Order this document by 1PMT5913BT3/D SEMICONDUCTOR TECHNICAL DATA %% $% &# "&!% %#"& "! !# "$ "'# % This complete new line of zener/tvs diodes offers a 2.5 watt series in a micro miniature, space saving surface mount package. The Powermite zener/tvs diodes are designed for use as a tvs or a regulation device in automotive and telecommunication applications where efficiency, low leakage, size/height and profile are important. PLASTIC SURFACE MOUNT ZENER DIODES 2.5 WATTS 3.3–91 VOLTS Features: • Voltage Range – 3.3 to 91 V 1 • ESD Rating of Class 3 (> 16 kV) per Human Body Model • Low Profile – maximum height of 1.1mm • Integral Heat Sink/Locking Tabs 2 • Full metallic bottom eliminates flux entrapment • Small Footprint – Footprint area of 8.45mm2 CASE 457–01 PLASTIC • Supplied in 12mm tape and reel – 12,000 units per reel • Powermite is JEDEC Registered as DO–216AA 1 2 1: CATHODE 2: ANODE MAXIMUM RATINGS Symbol Value Unit DC Power Dissipation @ TL = 75°C, Measured at Zero Lead Length Derate above 75°C Rating °PD° 2.5 40 °Watts° mW/°C DC Power Dissipation @ TA = 25°C(1) Derate above 25°C °PD° 380 2.8 °mW mW/°C Thermal Resistance from Junction to Lead RθJL 26 °C/W Thermal Resistance from Junction to Ambient RθJA 324 °C/W TJ, Tstg – 65 to +150 °C Operating and Storage Junction Temperature Range Typical Ppk Dissipation @ TL < 25°C, (PW–10/1000 µs per Figure 8)(2) Ppk 200 Watts Typical Ppk Dissipation @ TL < 25°C, (PW–8/20 µs per Figure 9)(2) Ppk 1000 Watts (1)FR4 Board, within 1” to device, using Motorola minimum recommended footprint, as shown in case 403A outline dimensions spec. (2)Non–repetitive current pulse. This document contains preview information only and is subject to change without notice. Powermite is a registered trademark of Microsemi Corporation. Thermal Clad is a trademark of the Bergquist Company. Motorola, Inc. 1996 1PMT5913BT3 through 1PMT5948BT3 MOTOROLA 1 ELECTRICAL CHARACTERISTICS (VF = 1.5 Volts Max @ IF = 200 mAdc for all types.) Device* Nominal Zener Voltage VZ @ IZT Volts (Note 1) Test Current IZT mA ZZT @ IZT Ohms ZZK Ohms 1PMT5913BT3 1PMT5914BT3 1PMT5915BT3 1PMT5916BT3 3.3 3.6 3.9 4.3 113.6 104.2 96.1 87.2 10 9 7.5 6 1PMT5917BT3 1PMT5918BT3 1PMT5919BT3 1PMT5920BT3 4.7 5.1 5.6 6.2 79.8 73.5 66.9 60.5 1PMT5921BT3 1PMT5922BT3 1PMT5923BT3 1PMT5924BT3 6.8 7.5 8.2 9.1 1PMT5925BT3 1PMT5926BT3 1PMT5927BT3 1PMT5928BT3 Max Zener Impedance (Note 2) Max Reverse Leakage Current Device Marking IZK mA IR µA 500 500 500 500 1 1 1 1 100 75 25 5 1 1 1 1 454 416 384 348 913B 914B 915B 916B 5 4 2 2 500 350 250 200 1 1 1 1 5 5 5 5 1.5 2 3 4 319 294 267 241 917B 918B 919B 920B 55.1 50 45.7 41.2 2.5 3 3.5 4 200 400 400 500 1 0.5 0.5 0.5 5 5 5 5 5.2 6.8 6.5 7 220 200 182 164 921B 922B 923B 924B 10 11 12 13 37.5 34.1 31.2 28.8 4.5 5.5 6.5 7 500 550 550 550 0.25 0.25 0.25 0.25 5 1 1 1 8 8.4 9.1 9.9 150 136 125 115 925B 926B 927B 928B 1PMT5929BT3 1PMT5930BT3 1PMT5931BT3 1PMT5932BT3 15 16 18 20 25 23.4 20.8 18.7 9 10 12 14 600 600 650 650 0.25 0.25 0.25 0.25 1 1 1 1 11.4 12.2 13.7 15.2 100 93 83 75 929B 930B 931B 932B 1PMT5933BT3 1PMT5934BT3 1PMT5935BT3 1PMT5936BT3 22 24 27 30 17 