inductor total current Io(s)
and Cn voltage VCn(s):
R ntcnet
⎛
⎞
V Cn ( s ) = ⎜ ------------------------------------------ × DCR⎟ × I o ( s ) × A cs ( s )
R
+
R
⎝ ntcnet
⎠
sum
( R ntcs + R ntc ) × R p
R ntcnet = ---------------------------------------------------R ntcs + R ntc + R p
s
1 + ------ωL
A cs ( s ) = ----------------------s
1 + ------------ω sns
(EQ. 7)
(EQ. 8)
(EQ. 9)
(EQ. 10)
DCR
ω L = ------------L
L
C n = --------------------------------------------------------------R ntcnet × R sum
------------------------------------------ × DCR
R ntcnet + R sum
(EQ. 12)
io
Vo
FIGURE 14. DESIRED LOAD TRANSIENT RESPONSE
WAVEFORMS
io
(EQ. 11)
1
ω sns = -------------------------------------------------------R ntcnet × R sum
------------------------------------------ × C n
R ntcnet + R sum
Transfer function Acs(s) always has unity gain at DC. The
inductor DCR value increases as the winding temperature
increases, giving higher reading of the inductor DC
current. The NTC Rntc values decreases as its
temperature decreases. Proper selections of Rsum, Rntcs,
Rp and Rntc parameters ensure that VCn represents the
inductor total DC current over the temperature range of
interest.
There are many sets of parameters that can properly
temperature-compensate the DCR change. Since the
NTC network and the Rsum resistors form a voltage
divider, Vcn is always a fraction of the inductor DCR
voltage. It is recommended to have a higher ratio of Vcn
to the inductor DCR voltage, so the droop circuit has
higher signal level to work with.
A typical set of parameters that provide good
temperature compensation are: Rsum = 3.65kΩ,
Rp = 11kΩ, Rntcs = 2.61kΩ and Rntc = 10kΩ
(ERT-J1VR103J). The NTC network parameters may need
to be fine tuned on actual boards. One can apply full load
DC current and record the output voltage reading
immediately; then record the output voltage reading
again when the board has reached the thermal steady
state. A good NTC network can limit the output voltage
drift to within 2mV. It is recommended to follow the
Intersil evaluation board layout and current-sensing
network parameters to minimize engineering time.
VCn(s) also needs to represent real-time Io(s) for the
controller to achieve good transient response. Transfer
function Acs(s) has a pole ωsns and a zero ωL. One needs
to match ωL and ωsns so Acs(s) is unity gain at all
frequencies. By forcing ωL equal to ωsns and solving for
the solution, Equation 12 gives Cn value.
18
Vo
FIGURE 15. LOAD TRANSIENT RESPONSE WHEN Cn IS
TOO SMALL
io
Vo
FIGURE 16. LOAD TRANSIENT RESPONSE WHEN Cn IS
TOO LARGE
For example, given Rsum = 3.65kΩ, Rp = 11kΩ,
Rntcs = 2.61kΩ, Rntc = 10kΩ, DCR = 1.1mΩ and
L = 0.45µH, Equation 12 gives Cn = 0.18µF.
Assuming the compensator design is correct, Figure 14
shows the expected load transient response waveforms if
Cn is correctly selected. When the load current Icore has
a square change, the output voltage Vcore also has a
square response.
If Cn value is too large or too small, VCn(s) will not
accurately represent real-time Io(s) and will worsen the
transient response. Figure 15 shows the load transient
response when Cn is too small. Vcore will sag excessively
upon load insertion and may create a system failure.
Figure 16 shows the transient response when Cn is too
large. Vcore is sluggish in drooping to its final value.
There will be excessive overshoot if load insertion occurs
during this time, which may potentially hurt the CPU
reliability.
FN6924.0
October 26, 2009
ISL62881, ISL62881B
iO
iL
VO
RING
BACK
FIGURE 17. OUTPUT VOLTAGE RING BACK PROBLEM
ISUM+
Rntcs
Cn.1
Rp
Rntc
Rn
OPTIONAL
+
Cn.2 Vcn
-
Ri
ISUM-
Rip Cip
OPTIONAL
FIGURE 18. OPTIONAL CIRCUITS FOR RING BACK
REDUCTION
Figure 17 shows the output voltage ring back problem
during load transient response. The load current io has a
fast step change, but the inductor current iL cannot
accurately follow. Instead, iL responds in first order
system fashion due to the nature of current loop. The
ESR and ESL effect of the output capacitors makes the
output voltage Vo dip quickly upon load current change.
However, the controller regulates Vo according to the
droop current idroop, which is a real-time representation
of iL; therefore it pulls Vo back to the level dictated by iL,
causing the ring back problem. This phenomenon is not
observed when the output capacitors have very low ESR
and ESL, such as all ceramic capacitors.
Figure 18 shows two optional circuits for reduction of the
ring back. Rip and Cip form an R-C branch in parallel with
Ri, providing a lower impedance path than Ri at the
beginning of io change. Rip and Cip do not have any
effect at steady state. Through proper selection of Rip
and Cip values, idroop can resemble io rather than iL, and
Vo will not ring back. The recommended value for Rip is
100W. Cip should be determined through tuning the load
transient response waveforms on an actual board. The
recommended range for Cip is 100pF~2000pF.
Cn is the capacitor used to match the inductor time
constant. It usually takes the parallel of two (or more)
capacitors to get the desired value. Figure 18 shows
19
that two capacitors Cn.1 and Cn.2 are in parallel.
Resistor Rn is an optional component to reduce the Vo
ring back. At steady state, Cn.1 + Cn.2 provides the
desired Cn capacitance. At the beginning of io change,
the effective capacitance is less because Rn increases
the impedance of the Cn.1 branch. As Figure 15
explains, Vo tends to dip when Cn is too small, and this
effect will reduce the Vo ring back. This effect is more
pronounced when Cn.1 is much larger than Cn.2. It is
also more pronounced when Rn is bigger. However, the
presence of Rn increases the ripple of the Vn signal if
Cn.2 is too small. It is recommended to keep Cn.2
greater than 2200pF. Rn value usually is a few ohms.
Cn.1, Cn.2 and Rn values should be determined
through tuning the load transient response waveforms
on an actual board.
