NSC LP3876-ADJ 3a fast ultra low dropout linear regulator Datasheet

LP3876-ADJ
3A Fast Ultra Low Dropout Linear Regulator
General Description
Features
The LP3876-ADJ fast ultra low-dropout linear regulators operate from a +2.5V to +7.0V input supply. These ultra low
dropout linear regulators respond very quickly to step
changes in load, which makes them suitable for low voltage
microprocessor applications. The LP3876-ADJ is developed
on a CMOS process which allows low quiescent current
operation independent of output load current. This CMOS
process also allows the LP3876-ADJ to operate under extremely low dropout conditions.
Dropout Voltage: Ultra low dropout voltage; typically 80mV
at 300mA load current and 800mV at 3A load current.
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Ground Pin Current: Typically 6mA at 3A load current.
Shutdown Mode: Typically 1µA quiescent current when the
shutdown pin is pulled low.
Adjustable Output Voltage: The output voltage may be
programmed via two external resistors.
Ultra low dropout voltage
Low ground pin current
Load regulation of 0.08%
1µA quiescent current in shutdown mode
Guaranteed output current of 3A DC
Available in TO-263 and TO-220 packages
Minimum output capacitor requirements
Overtemperature/overcurrent protection
−40˚C to +125˚C junction temperature range
Applications
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Microprocessor power supplies
GTL, GTL+, BTL, and SSTL bus terminators
Power supplies for DSPs
SCSI terminator
Post regulators
High efficiency linear regulators
Battery chargers
Other battery powered applications
Typical Application Circuit
20074445
*See Application Hints
© 2003 National Semiconductor Corporation
DS200744
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LP3876-ADJ 3A Fast Ultra Low Dropout Linear Regulator
September 2003
LP3876-ADJ
Connection Diagrams
20074405
20074406
Top View
TO220-5 Package
Bent, Staggered Leads
Top View
TO263-5 Package
Pin Description for TO220-5 and TO263-5 Packages
LP3876-ADJ
Pin #
Name
Function
1
SD
2
VIN
3
GND
Ground
4
VOUT
Output Voltage
5
ADJ
Set Output Voltage
Shutdown
Input Supply
Ordering Information
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Package Type Designator is "T" for TO220 package, and "S" for TO263 package.
TABLE 1. Package Marking and Ordering Information
Output
Voltage
Order Number
Current
Description
Package Type
Package Marking
Supplied As:
ADJ
LP3876ES-ADJ
3A
TO263-5
LP3876ES-ADJ
Rail
ADJ
LP3876ESX-ADJ
3A
TO263-5
LP3876ES-ADJ
Tape and Reel
ADJ
LP3876ET-ADJ
3A
TO220-5
LP3876ET-ADJ
Rail
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LP3876-ADJ
Block Diagram LP3876-ADJ
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LP3876-ADJ
Absolute Maximum Ratings
(Note 1)
IOUT (Survival)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Storage Temperature Range
Operating Ratings
−65˚C to +150˚C
Input Supply Voltage (Operating),
(Note 10)
Lead Temperature
(Soldering, 5 sec.)
260˚C
ESD Rating (Note 3)
Internally Limited
Input Supply Voltage (Survival)
Shutdown Input Voltage
(Survival)
Output Voltage (Survival), (Note
6), (Note 7)
2.5V to 7.0V
Shutdown Input Voltage
(Operating)
2 kV
Power Dissipation (Note 2)
Short Circuit Protected
−0.3V to +7.5V
−0.3V to 7.0V
Maximum Operating Current (DC)
3A
Operating Junction Temp. Range
−40˚C to +125˚C
−0.3V to 7.5V
−0.3V to +6.0V
Electrical Characteristics
LP3876-ADJ
Limits in standard typeface are for TJ = 25˚C, and limits in boldface type apply over the full operating temperature range.
Unless otherwise specified: VIN = VO(NOM) + 1.5V, IL = 10 mA, COUT = 10µF, VSD = 2V.
