ON LV5693P Multi-power supply system ic for car audio system Datasheet

Ordering number : ENA1914A
LV5693P
Monolithic Linear IC
Multi-Power Supply System IC
for Car Audio Systems
http://onsemi.com
Overview
LV5693P is a multiple voltage regulator for car audio system, which allows reduction of quiescent current. This IC has
5 systems of voltage regulator pre-driver for P-FET which generates USB power and a high side switch for external
devices. The following protection circuits are integrated: over current protector, overvoltage protector and Thermal
Shut Down. This IC is suitable for use in car audio with USB port.
Features
• Five channel regulator and one channel P-FET pre-driver (for USB-power)
For VDD: VOUT is 5.7V, IOmax is 300mA
For DSP: VOUT is 3.3V, IOmax is 300mA
For CD: VOUT is 8.0V, IOmax is 1300mA
For illumination: VOUT is 8.4V, IOmax is 500mA
For audio systems: VOUT is 8.4V, IOmax is 500mA
For USB (controller), VOUT is flexible (configurable with external resistor), IOmax is 1000mA
• High side switch: Voltage difference between input and output is 0.5V, IOmax is 500mA
• Over current protector
• Overvoltage protector (Without VDD-OUT) Clamp voltage is 21V (typical)
• Thermal Shut down 175ºC (typical)
• Quiescent current 50μA (Typ. when only VDD is in operation)
(Warning) The protector functions only improve the IC’s tolerance and they do not guarantee the safety of the IC if used under the
conditions out of safety range or ratings. Use of the IC such as use under over current protection range or thermal shutdown state may
degrade the IC’s reliability and eventually damage the IC.
Semiconductor Components Industries, LLC, 2013
August, 2013
O2611 SY 20111018-S00002/D2210 SY 20101216-S00004 No.A1914-1/15
LV5693P
Specifications
Absolute Maximum Ratings at Ta = 25°C
Parameter
Conditions
Power supply voltage
VCC max
Power dissipation
Pd max
Conditions
Ratings
Ta ≤ 25°C
IC unit
At using Al heat sink
At infinity heat sink
Peak voltage
VCC peak
Unit
36
V
1.5
W
5.6
W
32.5
W
50
V
Regarding Bias wave, refer to below the pulse.
Junction temperature
Tj max
150
°C
Operating temperature
Topr
-40 to +85
°C
Storage temperature
Tstg
-55 to +150
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating
Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
Recommended Operating range at Ta = 25°C
Parameter
Conditions
Power supply voltage rating 1
VDD output ON, DSP output ON
Power supply voltage rating 2
ILM output ON
Power supply voltage rating 3
Audio output ON, CD output ON
Ratings
Unit
7.7 to 16
V
10.8 to 16
V
10 to 16
V
* VCC1 should be as follows: VCC1>VCC-0.7V
Electrical Characteristics at Ta = 25°C, VCC = VCC1=14.4V (*2)
Parameter
Symbol
Ratings
Conditions
min
Current drain
ICC
typ
VDD no load, CTRL1/2/3 = ⎡L/L/L⎦
Unit
max
μA
50
100
0.3
V
1.65
2.1
V
5.5
V
400
520
kΩ
CTRL1 Input
Low input voltage
VIL1
0
Middle input voltage
VIM1
1.1
High input voltage
VIH1
2.5
Input impedance
RIH1
280
CTRL2 Input
Low input voltage
VIL2
0.3
V
Middle1 input voltage
VIM12
0.8
0
1.06
1.4
V
Middle2 input voltage
VIM22
1.9
2.13
2.4
V
High input voltage
VIH2
2.9
3.2
5.5
V
Input impedance
RIH2
280
400
520
kΩ
CTRL3 input.