Rip and Cip form an R-C branch in parallel with Ri,
providing a lower impedance path than Ri at the
beginning of io change. Rip and Cip do not have any
effect at steady state. Through proper selection of Rip
and Cip values, idroop can resemble io rather than iL,
and Vo will not ring back. The recommended value for
Rip is 100Ω. Cip should be determined through tuning
the load transient response waveforms on an actual
board. The recommended range for Cip is
100pF~2000pF. However, it should be noted that the
Rip -Cip branch may distort the idroop waveform.
Instead of being triangular as the real inductor current,
idroop may have sharp spikes, which may adversely
affect idroop average value detection and therefore
may affect OCP accuracy. User discretion is advised.
Resistor Current-Sensing Network
PHASE
L
DCR
ISUM+
RSUM
RSEN
Vcn
Cn
Ri
ISUM-
Io
FIGURE 19. RESISTOR CURRENT-SENSING NETWORK
Figure 19 shows the resistor current-sensing network.
The inductor has a series current-sensing resistor Rsen.
Rsum and is connected to the Rsen pad to accurately
capture the inductor current information. The Rsum feeds
the sensed information to capacitor Cn. Rsum and Cn
FN6924.0
October 26, 2009
ISL62881, ISL62881B
Substitution of Equation 20 into Equation 1 gives
Equation 21:
form a a filter for noise attenuation. Equations 13
through 15 gives VCn(s) expressions:
2
I droop = ----- × R sen × I o
Ri
(EQ. 21)
V Cn ( s ) = R sen × I o ( s ) × A Rsen ( s )
(EQ. 13)
1
A Rsen ( s ) = ----------------------s
-----------1+
ω sns
(EQ. 14)
2R sen × I o
R i = ---------------------------I droop
1
ω Rsen = ----------------------------R sum × C n
(EQ. 15)
Substitution of Equation 22 and application of the OCP
condition in Equation 18 gives:
Therefore:
Transfer function ARsen(s) always has unity gain at DC.
Current-sensing resistor Rsen value will not have
significant variation over-temperature, so there is no
need for the NTC network.
The recommended values are Rsum = 1kΩ and
Cn = 5600pF.
Overcurrent Protection
Referring to Equation 1 and Figures 12, 13 and 19,
resistor Ri sets the droop current Idroop. Table 3 shows
the internal OCP threshold. It is recommended to design
Idroop without using the Rcomp resistor.
For example, the OCP threshold is 20µA. We will design
Idroop to be 14µA at full load, so the OCP trip level is
1.43x of the full load current.
For inductor DCR sensing, Equation 16 gives the DC
relationship of Vcn(s) and Io(s).
R ntcnet
⎛
⎞
V Cn = ⎜ ------------------------------------------ × DCR⎟ × I o
R
⎝ ntcnet + R sum
⎠
(EQ. 16)
(EQ. 17)
Therefore:
2R ntcnet × DCR × I o
R i = ---------------------------------------------------------------------( R ntcnet + R sum ) × I droop
(EQ. 18)
Substitution of Equation 8 and application of the OCP
condition in Equation 18 gives:
( R ntcs + R ntc ) × R p
2 × ---------------------------------------------------- × DCR × I omax
R ntcs + R ntc + R p
R i = -----------------------------------------------------------------------------------------------------------------R
(
⎛ ntcs + R ntc ) × R p
⎞
⎜ ---------------------------------------------------- + R sum⎟ × I droopmax
⎝ R ntcs + R ntc + R p
⎠
(EQ. 19)
where Iomax is the full load current, Idroopmax is the
corresponding droop current. For example, given
Rsum = 3.65kΩ, Rp = 11kΩ, Rntcs = 2.61kΩ, Rntc = 10kΩ,
DCR = 1.1mΩ, Iomax = 14A and Idroopmax = 14µA,
Equation 19 gives Ri = 1.36kΩ.
For resistor sensing, Equation 20 gives the DC
relationship of Vcn(s) and Io(s).
(EQ. 23)
where Iomax is the full load current, Idroopmax is the
corresponding droop current. For example, given
Rsen = 1mΩ, Iomax = 14A and Idroopmax = 14µA,
Equation 23 gives Ri = 2kΩ.
A resistor from COMP to GND can adjust the internal OCP
threshold, providing another dimension of fine-tune
flexibility. Table 3 shows the detail. It is recommended to
scale Idroop such that the default OCP threshold gives
approximately the desired OCP level, then use Rcomp to
fine tune the OCP level if necessary.
Load Line Slope
Refer to Figure 12.
For inductor DCR sensing, substitution of Equation 17
into Equation 2 gives the load line slope expression in
Equation 24.
2R droop
R ntcnet
V droop
LL = ------------------- = ----------------------- × ------------------------------------------ × DCR
Io
Ri
R ntcnet + R sum
Substitution of Equation 16 into Equation 1 gives:
R ntcnet
2
I droop = ----- × ------------------------------------------ × DCR × I o
R i R ntcnet + R sum
2R sen × I omax
R i = --------------------------------------I droopmax
(EQ. 22)
(EQ. 24)
For resistor sensing, substitution of Equation 21 into
Equation 2 gives the load line slope expression in
Equation 25:
2R sen × R droop
V droop
LL = ------------------- = ------------------------------------------Io
Ri
(EQ. 25)
Substitution of Equation 18 and rewriting Equation 24,
or substitution of Equation 22 and rewriting Equation 25
gives the same result in Equation 26:
Io
R droop = ---------------- × LL
I droop
(EQ. 26)
One can use the full load condition to calculate Rdroop.
For example, given Iomax = 14A, Idroopmax = 14µA and
LL = 7mΩ, Equation 26 gives Rdroop = 7kΩ.
It is recommended to start with the Rdroop value
calculated by Equation 26, and fine tune it on the actual
board to get accurate load line slope. One should record
the output voltage readings at no load and at full load for
load line slope calculation. Reading the output voltage at
lighter load instead of full load will increase the
measurement error.
(EQ. 20)
V Cn = R sen × I o
20
FN6924.0
October 26, 2009
ISL62881, ISL62881B
Current Monitor
Referring to Equation 6 for the IMON pin current
expression.
Refer to Figures 1 and 2, the IMON pin current flows
through Rimon. The voltage across Rimon is shown in
Equation 27:
V Rimon = 3 × I droop × R imon
(EQ. 27)
T1(s) is the total loop gain of the voltage loop and the
droop loop. It always has a higher crossover frequency
than T2(s) and has more meaning of system stability.
(EQ. 28)
T2(s) is the voltage loop gain with closed droop loop. It
has more meaning of output voltage response.
Rewriting Equation 26 gives Equation 28:
Io
I droop = ------------------- × LL
R droop
Substitution of Equation 28 into Equation 27 gives
Equation 29:
3I o × LL
V Rimon = ---------------------- × R imon
R droop
inductor current, multiplies it by a gain of the load line
slope, then adds it on top of the sensed output voltage
and feeds it to the compensator. T(1) is measured after
the summing node, and T2(s) is measured in the voltage
loop before the summing node. The spreadsheet gives
both T1(s) and T2(s) plots. However, only T2(s) can be
actually measured on an ISL62881 regulator.
(EQ. 29)
Design the compensator to get stable T1(s) and T2(s)
with sufficient phase margin, and output impedance
equal or smaller than the load line slope.
L
Rewriting Equation 29 and application of full load
condition gives Equation 30:
V Rimon × R droop
R imon = ---------------------------------------------3I o × LL
VO
Q1
VIN
(EQ. 30)
GATE Q2
DRIVER
IO
COUT
LOAD LINE SLOPE
For example, given LL = 7mΩ, Rdroop = 7kΩ,
VRimon = 963mV at Iomax = 14A, Equation 30 gives
Rimon = 22.9kΩ.
A capacitor Cimon can be paralleled with Rimon to filter
the IMON pin voltage. The RimonCimon time constant is
the user’s choice. It is recommended to have a time
constant long enough such that switching frequency
ripples are removed.
Compensator
Figure 14 shows the desired load transient response
waveforms. Figure 20 shows the equivalent circuit of a
voltage regulator (VR) with the droop function. A VR is
equivalent to a voltage source (=VID) and output
impedance Zout(s). If Zout(s) is equal to the load line
slope LL, i.e. constant output impedance, in the entire
frequency range, Vo will have square response when Io
has a square change.
Zout(s) = LL
VID
VR
MOD
EA
+
COMP
LOOP GAIN =
+
VID
+
ISOLATION
TRANSFORMER
CHANNEL B
CHANNEL A
CHANNEL A
NETWORK
ANALYZER
CHANNEL B
EXCITATION OUTPUT
FIGURE 21. LOOP GAIN T1(s) MEASUREMENT SET-UP
L
VO
Q1
VIN
IO
COUT
GATE Q2
DRIVER
iO
LOAD
LOAD LINE SLOPE
+
VO
-
+
MOD
COMP
FIGURE 20. VOLTAGE REGULATOR EQUIVALENT
A VR with active droop function is a dual-loop system
consisting of a voltage loop and a droop loop which is a
current loop. However, neither loop alone is sufficient to
describe the entire system. The spreadsheet shows two
loop gain transfer functions, T1(s) and T2(s), that
describe the entire system. Figure 21 conceptually shows
T1(s) measurement set-up and Figure 22 conceptually
shows T2(s) measurement set-up. The VR senses the
21
20 Ω
LOOP GAIN =
EA
+
+
VID
CHANNEL B
20 Ω
ISOLATION
TRANSFORMER
CHANNEL A
CHANNEL A
NETWORK
ANALYZER
CHANNEL B
EXCITATION OUTPUT
FIGURE 22. LOOP GAIN T2(s) MEASUREMENT SET-UP
FN6924.0
October 26, 2009
ISL62881, ISL62881B
Optional Slew Rate Compensation Circuit
For 1-Tick VID Transition
When Vcore increases, the time domain expression of the
induced Idroop change is as shown in Equation 31:
–t
---------------------------⎞
C out × LL dV core ⎛
C
× LL⎟
I droop ( t ) = -------------------------- × ------------------- × ⎜ 1 – e out
⎜
⎟
R droop
dt
⎝
⎠
Rdroop
Rvid
Vcore
Cvid
OPTIONAL
Ivid
FB
(EQ. 31)
where Cout is the total output capacitance.
In the meantime, the Rvid-Cvid branch current Ivid time
domain expression is as shown in Equation 32:
–t
--------------------------------⎞
dV fb ⎛
R
× C vid⎟
I vid ( t ) = C vid × ------------ × ⎜ 1 – e vid
⎜
⎟
dt
⎝
⎠
Idroop_vid
COMP
E/A
Σ VDACDAC
VIDs
RTN
X1
INTERNAL TO
IC
VID<0:6>
VSSSENSE
VSS
(EQ. 32)
It is desired to let Ivid(t) cancel Idroop_vid(t). So there
are:
dV fb
C out × LL dV core
C vid × ------------ = -------------------------- × ------------------dt
dt
R droop
(EQ. 33)
and:
R vid × C vid = C out × LL
VID<0:6>
(EQ. 34)
The result is:
Vfb
(EQ. 35)
R vid = R droop
Ivid
and:
dV core
C out × LL -----------------dt
C vid = -------------------------- × ------------------R droop
dV fb
-----------dt
Vcore
Idroop_vid
FIGURE 23. OPTIONAL SLEW RATE COMPENSATION
CIRCUIT FOR1-TICK VID TRANSITION
During a large VID transition, the DAC steps through the
VIDs at a controlled slew rate of 2.5µs or 1.25µs per tick
(12.5mV), controlling output voltage Vcore slew rate at
5mV/µs or 10mV/µs.
Figure 23 shows the waveforms of 1-tick VID transition.
During 1-tick VID transition, the DAC output changes at
approximately 15mV/µs slew rate, but the DAC cannot
step through multiple VIDs to control the slew rate.
Instead, the control loop response speed determines
Vcore slew rate. Ideally, Vcore will follow the FB pin
voltage slew rate. However, the controller senses the
inductor current increase during the up transition, as the
Idroop_vid waveform shows, and will droop the output
voltage Vcore accordingly, making Vcore slew rate slow.
Similar behavior occurs during the down transition.
To control Vcore slew rate during 1-tick VID transition,
one can add the Rvid-Cvid branch, whose current Ivid
cancels Idroop_vid.
