AVAGO HSMB-C191 Surface mount chip led Datasheet

HSMB-Cxxx
Surface Mount Chip LEDs
Data Sheet
HSMB-C190, HSMB-C170, HSMB-C110,
HSMB-C150, HSMB-C191
Description
Features
These Blue chip LEDs are designed in an industry standard
package for ease of handling and use. Blue color chip
LED is a new product that offers color differentiation for
backlighting applications.
•
•
•
•
•
•
•
•
The HSMB-C150 has the industry standard 3.2 x 1.6 mm
footprint that is excellent for all around use. The HSMBC170 has the widely used 2.0 x 1.25 mm footprint. The
HSMB-C190 and HSMB-C191 have the industry standard
1.6 x 0.8 mm footprint, and their low profiles (0.8 mm for
HSMB-C190 and 0.6 mm for HSMB-C191) and wide viewing angles make these LEDs exceptional for backlighting
applications.
The HSMB-C110 is a right-angle package with the universally accepted dimensions of 3.2 x 1.0 x 1.5 mm. This part is
ideal for LCD backlighting and sidelighting applications.
All packages are compatible with IR reflow solder processes. The small size and wide viewing angle make these
LEDs prime choices for backlighting applications and front
panel illumination especially where space is a premium.
Small Size
Industry Standard Footprint
Compatible with IR Solder
Diffused Optics
Operating Temperature Range of –30°C to +85°C
Right Angle Package Available
SiC Blue Color
Available in 8 mm Tape on 7" (178 mm) Diameter
Reels
Applications
•
•
•
•
•
Keypad Backlighting
Push-Button Backlighting
LCD Backlighting
Symbol Backlighting
Front Panel Indicator
Device Selection Guide
Footprint (mm)
2.00 x 1.25
1.60 x 0.80
3.20 x 1.00[1]
3.20 x 1.60
Note:
SiC Blue
HSMB-C170
HSMB-C190/C191
HSMB-C110
HSMB-C150
Parts Per Reel
4000
4000
3000
3000
1. Right-angle package.
CAUTION: HSMB-C1xx LEDs are Class 1A ESD sensitive per JESD22-A114C.01. Please observe appropriate precautions
during handling and processing. Refer to Avago Technologies Application Note AN-1142 for additional details.
Package Dimensions
CATHODE
MARK
LED DIE
CATHODE
MARK
LED DIE
1.25 (0.049)
0.8 (0.031)
0.4 (0.016)
1.6
(0.063 )
2.0 (0.079 )
1.0
(0.039)
POLARITY
1.4
(0.055)
DIFFUSED
EPOXY
0.3 (0.012)
0.3 (0.012)
DIFFUSED EPOXY
PC BOARD
0.62 (0.024)
POLARITY
0.8 (0.031)
PC BOARD
0.3 (0.012)
0.8 (0.031)
0.3 (0.012)
CATHODE LINE
0.4 ± 0.15
(0.016 ± 0.006)
CATHODE LINE
0.3 ± 0.15
(0.012 ± 0.006)
0.3 ± 0.15
(0.012 ± 0.006)
0.4 ± 0.15
(0.016 ± 0.006)
0.7 (0.028) MIN.
SOLDERING
TERMINAL
SOLDERING
TERMINAL
HSMB-C170
HSMB-C190
HSMB-C190 Pkg Dimen - b (C170)
HSMB-C190 Pkg Dimen - a (C190)
CATHODE
LINE
LED DIE
CATHODE
MARK
LED DIE
1.0 (0.039)
1.6 (0.063)
2.6 (0.102 )
0.8 (0.031)
3.2 (0.126 )
POLARITY
3.2 (0.126 )
CLEAR
EPOXY
1.5 (0.059)
PC BOARD
DIFFUSED
EPOXY
POLARITY
2.0 (0.079)
0.6 (0.024)
1.1 (0.043)
1.6 (0.063 )
0.5 (0.020)
3.2 (0.126 )
0.8 (0.031)
PC BOARD
CATHODE LINE
CATHODE LINE
0.50 ± 0.2
(0.020 ± 0.008)
0.5 (0.020)
0.50 ± 0.2
(0.020 ± 0.008)
1.0 (0.039)
SOLDERING
TERMINAL
HSMB-C110
HSMB-C110
SOLDERING
TERMINAL
HSMB-C150
HSMx-C190 Pkg Dimen - a (C150)
CATHODE
MARK
LED DIE
0.8 (0.031)
0.4 (0.016)
1.6
(0.063 )
1.0
(0.039)
POLARITY
0.3 (0.012)
DIFFUSED EPOXY
PC BOARD
CATHODE LINE
0.6 (0.023)
0.3 (0.012)
0.3 ± 0.15
(0.012 ± 0.006)
0.3 ± 0.15
(0.012 ± 0.006)
0.7 (0.028) MIN.
