T PL IA N M CO *R oH S Features Applications n RoHS compliant* n RS-232, RS-422 & RS-423 data lines n Protects one line n Portable electronics n ESD protection 30 kV max. n Wireless bus protection LE AD FR EE n Control & monitoring systems CDSOT23-T03LC~T36LC - Low Capacitance TVS Diode Array Series General Information Ro VE LEA HS RS D CO ION FRE M SA E PL R IA E NT * The markets of portable communications, computing and video equipment are challenging the semiconductor industry to develop increasingly smaller electronic components. 2 1 Bourns offers Transient Voltage Suppressor Array Diodes for surge and ESD protection applications, in compact chip package SOT23 size format. The Transient Voltage Supressor Array series offers a choice of voltage types ranging from 3 V to 36 V. Bourns® Chip Diodes conform to JEDEC standards, are easy to handle on standard pick and place equipment and their flat configuration minimizes roll away. 3 The Bourns® device will meet IEC 61000-4-2 (ESD), IEC 61000-4-4 (EFT) and IEC 61000-4-5 (Surge) requirements. Thermal Characteristics (@ TA = 25 °C Unless Otherwise Noted) Parameter Operating Temperature Storage Temperature Symbol Value Unit TJ -55 to +150 °C -55 to +150 °C TSTG Electrical Characteristics (@ TA = 25 °C Unless Otherwise Noted) Parameter Breakdown Voltage @ 1 mA Working Peak Voltage Maximum Clamping Voltage VC @ IP1 Maximum Clamping Voltage @ 8/20 µs VC @ IPP1 Maximum Leakage Current @ VWM Typical Capacitance Bidirectional @ 0 V, 1 MHz Symbol T03LC T05LC T08LC T12LC T15LC T24LC T36LC Unit VBR 4.0 6.0 8.5 13.3 16.7 26.7 40.0 V VWM 3.3 5.0 8.0 12.0 15.0 24.0 36.0 V VF 8.0 9.8 13.4 19.0 24.0 43.0 51.0 V VF 10.9 V @ 43 A 13.5 V @ 42 A 16.9 V @ 34 A 25.9 V @ 27 A 30.0 V @ 17 A 49.0 V @ 12 A 76.8 V @9A V ID 125 20 10 2 1 1 1 µA Cj(SD) ESD Protection (per IEC 61000-4-2) Contact - Min. Contact - Max. Air - Min. Air - Max. ESD Peak Pulse Power (tp = 8/20 µs)2 PPP 5 ±8 ±30 ±15 ±30 500 Notes: 1. See Pulse Wave Form. 2. See Peak Pulse Power vs. Pulse Time. 3. Positive Potential is applied from Pin 1 to Pin 2 with Pin 2 as ground. 4. Do not test or surge from Pin 2 to Pin 1. *RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. pF kV W CDSOT23-T03LC~T36LC - Low Capacitance TVS Diode Array Series Product Dimensions Recommended Footprint This is a molded JEDEC SOT23-6 package with lead free 100 % Sn plating on the lead frame. It weighs approximately 0.6 g and has a flammability rating of UL 94V-0. A B A DIMENSIONS = MILLIMETERS (INCHES) B C 3 C 1 SEE DETAIL D A 2 E F E D DETAIL A GAUGE PLANE SEATING PLANE DIMENSIONS = MILLIMETERS (INCHES) L H G I J Dimensions 0 ° TO 8 ° K Dimensions A B 2.80 - 3.00 (0.110 - 0.118) 0.95 BSC (0.037) C 1.20 - 1.40 (0.047 - 0.055) D 2.10 - 2.49 (0.083 - 0.098) E 1.90 BSC (0.075) F 0.30 - 0.50 (0.012 - 0.019) G 0.89 - 1.17 (0.035 - 0.046) H 0.05 - 0.015 (0.002 - 0.006) I 0.25 BSC (0.010) J 0.46 - 0.64 (0.018 - 0.025) K 0.40 - 0.58 (0.016 - 0.023) L 0.08 - 0.20 (0.003 - 0.008) A 0.95 (0.037) B 0.95 (0.037) C 2.00 (0.079) D 0.85 (0.033) E 0.85 (0.033) How to Order