Symbol
Parameter
Conditions
Typ
(Note 4)
LP3876-ADJ (Note 5)
Units
Min
Max
1.198
1.180
1.234
1.253
V
100
nA
VOUT +1.5V ≤ VIN≤ 7V
10 mA ≤ IL ≤ 3A
1.216
Adjust Pin Input Current
VOUT +1.5V ≤ VIN≤ 7V
10 mA ≤ IL ≤ 3A
10
∆V OL
Output Voltage Line
Regulation (Note 8)
VOUT +1.5V ≤ VIN ≤ 7.0V
0.02
0.06
%
∆VO/ ∆IOUT
Output Voltage Load
Regulation
(Note 8)
10 mA ≤ IL ≤ 3A
0.08
0.14
%
VADJ
IADJ
Adjust Pin Voltage
VIN - VOUT
Dropout Voltage
(Note 9)
IGND
IGND
IO(PK)
IL = 300 mA
80
105
125
IL = 3A
800
1000
1200
IL = 300 mA
5
Ground Pin Current In
Normal Operation Mode
9
10
IL = 3A
6
14
15
Ground Pin Current In
Shutdown Mode
VSD ≤ 0.3V
1
-40˚C ≤TJ ≤ 85˚C
Peak Output Current
VO ≥ VO(NOM) - 4%
10
mV
mA
µA
50
4.5
A
6
A
SHORT CIRCUIT PROTECTION
ISC
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Short Circuit Current
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Limits in standard typeface are for TJ = 25˚C, and limits in boldface type apply over the full operating temperature range.
Unless otherwise specified: VIN = VO(NOM) + 1.5V, IL = 10 mA, COUT = 10µF, VSD = 2V.
Symbol
Parameter
Conditions
Typ
(Note 4)
LP3876-ADJ (Note 5)
Min
Units
Max
SHUTDOWN INPUT
VIN
0
Turn-off delay
IL = 3A
20
Turn-on delay
IL = 3A
25
µs
SD Input Current
VSD = VIN
1
nA
VIN = VOUT + 1V
COUT = 10uF
VOUT = 3.3V, f = 120Hz
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VIN = VOUT + 0.5V
COUT = 10uF
VOUT = 3.3V, f = 120Hz
57
f = 120Hz
0.8
BW = 10Hz – 100kHz
VOUT = 2.5V
150
BW = 300Hz – 300kHz
VOUT = 2.5V
100
Shutdown Threshold
TdOFF
TdON
ISD
2
Output = High
Output = Low
VSDT
0.3
V
µs
AC PARAMETERS
PSRR
ρn(l/f
en
Ripple Rejection
Output Noise Density
Output Noise Voltage
dB
µV
µV (rms)
Note 1: Absolute maximum ratings indicate limits beyond which damage to the device may occur. Operating ratings indicate conditions for which the device is
intended to be functional, but does not guarantee specific performance limits. For guaranteed specifications and test conditions, see Electrical Characteristics. The
guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed
test conditions.
Note 2: At elevated temperatures, devices must be derated based on package thermal resistance. The devices in TO220 package must be derated at θjA = 50˚C/W
(with 0.5in2, 1oz. copper area), junction-to-ambient (with no heat sink). The devices in the TO263 surface-mount package must be derated at θjA = 60˚C/W (with
0.5in2, 1oz. copper area), junction-to-ambient. See Application Hints.
Note 3: The human body model is a 100pF capacitor discharged through a 1.5kΩ resistor into each pin.
Note 4: Typical numbers are at 25˚C and represent the most likely parametric norm.
Note 5: Limits are guaranteed by testing, design, or statistical correlation.
Note 6: If used in a dual-supply system where the regulator load is returned to a negative supply, the output must be diode-clamped to ground.
Note 7: The output PMOS structure contains a diode between the VIN and VOUT terminals. This diode is normally reverse biased. This diode will get forward biased
if the voltage at the output terminal is forced to be higher than the voltage at the input terminal. This diode can typically withstand 200mA of DC current and 1Amp
of peak current.
Note 8: Output voltage line regulation is defined as the change in output voltage from the nominal value due to change in the input line voltage. Output voltage load
regulation is defined as the change in output voltage from the nominal value due to change in load current.
Note 9: Dropout voltage is defined as the minimum input to output differential voltage at which the output drops 2% below the nominal value. Dropout voltage
specification applies only to output voltages of 2.5V and above. For output voltages below 2.5V, the drop-out voltage is nothing but the input to output differential,
since the minimum input voltage is 2.5V.
Note 10: The minimum operating value for VIN is equal to either [VOUT(NOM) + VDROPOUT] or 2.5V, whichever is greater.