SOLDERING
TERMINAL
HSMx-C191
HSMB-C191
NOTE:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
Absolute Maximum Ratings at TA=25°C
Parameter
HSMB-C190/C170/C110/C150/C191
DC Forward Current[1]
20
[2]
Peak Pulsing Current
100
Power Dissipation
92
Reverse Voltage (IR = 100 µA)
5
Maximum LED Junction Temperature
95
Operating Temperature Range
-30 to +85
Storage Temperature Range
-40 to +85
Soldering Temperature
See reflow soldering profile (Figure 7 & 8)
Notes:
1. Derate linearly as shown in Figure 4 for temperature above 25°C.
2. Pulse condition of 1/10 duty and 0.1 msec. width.
Units
mA
mA
mW
V
°C
°C
°C
Optical Characteristics at TA=25°C
Luminous
Intensity[1]
Part No.
Color Iv (mcd) @ 20 mA
Min.
Typ.
HSMBSiC Blue
1.80
6.0
C190/C170/
C150/C191
HSMB-C110
SiC Blue
1.80
6.5
Notes:
Peak
Wavelength
λpeak (nm)
Typ.
428
Dominant
Wavelength
λd (nm)
Typ.
466
Viewing
Angle 2θ1/2
(degrees)[2]
Typ.
170
428
466
130
1. The luminous intensity, Iv, is measured at the peak of the spatial radiation pattern, which may not be aligned with the mechanical axis of the
lamp package.
2. u1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
Electrical Characteristics at TA=25°C
Forward Voltage
VF (Volts)
Part No.
@ IF = 20 mA
Typ.
Max.
HSMB-C190/C170/C150/C191
3.8
4.6
HSMB-C110
3.8
4.6
Reverse
Breakdown
VR (Volts)
@ IR = 100 µA
Min.
5
5
Thermal
Resistance
RθJ-P (°C/W)
Typ.
300
300
Capacitance C
(pF) @ VF = 0 V,
f = 1 MHz
Typ.
67
67
VF Tolerance: ±0.1 V
Light Intensity (Iv) Bin Limits[1]
Blue Color Bins[1]
Dom. Wavelength (nm)
Bin ID
Min.
Max.
A
460.0
465.0
B
465.0
470.0
C
470.0
475.0
D
475.0
480.0
Tolerance: ±1 nm
Note:
1. Bin categories are established for class­
ification of products. Products may not be
available in all categories. Please contact
your Avago representative for information
on currently available bins.
Intensity (mcd) Intensity (mcd)
Bin ID
Min.
Max.
Bin ID
Min.
A
0.11
0.18
N
28.50
B
0.18
0.29
P
45.00
C
0.29
0.45
Q
71.50
D
0.45
0.72
R
112.50
E
0.72
1.10
S
180.00
F
1.10
1.80
T
285.00
G
1.80
2.80
U
450.00
H
2.80
4.50
V
715.00
J
4.50
7.20
W
1125.00
K
7.20
11.20
X
1800.00
L
11.20
18.00
Y
2850.00
M
18.00
28.50
Max.
45.00
71.50
112.50
180.00
285.00
450.00
715.00
1125.00
1800.00
2850.00
4500.00
Tolerance: ±15%
Note:
1. Bin categories are established for classification of products. Products may not be available in
all categories. Please contact your Avago representative for information on currently available bins.
100
80
60
40
20
0
380
480
580
10
1
0.1
680
1.2
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
IF – FORWARD CURRENT – mA
RELATIVE INTENSITY – %
100
3.0
WAVELENGTH – nm
3.2
3.4
3.6
3.8
Figure 2. Forward Current vs. Forward Voltage.
0.4
0.2
0
5
10
15
HSMB-C190 fig 3
100
90
RELATIVE INTENSITY – %
20
15
10
5
80
70
60
50
40
30
20
10
0
0
20
40
60
80
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
100
TA – AMBIENT TEMPERATURE – °C
0
10 20 30 40 50 60 70 80 90
ANGLE
Figure 4. Maximum Forward Current vs. Ambient
Temperature.
HSMB-C190 fig 4
100
HSMB-C190 fig 5a
RELATIVE INTENSITY – %
90
80
70
60
50
40
30
20
10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
ANGLE
Figure 5. Relative Intensity vs. Angle for HSMB-C110.
HSMB-C190 fig 5b
20
Figure 3. Relative Luminous Intensity vs. Forward
Current.
HSMB-C190 fig 2
IF MAX. – MAXIMUM FORWARD CURRENT – mA
0.6
IF – FORWARD CURRENT – mA
HSMB-C190 fig 1
25
0.8
0
4.0
VF – FORWARD VOLTAGE – V
Figure 1. Relative Intensity vs. Wavelength.
1.0
25
100
80
70
60
10 SEC. MAX.
50
40
30
20
10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
230°C MAX.
TEMPERATURE
RELATIVE INTENSITY – %
90
0
4°C/SEC. MAX.
140-160°C
–3°C/SEC. MAX.
4°C/SEC.
MAX.
10 20 30 40 50 60 70 80 90
OVER 2 MIN.
TIME
ANGLE
Figure 6. Relative Intensity vs. Angle for HSMB-C170, HSMB-C190, HSMB-C150, and HSMB-C191.