Low input voltage
VIL3
0
0.3
V
High input voltage
VIH3
2.5
5.5
V
Input impedance
RIH3
280
400
520
kΩ
5.7
5.985
VDD5.7V output
Output voltage
VO1
IO1 = 200mA
5.415
Output current
IO1
VO1 ≥ 5.35V
300
Line regulation
ΔVOLN1
8.2V < VCC1 < 16V, IO1 = 200mA
30
100
mV
Load regulation
ΔVOLD1
1mA < IO1 < 200mA
70
150
mV
Dropout voltage 1
VDROP1
IO1 = 400mA
0.5
1.2
V
Dropout voltage 2
VDROP1’
IO1 = 200mA
0.25
0.6
Ripple rejection
RREJ1
f = 120Hz, IO1 = 200mA
30
V
mA
40
V
dB
USB output: CTRL3 = ⎡H⎦ (When external power FET 2SJ650, it external resists 27kΩ, and 9.1kΩ is set)
USB output voltage
VO2
IO2 = 1000mA
4.75
USB output current
IO2
VO2 ≥ 4.75V
1000
Line regulation
ΔVOLN2
10V < VCC < 16V, IO2 = 1000mA
Load regulation
ΔVOLD2
Dropout voltage
VDROP2
Ripple rejection
RREJ1
f = 120Hz, IO2 = 1000mA
5
5.25
V
mA
50
90
mV
10mA < IO2 < 1000mA
100
150
mV
IO2 = 1000mA
1.0
1.5
40
50
V
dB
Continued on next page.
No.A1914-2/15
LV5693P
Continued from preceding page.
Parameter
Symbol
Ratings
Conditions
min
typ
Unit
max
AUDIO (8.4V) Output ; CTRL1 = ⎡M or H⎦
AUDIO output voltage 1
VO3
IO3 = 400mA
8.0
AUDIO output current
IO3
VO3 ≥ 8.0V
500
8.4
8.8
V
Line regulation
ΔVOLN3
10V < VCC < 16V, IO3 = 400mA
30
90
mV
Load regulation
ΔVOLD3
1mA < IO3 < 400mA
70
150
mV
Dropout voltage 1
VDROP3
IO3 = 400mA
0.4
0.8
V
0.2
0.4
mA
Dropout voltage 2
VDROP3’
IO3 = 200mA
Ripple rejection
RREJ3
f = 120Hz, IO3 = 400mA
40
50
IO4 = 400mA
8.0
8.4
8.8
V
dB
ILM (8.4V) Output ; CTRL2 = ⎡M1 or H⎦
ILM output voltage
VO4
ILM output current
IO4
Line regulation
ΔVOLN4
10.8V < VCC < 16V, IO4 = 400mA
30
90
mV
Load regulation
ΔVOLD4
1mA < IO4 < 400mA
70
150
mV
Dropout voltage 1
VDROP4
IO4 = 400mA
1.0
1.5
V
Dropout voltage 2
VDROP4’
IO4 = 200mA
0.7
1.05
Ripple rejection
RREJ4
f = 120Hz, IO4 = 400mA
Output voltage
VO5
IO5 = 500mA
Output current
IO5
VO5 ≤ VCC-1.0
500
V
mA
40
50
VCC-1.0
VCC-0.5
V
dB
AMP_HS-SW; CTRL2 = ⎡M2 or H⎦
V
350
mA
DSP(3.3V output); CTRL1 = ⎡M or H⎦
DSP output voltage
VO7
DSP output current
IO7
IO7 = 200mA
3.1
3.3
3.5
Line regulation
ΔVOLN7
10V < VCC < 16V, IO7 = 200mA
30
90
mV
Load regulation
ΔVOLD7
1mA < IO7 < 200mA
70
150
mV
Ripple rejection
RREJ7
f = 120Hz, IO7 = 200mA
CD output voltage
VO8
IO8 = 1000mA
CD output current
IO8
Line regulation
ΔVOLN8
10.5V < VCC < 16V, IO8 = 1000mA
Load regulation
ΔVOLD8
Dropout voltage
VDROP8
Ripple rejection
RREJ8
f = 120Hz, IO8 = 1000mA
300
V
mA
40
50
7.6
8.0
dB
CD(8.0V output); CTRL1 = ⎡H⎦
8.4
1300
V
mA
50
100
mV
10mA < IO8 < 1000mA
100
200
mV
IO8 = 1000mA
1.0
1.5
40
50
V
dB
*2: The entire specification has been defined based on the tests performed under the conditions where Tj and Ta (=25°C) are almost equal. There tests were
performed with pulse load to minimize the increase of junction temperature (Tj).
