MITSUBISHI RF MOSFET MODULE ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS RA30H2127M 210-270MHz 30W 12.5V MOBILE RADIO DESCRIPTION The RA30H2127M is a 30-watt RF MOSFET Amplifier Module for 12.5-volt mobile radios that operate in the 210- to 270-MHz range. The battery can be connected directly to the drain of the enhancement-mode MOSFET transistors. Without the gate voltage (V GG=0V), only a small leakage current flows into the drain and the RF input signal attenuates up to 60 dB. The output power and drain current increase as the gate voltage increases. With a gate voltage around 4V (minimum), output power and drain current increases substantially. The nominal output power becomes available at 4.5V (typical) and 5V (maximum). At VGG=5V, the typical gate current is 1 mA. This module is designed for non-linear FM modulation, but may also be used for linear modulation by setting the drain quiescent current with the gate voltage and controlling the output power with the input power. FEATURES • Enhancement-Mode MOSFET Transistors (IDD≅0 @ VDD=12.5V, VGG=0V) BLOCK DIAGRAM 2 3 1 4 5 1 RF Input (Pin) 2 Gate Voltage (VGG), Power Control 3 Drain Voltage (VDD), Battery 4 RF Output (Pout) 5 RF Ground (Case) • Pout>30W, ηT>40% @ VDD=12.5V, VGG=5V, Pin=50mW • Broadband Frequency Range: 210-270MHz • Low-Power Control Current IGG=1mA (typ) at VGG=5V • Module Size: 66 x 21 x 9.88 mm • Linear operation is possible by setting the quiescent drain current with the gate voltage and controlling the output power with the input power ORDERING INFORMATION: ORDER NUMBER RA30H2127M-E01 RA30H2127M-01 SUPPLY FORM Antistatic tray, 10 modules/tray (Japan - packed without desiccator) RA30H2127M MITSUBISHI ELECTRIC 1/9 23 Dec 2002 ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS MITSUBISHI RF POWER MODULE RA30H 2127M MAXIMUM RATINGS (Tcase=+25°C, unless otherwise specified) SYMBOL PARAMETER CONDITIONS RATING UNIT VDD Drain Voltage VGG<5V 17 V VGG Gate Voltage VDD<12.5V, Pin=0mW 6 V Pin Input Power 100 mW Pout Output Power f=210-270MHz, ZG=ZL=50Ω 45 W Operation Case Temperature Range -30 to +110 °C Storage Temperature Range -40 to +110 °C Tcase(OP) Tstg The above parameters are independently guaranteed. ELECTRICAL CHARACTERISTICS (Tcase=+25°C, ZG=ZL=50Ω, unless otherwise specified) SYMBOL PARAMETER f CONDITIONS Frequency Range Pout Output Power ηT Total Efficiency nd MIN TYP 210 VDD=12.5V, MAX UNIT 270 MHz 30 W 40 % 2fo 2 Harmonic VGG=5V, -25 dBc ρ in Input VSWR Pin=50mW 3:1 — IGG Gate Current — Stability VDD=10.0-15.2V, Pin=25-70mW, Pout<40W (VGG control), Load VSWR=3:1 — Load VSWR Tolerance VDD=15.2V, Pin=50mW, Pout=30W (VGG control), Load VSWR=20:1 1 mA No parasitic oscillation — No degradation or destroy — All parameters, conditions, ratings, and limits are subject to change without notice. RA30H2127M MITSUBISHI ELECTRIC 2/9 23 Dec 2002 MITSUBISHI RF POWER MODULE ELECTROSTATIC SENSITIVE DEVICE RA30H 2127M OBSERVE HANDLING PRECAUTIONS TYPICAL PERFORMANCE (Tcase=+25°C, ZG=ZL=50Ω, unless otherwise specified) 2nd , 3 rd HARMONICS versus FREQUENCY OUTPUT POWER, TOTAL EFFICIENCY, and INPUT VSWR versus FREQUENCY 100 40 80 ηT 30 60 20 40 10 20 ρ in 0 0 200 210 220 230 240 250 260 270 280 FREQUENCY f(MHz) -40 -60 30 6 4 I DD f=210MHz, V DD=12.5V, V GG =5V 2 0 OUTPUT POWER Pout(dBm) POWER GAIN Gp(dB) 8 60 DRAIN CURRENT IDD(A) OUTPUT POWER Pout(dBm) POWER GAIN Gp(dB) 10 Gp 10 rd 3 : < -60dBc OUTPUT POWER, POWER GAIN and DRAIN CURRENT versus INPUT POWER 12 P out 20 -5 0 5 10 15 INPUT POWER Pin(dBm) 12 P out 50 10 Gp 40 8 30 6 ID D 20 4 f=240MHz, VDD=12.5V, VGG=5V 10 0 -10 nd -70 200 210 220 230 240 250 260 270 280 FREQUENCY f(MHz) 60 40 2 -50 OUTPUT POWER, POWER GAIN and DRAIN CURRENT versus INPUT POWER 50 VDD=12.5V VGG =5V Pin=50mW -30 2 0 20 IDD(A) P out DRAIN CURRENT 50 -20 HARMONICS (dBc) 120 V DD=12.5V V GG =5V P in=50mW TOTAL EFFICIENCY η T(%) INPUT VSWR ρin (-) OUTPUT POWER Pout(W) 60 0 -10 -5 0 5 10 15 20 INPUT POWER Pin(dBm) OUTPUT POWER, POWER GAIN and DRAIN CURRENT versus INPUT POWER 12 P out 50 10 Gp 40 8 30 6 ID D 20 4 f=270MHz, V DD=12.5V, V GG =5V 10 DRAIN CURRENT IDD(A) OUTPUT POWER P out(dBm) POWER GAIN Gp(dB) 60 2 0 0 -10 -5 0 5 10 15 20 INPUT POWER P in(dBm) 14 12 10 Pout 40 8 30 6 I DD 20 10 4 2 0 0 2 RA30H2127M 4 6 8 10 12 14 DRAIN VOLTAGE VDD(V) 16 18 16 f=240MHz, V DD=12.5V, V GG =5V 70 60 14 12 P out 50 40 30 10 8 6 I DD 20 4 10 2 0 0 2 4 6 8 10 12 14 DRAIN VOLTAGE VDD(V) MITSUBISHI ELECTRIC 3/9 DD(A) 60 50 90 80 DRAIN CURRENT I 70 OUTPUT POWER P out(W) 18 16 f=210MHz, V DD=12.5V, V GG =5V DD(A) 90 80 OUTPUT POWER and DRAIN CURRENT versus DRAIN VOLTAGE DRAIN CURRENT I OUTPUT POWER P out(W) OUTPUT POWER and DRAIN CURRENT versus DRAIN VOLTAGE 16 23 Dec 2002 MITSUBISHI RF POWER MODULE ELECTROSTATIC SENSITIVE DEVICE RA30H 2127M OBSERVE HANDLING PRECAUTIONS TYPICAL PERFORMANCE (Tcase=+25°C, ZG=ZL=50Ω, unless otherwise specified) 18 16 14 12 10 8 6 4 2 0 f=270MHz, VDD =12.5V, VGG=5V Pout IDD 2 4 6 8 10 12 14 DRAIN VOLTAGE V DD(V) 16 OUTPUT POWER and DRAIN CURRENT versus GATE VOLTAGE 50 10 P out 40 8 30 6 I DD 20 4 10 2 0 0 2 2.5 3 3.5 4 4.5 GATE VOLTAGE VGG(V) 60 5 OUTPUT POWER Pout(W) 12 f=210MHz, VDD =12.5V, VGG =5V DRAIN CURRENT IDD(A) OUTPUT POWER Pout(W) 60 OUTPUT POWER and DRAIN CURRENT versus GATE VOLTAGE 12 f=240MHz, V DD=12.5V, V GG=5V 50 40 10 8 P out 30 6 I DD 20 4 10 2 0 0 2 2.5 3 3.5 4 4.5 GATE VOLTAGE VGG (V) DRAIN CURRENT IDD(A) 90 80 70 60 50 40 30 20 10 0 DRAIN CURRENT IDD(A) OUTPUT POWER Pout(W) OUTPUT POWER and DRAIN CURRENT versus DRAIN VOLTAGE 5 OUTPUT POWER and DRAIN CURRENT versus GATE VOLTAGE 12 f=270MHz, VDD =12.5V, VGG =5V 50 40 10 Pout 8 30 6 I DD 20 4 10 2 0 0 2 RA30H2127M 2.5 3 3.5 4 4.5 GATE VOLTAGE VGG(V) DRAIN CURRENT IDD(A) OUTPUT POWER Pout(W) 60 5 MITSUBISHI ELECTRIC 4/9 23 Dec 2002 MITSUBISHI RF POWER MODULE ELECTROSTATIC SENSITIVE DEVICE RA30H 2127M OBSERVE HANDLING PRECAUTIONS OUTLINE DRAWING (mm) 66.0 ±0.5 7.25 ±0.8 51.5 ±0.5 3 2.0 ±0.5 2 4 4.0 ±0.3 9.5 ±0.5 5 1 14.0 ±1 2-R2 ±0.5 17.0 ±0.5 60.0 ±0.5 21.0 ±0.5 3.0 ±0.3 Ø0.45 ±0.15 12.0 ±1 16.5 ±1 43.5 ±1 (50.4) (9.88) 2.3 ±0.3 7.5 ±0.5 0.09 ±0.02 3.1 +0.6/-0.4 55.5 ±1 1 RF Input (P in) 2 Gate Voltage (V GG) 3 Drain Voltage (V DD) 4 RF Output (P out) 5 RF Ground (Case) RA30H2127M MITSUBISHI ELECTRIC 5/9 23 Dec 2002 MITSUBISHI RF POWER MODULE