ON MC100EPT20DTR2 3.3v lvttl/lvcmos to differential lvpecl translator Datasheet

MC10EPT20, MC100EPT20
3.3VLVTTL/LVCMOS to
Differential LVPECL
Translator
The MC10EPT20 is a 3.3 V TTL/CMOS to differential PECL
translator. Because PECL (Positive ECL) levels are used, only +3.3 V
and ground are required. The small outline SOIC−8 package and the
single gate of the EPT20 makes it ideal for those applications where
space, performance, and low power are at a premium.
The 100 Series contains temperature compensation.
• 390 ps Typical Propagation Delay
• Maximum Input Clock Frequency > 1 GHz Typical
• Operating Range VCC = 3.0 V to 3.6 V
•
•
•
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MARKING DIAGRAMS*
8
8
1
SO−8
D SUFFIX
CASE 751
with GND = 0 V
PNP TTL Input for Minimal Loading
Q Output will Default HIGH with Input Open
Pb−Free Packages are Available
8
HPT20
ALYW
1
1
8
8
1
TSSOP−8
DT SUFFIX
CASE 948R
KPT20
ALYW
8
HA20
ALYW
KA20
ALYW
1
1
H = MC10
K = MC100
A = Assembly Location
L = Wafer Lot
Y = Year
W = Work Week
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
 Semiconductor Components Industries, LLC, 2004
September, 2004 − Rev. 7
1
Publication Order Number:
MC10EPT20/D
MC10EPT20, MC100EPT20
Table 1. PIN DESCRIPTION
NC
Q
Q
1
8
LVTTL
2
3
VCC
7
D
6
NC
5
GND
PIN
FUNCTION
Q, Q
Differential PECL Outputs
D
LVTTL Input
VCC
Positive Supply
GND
Ground
NC
No Connect
LVPECL
NC
4
Figure 1. 8−Lead Pinout (Top View) and Logic Diagram
Table 2. ATTRIBUTES
Characteristics
Value
Internal Input Pulldown Resistor
N/A
Internal Input Pullup Resistor
N/A
ESD Protection
Human Body Model
Machine Model
Charged Device Model
> 1.5 kV
> 200 V
> 2 kV
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)
Flammability Rating
Level 1
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
Transistor Count
150 Devices
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
1. For additional information, see Application Note AND8003/D.
Table 3. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Unit
6
V
6
V
50
100
mA
mA
VCC
Power Supply
GND = 0 V
VI
Input Voltage
GND = 0 V
Iout
Output Current
Continuous
Surge
TA
Operating Temperature Range
−40 to +85
°C
Tstg
Storage Temperature Range
−65 to +150
°C
JA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
SOIC−8
SOIC−8
190
130
°C/W
°C/W
JC
Thermal Resistance (Junction−to−Case)
Standard Board
SOIC−8
41 to 44
°C/W
JA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
TSSOP−8
TSSOP−8
185
140
°C/W
°C/W
JC
Thermal Resistance (Junction−to−Case)
Standard Board
TSSOP−8
41 to 44
°C/W
Tsol
Wave Solder
<2 to 3 sec @ 248°C
265
°C
VI VCC
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
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2
MC10EPT20, MC100EPT20
Table 4. LVTTL INPUT DC CHARACTERISTICS VCC = 3.3 V, GND = 0 V, TA = −40°C to +85°C
Max
Unit
IIH
Input HIGH Current (Vin = 2.7 V)
Characteristic
20
A
IIHH
Input HIGH Current MAX (Vin = 6.0 V)
100
A
IIL
Input LOW Current (Vin = 0.5 V)
−0.6
mA
VIK
Input Clamp Voltage (Iin = −18 mA)
−1.2
V
VIH
Input HIGH Voltage
VIL
Input LOW Voltage
Symbol
Min
Typ
2.0
V
0.8
V
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
Table 5. 10EPT PECL OUTPUT DC CHARACTERISTICS VCC = 3.3 V, GND = 0 V (Note 2)
−40°C
25°C
85°C
Characteristic
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
ICC
Positive Power Supply Current “HIGH”
18
23
28
18
23
28
19
24
29
mA
VOH
Output HIGH Voltage (Note 3)
2165
2290
2415
2230
2355
2480
2290
2415
2540
mV
VOL
Output LOW Voltage (Note 3)
1365
1490
1615
1430
1555
1680
1490
1615
1740
mV
Symbol
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
2. Output parameters vary 1:1 with VCC.
3. All loading with 50 to VCC − 2.0 V.
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3
MC10EPT20, MC100EPT20
Table 6. 100EPT PECL OUTPUT DC CHARACTERISTICS VCC = 3.3 V, GND = 0 V (Note 4)
−40°C
Symbol
Characteristic
25°C
85°C
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
20
25
30
22
27
32
23
28
33
mA
ICC
Negative Power Supply Current
VOH
Output HIGH Voltage (Note 5)
2155
2280
2405
2155
2280
2405
2155
2280
2405
mV
VOL
Output LOW Voltage (Note 5)
