Panasonic EXB1HV472JV Chip resistor array Datasheet

Chip Resistor Array
Chip Resistor Array
Type: EXB1:0201x2
EXB2:0402x2, 0402x4, 0402x8
EXB3:0603x2, 0603x4
EXBV:0603x2, 0603x4
EXBS:0805x4
■ Features
● High density
2 resistors in 0.8 mm × 0.6 mm size (14V, Convex Terminal)
2 resistors in 1.0 mm × 1.0 mm size (24V, Convex Terminal)
2 resistors in 1.6 mm × 1.6 mm size (34V, Convex Terminal)
2 resistors in 1.6 mm × 1.6 mm size (V4V, Concave Terminal)
4 resistors in 2.0 mm × 1.0 mm size (28V, Convex Terminal)
4 resistors in 3.2 mm × 1.6 mm size (38V, Convex Terminal)
4 resistors in 3.2 mm × 1.6 mm size (V8V, Concave Terminal)
4 resistors in 5.08 mm × 2.2 mm size (S8V, Concave Terminal)
8 resistors in 3.8 mm × 1.6 mm size (2HV, Convex Terminal)
● Improvement of placement efficiency
Placement efficiency of Chip Resistor Array is two or four or eight times of the flat type chip resistor
● Approved under the ISO 9001 system
■ Explanation of Part Numbers
E
X
B
V
■ Construction (Example : EXBV8V)
8
V
4
7
2
J
V
■ Schematics
● Isolated type
14V, 24V, 34V, V4V
28V, 38V, V8V, S8V
2 resistors
4 resistors
2HV
8 resistors
Chip Resistor Array
■ Dimensions in mm (not to scale)
V8V, S8V
V4V
28V
38V
14V, 34V
Surface Mount
Resistors
24V
2HV
Type
(inches)
L
W
T
EXB14V
(0201×2)
Dimensions (mm)
B
fD
0.80
0.60
0.35
0.35
EXB24V
(0402×2)
1.00±0.05
1.00±0.05
0.35±0.05
0.33±0.05
0.15±0.10
EXB28V
(0402×4)
2.00±0.10
1.00±0.10
0.35±0.10
0.20±0.10
EXBV4V
(0603×2)
1.60+0.20
Ð0.10
1.60+0.20
Ð0.10
0.60±0.10
EXB34V
(0603×2)
1.60±0.20
1.60±0.15
EXBV8V
(0603×4)
3.20+0.20
Ð0.10
EXB38V
(0603×4)
P
E
G
±0.10
0.50
Ñ
0.15±0.10
0.34±0.05
0.65±0.10
Ñ
0.25±0.05
0.20±0.10
Ñ
0.50±0.10
Ñ
0.25±0.10
0.60±0.10
0.30±0.15
(0.3)
0.80±0.10
0.45±0.10
0.40±0.15
0.50±0.10
0.45±0.15
(0.30±0.20)
Ñ
0.80±0.15
Ñ
0.30±0.20
1.60+0.20
Ð0.10
0.60±0.10
0.60±0.10
0.30±0.15
(0.3)
0.80±0.10
0.45±0.10
0.45±0.15
3.20±0.20
1.60±0.15
0.50±0.10
0.45±0.15
(0.30±0.20)
Ñ
0.80±0.15
Ñ
0.35±0.20
EXBS8V
(0805×4)
5.08+0.20
Ð0.10
2.20+0.20
Ð0.10
0.70±0.20
0.80±0.15
0.50±0.15
(0.5)
1.27±0.20
0.70±0.20
0.55±0.15
EXB2HV
(0402×8)
3.80±0.10
1.60±0.10
0.45±0.10
0.30±0.10
(0.30±0.10)
Ñ
0.50±0.10
Ñ
0.30±0.10
±0.10
±0.10
A
±0.10
±0.10
(0.15
±0.10
)
Ñ
( ) Reference
Chip Resistor Array
■ Ratings
10 Ω to 1 MΩ: E24 series
Resistance Range
ResistanceTolerance
14V,2HV,24V,28V,38V,34V J: ±5 %
V4V,V8V,S8V
G: ±2 %, J: ±5 %
14V,24V,V4V,34V
4 terminal
Number of Terminal 28V,38V,V8V,S8V
8 terminal
16 terminal
2HV
14V,24V,V4V,34V 2 resistors
Number of Resistors 28V,38V,V8V,S8V 4 resistors
Power Rating at 70 ¡C
Item
Specifications
2HV
8 resistors
14V,28V
0.031 W/element
24V,V4V,34V,V8V,38V 0.063 W/element
0.1 W/element
0.063 W/element
(0.25 W/package)
S8V
2HV
Specifications
14V
Limiting Element Voltage(1)
2HV
Max. Rated Continuous
24V,28V,38V,34V,V4V,V8V
Working Voltage
S8V
14V
2HV
Max. Over-load Voltage(2)
24V,28V,38V,34V,V4V,V8V
S8V
12.5 V
25 V
50 V
100 V
25 V
50 V
100 V
200 V
T.C.R.
±200 ×10 Ð6/ûC(ppm/ûC)
Category Temperature Range
(Operating Temperature Range)
Ð55 ûC to 125 ûC
(
Jumper Array
Item
)
(A) R000
Rated Current
(A) R000
Max. Overload Current
14V,2HV,24V,28V,38V,34V,V4V,V8V
S8V
14V,2HV,24V,28V,38V,34V,V4V,V8V
S8V
1A
2A
2A
4A
(1) Rated Continuous Working Voltage (RCWV) shall be determined from RCWV= √Power Rating × Resistance Value, or Limiting Element Voltage (max.
RCWV) listed above, whichever less.