ELECTROSTATIC SENSITIVE DEVICE RA30H 2127M OBSERVE HANDLING PRECAUTIONS TEST BLOCK DIAGRAM Power Meter DUT 1 Signal Generator Attenuator Preamplifier Attenuator Directional Coupler 2 3 ZG=50Ω C1 Spectrum Analyzer 4 ZL=50Ω Directional Coupler Attenuator Power Meter C2 + DC Power Supply V GG C1, C2: 4700pF, 22uF in parallel 5 + DC Power Supply V DD 1 RF Input (P in) 2 Gate Voltage (V GG) 3 Drain Voltage (V DD) 4 RF Output (P out) 5 RF Ground (Case) EQUIVALENT CIRCUIT 3 2 1 4 5 RA30H2127M MITSUBISHI ELECTRIC 6/9 23 Dec 2002 MITSUBISHI RF POWER MODULE ELECTROSTATIC SENSITIVE DEVICE RA30H 2127M OBSERVE HANDLING PRECAUTIONS PRECAUTIONS, RECOMMENDATIONS, and APPLICATION INFORMATION: Construction: This module consists of an alumina substrate soldered onto a copper flange. For mechanical protection, a plastic cap is attached with silicone. The MOSFET transistor chips are die bonded onto metal, wire bonded to the substrate, and coated with resin. Lines on the substrate (eventually inductors), chip capacitors, and resistors form the bias and matching circuits. Wire leads soldered onto the alumina substrate provide the DC and RF connection. Following conditions must be avoided: a) Bending forces on the alumina substrate (for example, by driving screws or from fast thermal changes) b) Mechanical stress on the wire leads (for example, by first soldering then driving screws or by thermal expansion) c) Defluxing solvents reacting with the resin coating on the MOSFET chips (for example, Trichlorethylene) d) Frequent on/off switching that causes thermal expansion of the resin e) ESD, surge, overvoltage in combination with load VSWR, and oscillation ESD: This MOSFET module is sensitive to ESD voltages down to 1000V. Appropriate ESD precautions are required. Mounting: Heat sink flatness must be less than 50 µm (a heat sink that is not flat or particles between module and heat sink may cause the ceramic substrate in the module to crack by bending forces, either immediately when driving screws or later when thermal expansion forces are added). A thermal compound between module and heat sink is recommended for low thermal contact resistance and to reduce the bending stress on the ceramic substrate caused by the temperature difference to the heat sink. The module must first be screwed to the heat sink, then the leads can be soldered to the printed circuit board. M3 screws are recommended with a tightening torque of 0.4 to 0.6 Nm. Soldering and Defluxing: This module is designed for manual soldering. The leads must be soldered after the module is screwed onto the heat sink. The soldering temperature must be lower than 260°C for a maximum of 10 seconds, or lower than 350°C for a maximum of three seconds. Ethyl Alcohol is recommend for removing flux. Trichlorethylene solvents must not be used (they may cause bubbles in the coating of the transistor chips which can lift off the bond wires). Thermal Design of the Heat Sink: At Pout=30W, VDD=12.5V and Pin=50mW each stage transistor operating conditions are: 1st Pin (W) 0.05 Pout (W) 5.0 Rth(ch-case) (°C/W) 4.5 IDD @ ηT =40% (A) 0.95 2nd 5.0 30.0 1.2 5.0 Stage VDD (V) 12.5 The channel temperatures