HSMB-C190 fig 6
Figure 7. Recommended reflow soldering profile.
HSMB-C190 fig 7
TEMPERATURE
10 - 30 SEC.
217 °C
200 °C
255 - 260 °C
3 °C/SEC. MAX.
6 °C/SEC. MAX.
150 °C
1.2 (0.047)
3 °C/SEC. MAX.
100 SEC. MAX.
60 - 120 SEC.
TIME
1.2
(0.047)
1.2
(0.047)
0.9
(0.035)
(Acc. to J-STD-020C)
Figure 8. Recommended Pb-free Reflow Soldering Profile.
Figure 9. Recommended Soldering Pattern for HSMB-C170.
HSMB-C190 fig 8
5.0 (0.200)
0.8 (0.031)
0.9 (0.035)
0.9 (0.035)
0.8
(0.031)
0.7
(0.028)
0.8
(0.031)
Figure 10. Recommended Soldering Pattern for HSMB-C190 and C191.
HSMB-C190 fig 9
Note:
1. All dimensions in millimeters (inches).
1.0 (0.039)
0.2 (0.008)
1.5
(0.059)
2.0
(0.079)
1.5
(0.059)
Figure 11. Recommended Soldering Pattern for HSMB-C110.
HSSM-C110 fig 8
USER FEED DIRECTION
1.5 (0.059)
CATHODE SIDE
1.5
(0.059)
2.0
(0.079)
1.5
(0.059)
PRINTED LABEL
Figure 12. Recommended Soldering Pattern for HSMB-C150.
Figure 13. Reeling Orientation.
HSMX-C190 fig 8
8.0 ± 1.0 (0.315 ± 0.039)
10.50 ± 1.0 (0.413 ± 0.039)
Ø 13.1 ± 0.5
(Ø 0.516 ± 0.020)
Ø 20.20 MIN.
(Ø 0.795 MIN.)
3.0 ± 0.5
(0.118 ± 0.020)
59.60 ± 1.00
(2.346 ± 0.039)
178.40 ± 1.00
(7.024 ± 0.039)
4.0 ± 0.5
(0.157 ± 0.020)
Figure 14. Reel Dimensions.
Note:
1. All dimensions in millimeters (inches).
6
PS
5.0 ± 0.5
(0.197 ± 0.020)
4.00 (0.157)
DIM. C
(SEE TABLE 1)
CATHODE
1.50 (0.059)
0.20 ± 0.05
(0.008 ± 0.002)
1.75 (0.069)
3.50 ± 0.05
(0.138 ± 0.002)
DIM. A
(SEE TABLE 1)
8.00 ± 0.30
(0.315 ± 0.012)
DIM. B
(SEE TABLE 1)
2.00 ± 0.05
(0.079 ± 0.002)
USER FEED
DIRECTION
4.00 (0.157)
HSMx-C110
POSITION IN
CARRIER TAPE
HSMx-C191 SERIES
HSMx-C190 SERIES
HSMx-C170 SERIES
HSMx-C110 SERIES
HSMx-C150 SERIES
DIM. A
DIM. B
DIM. C
± 0.10 (± 0.004) ± 0.10 (± 0.004) ± 0.10 (± 0.004)
1.85 (0.073)
1.80 (0.071)
2.30 (0.091)
3.40 (0.134)
3.50 (0.138)
R 1.0 ± 0.05
(0.039 ± 0.002)
DIM. B
(SEE TABLE 1)
Figure 15. Tape Dimensions.
END
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
START
MOUNTED WITH
COMPONENTS
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
Figure 16. Tape Leader and Trailer Dimensions.
Notes:
HSMB-C190 fig 14
1. All dimensions in millimeters (inches).
2. Tolerance is ±0.1 mm (±0.004 in.) unless otherwise specified.
COVER TAPE
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
PART NUMBER
DIM. A
(SEE TABLE 1)
CARRIER TAPE
MINIMUM OF
230 mm
(9.05 INCH)
MAY CONSIST
OF CARRIER
AND/OR
COVER TAPE.
0.88 (0.035)
0.95 (0.037)
1.45 (0.057)
1.70 (0.067)
1.88 (0.074)
0.85 (0.033)
0.87 (0.034)
0.95 (0.037)
1.20 (0.047)
1.27 (0.050)
Reflow Soldering:
For more information on reflow soldering, refer to Application Note AN-1060, Surface Mounting SMT LED Indicator
Components.
Storage Condition: 5 to 30°C @ 60%RH max.
Baking is required before mounting, if:
1. Humidity Indicator Card is > 10% when read at 23 ± 5°C.
2. Device expose to factory conditions <30°C/60%RH more than 672 hours.
Recommended baking condition: 60±5°C for 20 hours.
For product information and a complete list of distributors, please go to our website:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.
Data subject to change. Copyright © 2006 Avago Technologies Limited. All rights reserved. Obsoletes 5989-0417EN
AV02-0613EN - July 27, 2007
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