1355
1480
1605
1355
1480
1605
1355
1480
1605
mV
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
4. Output parameters vary 1:1 with VCC.
5. All loading with 50 to VCC − 2.0 V.
Table 7. AC CHARACTERISTICS VCC = 3.0 V to 3.6 V, GND = 0 V (Note 6)
−40°C
Symbol
Min
Characteristic
fmax
Maximum Input Clock Frequency
tPLH,
tPHL
Propagation Delay to
Output Differential
tSKEW
Device−to−Device Skew (Note 7)
tJITTER
RMS Random Clock Jitter
tr
tf
Output Rise/Fall Times
(20% − 80%)
Typ
25°C
Max
Min
>1
Typ
85°C
Max
Min
>1
Typ
Max
>1
Unit
GHz
ps
280
350
430
300
370
150
Q, Q
70
<1
<2
100
170
450
320
400
150
80
<1
<2
120
180
90
490
170
ps
<1
<2
ps
140
190
ps
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
6. Measured using a LVTTL source, 50% duty cycle clock source. All loading with 50 to VCC − 2.0 V.
7. Skew is measured between outputs under identical transitions.
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4
900
9
800
8
700
7
600
6
500
5
400
4
300
3
RMS RANDOM CLOCK JITTER (ps)
OUTPUT VOLTAGE AMPLITUDE (mV)
MC10EPT20, MC100EPT20
ÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
2
200
(JITTER)
100
1
0
0
200
400
600
800
1000
1200
INPUT CLOCK FREQUENCY (MHz)
Figure 2. Output Voltage Amplitude (VOUTpp)/RMS Jitter
vs. Input Clock Frequency at Ambient Temperature
Q
Zo = 50 D
Receiver
Device
Driver
Device
Q
Zo = 50 D
50 50 VTT
VTT = VCC − 2.0 V
Figure 3. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D − Termination of ECL Logic Devices.)
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5
MC10EPT20, MC100EPT20
ORDERING INFORMATION
Package
Shipping†
MC10EPT20D
SO−8
98 Units / Rail
MC10EPT20DR2
SO−8
2500 / Tape & Reel
MC10EPT20DT
TSSOP−8
100 Units / Rail
MC10EPT20DTR2
TSSOP−8
2500 / Tape & Reel
Device
MC100EPT20D
SO−8
98 Units / Rail
MC100EPT20DG
SO−8
(Pb−Free)
98 Units / Rail
MC100EPT20DR2
SO−8
2500 / Tape & Reel
MC100EPT20DT
TSSOP−8
100 Units / Rail
MC100EPT20DTG
TSSOP−8
(Pb−Free)
100 Units / Rail
MC100EPT20DTR2
TSSOP−8
2500 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
Resource Reference of Application Notes
AN1405/D
− ECL Clock Distribution Techniques
AN1406/D
− Designing with PECL (ECL at +5.0 V)
AN1503/D
− ECLinPS I/O SPiCE Modeling Kit
AN1504/D
− Metastability and the ECLinPS Family
AN1568/D
− Interfacing Between LVDS and ECL
AN1642/D
− The ECL Translator Guide
AND8001/D
− Odd Number Counters Design
AND8002/D
− Marking and Date Codes
AND8020/D
− Termination of ECL Logic Devices
AND8066/D
− Interfacing with ECLinPS
AND8090/D
− AC Characteristics of ECL Devices
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6
MC10EPT20, MC100EPT20
PACKAGE DIMENSIONS
SOIC−8 NB
D SUFFIX
CASE 751−07
ISSUE AC
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
−X−
A
8
5
0.25 (0.010)
S
B
1
M
Y
M
4
K
−Y−
G
C
N
DIM
A
B
C
D
G
H
J
K
M
N
S
X 45 SEATING
PLANE
−Z−
0.10 (0.004)
H
D
0.25 (0.010)
M
Z Y
S
X
M
J
S
SOLDERING FOOTPRINT*
1.52
0.060
7.0
0.275
4.0
0.155
0.6
0.024
1.270
0.050
SCALE 6:1
mm inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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7
MILLIMETERS
MIN
MAX
4.80
5.00
3.80
4.00
1.35
1.75
0.33
0.51
1.27 BSC
0.10
0.25
0.19
0.25
0.40
1.27
0
8
0.25
0.50
5.80
6.20
INCHES
MIN
MAX
0.189
0.197
0.150
0.157
0.053
0.069
0.013
0.020
0.050 BSC
0.004
0.010
0.007
0.010
0.016
0.050
0 8 0.010
0.020
0.228
0.244
MC10EPT20, MC100EPT20
PACKAGE DIMENSIONS
TSSOP−8
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948R−02
ISSUE A
8x
0.15 (0.006) T U
K REF
0.10 (0.004)
S
2X
L/2
8
1
PIN 1
IDENT
S
T U
V
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
5. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
6. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE −W−.
S
5
0.25 (0.010)
B
−U−
L
0.15 (0.006) T U
M
M
4
A
−V−
F
DETAIL E
C
0.10 (0.004)
−T− SEATING
PLANE
D
−W−
G
DETAIL E
DIM
A
B
C
D
F
G
K
L
M
MILLIMETERS
MIN
MAX
2.90
3.10
2.90
3.10
0.80
1.10
0.05
0.15
0.40
0.70
0.65 BSC
0.25
0.40
4.90 BSC
0
6
INCHES
MIN
MAX
0.114
0.122
0.114
0.122
0.031
0.043
0.002
0.006
0.016
0.028
0.026 BSC
0.010
0.016
0.193 BSC
0
6
ECLinPS is a trademark of Semiconductor Components INdustries, LLC (SCILLC).
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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For additional information, please contact your
local Sales Representative.
MC10EPT20/D
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