No.A1914-3/15
LV5693P
Package Dimensions
unit : mm (typ)
3395
• Allowable power dissipation derating curve
Pd max -- Ta
(20.0)
HEAT SPREADER
HEAT SINK
(15.8)
3.0
(11.0)
3.35
12.4
(9.05)
(14.55)
17.9
(9.6)
(R1.75)
1
0.4
15
(1.91)
1.27
Allowable power dissipation, Pd max -- W
8
21.6
Aluminum heat sink (50 × 50 × 1.5mm3) when using
6
5.6
5
4
3
2
Independent IC
1.5
1
0
2.54 2.54
0.7
Aluminum heat sink mounting conditions
tightening torque : 39N⋅cm, using silicone grease
7
0
20
40
60
80
100
120
140 150 160
Ambient temperature, Ta -- °C
SANYO : HZIP15J
• Waveform applied during surge test
50V
90%
10%
16V
5msec
100msec
CTRL Pin Output Truth Table
CTRL1
CD
DSP
AUDIO
CTRL3
USB
L
OFF
OFF
OFF
L
OFF
M
OFF
ON
ON
H
ON
H
ON
ON
ON
CTRL2
EXT
ILM
L
OFF
OFF
M1
OFF
ON
M2
ON
OFF
H
ON
ON
No.A1914-4/15
LV5693P
Example of CTRL2 application circuit
EXT
ILM
CTRL2
EXT
ILM
CTRL2
0V
0V
0V
0V
3.3V
1.06V
3.3V
0V
2.13V
3.3V
3.3V
3.20V
note) The control terminal is input 3.3V correspondence. Please set it by the input resistance at 5V input.
(Warning) Usage of CTRL2
When CTRL pin transits between L and M2, since it passes M1, ILM is turned on for a moment. Likewise, when CTRL
pin transits between H and M1, since it passes M2, ILM is turned off for a moment.
To avoid operation failure by the above factors, please refer to the following precautions.
• Do not connect parasitic capacitor to CTRL as much as possible.
• If use of capacitor for CTRL is required, keep the resistance value as low as possible.
• Make sure that the output load capacitor has enough marjin against the voltage fluctuation due to instantaneous
ON/OFF.
No.A1914-5/15
LV5693P
z Block Diagram
VCC
EXT
out
Over
Voltage
Protection
AMP_HS-SW(VCC-1V)
500mA
Start
up
Vref
+
ILM output (8.4V)
500mA
+
AUDIO output (8.4V)
CTRL1
500mA
OUTPUT
VCC
CTRL2
Control
Ilim
Recommendation
FET:2SJ650
USB output (5V)
+
CTRL3
1000mA
Thermal
+
CD output (8V)
1300mA
Shut Down
VCC1
GND
+
VCC
VDD output (5.7V)
300mA
+
DSP output (3.3)
300mA
No.A1914-6/15
LV5693P
Pin Function
Pin No.
1
Pin name
ILM
Description
ILM output pin
ON when CTRL2 = M1, H
Equivalent Circuit
VCC
15
8.4V/0.5A
1
2
GND
3
CD
2
GND
15
VCC
GND pin
CD output pin
ON when CTRL1 = H
8.0V/1.3A
3
2
4
CTRL1
GND
CTRL1 input pin
15
Three value input
VCC
4
2
5
AUDIO
AUDIO output pin
ON when CTRL1 = M, H
15
GND
VCC
8.4V/0.5A
5
2
GND
Continued on next page.
No.A1914-7/15
LV5693P
Continued from preceding page.
Pin No.
6
Pin name
CTRL2
Description
Equivalent Circuit
CTRL2 input pin
Four-value input
VCC
15
6
2
7
DSP
DSP output pin
ON when CTRL1 = M, H
GND
VCC
15
3.3V/0.3A
7
2
8
CTRL3
GND
CTRL3 input pin
Two-value input
VCC
15
8
2
9
FB
USB-FB pin
1.26V
GND
15
VCC
9
2
GND
Continued on next page.
No.A1914-8/15
LV5693P
Continued from preceding page.
Pin No.