of each stage transistor Tch = Tcase + (V DD x IDD - Pout + Pin) x Rth(ch-case) are: Tch1 = Tcase + (12.5V x 0.95A – 5.0W + 0.05W) x 4.5°C/W = Tcase + 31.2 °C Tch2 = Tcase + (12.5V x 5.0A - 30.0W + 5.0W) x 1.2°C/W = Tcase + 45.0 °C For long-term reliability, it is best to keep the module case temperature (Tcase) below 90°C. For an ambient temperature Tair=60°C and P out=30W, the required thermal resistance Rth (case-air) = ( Tcase - Tair) / ( (P out / ηT ) - Pout + Pin ) of the heat sink, including the contact resistance, is: Rth(case-air) = (90°C - 60°C) / (30W/40% – 30W + 0.05W) = 0.67 °C/W When mounting the module with the thermal resistance of 0.67 °C/W, the channel temperature of each stage transistor is: Tch1 = Tair + 31.2 °C Tch2 = Tair + 45.0 °C The 175°C maximum rating for the channel temperature ensures application under derated conditions. RA30H2127M MITSUBISHI ELECTRIC 7/9 23 Dec 2002 ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS MITSUBISHI RF POWER MODULE RA30H 2127M Output Power Control: Depending on linearity, the following two methods are recommended to control the output power: a) Non-linear FM modulation: By the gate voltage (V GG). When the gate voltage is close to zero, the RF input signal is attenuated up to 60 dB and only a small leakage current flows from the battery into the drain. Around VGG=4V, the output power and drain current increases substantially. Around VGG=4.5V (typical) to VGG=5V (maximum), the nominal output power becomes available. b) Linear AM modulation: By RF input power Pin. The gate voltage is used to set the drain’s quiescent current for the required linearity. Oscillation: To test RF characteristics, this module is put on a fixture with two bias decoupling capacitors each on gate and drain, a 4.700 pF chip capacitor, located close to the module, and a 22 µF (or more) electrolytic capacitor. When an amplifier circuit around this module shows oscillation, the following may be checked: a) Do the bias decoupling capacitors have a low inductance pass to the case of the module? b) Is the load impedance ZL=50Ω? c) Is the source impedance ZG=50Ω? Frequent on/off switching: In base stations, frequent on/off switching can cause thermal expansion of the resin that coats the transistor chips and can result in reduced or no output power. The bond wires in the resin will break after long-term thermally induced mechanical stress. Quality: Mitsubishi Electric is not liable for failures resulting from base station operation time or operating conditions exceeding those of mobile radios. This module technology results from more than 20 years of experience, field proven in tens of millions of mobile radios. Currently, most returned modules show failures such as ESD, substrate crack, and transistor burnout, which are caused by improper handling or exceeding recommended operating conditions. Few degradation failures are found. Keep safety first in your circuit designs! Mitsubishi Electric Corporation puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of non-flammable material, or (iii) prevention against any malfunction or mishap. RA30H2127M MITSUBISHI ELECTRIC 8/9 23 Dec 2002