15.6 13.9 12.5 17.5 19 23 26 650 700 700 750 0.25 0.25 0.25 0.25 1 1 1 1 16.7 18.2 20.6 22.8 68 62 55 50 933B 934B 935B 936B 1PMT5937BT3 1PMT5938BT3 1PMT5939BT3 1PMT5940BT3 33 36 39 43 11.4 10.4 9.6 8.7 33 38 45 53 800 850 900 950 0.25 0.25 0.25 0.25 1 1 1 1 25.1 27.4 29.7 32.7 45 41 38 34 937B 938B 939B 940B 1PMT5941BT3 1PMT5942BT3 1PMT5943BT3 1PMT5944BT3 47 51 56 62 8 7.3 6.7 6 67 70 86 100 1000 1100 1300 1500 0.25 0.25 0.25 0.25 1 1 1 1 35.8 38.8 42.6 47.1 31 29 26 24 941B 942B 943B 944B 1PMT5945BT3 1PMT5946BT3 1PMT5947BT3 1PMT5948BT3 68 75 82 91 5.5 5 4.6 4.1 120 140 160 200 1700 2000 2500 3000 0.25 0.25 0.25 0.25 1 1 1 1 51.7 56 62.2 69.2 22 20 18 16 945B 946B 947B 948B * TOLERANCE AND VOLTAGE DESIGNATION @ @ VR Volts Maximum DC Zener Current IZM mAdc Tolerance designation — The type numbers listed indicate a tolerance of ±5%. Devices listed in bold, italic are Motorola preferred devices. MOTOROLA 2 1PMT5913BT3 through 1PMT5948BT3 1000 6 PPK , PEAK SURGE POWER (WATTS) P D, MAXIMUM POWER DISSIPATION (WATTS) TYPICAL CHARACTERISTICS 5 4 TL 3 2 1 TA 0 0 25 50 75 100 125 RECTANGULAR NONREPETITIVE WAVEFORM 100 10 0.1 150 1 10 PW, PULSE WIDTH (ms) T, TEMPERATURE (°C) Figure 1. Steady State Power Derating Figure 2. Maximum Surge Power 10 120 Ippm, PEAK PULSE CURRENT (%) PPK , PEAK POWER (kW) NONREPETITIVE EXPONENTIAL PULSE WAVEFORM TJ = 25°C 1 0.1 0.001 0.01 0.1 1 = 10 µs PEAK VALUE Ippm 80 60 HALF VALUE – Ipp/2 40 10/1000 µs WAVEFORM AS DEFINED BY R.E.A. 20 0 10 td 0 1 2 10 VZ @ IZT 6 4 2 0 –2 2 4 6 8 VZ, ZENER VOLTAGE (VOLTS) 10 Figure 5. Zener Voltage – To 12 Volts 3 t, TIME (ms) 5 4 Figure 4. Pulse Waveform 10/1000 θVZ , TEMPERATURE COEFFICIENT (mV/ °C) θVZ , TEMPERATURE COEFFICIENT (mV/ °C) Figure 3. Maximum Surge Power –4 TA = 25°C PW (ID) IS DEFINED AS THE POINT WHERE THE PEAK CURRENT DECAYS TO 50% OF Ipp. 100 Tp, PULSE WIDTH (ms) 8 100 12 200 100 VZ @ IZT 70 50 30 20 10 10 20 30 50 70 100 VZ, ZENER VOLTAGE (VOLTS) 200 Figure 6. Zener Voltage – 14 To 200 Volts NOTE 1. ZENER VOLTAGE (VZ) MEASUREMENT Nominal zener voltage is measured with the device junction in thermal equilibrium with ambient temperature at 25°C 1PMT5913BT3 through 1PMT5948BT3 MOTOROLA 3 100 50 30 20 50 30 20 IZ , ZENER CURRENT (mA) IZ, ZENER CURRENT (mA) 100 10 5 3 2 1 0.5 0.3 0.2 0.1 10 5 3 2 1 0.5 0.3 0.2 0.1 0 1 2 3 4 5 6 7 VZ, ZENER VOLTAGE (VOLTS) 8 9 0 10 10 20 Figure 7. VZ = 3.3 thru 10 Volts 100 1k IZ(dc) = 1mA 100 70 50 30 20 10mA 10 7 5 20mA 5 7 10 TJ = 25°C iZ(rms) = 0.1 IZ(dc) 500 ZZ , DYNAMIC IMPEDANCE (OHMS) ZZ , DYNAMIC IMPEDANCE (OHMS) 90 Figure 8. VZ = 12 thru 82 Volts 200 3 2 30 40 50 60 70 80 VZ, ZENER VOLTAGE (VOLTS) iZ(rms) = 0.1 IZ(dc) 20 30 50 VZ, ZENER VOLTAGE (VOLTS) Figure 9. Effect of Zener Voltage 70 100 200 VZ =150V 100 91V 50 62V 20 10 5 22V 2 12V 1 0.5 1 2 5 10 20 50 100 IZ, ZENER TEST CURRENT (mA) 200 6.8V 500 Figure 10. Effect of Zener Current NOTE 2. ZENER IMPEDANCE (ZZ) DERIVATION ZZT and ZZK are measured by dividing the ac voltage drop across the device by the ac current applied. The specified limits are for IZ(ac) = 0.1 IZ(dc) with the ac frequency = 60 Hz. MOTOROLA 4 1PMT5913BT3 through 1PMT5948BT3 INFORMATION FOR USING THE POWERMITE SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process. 