CALMIRCO CSPEMI200AG 4 channel headset emi filter with esd protection Datasheet

CSPEMI200A
4 Channel Headset EMI Filter with ESD Protection
Features
Product Description
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The CSPEMI200A is a quad low-pass filter array integrating four pi-style filters (C-R-C) that reduce EMI/RFI
emissions while at the same time providing ESD protection. This device is custom-designed to interface
with the headset port on a cellular telephone, and contains 3 different filter values. Each high quality filter
provides more than 20dB attenuation in the 800-2700
MHz range. These pi-style filters support bidirectional
filtering, controlling EMI both to and from the microphone and speaker elements. They also support bipolar signals, enabling audio signals to pass through
without distortion.
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•
•
•
•
•
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•
Four channels of EMI filtering
Pi-style EMI filters in a capacitor-resistor-capacitor
(C-R-C) network
Includes 1 channel of ESD-only protection
Greater than 30dB attenuation at 1GHz
+8kV ESD protection on each channel
(IEC 61000-4-2 Level 4, contact discharge)
+15kV ESD protection on each channel (HBM)
Supports bipolar signals—ideal for
audio applications
11-bump, 2.046mm X 1.436mm footprint
Chip Scale Package (CSP)
Chip Scale Package features extremely low
lead inductance for optimum filter and ESD
performance
Lead-free version available
Applications
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•
•
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EMI filtering and ESD protection for audio ports
Wireless Handsets
Handheld PCs / PDAs
MP3 Players
Digital Camcorders
Notebooks
Desktop PCs
In addition, the CSPEMI200A provides a very high
level of protection for sensitive electronic components
that may be subject to electrostatic discharge (ESD).
The CSPEMI200A can safely dissipate ESD strikes of
+8kV, the maximum requirement of the IEC 61000-4-2
international standard. Using the MIL-STD-883
(Method 3015) specification for Human Body Model
(HBM) ESD, the device provides protection for contact
discharges to greater than +15kV.
The CSPEMI200A is particularly well suited for portable electronics (e.g., cellular telephones, PDAs, notebook computers) because of its small package format
and low weight. The CSPEMI200A is available in a
space-saving, low-profile Chip Scale Package with
optional lead-free finishing.
Electrical Schematic
100Ω
SPKR_IN2
10Ω
C4
47pF
47pF
C2
A3
SPKR_OUT1
A4
SPKR_OUT2
100pF
GND
MIC_OUT2
10Ω
C3
100pF
GND
SPKR_IN1
100pF
68Ω
A2
MIC_OUT1
100pF
MIC_IN2
C1
47pF
B1
47pF
MIC_IN1
B3
B2
ESD Channel
B4
© 2005 California Micro Devices Corp. All rights reserved.
09/27/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
1
CSPEMI200A
PACKAGE / PINOUT DIAGRAMS
BOTTOM VIEW
(Bumps Up View)
TOP VIEW
(Bumps Down View)
Orientation
Marking
(see note 2)
1
2
3
4
MIC_OUT1 MIC_OUT2 SPKR_IN1 SPKR_IN2
A
200A
B
C1
C2
MIC_IN1
ESD1
GND
GND
B1
B2
B3
B4
Orientation
Marking
C
C3
C4
MIC_IN2 SPKR_OUT1 SPKR_OUT2
A2
A3
A4
A1
CSPEMI200A
Notes:
CSP Package
1) These drawings are not to scale.
2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
PIN DESCRIPTIONS
PIN
NAME
DESCRIPTION
A1
N.B.
A2
MIC_IN2
No Bump – used for orientation / alignment
A3
SPKR_OUT1
Speaker Output 1 (to speaker)
A4
SPKR_OUT2
Speaker Output 2 (to speaker)
B1
MIC_IN1
B2
ESD1
ESD Protection Input. Provides a channel specifically for ESD protection purposes.
B3
GND
Device Ground
B4
GND
Device Ground
C1
MIC_OUT1
Microphone Output 1 (to audio circuitry)
C2
MIC_OUT2
Microphone Output 2 (to audio circuitry)
C3
SPKR_IN1
Speaker Input 1 (from audio circuitry)
C4
SPKR_IN2
Speaker Input 2 (from audio circuitry)
Microphone Input 2 (from microphone)
Microphone Input 1 (from microphone)
Ordering Information
PART NUMBERING INFORMATION
Lead-free Finish2
Standard Finish
Bumps
Package
Ordering Part
Number1
Part Marking
Ordering Part
Number1
Part Marking
11
CSP
CSPEMI200A
200A
CSPEMI200AG
200A
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
© 2005 California Micro Devices Corp. All rights reserved.
2
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
09/27/05
CSPEMI200A
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
Storage Temperature Range
RATING
UNITS
-65 to +150
°C
DC Power per Resistor
100
mW
DC Package Power Rating
400
mW
RATING
UNITS
-40 to +85
°C
STANDARD OPERATING CONDITIONS
PARAMETER
Operating Temperature Range
ELECTRICAL OPERATING CHARACTERISTICS (NOTE 1)
SYMBOL
PARAMETER
R1
CONDITIONS
MIN
TYP
MAX
UNITS
Resistance 1
90
100
110
Ω
R2
Resistance 2
61
68
75
Ω
R3
Resistance 3
9
10
11
Ω
C1
Capacitance 1
38
47
57
pF
C2
Capacitance 2
80
100
120
pF
1.0
μA
15
-15
V
V
ILEAK
Diode Leakage Current
VIN=5.0V
VSIG
Signal Voltage
Positive Clamp
Negative Clamp
ILOAD = 10mA
VESD
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883,
Method 3015
b) Contact Discharge per IEC 61000-4-2
Level 4
Notes 2,4 and 5
Clamping Voltage during ESD Discharge
MIL-STD-883 (Method 3015), 8kV
Positive Transients
Negative Transients
Notes 2,3,4 and 5
fC1
Cut-off frequency 1; Note 6
fC2
fC3
VCL
5
-5
7
-10
±15
kV
±8
kV
+15
-19
V
V
R = 100Ω, C = 47pF
53
MHz
Cut-off frequency 2; Note 6
R = 68Ω, C = 47pF
61
MHz
Cut-off frequency 3; Note 6
R = 10Ω, C = 100pF
33
MHz
Note 1: TA=25°C unless otherwise specified.
Note 2: ESD applied to input pins with respect to GND, one at a time, pins A2, A3, A4, B1 and B2 only.
Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin B1,
then clamping voltage is measured at Pin C1.
Note 4: Unused pins are left open
Note 5: The parameters are guaranteed by design and characterization.
Note 6: ZSOURCE=50Ω, ZLOAD=50Ω.
© 2005 California Micro Devices Corp. All rights reserved.
09/27/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
3
CSPEMI200A
Performance Information
Typical Filter Performance (nominal conditions unless specified otherwise)
Figure 1. Microphone 1 Circuit (B1-C1) EMI Filter Performance
Figure 2. Microphone 2 Circuit (A2-C2) EMI Filter Performance
© 2005 California Micro Devices Corp. All rights reserved.
4
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
09/27/05
CSPEMI200A
Performance Information (Cont’d)
Typical Filter Performance (nominal conditions unless specified otherwise)
Figure 3. Speaker 1 Circuit (A3-C3) EMI Filter Performance
Figure 4. Speaker 2 Circuit (A4-C4) EMI Filter Performance
© 2005 California Micro Devices Corp. All rights reserved.
09/27/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
5
CSPEMI200A
Application Information
Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages
offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
Pad Size on PCB
0.275mm
Pad Shape
Round
Pad Definition
Non-Solder Mask defined pads
Solder Mask Opening
0.325mm Round
Solder Stencil Thickness
0.125 - 0.150mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
0.330mm Round
Solder Flux Ratio
50/50 by volume
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance — Edge To Corner Ball
+50μm
Solder Ball Side Coplanarity
+20μm
Maximum Dwell Time Above Liquidous
60 seconds
Maximum Soldering Temperature for Eutectic Devices using a Eutectic Solder Paste
240°C
Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste
260°C
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Stencil Opening
0.330mm DIA.
Solder Mask Opening
0.325mm DIA.
Figure 5. Recommended Non-Solder Mask Defined Pad Illustration
Temperature (°C)
250
200
150
100
50
0
Figure 6. Eutectic (SnPb) Solder
Ball Reflow Profile
1:00.0
2:00.0
3:00.0
Time (minutes)
4:00.0
Figure 7. Lead-free (SnAgCu) Solder
Ball Reflow Profile
© 2005 California Micro Devices Corp. All rights reserved.
6
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
09/27/05
CSPEMI200A
Mechanical Details
CSP Mechanical Specifications
Mechanical Package Diagrams
CSPEMI200A devices are packaged in a custom Chip
Scale Package (CSP). Dimensions are presented
below. For complete information on CSP packaging,
see the California Micro Devices CSP Package Information document.
BOTTOM VIEW
A1
SIDE
VIEW
C1
PACKAGE DIMENSIONS
C
B
Bumps
11
A
Millimeters
Min
Nom
Inches
Max
Min
Nom
1
Max
A1
2.001 2.046 2.091 0.0788 0.0806 0.0823
A2
1.391 1.436 1.481 0.0548 0.0565 0.0583
B1
0.495 0.500 0.505 0.0195 0.0197 0.0199
B2
0.495 0.500 0.505 0.0195 0.0197 0.0199
C1
0.223 0.273 0.323 0.0088 0.0107 0.0127
C2
0.168 0.218 0.268 0.0066 0.0086 0.0106
D1
0.562 0.606 0.650 0.0221 0.0239 0.0256
D2
0.356 0.381 0.406 0.0140 0.0150 0.0160
# per tape and
reel
A2
Custom CSP
C2
Package
Dim
B2
B1
2
3
4
D1
D2
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
DIMENSIONS IN MILLIMETERS
Package Dimensions for CSPEMI200A
Chip Scale Package
3500 pieces
Controlling dimension: millimeters
CSP Tape and Reel Specifications
PART NUMBER
CHIP SIZE (mm)
POCKET SIZE (mm)
B0 X A0 X K0
CSPEMI200A
2.04 X 1.44 X 0.606
2.29 X 1.60 X 0.81
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
P0
P1
8mm
178mm (7")
3500
4mm
4mm
Po
Top
Cover
Tape
10 Pitches Cumulative
Tolerance On Tape
±0.2 mm
Ao
W
Bo
Ko
For Tape Feeder Reference
Only including Draft.
Concentric Around B.
Embossment
Center Lines
of Cavity
P1
User Direction of Feed
Figure 8. Tape and Reel Mechanical Data
© 2005 California Micro Devices Corp. All rights reserved.
09/27/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
7
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