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LP3876-ADJ
Electrical Characteristics
LP3876-ADJ (Continued)
LP3876-ADJ
Typical Performance Characteristics Unless otherwise specified: TJ = 25˚C, COUT = 10µF,
CIN = 10µF, S/D pin is tied to VIN, VOUT = 2.5V, VIN = VO(NOM) + 1.5V, IL = 10mA
Ground Current vs Output Load Current
VOUT = 5V
Dropout Voltage Vs Output Load Current
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20074453
Ground Current vs Output Voltage
IL=3A
Shutdown IQ vs Junction Temperature
20074455
20074454
DC Load Reg. vs Junction Temperature
DC Line Regulation vs Temperature
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20074459
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VIN vs VOUT Over Temperature
Noise vs Frequency
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Load Transient Response
CIN = COUT = 100µF, OSCON
Load Transient Response
CIN = COUT = 10µF, OSCON
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Load Transient Response
CIN = COUT = 10µF, TANTALUM
Load Transient Response
CIN = COUT = 100µF, POSCAP
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LP3876-ADJ
Typical Performance Characteristics Unless otherwise specified: TJ = 25˚C, COUT = 10µF,
CIN = 10µF, S/D pin is tied to VIN, VOUT = 2.5V, VIN = VO(NOM) + 1.5V, IL = 10mA (Continued)
LP3876-ADJ
Typical Performance Characteristics Unless otherwise specified: TJ = 25˚C, COUT = 10µF,
CIN = 10µF, S/D pin is tied to VIN, VOUT = 2.5V, VIN = VO(NOM) + 1.5V, IL = 10mA (Continued)
Load Transient Response
CIN = COUT = 100µF, TANTALUM
Load Transient Response
CIN = COUT = 10µF, OSCON
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Load Transient Response
CIN = COUT = 100µF, POSCAP
Load Transient Response
CIN = COUT = 100µF, OSCON
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Load Transient Response
CIN = COUT = 100µF, TANTALUM
Load Transient Response
CIN = COUT = 10µF, TANTALUM
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LP3876-ADJ
Application Hints
VIN RESTRICTIONS FOR PROPER START-UP
ESR Curve
To prevent misoperation, ensure that VIN is below 50mV
before start-up is initiated. This scenario can occur in systems with a backup battery using reverse-biased "blocking"
diodes which may allow enough leakage current to flow into
the VIN node to raise it’s voltage slightly above ground when
the main power is removed. Using low leakage diodes or a
resistive pull down can prevent the voltage at VIN from rising
above 50mV. Large bulk capacitors connected to VIN may
also cause a start-up problem if they do not discharge fully
before re-start is initiated (but only if VIN is allowed to fall
below 1V). A resistor connected across the capacitor will
allow it to discharge more quickly. It should be noted that the
probability of a "false start" caused by incorrect logic states
is extremely low.
SETTING THE OUTPUT VOLTAGE
The output voltage is set using the resistors R1 and R2 (see
Typical Application Circuit). The output is also dependent on
the reference voltage (typically 1.216V) which is measured
at the ADJ pin. The output voltage is given by the equation:
VOUT = VADJ x ( 1 + R1 / R2)
This equation does not include errors due to the bias current
flowing in the ADJ pin which is typically about 10 nA. This
error term is negligible for most applications. If R1 is >
100kΩ , a small error may be introduced by the ADJ bias
current.
20074470
CFF (Feed Forward Capacitor)
The capacitor CFF is required to add phase lead and help
improve loop compensation. The correct amount of capacitance depends on the value selected for R1 (see Typical
Application Circuit). The capacitor should be selected such
that the zero frequency as given by the equation shown
below is approximately 45 kHz:
Fz = 45,000 = 1 / ( 2 x π x R1 x CFF )
A good quality ceramic with X5R or X7R dielectric should be
used for this capacitor.
The tolerance of the external resistors used contributes a
significant error to the output voltage accuracy, with 1%
resistors typically adding a total error of approximately 1.4%
to the output voltage (this error is in addition to the tolerance
of the reference voltage at VADJ).
SELECTING A CAPACITOR
It is important to note that capacitance tolerance and variation with temperature must be taken into consideration when
selecting a capacitor so that the minimum required amount
of capacitance is provided over the full operating temperature range. In general, a good Tantalum capacitor will show
very little capacitance variation with temperature, but a ceramic may not be as good (depending on dielectric type).