22
(EQ. 36)
For example: given LL = 3mΩ, Rdroop = 4.22kΩ,
Cout = 1320µF, dVcore/dt = 5mV/µs and
dVfb/dt = 15mV/µs, Equation 35 gives Rvid = 4.22kΩ
and Equation 36 gives Cvid = 227pF.
It’s recommended to select the calculated Rvid value and
start with the calculated Cvid value and tweak it on the
actual board to get the best performance.
During normal transient response, the FB pin voltage is
held constant, therefore is virtual ground in small signal
sense. The Rvid-Cvid network is between the virtual
ground and the real ground, and hence has no effect on
transient response.
Voltage Regulator Thermal Throttling
Figure 24 shows the thermal throttling feature with
hysteresis. An NTC network is connected between the
NTC pin and GND. At low temperature, SW1 is on and
SW2 connects to the 1.20V side. The total current
flowing out of the NTC pin is 60µA. The voltage on NTC
pin is higher than the threshold voltage of 1.20V and the
comparator output is low. VR_TT# is pulled up by the
external resistor.
FN6924.0
October 26, 2009
ISL62881, ISL62881B
54µ
64µ
VR_TT#
SW1
NTC
2.96kΩ
------------------------------------------------------ = 467kΩ
( 0.03956 – 0.03322 )
+
VNTC
-
+
RNTC
Rs
1.24V
For example, given Panasonic NTC thermistor with
B = 4700, the resistance will drop to 0.03322 of its
nominal at +105°C, and drop to 0.03956 of its nominal
at +100°C. If the required temperature hysteresis is
+105°C to +100°C, the required resistance of NTC will
be as shown in Equation 38:
(EQ. 38)
Therefore, a larger value thermistor such as 470k NTC
should be used.
SW2
1.20V
INTERNAL TO
ISL62881
FIGURE 24. CIRCUITRY ASSOCIATED WITH THE
THERMAL THROTTLING FEATURE OF THE
ISL62881
When temperature increases, the NTC thermistor
resistance decreases so the NTC pin voltage drops. When
the NTC pin voltage drops below 1.20V, the comparator
changes polarity and turns SW1 off and throws SW2 to
1.24V. This pulls VR_TT# low and sends the signal to
start thermal throttle. There is a 6µA current reduction
on NTC pin and 40mV voltage increase on threshold
voltage of the comparator in this state. The VR_TT#
signal will be used to change the CPU operation and
decrease the power consumption. When the temperature
drops down, the NTC thermistor voltage will go up. If
NTC voltage increases to above 1.24V, the comparator
will flip back. The external resistance difference in these
two conditions is shown in Equation 37:
1.24V 1.20V
---------------- – ---------------- = 2.96k
54μA 60μA
At +105°C, 470kΩ NTC resistance becomes
(0.03322 × 470kΩ) = 15.6kΩ. With 60µA on the NTC pin,
the voltage is only (15.6kΩ × 60µA) = 0.937V. This value
is much lower than the threshold voltage of 1.20V.
Therefore, a regular resistor needs to be in series with
the NTC. The required resistance can be calculated by
Equation 39:
1.20V
---------------- – 15.6kΩ = 4.4kΩ
60μA
(EQ. 39)
4.42k is a standard resistor value. Therefore, the NTC
branch should have a 470k NTC and 4.42k resistor in
series. The part number for the NTC thermistor is
ERTJ0EV474J. It is a 0402 package. NTC thermistor will
be placed in the hot spot of the board.
Layout Guidelines
Table 5 shows the layout considerations. The
designators refer to the reference designs shown in
Figures 25 and 26.
(EQ. 37)
One needs to properly select the NTC thermistor value
such that the required temperature hysteresis correlates
to 2.96kΩ resistance change. A regular resistor may
need to be in series with the NTC thermistor to meet the
threshold voltage values.
TABLE 5. LAYOUT CONSIDERATIONS
NAME
LAYOUT CONSIDERATION
GND
Create analog ground plane underneath the controller and the analog signal processing components. Don’t let the
power ground plane overlap with the analog ground plane. Avoid noisy planes/traces (e.g.: phase node) from
crossing over/overlapping with the analog plane.
CLK_EN#
No special consideration.
PGOOD
No special consideration
RBIAS
Place the RBIAS resistor (R16) in general proximity of the controller. Low impedance connection to the analog ground
plane.
VR_TT#
No special consideration.
NTC
The NTC thermistor (R9) needs to be placed close to the thermal source that is monitor to determine thermal
throttling. Usually it’s placed close to phase-1 high-side MOSFET.
VW
Place capacitor (C4) across VW and COMP in close proximity of the controller.
COMP
Place compensator components (C3, C5, C6 R7, R11, R10 and C11) in general proximity of the controller.
FB
23
FN6924.0
October 26, 2009
ISL62881, ISL62881B
TABLE 5. LAYOUT CONSIDERATIONS (Continued)
NAME
VSEN
LAYOUT CONSIDERATION
Place the VSEN/RTN filter (C12, C13) in close proximity of the controller for good decoupling.
RTN
VDD
A capacitor (C16) decouples it to GND. Place it in close proximity of the controller.
IMON
Place the filter capacitor (C21) close to the CPU.
ISUM-
Place the current sensing circuit in general proximity of the controller.
Place C82 very close to the controller.
Place NTC thermistors R42 next to inductor (L1) so it senses the inductor temperature correctly.
The power stage sends a pair of VSUM+ and VSUM- signals to the controller. Run these two signal traces in parallel
fashion with decent width (>20mil).
IMPORTANT: Sense the inductor current by routing the sensing circuit to the inductor pads.
Route R63 to the phase-node side pad of inductor L1. Route the other current sensing trace to the output side pad
of inductor L1.
If possible, route the traces on a different layer from the inductor pad layer and use vias to connect the traces to
the center of the pads. If no via is allowed on the pad, consider routing the traces into the pads from the inside of
the inductor. The following drawings show the two preferred ways of routing current sensing traces.
ISUM+
INDUCTOR
INDUCTOR
VIAS
CURRENTSENSING TRACES
VIN
CURRENTSENSING TRACES
A capacitor (C17) decouples it to GND. Place it in close proximity of the controller.
BOOT
Use decent wide trace (>30mil). Avoid any sensitive analog signal trace from crossing over or getting close.