10
Pin name
USBGT
Description
Equivalent Circuit
Pch-FET gate connect pin
VCC
15
12.0V
10
2
11
EXT
GND
EXT output pin
ON when CTRL2 = M2, H
VCC
15
VCC-0.5V/500mA
11
2
12
RSNS
GND
USB current detection resistance connection pin
14.3V
VCC
15
12
2
13
VDD
VDD output pin
5.7V/0.3A
GND
VCC
15
13
2
14
VCC1
VDD power supply pin
15
VCC
Power supply pin
GND
VCC 15
2
14 VCC1
GND
No.A1914-9/15
LV5693P
Timing Chart
21V
VCC
(15PIN)
21V
VCC1
(14PIN)
6.2V
VDD output
(13PIN)
H
CTRL1 input
(4PIN)
M
L
H
CTRL2 input
(6PIN)
M2
M1
L
CTRL3 input
(8PIN)
AUDIO output
(5PIN)
DSP output
(7PIN)
CD output
(3PIN)
ILM output
(1PIN)
EXT output
(11PIN)
USB output
(FET-OUT)
*Usage condition: Use under typical value.
No.A1914-10/15
LV5693P
CTRL2
C8 + C7
C6 + C5
C4 + C3
C2 + C1
ILM
CD
AUDIO
DSP
R2
C18 +
D2
C19
C17
VDD
C13
R1
15
C15 C20 +
C16 +
CTRL3
C12
14
13
C14
+
CTRL1
VCC1
RSNS
12
11
VCC
10
9
VDD
8
7
EXT
USBGT
CTRL3
CTRL2
6
5
FB
4
3
DSP
2
1
AUDIO
CD
ILM
GND
CTRL1
Recommended Operation Circuit
D1
D3
M1
C11 C10
+
EXT
USB
R3
VCC
M1: 2SJ650
Peripheral parts list
Name of part
C2, C4, C6, C8, C11, C16
C1, C3, C5, C7, C10, C15
Description
Recommended value
Remarks
Output stabilization capacitor
10μF or more*
Electrolytic capacitor
Output stabilization capacitor
0.22μF or more*
Ceramic capacitor
C12=1000pF
Ceramic capacitor
C12, C13
Capacity for phase amends
C18, C20
Power supply bypass capacitor
100μF or more
These capacitors must be placed near
C17, C19
Oscillation prevention capacitor
0.22μF or more
the VCC and GND pins.
EXT output stabilization capacitor
2.2μF or more
(C13=0pF: TBD)
C14
R1, R2
R1/R2=9.1kΩ/27kΩ for 5.0V
Resistor for ILM voltage adjustment
R3
Resistor for AUDIO voltage setting
M1
USB output Pch-FET
D1
A resistor with resistance accuracy as
low as less than ±1% must be used.
0.1Ω for Ipeak=3A
Panasonic ERJB1CFR10U(Reference)
2SJ650
Diode for prevention of backflow
D2, D3
Diode for internal element protection
SB1003M3
note)The circuit diagram and the values are only tentative which are subject to change.
* : Make sure that the capacitors of the output pins are 10μF or higher and ESR is 10Ω or lower in total and temperature characteristics and accuracy are taken
into consideration. Also the E-cap should have good high frequency characteristics.
• USB output voltage setting method
Formula for USB voltage calculation
1.26[V]
R1 × R2 + 1.26[V]
R2 (USB-1.26)
R1 =
1.26
VCC
RSNS
USBGT
USB =
12
10
USB
R2
1.26V
9
R1
The FB voltage is determined by the internal
band gap voltage of the IC (typ = 1.26V)
Please design so that the ratio of R1 and R2 may fill the
above-mentioned expression for the set USB voltage.
R2 (5.0-1.26)
2.968
R1 = 1.26
R2 27kΩ
R1 = 9.1kΩ 2.967
USB = 1.26V × 2.967 + 1.26V
4.998V
No.A1914-11/15
LV5693P
• Since this IC does not detect the heat generation of the external FET,
keep the temperature of the FET as low as possible so as not to exceed
the eatings.
• Recommended FET: 2SJ650.
(note)The above values were obtained under typcal conditions. The
values may fluctuate in manufacturing processes due to external
resistor and IC variation.
Output voltage
• How to set USB overcurrent limit value (OCP)
OCP of the USB works when the voltage of RSNS is under VCC-0.3V. The peak current value of OCP is calculated as
follws: Ipeak(A) =0.3/R3. (ex.) R3=0.1Ω → Ipeak=3A
Outout current
Ipeak
• Warning
The internal circuit of USBGT and RSNS consist of components that support 5V. Do not bias 7V or above between VCC
and these pins to prevent the IC from destruction. Do not use the device under overvoltaged condition(for example
shorting these terminals to low voltage node) even for short period of time .
