LIGITEK LHY2643-1-PF Super bright round type led lamp Datasheet

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
SUPER BRIGHT ROUND TYPE LED LAMPS
LHY2643-1-PF
DATA SHEET
DOC. NO :
QW0905- LHY2643-1-PF
REV.
:
A
DATE
:
25 - Apr. - 2005
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 1/5
PART NO. LHY2643-1-PF
Package Dimensions
2.9
3.3
3.1
4.3
1.5MAX
25.0MIN
□0.5
TYP
1.0MIN
2.54TYP
Note : 1.All dimension are in millimeter tolerance is ± 0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
Directivity Radiation
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 2/5
PART NO. LHY2643-1-PF
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Symbol
Parameter
UNIT
HY
Forward Current
IF
30
mA
Peak Forward Current
Duty 1/10@10KHz
IFP
60
mA
Power Dissipation
PD
75
mW
Reverse Current @5V
Ir
10
μA
Electrostatic Discharge
ESD
2000
V
Operating Temperature
Topr
-40 ~ +85
℃
Storage Temperature
Tstg
-40 ~ +100
℃
Soldering Temperature
Tsol
Max 260 ℃ for 5 sec Max
(2mm from body)
Typical Electrical & Optical Characteristics (Ta=25 ℃)
PART NO
COLOR
MATERIAL
Emitted
LHY2643-1-PF AlGaInP
Yellow
Forward
Dominant Spectral
voltage
wave
halfwidth
@
20mA(V)
length
△λ nm
λDnm
Lens
Water Clear
595
15
Luminous
intensity
@20mA(mcd)
Min. Max. Min.
Typ.
300
550
1.7
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
2.6
Viewing
angle
2θ1/2
(deg)
40
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page3/5
PART NO. LHY2643-1-PF
Typical Electro-Optical Characteristics Curve
HY CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1.0
0.1
2.5
2.0
1.5
1.0
0.5
0.0
1.5
1.0
2.0
2.5
3.0
1.0
10
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
1.2
3.0
Relative Intensity@20mA
Normalize @25 ℃
Forward Voltage@20mA
Normalize @25℃
1000
Forward Current(mA)
Forward Voltage(V)
1.1
1.0
0.9
0.8
-40
-20
0
20
40
60
80
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0.0
500
550
600
Wavelength (nm)
100
2.5
2.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
80
Ambient Temperature(℃)
Ambient Temperature( ℃)
Relative Intensity@20mA
100
650
100
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LHY2643-1-PF
Page 4/5
Recommended Soldering Conditions
1. Wave Solder
Soldering
Soldering Iron:30W Max
Temperature 300°C Max
Soldering Time:3 Seconds Max
Distance:2mm Min(From solder
joint to case)
Temp(°C)
245°C 5sec Max
245°
120°
Preheat
2°/sec
max
2°/sec
max
2°/sec
max
Time(sec)
120 Seconds Max
Dip Soldering
Preheat: 120° C Max
Preheat time: 120 seconds Max
Ramp-up:2°C/sec(max)
Ramp-Down:2°C/sec(max)
Solder Bath:245°C Max
Dipping Time:5 seconds Max
Distance:2mm Min(From solder
joint to case)
2. PB-Free Wave Solder
Soldering
Soldering Iron:30W Max
Temperature:350 °CMax
Soldering Time:3seconds Max
Distance:2mm Min(From solder
joint to case)
Temp(°C)
265°C 5sec Max
265°
120°
Preheat
2°/sec
max
2°/sec
max
2°/sec
max
Time(sec)
120 Seconds Max
Dip Soldering
Preheat: 120° C Max
Preheat time: 120seconds Max
Ramp-up:2°C/sec(max)
Ramp-Down:2°C/sec(max)
Solder Bath:265°C Max
Dipping Time:5 seconds Max
Distance:2mm Min(From solder
joint to case)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 5/5
PART NO. LHY2643-1-PF
Reliability Test:
Test Item
Test Condition
Description
Reference
Standard
Operating Life Test
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resisance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=105 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of
the device which is laid under ondition
of high temperature for hours.
MIL-STD-883:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃±5 ℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
High Temperature
High Humidity Test
1.Ta=65 ℃±5 ℃
2.RH=90 %~95%
3.t=240hrs ±2hrs
The purpose of this test is the resistance
of the device under tropical for hous.
1.Ta=105 ℃±5℃ &-40 ℃±5 ℃
(10min) (10min)
2.total 10 cycles
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solderability Test
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
This test intended to see soldering well
performed or not.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
Thermal Shock Test
JIS C 7021: B-12
MIL-STD-202:103B
JIS C 7021: B-11
Similar pages