UGATE
Run these two traces in parallel fashion with decent width (>30mil). Avoid any sensitive analog signal trace from
crossing over or getting close. Recommend routing PHASE trace to the high-side MOSFET (Q2 and Q8) source pins
instead of general phase node copper.
PHASE
VSSP
Run these two traces in parallel fashion with decent width (>30mil). Avoid any sensitive analog signal trace from
crossing over or getting close. Recommend routing VSSP to the low-side MOSFET (Q3 and Q9) source pins instead
LGATE
of general power ground plane for better performance.
or
LGATEa and
LGATEb
VCCP
A capacitor (C22) decouples it to GND. Place it in close proximity of the controller.
VID0~6
No special consideration.
VR_ON
No special consideration.
DPRSLPVR No special consideration.
Phase Node Minimize phase node copper area. Don’t let the phase node copper overlap with/getting close to other sensitive
traces. Cut the power ground plane to avoid overlapping with phase node copper.
Minimize the loop consisting of input capacitor, high-side MOSFETs and low-side MOSFETs (e.g.: C27, C33, Q2, Q8,
Q3 and Q9).
24
FN6924.0
October 26, 2009
VID0
VID1
VID2
VID3
VID4
VID5
VID6
VR_ON
DPRSLPVR
IN
IN
IN
IN
IN
IN
IN
+3.3V
IN
IN
IN
COMP
VSEN
EP
UGATE
R11
R20
C27
10UF
C54
VCORE
10UF
C55
10UF
C56
10UF
C40
10UF
C41
10UF
C59
10UF
C60
10UF
10UF
C52
C61
0.22UF
16
15
C22
C21
OUT
IMON
IN
VSSSENSE
3900PF
22.6K
0
R50
1UF
C17
C16
IN
+5V
VIN
0.1UF
----
----
DNP DNP
-----------OPTIONAL
C20
R41
11K
10K 2.61K
NTC
R30
3.01K
-----------C81 R109
-----> R42
R38
C82
C15
0.15UF
R63
R26
10
Q3
17
IN
R40
1
0.01UF 82.5
R18
C13
IN
0.88UH
18
R37
----
VSSSENSE
0
+5V
IN
IRF7832
0
0.22UF
IN
6.98K
OPTIONAL
----
19
C30
3.65K
PLACE NEAR L1
FIGURE 25. GPU APPLICATION REFERENCE DESIGN
LAYOUT
NOTE:
ROUTE UGATE TRACE IN PARALLEL
WITH THE PHASE TRACE GOING TO
THE SOURCE OF Q2
ROUTE LGATE TRACE IN PARALLEL
WITH THE VSSP TRACE GOING TO
THE SOURCE OF Q3
ISL62881, ISL62881B
R17
10
VCCSENSE
PHASE
C18
R7
422K
----C12
C3
---- 100PF
VCORE IN
29
2.37K 270PF
VSSP
ISL62881HRZ
FB
0.056UF
15PF
C11
1000PF 330PF
-----
C83 R110
DNP
DNP
--------
--------
R10
VCCP
LGATE
RTN
ISUMISUM+
VDD
VIN
IMON
BOOT
5
7
C6
U6
VW
OUT
R56
20
470UF
RBIAS
4
6
OPTIONAL
----
VID0
21
1UF
PGOOD
3
L1
VID1
CLK_EN#
8
9
10
11
12
13
14
C4
1000PF
----
R16
47K
10UF
C33
C24
28
27
26
25
24
23
22
1
2
IRF7821
Q2
VR_ON
VID6
VID5
VID4
VID3
VID2
DPRSLPVR
TBD
R19
1.91K
R23
OUT
10K
DNP
------R6
25
------R4
PGOOD
OPTIONAL
----
IN
56UF
VIN
FN6924.0
October 26, 2009
VID0
VID1
VID2
VID3
VID4
VID5
VID6
VR_ON
DPRSLPVR
IN
IN
IN
IN
IN
IN
IN
+3.3V
IN
IN
IN
10UF
C27
C59
10UF
C41
10UF
C40
10UF
C56
C75
10UF
C74
10UF
C71
10UF
C70
10UF
C50
10UF
C49
10UF
C48
10UF
C47
10UF
C55
17
16
15
10UF
C43
10
C63
10UF
C64
10UF
C65
10UF
C66
10UF
C67
VSSSENSE
10UF
IN
C68
IMON
10UF
C21
OUT
2700PF
0
34K
IN
+5V
VIN
R50
1UF
C17
IN
R40
1
0.1UF
----
----
DNP DNP
----------OPTIONAL
C20
R41
11K
10K 2.61K
NTC
R30
-----> R42
R38
0.15UF
C18
0.022UF
C82
R26
C15
0.01UF 82.5
R63
1.91K
----------C81 R109
VCORE
10UF
C60
10UF
C54
10UF
C42
10UF
C61
10UF
C52
OUT
10UF
0.22UF
330UF
Q9
C39
0.45UH
330UF
0
+5V
IN
Q3
IRF7832
18
R37
OPTIONAL
C16
R18
C13
IN
19
IRF7832
0
---VSSSENSE
10UF
C33
C24
UGATE
20
C30
1UF
VSEN
EP
0.22UF
IN
----C12
10
PHASE
R20
----
VSSP
ISL62881HRZ
FB
R11
4.22K
VCCP
LGATE
R56
3.65K
PLACE NEAR L1
FIGURE 26. CPU APPLICATION REFERENCE DESIGN
LAYOUT
NOTE:
ROUTE UGATE TRACE IN PARALLEL
WITH THE PHASE TRACE GOING TO
THE SOURCE OF Q2 AND Q8
ROUTE LGATE TRACE IN PARALLEL
WITH THE VSSP TRACE GOING TO
THE SOURCE OF Q3 AND Q9
ISL62881, ISL62881B
100PF 422K
---R17
VCORE IN
VCCSENSE
29
1000PF 330PF
-----
C83 R110
DNP DNP
--------
--------
R7
U6
COMP
C11
4.87K 470PF
27PF
C3
VID0
21
C22
5
R10
PGOOD
VW
7
C6
VID1
RBIAS
4
6
OPTIONAL
----
56UF
28
27
26
25
24
23
22
3
L1
CLK_EN#
RTN
ISUMISUM+
VDD
VIN
IMON
BOOT