0.025 0.635 0.105 2.67 0.030 0.762 0.100 2.54 0.050 1.27 inches mm POWERMITE POWERMITE POWER DISSIPATION The power dissipation of the Powermite is a function of the drain pad size. This can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by T J(max), the maximum rated junction temperature of the die, RθJA, the thermal resistance from the device junction to ambient, and the operating temperature, TA . Using the values provided on the data sheet for the Powermite package, PD can be calculated as follows: PD = TJ(max) – TA RθJA The values for the equation are found in the maximum ratings table on the data sheet. Substituting these values into the equation for an ambient temperature TA of 25°C, one can calculate the power dissipation of the device which in this case is 386 milliwatts. PD = 150°C – 25°C 324°C/W = 386 milliwatts The 324°C/W for the Powermite package assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 386 milliwatts. There are other alternatives to achieving higher power dissipation from the Powermite package. Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal Clad. Using a board material such as Thermal Clad, an aluminum core board, the power dissipation can be doubled using the same footprint. SOLDERING PRECAUTIONS The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. • Always preheat the device. • The delta temperature between the preheat and soldering should be 100°C or less.* • When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference shall be a maximum of 10°C. • The soldering temperature and time shall not exceed 260°C for more than 10 seconds. • When shifting from preheating to soldering, the maximum temperature gradient shall be 5°C or less. • After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. • Mechanical stress or shock should not be applied during cooling. * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device. 1PMT5913BT3 through 1PMT5948BT3 MOTOROLA 5 OUTLINE DIMENSIONS F 0.08 (0.003) C –A– J M T B S S TERM. 1 CATHODE –B– K TERM. 2 ANODE R L J C S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. DIM A B C D F H J K L R S MILLIMETERS INCHES MIN MAX MIN MAX 1.75 2.15 0.069 0.081 1.75 2.15 0.069 0.086 0.85 1.15 0.033 0.045 0.40 0.65 0.016 0.026 0.70 1.00 0.028 0.039 –0.05 +0.10 –0.002 +0.004 0.10 0.25 0.004 0.010 3.60 4.15 0.142 0.163 0.50 0.80 0.020 0.031 1.20 1.50 0.047 0.059 0.50 REF 0.020 D H –T– 0.08 (0.003) M T B S C S CASE 457–01 ISSUE O Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. How to reach us: USA / EUROPE / Locations Not Listed: Motorola Literature Distribution; P.O. Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 or 602–303–5454 JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center, 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 03–81–3521–8315 MFAX: [email protected] – TOUCHTONE 602–244–6609 INTERNET: http://Design–NET.com ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 MOTOROLA 6 ◊ *1PMT5913BT3/D* 1PMT5913BT3/D 1PMT5913BT3 through 1PMT5948BT3