In normal operating condition with recommended application, the device controls voltage of these terminals within 5V.
Caution for implementing LV5693P to a system board
The package of LV5693P is HZIP15J which has some metal exposures other than connection pins and heatsink as shown in the
diagram below. The electrical potentials of (2) and (3) are the same as those of pin 15 and pin 1, respectively. (2) (=pin 15) is the VCC
pin and (3) (=pin 1) is the ILM (regulator) output pin. When you implement the IC to the set board, make sure that the bolts and the
heatsink are out of touch from (2) and (3). If the metal exposures touch the bolts which has the same electrical potential with GND,
GND short occurs in ILM output and VCC. The exposures of (1) are connected to heatsink which has the same electrical potential with
substrate of the IC chip (GND). Therefore, (1) and GND electrical potential of the set board can connect each other.
• HZIP15J outline
Heat-sink
1 Same potential
2 15PIN
Same potential
1PIN
3 Same potential
Heat-sink
1 Same potential
Heat-sink side
1
Heat-sink
Same potential
:Metal exposure
Heat-sink side
:Metal exposure
<Top view of HZIP15J>
<Side view of HZIP15J>
No.A1914-12/15
LV5693P
• Frame diagram (LV5693P) *In the system power supply other than LV5693P, pin assignment may differ.
Metal exposure 1
Metal exposure 3
Metal exposure 2
Metal exposure 1
LV5693
Metal exposure 1
Metal exposure 1
1PIN
15PIN
No.A1914-13/15
LV5693P
HZIP15J Heat sink attachment
Heat sinks are used to lower the semiconductor device junction temperature by leading the head generated by the device to
the outer environment and dissipating that heat.
a. Unless otherwise specified, for power ICs with tabs and power ICs with attached heat sinks, solder must not be
applied to the heat sink or tabs.
b.
Heat sink attachment
· Use flat-head screws to attach heat sinks.
· Use also washer to protect the package.
· Use tightening torques in the ranges 39-59Ncm(4-6kgcm) .
· If tapping screws are used, do not use screws with a diameter larger
than the holes in the semiconductor device itself.
· Do not make gap, dust, or other contaminants to get between the
semiconductor device and the tab or heat sink.
· Take care a position of via hole .
· Do not allow dirt, dust, or other contaminants to get between the
semiconductor device and the tab or heat sink.
· Verify that there are no press burrs or screw-hole burrs on the heat sink.
· Warping in heat sinks and printed circuit boards must be no more than
0.05 mm between screw holes, for either concave or convex warping.
· Twisting must be limited to under 0.05 mm.
· Heat sink and semiconductor device are mounted in parallel.
Take care of electric or compressed air drivers
· The speed of these torque wrenches should never exceed 700 rpm, and
should typically be about 400 rpm.
Binding head
machine screw
Countersunk head
mashine screw
Heat sink
gap
Via hole
c.
Silicone grease
· Spread the silicone grease evenly when mounting heat sinks.
· Our company recommends YG-6260 (Momentive Performance Materials Japan LLC)
d.
Mount
· First mount the heat sink on the semiconductor device, and then mount that assembly on the printed circuit board.
· When attaching a heat sink after mounting a semiconductor device into the printed circuit board, when tightening
up a heat sink with the screw, the mechanical stress which is impossible to the semiconductor device and the pin
doesn't hang.
e.
When mounting the semiconductor device to the heat sink using jigs, etc.,
· Take care not to allow the device to ride onto the jig or positioning dowel.
· Design the jig so that no unreasonable mechanical stress is not applied to the semiconductor device.
f.
Heat sink screw holes
· Be sure that chamfering and shear drop of heat sinks must not be larger than the diameter of screw head used.
· When using nuts, do not make the heat sink hole diameters larger than the diameter of the head of the screws used.
A hole diameter about 15% larger than the diameter of the screw is desirable.
· When tap screws are used, be sure that the diameter of the holes in the heat sink are not too small. A diameter about
15% smaller than the diameter of the screw is desirable.
g.
There is a method to mount the semiconductor device to the heat sink by using a spring band. But this method is not
recommended because of possible displacement due to fluctuation of the spring force with time or vibration.
No.A1914-14/15
LV5693P
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PS No.A1914-15/15
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