147K
IRF7821
Q2
VR_ON
VID6
VID5
VID4
VID3
VID2
DPRSLPVR
2
R16
IN
8
9
10
11
12
13
14
C4
----
1
1000PF
7.32K
R4
DNP
------R6
26
-------
CLK_EN# OUT
PGOOD OUT
OPTIONAL
----
1.91K
10K
R23
R19
VIN
FN6924.0
October 26, 2009
ISL62881, ISL62881B
CPU Application Reference Design Bill of Materials
QTY REFERENCE
VALUE
DESCRIPTION
MANUFACTURER
PART NUMBER
PACKAGE
1
C11
470pF
Multilayer Cap, 16V, 10%
GENERIC
H1045-00471-16V10
SM0603
1
C12
330pF
Multilayer Cap, 16V, 10%
GENERIC
H1045-00331-16V10
SM0603
1
C13
1000pF Multilayer Cap, 16V, 10%
GENERIC
H1045-00102-16V10
SM0603
1
C15
0.01µF Multilayer Cap, 16V, 10%
GENERIC
H1045-00103-16V10
SM0603
2
C16, C22
Multilayer Cap, 16V, 20%
GENERIC
H1045-00105-16V20
SM0603
1
C18
0.15µF Multilayer Cap, 16V, 10%
GENERIC
H1045-00154-16V10
SM0603
1
C20
Multilayer Cap, 16V, 10%
GENERIC
H1045-00104-16V10
SM0603
1
C21
2700pF Multilayer Cap, 16V, 10%
GENERIC
H1045-00272-16V10
SM0603
2
C17, C30
0.22µF Multilayer Cap, 25V, 10%
GENERIC
H1045-00224-25V10
SM0603
1
C24
56µF
Radial SP Series Cap, 25V, 20%
25SP56M
CASE-CC
2
C27, C33
10µF
Multilayer Cap, 25V, 20%
GENERIC
H1065-00106-25V20
SM1206
1
C3
100pF
Multilayer Cap, 16V, 10%
GENERIC
H1045-00101-16V10
SM0603
2
C39, C52
330µF
SPCAP, 2V, 4MΩ
1µF
0.1µF
POLYMER CAP, 2.5V, 4.5MΩ
1
C4
1000pF Multilayer Cap, 16V, 10%
30
C40-C43,
C47-C50,
C53-C56, C59,
C75, C78
10µF
1
C6
27pF
1
C82
0
C81, C83
1
L1
1
Q2
N-Channel Power MOSFET
2
Q3, Q9
N-Channel Power MOSFET
1
R10
4.87k
Thick Film Chip Resistor, 1%
1
R11
4.22k
1
R16
2
Multilayer Cap, 6.3V, 20%
SANYO
PANASONIC
KEMET
EEXSX0D331E4
T520V337M2R5A(1)E4R5-6666
GENERIC
H1045-00102-16V10
SM0603
MURATA
GRM21BR61C106KE15L
SM0805
TDK
C2012X5R0J106K
Multilayer Cap, 16V, 10%
GENERIC
H1045-00270-16V10
SM0603
0.022µF Multilayer Cap, 16V, 10%
GENERIC
H1045-00223-16V10
SM0603
MPCG1040LR45
10mmx10mm
IR
IRF7821
PWRPAKSO8
IR
IRF7832
PWRPAKSO8
GENERIC
H2511-04871-1/16W1
SM0603
Thick Film Chip Resistor, 1%
GENERIC
H2511-04221-1/16W1
SM0603
147k
Thick Film Chip Resistor, 1%
GENERIC
H2511-01473-1/16W1
SM0603
R17, R18
10
Thick Film Chip Resistor, 1%
GENERIC
H2511-00100-1/16W1
SM0603
1
R19
1.91k
Thick Film Chip Resistor, 1%
GENERIC
H2511-01911-1/16W1
SM0603
1
R26
82.5
Thick Film Chip Resistor, 1%
GENERIC
H2511-082R5-1/16W1
SM0603
3
R20, R40, R56
0
Thick Film Chip Resistor, 1%
GENERIC
H2511-00R00-1/16W1
SM0603
1
R30
1.91k
Thick Film Chip Resistor, 1%
GENERIC
H2511-01911-1/16W1
SM0603
1
R37
1
Thick Film Chip Resistor, 1%
GENERIC
H2511-01R00-1/16W1
SM0603
1
R38
11k
Thick Film Chip Resistor, 1%
GENERIC
H2511-01102-1/16W1
SM0603
1
R41
2.61k
Thick Film Chip Resistor, 1%
GENERIC
H2511-02611-1/16W1
SM0603
1
R42
ERT-J1VR103J
SM0603
1
R50
H2511-03402-1/16W1
SM0603
DNP
0.45µH Inductor, Inductance 20%,
DCR 7%
10k NTC Thermistor, 10k NTC
34k
Thick Film Chip Resistor, 1%
27
NEC-TOKIN
PANASONIC
GENERIC
FN6924.0
October 26, 2009
ISL62881, ISL62881B
CPU Application Reference Design Bill of Materials (Continued)
QTY REFERENCE
VALUE
DESCRIPTION
MANUFACTURER
PART NUMBER
PACKAGE
1
R6
7.32k
Thick Film Chip Resistor, 1%
GENERIC
H2511-07321-1/16W1
SM0603
1
R63
3.65k
Thick Film Chip Resistor, 1%
GENERIC
H2511-03651-1/16W1
SM0805
1
R7
422k
Thick Film Chip Resistor, 1%
GENERIC
H2511-04223-1/16W1
SM0603
0
R109, R110,
R4, R8, R9
DNP
1
U6
IMVP-6.5 PWM Controller
INTERSIL
ISL62881HRTZ
QFN-28
GPU Application Reference Design Bill of Materials
QTY REFERENCE VALUE
DESCRIPTION
MANUFACTURER
PART NUMBER
PACKAGE
1
C11
270pF
Multilayer Cap, 16V, 10%
GENERIC
H1045-00271-16V10
SM0603
1
C12
330pF
Multilayer Cap, 16V, 10%
GENERIC
H1045-00331-16V10
SM0603
1
C13
1000pF Multilayer Cap, 16V, 10%
GENERIC
H1045-00102-16V10
SM0603
1
C15
0.01µF Multilayer Cap, 16V, 10%
GENERIC
H1045-00103-16V10
SM0603
2
C16, C22
Multilayer Cap, 16V, 20%
GENERIC
H1045-00105-16V20
SM0603
1
C18
0.15µF Multilayer Cap, 16V, 10%
GENERIC
H1045-00154-16V10
SM0603
1
C20
Multilayer Cap, 16V, 10%
GENERIC
H1045-00104-16V10
SM0603
2
C17, C30
0.22µF Multilayer Cap, 25V, 10%
GENERIC
H1045-00224-25V10
SM0603
1
C21
3900pF Multilayer Cap, 16V, 10%
GENERIC
H1045-00392-16V10
SM0603
1
C24
56µF
Radial SP Series Cap, 25V, 20%
25SP56M
CASE-CC
2
C27, C33
10µF
Multilayer Cap, 25V, 20%
GENERIC
H1065-00106-25V20
SM1206
1
C3
100pF
Multilayer Cap, 16V, 10%
GENERIC
H1045-00101-16V10
SM0603
1
C52
470µF
SPCAP, 2V, 4MΩ
1µF
0.1µF
POLYMER CAP, 2.5V, 4.5MΩ
1000pF Multilayer Cap, 16V, 10%
SANYO
PANASONIC
KEMET
EEXSX0D471E4
T520V477M2R5A(1)E4R5-6666
1
C4
8
C40, C41,
C54-C56,
C59-C61
10µF
1
C6
15pF
1
C82
0
C81, C83
1
L1
1
Q2
N-Channel Power MOSFET
IR
IRF7821
PWRPAKSO8
2
Q3, Q9
N-Channel Power MOSFET
IR
IRF7832
PWRPAKSO8
1
R10
2.37k
Thick Film Chip Resistor, 1%
GENERIC
H2511-02371-1/16W1
SM0603
1
R11
6.98k
Thick Film Chip Resistor, 1%
GENERIC
H2511-06981-1/16W1
SM0603
1
R16
47.5k
Thick Film Chip Resistor, 1%
GENERIC
H2511-04752-1/16W1
SM0603
2
R17, R18
10
Thick Film Chip Resistor, 1%
GENERIC
H2511-00100-1/16W1
SM0603
1
R19
1.91k
Thick Film Chip Resistor, 1%
GENERIC
H2511-01911-1/16W1
SM0603
1
R26
82.5
Thick Film Chip Resistor, 1%
GENERIC
H2511-082R5-1/16W1
SM0603
Multilayer Cap, 6.3V, 20%
GENERIC
H1045-00102-16V10
SM0603
MURATA
GRM21BR61C106KE15L
SM0805
TDK
C2012X5R0J106K
Multilayer Cap, 16V, 10%
GENERIC
H1045-00150-16V10
SM0603
0.056µF Multilayer Cap, 16V, 10%
GENERIC
H1045-00563-16V10
SM0603
DNP
0.88µH Inductor, Inductance 20%, DCR
7%
28
NEC-TOKIN
MPC1040LR88
10mmx10mm
FN6924.0
October 26, 2009
ISL62881, ISL62881B
GPU Application Reference Design Bill of Materials (Continued)
QTY REFERENCE VALUE
DESCRIPTION
MANUFACTURER
PART NUMBER
PACKAGE
3
R20, R40,
R56
0
Thick Film Chip Resistor, 1%
GENERIC
H2511-00R00-1/16W1
SM0603
1
R30
3.01k
Thick Film Chip Resistor, 1%
GENERIC
H2511-03011-1/16W1
SM0603
1
R37
1
Thick Film Chip Resistor, 1%
GENERIC
H2511-01R00-1/16W1
SM0603
1
R38
11k
Thick Film Chip Resistor, 1%
GENERIC
H2511-01102-1/16W1
SM0603
1
R41
2.61k
Thick Film Chip Resistor, 1%
GENERIC
H2511-02611-1/16W1
SM0603
1
R42
ERT-J1VR103J
SM0603
1
R50
22.6k
Thick Film Chip Resistor, 1%
GENERIC
H2511-02262-1/16W1
SM0603
1
R6
10k
Thick Film Chip Resistor, 1%
GENERIC
H2511-01002-1/16W1
SM0603
1
R63
3.65k
Thick Film Chip Resistor, 1%
GENERIC
H2511-03651-1/16W1
SM0805
1
R7
412k
Thick Film Chip Resistor, 1%
GENERIC
H2511-04123-1/16W1
SM0603
0
R109, R110,
R4, R8, R9
DNP
1
U6
IMVP-6.5 PWM Controller
INTERSIL
ISL62881HRTZ
QFN-28
10k NTC Thermistor, 10k NTC
29
PANASONIC
FN6924.0
October 26, 2009
ISL62881, ISL62881B
90
88
88
86
86
84
EFFICIENCY (%)
EFFICIENCY (%)
Typical Performance
84
VIN = 12V
82
VIN = 8V
80
VIN = 19V
78
76
74
80
78
76
74
VIN = 12V
VIN = 19V
VIN = 8V
72
72
70
82
0
2
4
6
8
10 12 14
IOUT (A)
16
18
20
22
FIGURE 27. CPU APPLICATION CCM EFFICIENCY,
VID = 0.9V, VIN1 = 8V, VIN2 = 12.6V AND
VIN3 = 19V
0.91
70
0.1
1.0
IOUT (A)
10.0
FIGURE 28. CPU APPLICATION DCM EFFICIENCY,
VID = 0.9V, VIN1 = 8V, VIN2 = 12.6V AND
VIN3 = 19V
VIN = 19V
0.90
0.89
VOUT (V)
0.88
0.87
0.86
0.85
0.84
0.83
VIN = 12V
0.82
VIN = 8V
0.81
0.80
0
2
4
6
8
10 12 14
IOUT (A)
16
18
20
22
FIGURE 29. CPU APPLICATION CCM LOAD LINE,
VID = 0.9V, VIN1 = 8V, VIN2 = 12.6V AND
VIN3 = 19V
FIGURE 30. CPU MODE CLK_EN# DELAY, VIN = 19V,
IO = 0A, VID = 1.2V, Ch1: PHASE1,
Ch2: VO, Ch4: CLK_EN#
FIGURE 31. CPU MODE SOFT-START, VIN = 19V,
IO = 0A, VID = 1.2V, Ch1: PHASE, Ch2: VO
FIGURE 32. GPU MODE SOFT-START, VIN = 19V,
IO = 0A, VID = 1.2V, Ch1: PHASE, Ch2: VO
30
FN6924.0
October 26, 2009
ISL62881, ISL62881B
Typical Performance (Continued)
FIGURE 33. CPU MODE SHUT DOWN, VIN = 19V,
IO = 0A, VID = 1.2V, Ch1: PHASE, Ch2: VO
FIGURE 34. GPU MODE SHUT DOWN, VIN = 19V,
IO = 0A, VID = 1.2V, Ch1: PHASE, Ch2: VO
FIGURE 35. CCM STEADY STATE, CPU MODE, VIN = 8V,