Aluminum electrolytics also typically have large temperature
variation of capacitance value.
Equally important to consider is a capacitor’s ESR change
with temperature: this is not an issue with ceramics, as their
ESR is extremely low. However, it is very important in Tantalum and aluminum electrolytic capacitors. Both show increasing ESR at colder temperatures, but the increase in
aluminum electrolytic capacitors is so severe they may not
be feasible for some applications (see Capacitor Characteristics Section).
EXTERNAL CAPACITORS
Like any low-dropout regulator, external capacitors are required to assure stability. these capacitors must be correctly
selected for proper performance.
INPUT CAPACITOR: An input capacitor of at least 1µF is
required. Ceramic or Tantalum may be used, and capacitance may be increased without limit
OUTPUT CAPACITOR: An output capacitor is required for
loop stability. It must be located less than 1 cm from the
device and connected directly to the output and ground pins
using traces which have no other currents flowing through
them (see PCB Layout section).
The minimum value of the output capacitance that can be
used for stable full-load operation is 10 µF, but it may be
increased without limit. The output capacitor must have an
ESR value as shown in the stable region of the curve (below).
CAPACITOR CHARACTERISTICS
CERAMIC: For values of capacitance in the 10 to 100 µF
range, ceramics are usually larger and more costly than
tantalums but give superior AC performance for bypassing
high frequency noise because of very low ESR (typically less
than 10 mΩ). However, some dielectric types do not have
good capacitance characteristics as a function of voltage
and temperature.
Z5U and Y5V dielectric ceramics have capacitance that
drops severely with applied voltage. A typical Z5U or Y5V
capacitor can lose 60% of its rated capacitance with half of
the rated voltage applied to it. The Z5U and Y5V also exhibit
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LP3876-ADJ
Application Hints
these nodes resulting from current flowing through the
ground plane. Using a single point ground technique for the
regulator and it’s capacitors fixed the problem.
(Continued)
a severe temperature effect, losing more than 50% of nominal capacitance at high and low limits of the temperature
range.
X7R and X5R dielectric ceramic capacitors are strongly recommended if ceramics are used, as they typically maintain a
capacitance range within ± 20% of nominal over full operating ratings of temperature and voltage. Of course, they are
typically larger and more costly than Z5U/Y5U types for a
given voltage and capacitance.
TANTALUM: Solid Tantalum capacitors are recommended
for use on the output because their typical ESR is very close
to the ideal value required for loop compensation. They also
work well as input capacitors if selected to meet the ESR
requirements previously listed.
Since high current flows through the traces going into VIN
and coming from VOUT, Kelvin connect the capacitor leads to
these pins so there is no voltage drop in series with the input
and output capacitors.
RFI/EMI SUSCEPTIBILITY
RFI (radio frequency interference) and EMI (electromagnetic
interference) can degrade any integrated circuit’s performance because of the small dimensions of the geometries
inside the device. In applications where circuit sources are
present which generate signals with significant high frequency energy content ( > 1 MHz), care must be taken to
ensure that this does not affect the IC regulator.
If RFI/EMI noise is present on the input side of the regulator
(such as applications where the input source comes from the
output of a switching regulator), good ceramic bypass capacitors must be used at the input pin of the IC.
Tantalums also have good temperature stability: a good
quality Tantalum will typically show a capacitance value that
varies less than 10-15% across the full temperature range of
125˚C to −40˚C. ESR will vary only about 2X going from the
high to low temperature limits.
The increasing ESR at lower temperatures can cause oscillations when marginal quality capacitors are used (if the ESR
of the capacitor is near the upper limit of the stability range at
room temperature).
ALUMINUM: This capacitor type offers the most capacitance for the money. The disadvantages are that they are
larger in physical size, not widely available in surface mount,
and have poor AC performance (especially at higher frequencies) due to higher ESR and ESL.
Compared by size, the ESR of an aluminum electrolytic is
higher than either Tantalum or ceramic, and it also varies
greatly with temperature. A typical aluminum electrolytic can
exhibit an ESR increase of as much as 50X when going from
25˚C down to −40˚C.