(2) Overload (Short-time Overload) Test Voltage (SOTV) shall be determined from SOTV=2.5 × Power Rating or max. Overload (Voltage) listed above whichever less.
Power Derating Curve
For resistors operated in ambient temperature above
70 ¡C, power rating shall be derated in accordance
with the right figure.
■ Packaging Methods
● Standard Quantity
Type
(inches)
EXB14V
(0201×2)
EXB24V, 28V
(0402×2, 0402×4)
EXBV4V, V8V
(0603×2, 0603×4)
EXB34V, 38V
(0603×2, 0603×4)
EXBS8V
(0805×4)
EXB2HV
(0402×8)
Thickness
(mm)
Weight/1000 pcs.
(g)
Punched (Paper) Taping
Embossed Taping
10000 pcs./reel
Ñ
10000 pcs./reel
Ñ
0.35
14V: 0.5
0.35
24V: 1.2
28V:
0.6
V4V: 5
V8V: 10
5000 pcs./reel
Ñ
0.5
34V: 3.5
38V:
5000 pcs./reel
Ñ
0.7
S8V: 30
Ñ
2500 pcs./reel
0.45
2HV: 9
5000 pcs./reel
Ñ
2
7
Chip Resistor Array
● Punched (Paper) Taping Reel
fA
0
180.0Ð3.0
Type
14V, 2HV
Dimensions
24V, 28V
(mm)
V4V, 34V
V8V, 38V
fB
fC
60 min.
13.0±1.0
W
Type
14V
24V
28V
Dimensions
V4V
(mm)
34V
V8V
38V
2HV
11.4±2.0
Dimensions Type
(mm)
S8V
fA
0
180.0 Ð3.0
W
13.0±1.0
W
F
E
1.95 ±0.15
1.95 ±0.20
8.00 ±0.20
3.50 ±0.05
1.75 ±0.10
2.00 ±0.15
3.60 ±0.20
1.90 ±0.15
4.10 ±0.15
P0
fD0
T
1.20 ±0.05
P2
0.45 ±0.05
2.00 ±0.05
4.00 ±0.10
1.50 +0.10
0
0.84 ±0.05
0.64 ±0.05
0.84 ±0.05
0.64 ±0.05
● Embossed Taping
● Embossed Taping Reel
Dimensions Type
(mm)
S8V
B
0.90 ±0.05
1.20 ±0.05
2.20±0.10
Type
P1
14V
24V 2.00 ±0.10
28V
Dimensions
V4V
(mm)
34V
V8V 4.00 ±0.10
38V
2HV
T
9.0±1.0
A
0.70 ±0.05
fB
60 min.
A
B
W
F
E
P0
Dimensions Type
S8V 2.80 ±0.20 5.70±0.20 12.00±0.30 5.50 ±0.05 1.75 ±0.10 4.00±0.10
(mm)
fC
13.0±1.0
P1
Dimensions Type
(mm)
S8V 4.00±0.10
T
15.4±2.0
P2
2.00 ±0.05
fD0
t2
fD1
1.50 +0.10
1.6 max. 1.50 +0.10
0
0
■ Land pattern design
Recommendable land pattern design for Network chip is as shown below figure.
Type
(Not to scale)
Unit (mm)
Dimensions
a
b
c
p
f
14V
0.3
0.3
0.3
0.50
0.9
24V
0.5
0.65
1.4 to 1.5
28V
0.4
0.50
1.4
0.35 to 0.40 0.35 to 0.40
0.525
0.25
V4V,V8V 0.7 to 0.9 0.4 to 0.45 0.4 to 0.45
0.80
2 to 2.4
34V,38V 0.7 to 0.9
0.4 to 0.5
0.80
2.2 to 2.6
0.5 to 0.75 0.5 to 0.75
1.27
3.2 to 3.8
0.50
2
S8V
1 to 1.2
2HV
1
0.4 to 0.5
0.425
0.25
Surface Mount
Resistors
Type
14V, 2HV
Dimensions
24V, 28V
(mm)
V4V, 34V
V8V, 38V
● Punched (Paper) Taping
Chip Resistor Array
Cautions for Safety
1. Component Placement
A Take measure against mechanical stress during and after mounting so as not to damage the termination
and protective coating.
B Misplacement of components on the land pattern may cause solder bridge problem.
2. Soldering
Precaution and recommondations are described
below.
(a)Soldering iron
Keep the followings:
A Soldering iron tip shall not touch the protective
coating of the part.
B Solder as quick as possible (within 3 seconds)
when the temperature of the soldering iron tip is
over 280 ¡C.
(b)Reflow soldering
Recommendable reflow soldering is shown right.
3. Cleaning
Recommendable cleaning method is shown below.
Solvents
Isopropyl
Alcohol
Cleaning condition
Ultrasonic wave washing
1 minute maxium
5 minutes
Power: 20 W/L
maximum
Frequency: 10 kHz to 100 kHz
Dipping
[
]
4. If transient load (heavy load in a short time) like pulse is expected to be applied, carry out evaluation and
confirmation test with the resistors actually mounted on your own board.
When the load of more than rated power is applied under the load condition at steady state, it may impair
performance and/or reliability of resistor. Never exceed the rated power.
5. Chlorine type or other high-activity flux is not recommeded as the residue may affect performance or reliability
of resistors.
6. When soldering with soldering iron, never touch the body of the chip resistor with a tip of the soldering iron.
When using a soldering iron with a tip at high temperature, solder for a time as short as possible (three
seconds or less up to 350 ¡C).
7. Avoid physical shock to the resistor and nipping of the resistor with hard tool (a pair of pliers or tweezers) as
it may damage protective film or the body of resistor and may affect resistorÕs performance.
8. Do not use the product in dewy atmospheres.
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