IO = 1A, VID = 1.2375V, Ch1: PHASE,
Ch2: VO
FIGURE 36. DCM STEADY STATE, CPU MODE,
VIN = 12V, IO = 1A, VID = 1.075V, Ch1:
PHASE1, Ch2: VO, Ch3: COMP, Ch4: LGATE
1000
Phase Margin
Gain
IMON-VSSSENSE (mV)
900
800
700
600
500
IMON
400
300
200
100
0
FIGURE 37. GPU MODE REFERENCE DESIGN LOOP GAIN
T2(s) MEASUREMENT RESULT
31
TARGET
0
2
4
6
8
10 12
IOUT (A)
14
16
18
20
22
FIGURE 38. IMON, VID = 1.2375
FN6924.0
October 26, 2009
ISL62881, ISL62881B
Typical Performance (Continued)
FIGURE 39. LOAD TRANSIENT RESPONSE WITH
OVERSHOOT REDUCTION FUNCTION
DISABLED, GPU MODE, VIN = 12V,
VID = 0.9V, IO = 12A/22A,
di/dt = “FASTEST”
FIGURE 40. LOAD TRANSIENT RESPONSE WITH
OVERSHOOT REDUCTION FUNCTION
DISABLED, GPU MODE, VIN = 12V,
VID = 0.9V, IO = 12A/22A,
di/dt = “FASTEST”
FIGURE 41. LOAD TRANSIENT RESPONSE WITH
OVERSHOOT REDUCTION FUNCTION
DISABLED, GPU MODE, VIN = 12V,
VID = 0.9V, IO = 12A/22A,
di/dt = “FASTEST”
FIGURE 42. LOAD TRANSIENT RESPONSE WITH
OVERSHOOT REDUCTION FUNCTION
DISABLED, GPU MODE, VIN = 12V,
VID = 0.9V, IO = 12A/22A,
di/dt = “FASTEST”
FIGURE 43. CPU MODE VID TRANSITION,
DPRSLPVR = 0, IO = 2A,
VID = 1.2375V/1.0375V, Ch2: VO, Ch3:
VID4
FIGURE 44. GPU MODE VID TRANSITION,
DPRSLPVR = 0, IO = 2A,
VID = 1.2375V/1.0375V, Ch2: VO, Ch3:
VID4
32
FN6924.0
October 26, 2009
ISL62881, ISL62881B
Typical Performance (Continued)
FIGURE 45. CPU MODE VID TRANSITION,
DPRSLPVR = 1, IO = 2A,
VID = 1.2375V/1.0375V, Ch2: VO,
Ch3: VID4
FIGURE 46. GPU MODE VID TRANSITION,
DPRSLPVR = 1, IO = 2A,
VID = 1.2375V/1.0375V, Ch2: VO,
Ch3: VID4
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Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted
in the quality certifications found at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications
at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by
Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any
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33
FN6924.0
October 26, 2009
ISL62881, ISL62881B
Package Outline Drawing
L28.4x4
28 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 0, 9/06
A
4 . 00
2 . 50
PIN #1 INDEX AREA
CHAMFER 0 . 400 X 45¬
0 . 40
22
28
1
0 . 40
15
3 . 20
2 . 50
4 . 00
21
0 . 4 x 6 = 2.40 REF
B
PIN 1
INDEX AREA
7
0 . 10
2X
14
8
0 . 20 ±0 . 0
0 . 10 M C A B
0 . 4 x 6 = 2 . 40 REF
TOP VIEW
3 . 20
BOTTOM VIEW
SEE DETAIL X''
0 . 10 C
(3 . 20)
C
PACKAGE BOUNDARY
MAX. 0 . 80
SEATING PLANE
(28X 0 . 20)
0 . 00 - 0 . 05
0 . 08 C
0 . 20 REF
(3 . 20)
(2 . 50)
SIDE VIEW
(0 . 40)
C
(0 . 40)
0 . 20 REF
5
0 ~ 0 . 05
(2 . 50)
(28X 0 . 60)
DETAIL "X"
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1. Controlling dimensions are in mm.
Dimensions in ( ) for reference only.
2. Unless otherwise specified, tolerance : Decimal ±0.05
Angular ±2°
3. Dimensioning and tolerancing conform to AMSE Y14.5M-1994.
4. Bottom side Pin#1 ID is diepad chamfer as shown.
5. Tiebar shown (if present) is a non-functional feature.
34
FN6924.0
October 26, 2009
ISL62881, ISL62881B
Package Outline Drawing
L32.5x5E
32 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 0, 03/09
3.50
5.00
28X 0.50
A
B
6
6
PIN 1
INDEX AREA
24
1
3.50
5.00
3.70
Exp. DAP
8
17
(4X)
PIN #1 INDEX AREA
32
25
0.15
32X 0.25 4
0.10 M C A B
9
16
3.70
Exp. DAP
SIDE VIEW
TOP VIEW
32X 0.40
BOTTOM VIEW
SEE DETAIL "X"
( 4.80 )
( 3.50)
0.10 C
Max 0.80
( 28X 0.50)
C
SEATING PLANE
0.08 C
SIDE VIEW
( 4.80 )
(3.70
)
( 3.50)
(32X 0.25)
C
0 . 2 REF
5
0 . 00 MIN.
0 . 05 MAX.
( 32 X 0.60)
DETAIL "X"
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3. Unless otherwise specified, tolerance : Decimal ± 0.0
4. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5. Tiebar shown (if present) is a non-functional feature.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
35
FN6924.0
October 26, 2009
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