It should also be noted that many aluminum electrolytics only
specify impedance at a frequency of 120 Hz, which indicates
they have poor high frequency performance. Only aluminum
electrolytics that have an impedance specified at a higher
frequency (between 20 kHz and 100 kHz) should be used for
the LP387X. Derating must be applied to the manufacturer’s
ESR specification, since it is typically only valid at room
temperature.
Any applications using aluminum electrolytics should be
thoroughly tested at the lowest ambient operating temperature where ESR is maximum.
If a load is connected to the IC output which switches at high
speed (such as a clock), the high-frequency current pulses
required by the load must be supplied by the capacitors on
the IC output. Since the bandwidth of the regulator loop is
less than 100 kHz, the control circuitry cannot respond to
load changes above that frequency. The means the effective
output impedance of the IC at frequencies above 100 kHz is
determined only by the output capacitor(s).
In applications where the load is switching at high speed, the
output of the IC may need RF isolation from the load. It is
recommended that some inductance be placed between the
output capacitor and the load, and good RF bypass capacitors be placed directly across the load.
PCB layout is also critical in high noise environments, since
RFI/EMI is easily radiated directly into PC traces. Noisy
circuitry should be isolated from "clean" circuits where possible, and grounded through a separate path. At MHz frequencies, ground planes begin to look inductive and RFI/
EMI can cause ground bounce across the ground plane.
In multi-layer PCB applications, care should be taken in
layout so that noisy power and ground planes do not radiate
directly into adjacent layers which carry analog power and
ground.
OUTPUT NOISE
Noise is specified in two waysSpot Noise or Output noise density is the RMS sum of all
noise sources, measured at the regulator output, at a specific frequency (measured with a 1Hz bandwidth). This type
of noise is usually plotted on a curve as a function of frequency.
Total output Noise or Broad-band noise is the RMS sum
of spot noise over a specified bandwidth, usually several
decades of frequencies.
Attention should be paid to the units of measurement. Spot
noise is measured in units µV/√Hz or nV/√Hz and total output
noise is measured in µV(rms).
The primary source of noise in low-dropout regulators is the
internal reference. In CMOS regulators, noise has a low
frequency component and a high frequency component,
which depend strongly on the silicon area and quiescent
current. Noise can be reduced in two ways: by increasing the
transistor area or by increasing the current drawn by the
internal reference. Increasing the area will decrease the
chance of fitting the die into a smaller package. Increasing
PCB LAYOUT
Good PC layout practices must be used or instability can be
induced because of ground loops and voltage drops. The
input and output capacitors must be directly connected to the
input, output, and ground pins of the LP387X using traces
which do not have other currents flowing in them (Kelvin
connect).
The best way to do this is to lay out CIN and COUT near the
device with short traces to the VIN, VOUT, and ground pins.
The regulator ground pin should be connected to the external circuit ground so that the regulator and its capacitors
have a "single point ground".
It should be noted that stability problems have been seen in
applications where "vias" to an internal ground plane were
used at the ground points of the IC and the input and output
capacitors. This was caused by varying ground potentials at
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The maximum allowable value for junction to ambient Thermal Resistance, θJA, can be calculated using the formula:
θJA = TRmax / PD
The LP3876-ADJ is available in TO-220 and TO-263 packages. The thermal resistance depends on amount of copper
area or heat sink, and on air flow. If the maximum allowable
value of θJA calculated above is ≥ 60 ˚C/W for TO-220
package and ≥ 60 ˚C/W for TO-263 package no heatsink is
needed since the package can dissipate enough heat to
satisfy these requirements. If the value for allowable θJA falls
below these limits, a heat sink is required.
(Continued)
the current drawn by the internal reference increases the
total supply current (ground pin current). Using an optimized
trade-off of ground pin current and die size, LP387X
achieves low noise performance and low quiescent current
operation.
The total output noise specification for LP387X is presented
in the Electrical Characteristics table. The Output noise density at different frequencies is represented by a curve under
typical performance characteristics.
SHORT-CIRCUIT PROTECTION
The LP3876-ADJ is short circuit protected and in the event of
a peak over-current condition, the short-circuit control loop
will rapidly drive the output PMOS pass element off. Once
the power pass element shuts down, the control loop will
rapidly cycle the output on and off until the average power
dissipation causes the thermal shutdown circuit to respond
to servo the on/off cycling to a lower frequency. Please refer
to the section on thermal information for power dissipation
calculations.
HEATSINKING TO-220 PACKAGE
The thermal resistance of a TO220 package can be reduced
by attaching it to a heat sink or a copper plane on a PC
board. If a copper plane is to be used, the values of θJA will
be same as shown in next section for TO263 package.
The heatsink to be used in the application should have a
heatsink to ambient thermal resistance,
θHA≤ θJA − θCH − θJC.
In this equation, θCH is the thermal resistance from the case
to the surface of the heat sink and θJC is the thermal resistance from the junction to the surface of the case. θJC is
about 3˚C/W for a TO220 package. The value for θCH depends on method of attachment, insulator, etc. θCH varies
between 1.5˚C/W to 2.5˚C/W. If the exact value is unknown,
2˚C/W can be assumed.
SHUTDOWN OPERATION
A CMOS Logic level signal at the shutdown ( SD) pin will
turn-off the regulator. Pin SD must be actively terminated
through a 10kΩ pull-up resistor for a proper operation. If this
pin is driven from a source that actively pulls high and low
(such as a CMOS rail to rail comparator), the pull-up resistor
is not required. This pin must be tied to Vin if not used.
HEATSINKING TO-263 PACKAGE
The TO-263 package uses the copper plane on the PCB as
a heatsink. The tab of these packages are soldered to the
copper plane for heat sinking. Figure 1 shows a curve for the
θJA of TO-263 package for different copper area sizes, using
a typical PCB with 1 ounce copper and no solder mask over
the copper area for heat sinking.
DROPOUT VOLTAGE
The dropout voltage of a regulator is defined as the minimum
input-to-output differential required to stay within 2% of the
nominal output voltage. For CMOS LDOs, the dropout voltage is the product of the load current and the Rds(on) of the
internal MOSFET.
REVERSE CURRENT PATH
The internal MOSFET in LP3876-ADJ has an inherent parasitic diode. During normal operation, the input voltage is
higher than the output voltage and the parasitic diode is
reverse biased. However, if the output is pulled above the
input in an application, then current flows from the output to
the input as the parasitic diode gets forward biased. The
output can be pulled above the input as long as the current
in the parasitic diode is limited to 200mA continuous and 1A
peak.
POWER DISSIPATION/HEATSINKING
The LP3876-ADJ can deliver a continuous current of 3A over
the full operating temperature range. A heatsink may be
required depending on the maximum power dissipation and
maximum ambient temperature of the application. Under all
possible conditions, the junction temperature must be within
the range specified under operating conditions. The total
power dissipation of the device is given by:
PD = (VIN−VOUT)IOUT+ (VIN)IGND
where IGND is the operating ground current of the device
(specified under Electrical Characteristics).
The maximum allowable temperature rise (TRmax) depends
on the maximum ambient temperature (TAmax) of the application, and the maximum allowable junction temperature
(TJmax):
TRmax = TJmax− TAmax
20074432
FIGURE 1. θJA vs Copper (1 Ounce) Area for TO-263
package
As shown in the figure, increasing the copper area beyond 1
square inch produces very little improvement. The minimum
value for θJA for the TO-263 package mounted to a PCB is
32˚C/W.
Figure 2 shows the maximum allowable power dissipation
for TO-263 packages for different ambient temperatures,
assuming θJA is 35˚C/W and the maximum junction temperature is 125˚C.
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LP3876-ADJ
Application Hints
LP3876-ADJ
Application Hints
(Continued)
20074433
FIGURE 2. Maximum power dissipation vs ambient
temperature for TO-263 package
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LP3876-ADJ
Physical Dimensions
inches (millimeters)
unless otherwise noted
TO220 5-lead, Molded, Stagger Bend Package (TO220-5)
NS Package Number T05D
For Order Numbers, refer to the “Ordering Information” section of this document.
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LP3876-ADJ 3A Fast Ultra Low Dropout Linear Regulator
Physical Dimensions
inches (millimeters) unless otherwise noted (Continued)
TO263 5-Lead, Molded, Surface Mount Package (TO263-5)
NS Package Number TS5B
For Order Numbers, refer to the “Ordering Information” section of this document.
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Japan Customer Support Center
Fax: 81-3-5639-7507
Email: [email protected]
Tel: 81-3-5639-7560
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
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