CD SOT23 - T 03 LC Common Code CD = Chip Diode Package SOT23 = SOT23 Package Model T = Transient Voltage Suppressor Working Peak Voltage 03 = 3 VRWM (Volts) Suffix LC = Low Capacitance Diode Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. CDSOT23-T03LC~T36LC - Low Capacitance TVS Diode Array Series Performance Graphs Peak Pulse Power vs. Pulse Time Pulse Waveform 120 IPP – Peak Pulse Current (% of IPP) PPP – Peak Pulse Power (W) 10,000 500 W, 8/20 µs Waveform 1,000 100 10 0.01 1 10 100 1,000 80 et 60 40 td = t|IPP/2 20 0 10,000 Test Waveform Parameters tt = 8 µs td = 20 µs tt 100 5 0 10 Block Diagram 15 20 25 30 t – Time (µs) td – Pulse Duration (µs) Power Derating Curve The device block diagram below includes the pin names and basic electrical connections. 1 % of Rated Power 2 100 Peak Pulse Power 8/20 µs 80 60 40 20 3 Average Power 0 0 25 Typical Part Marking CDSOT23-T03LC ..........................................................................03L CDSOT23-T05LC ..........................................................................05L CDSOT23-T08LC ..........................................................................08L 50 75 125 150 TL – Lead Temperature (°C) Pin Out 2 1 CDSOT23-T12LC ..........................................................................12L CDSOT23-T15LC ..........................................................................15L CDSOT23-T24LC ..........................................................................24L CDSOT23-T36LC ..........................................................................36L 100 3 Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. Pin Function 1 I/O 2 I/O 3 N.C. CDSOT23-T03LC~T36LC - Low Capacitance TVS Diode Array Series Packaging Information The surface mount product is packaged in a 12 mm x 8 mm tape and reel format per EIA-481 standard. P 0 P 1 Index Hole d E T 120 ° F D2 W B D1 P A Trailer C Device ....... ....... End ....... ....... ....... ....... 10 pitches (min.) D Leader ....... ....... 10 pitches (min.) W1 Start DIMENSIONS = MILLIMETERS (INCHES) Direction of Feed Item Symbol Carrier Width A Carrier Length B Carrier Depth C Sprocket Hole d Reel Outside Diameter D Reel Inner Diameter D1 Feed Hole Diameter D2 Sprocket Hole Position E Punch Hole Position F Punch Hole Pitch P Sprocket Hole Pitch P0 Embossment Center P1 Overall Tape Thickness T Tape Width W Reel Width W1 Quantity per Reel — SOT23 2.25 ± 0.10 (0.088 ± 0.004) 2.34 ± 0.10 (0.092 ± 0.004) 1.22 ± 0.10 (0.048 ± 0.004) 1.55 ± 0.05 (0.061 ± 0.002) 178 (7.008) 50.0 Min. (1.969) 13.0 ± 0.20 (0.512 ± 0.008) 1.75 ± 0.10 (0.069 ± 0.004) 3.50 ± 0.05 (0.138 ± 0.002) 4.00 ± 0.10 (0.157 ± 0.004) 4.00 ± 0.10 (0.157 ± 0.004) 2.00 ± 0.05 (0.079 ± 0.002) 0.20 ± 0.10 (0.008 ± 0.004) 8.00 ± 0.20 (0.315 ± 0.008) 14.4 Max. (0.567) 3,000 Asia-Pacific: Tel: +886-2 2562-4117 Email: [email protected] Europe: Tel: +36 88 520 390 Email: [email protected] The Americas: Tel: +1-951 781-5500 Email: [email protected] www.bourns.com REV. 01/17 Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications.