IRF IRPT1059C Integrated power stage for 1hp motor drive Datasheet

PD 6.103
PRELIMINARY
IRPT1059
ΤΜ
Integrated Power Stage for 1 hp Motor Drives
· 1 hp (0.75kW) power output
Industrial rating at 150% overload for 1 minute
· 180 - 240V AC single-phase input, 50/60Hz
· Available as complete system or as sub-system
assemblies
Power Module
· Single-phase rectifier bridge
· 3-phase short circuit rated, ultrafast IGBT inverter
· Low inductance (current sense)
shunts in positive and negative DC rail
· NTC temperature sensor
· Pin-to-base plate isolation 2500V rms
· Easy-to-mount two-screw package
· Case temperature range -25°C to 125°C operational
Driver-Plus Board
180 - 240V
single-phase input
IRPT1059C
· DC bus capacitor filter with NTC inrush
current limiter
· IR2132 monolithic 3-phase HVIC driver
· On-board +15V and +5V power supply
· MOV surge suppression at input
· DC bus voltage and current feedback
· Protection for short-circuit, earth/ground fault and
overtemperature
· Terminal blocks for single-phase input and output
connections
Figure 1. The IRPT1059C
control system
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within a motor
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IRPT1059
System Description
The IRPT1059C
provides the complete
conversion function for a 1hp (0.75kW) variable frequency,
variable voltage, AC motor controller. The
combines a power module IRPT1059A with a Driver-Plus Board
IRPT1059D. Figure 1 shows the block diagram of the
within an AC motor control system.
The power module contains a single-phase input bridge
rectifier, 3-phase IGBT inverter, current sense shunts, and a
thermistor. It is designed for easy mounting to a heat sink. The
Driver-Plus Board contains DC link capacitors, capacitor soft
charge function using NTC thermistor, surge suppression MOV,
IGBT gate drivers, DC bus voltage and current feedback signals,
protection circuitry and local power supply. It is designed to mate
with a controller board through a single row header. Terminal
blocks are provided on the Driver-Plus Board for all end user line
input and motor output.
Output power is Pulse-Width Modulated (PWM) 3-phase,
variable frequency, variable voltage controlled by an externally
generated user-provided PWM controller for inverter IGBT
switching. The power supply offers the user non-isolated 5V and
15V to power the micro-controller.
The IRPT1059C offers several benefits to the drive
manufacturer listed below:
• It greatly simplifies component selection, design of layout,
interconnection, gate drive, local power supply, thermal
sensing, current sensing and protection.
• Gate drive and protection circuits are designed to closely
match the operating characteristics of the power
semiconductors. This allows power losses to be minimized and
power rating to be maximized to a greater extent than is
possible by designing with individual components.
• It reduces the effort of calculating and evaluating power
semiconductor losses and junction temperature.
• It reduces the manufacturer's part inventory and simplifies
assembly.
[
specifications and ratings are given for system
input and output voltage and current, power losses and heat sink
requirements over a range of operating conditions.
system ratings are verified by IR in final testing.]
The IRPT1059A Power Module
The IRPT1059A Power Module, shown in figure 2, is a chip
and wire epoxy encapsulated module. It houses input rectifiers
output inverter, current sense shunts and NTC thermistor. The
single-phase input bridge rectifiers are rated at 800V. The
inverter section employs 600V, short circuit rated, ultrafast
IGBTs and ultrafast freewheeling diodes. Current sensing is
achieved through 45mΩ low inductance shunts provided in the
positive and negative DC bus rail. The NTC thermistor
provides temperature sensing capability. The lead spacing on the
power module meets UL840 pollution level 3 requirements.
The power circuit and layout within the module are carefully
designed to minimize inductance in the power path, to reduce
noise during inverter operation and to improve the inverter
efficiency. The Driver-Plus Board required to run the inverter
can be soldered to the power module pins, thus minimizing
assembly and alignment. The power module is designed to be
mounted to a heat sink with two screw mount positions, in order
to insure good thermal contact between the module substrate and
the heat sink.
Figure 2. IRPT1059A Power Module
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IRPT1059
The IRPT1059D Driver-Plus Board
The IRPT1059D Driver-Plus board, shown in figure 3, houses
surge suppression MOV on input, a switching power supply, a DC
bus filter capacitor with NTC inrush current limiter, an IR2132J
monolithic 3-phase driver IC, and protection and sensing circuitry.
The inverter gate drive circuit, implemented with an IR2132J
monolithic 3-phase HVIC driver, delivers on/off gate drive
signals to the IGBTs’ gates, corresponding with input PWM
control signals IN1 through IN6. After power-up, RESET pin on
the J3 connector must be held low (with open collector
configuration) for at least 2µsec while all PWM signals, IN1
through IN6 are held high (off condition). A latch in the
protection circuitry is set high during a fault condition to trip the
IR2132J’s internal latch and shut down all PWM output gate
drive signals and cause the FAULT output pin on IR2132J to set
low and light the LED. The Fault diagnostic is an active low,
open drain output with a pull-up resistor. This signal is provided
on the J3 connector for fault feedback to external control logic.
The protection circuitry receives current signals from shunts
in positive and negative DC bus rail for earth/ground fault and
short-circuit conditions. Any earth-fault signal is fed through an
opto-isolator to the protection circuitry. Current signal from
negative DC bus rail is provided on the J3 connector as current
feedback, I FB (0.045V/A). If filtering of this signal is required,
it should be done by adding a high-impedance buffer stage
between signal and filter. DC bus voltage is scaled down to
provided a voltage signal on the J3 connector as voltage
feedback, VFB (0.023 x Bus voltage). Thermal sense signal for
over-temperature protection is obtained from a thermistor
housed inside the power module. The thermistor activates the
latch if the temperature of the power module’s IMS substrate
exceeds a set level.
The system is designed for 150% overload for one minute
while operating with the specified heat sink. The external
microcontroller should shut off PWM signals if the overload
condition persists for more than one minute.
The switching power supply employs the IR2152S selfoscillating driver chip in a buck regulator topology to deliver
nominal 15V and 5V DC outputs, referenced to the negative DC
bus (N). The power supply feeds the gate drive and protection
circuits. The 15V and 5V outputs are available on the control
interface connector’s (J3) VCC and VDD pins for external
microprocessor and control logic supply.
Figure 3. IRPT1059D Driver-Plus Board
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IRPT1059
Figure 4. IRPT1059C Basic Architecture
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IRPT1059
Specifications
PARAMETERS
Input Power
VALUES
Voltage
Frequency
Input current
220V, -15%, +10%, single-phase
50/60 Hz
10.5A rms @ nominal output
150A peak
CONDITIONS
TA = 40°C, RthSA = 1.36°C/W
Initial bus capacitor charging
Output Power
Voltage
Nominal Motor hp (kW)
Nominal motor current
0 - 230V
1hp (0.75 kW) nominal full load power
150% overload for 1 minute
4.4A nominal full load current
6.6A 150% overload for 1 minute
defined by external PWM control
V in = 230V, fpwm = 4 kHz, fo = 60 Hz
T A = 40°C, RthSA = 1.36°C/W
ZthSA limits DTc to 10°C during overload
5V maximum, active low
0.8 µsec typ. deadtime set by IR2132J
1 µsec
open collector, active low
CMOS, LSTTL compatible, open collector
max. deadtime set by external controller
Control Inputs
PWM input signals IN1...IN6
Pulse deadtime
Minimum input pulse width
RESET
pin 14 of control interface connector
pull down for ≥ 2 µsec to release latch
Protection
Output current trip level
Earth/gnd fault current trip level
Overtemperature trip level
30A, ±10%
36A, ±10%
100°C, ±5%
Maximum DC link voltage
Short circuit shutdown time
400V
2.5 µsec typical
TC = 25°C
TC = 25°C
Case temperature
user to ensure rating not exceeded for >30 sec.
output terminals shorted
Feedback Signals
Current feedback (IFB)
DC bus voltage feedback (VFB)
Fault feedback (Fault)
0.045V/A
0.023 typical V/VBUS
5V, active low
On Board Power Supply
VCC
VDD
ICC+ IDD
15V, ±10%
5V, ±5%
60 mA
max. limit specified is available on control
interface connector J3 for external use
Module
Isolation voltage
2500V rms
Operating case temperature
-25°C to 125°C
Mounting torque
1 Nm
pin to base plate isolation, 60 Hz, 1 minute
95%RH max. (non-condensing)
M4 screw type
System Environment
Ambient operating temp. range
0 to 40°C
Storage temperature range
-25 to 60°C
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95%RH max. (non-condensing)
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IRPT1059
Total Power Dissipation (Watts)
Thermal Resistance (RthSA°C/W)
RthSA 100% load continuous
10-60 Hz
Power
150%
RthSA 150% load
(1 min.)10-60 Hz
Power
100%
RthSA 150% load (1 min.)
down to 3 Hz
1.0 hp
(0.75 kW)
PWM Frequency (kHz) – (Induction Motor Load)
Figure 5a. 1hp/4.4A Output Heat sink Thermal Resistance and Power Dissipation vs. PWM Frequency
continuous
Total Power Dissipation (Watts)
Thermal Resistance (RthSA°C/W)
RthSA 100% load
10-60 Hz
RthSA 150% load
(1 min.)10-60 Hz
Power
150%
RthSA 150% load (1 min.)
down to 3 Hz
Power
100%
0.75 hp
(0.55 kW)
PWM Frequency (kHz) – (Induction Motor Load)
Figure 5b. 0.75hp/3.5A Output Heat Sink Thermal Resistance and Power Dissipation vs. PWM Frequency
NOTE: For figures 5a and 5b – Operating Conditions: Vin = 230V rms, MI = 1.15, P.F. = 0.8, TA = 40°C. ZthSA limits ∆Tc rise during 1 minute overload to 10°C.
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IRPT1059
Mounting, Hookup and Application Instructions
Mounting
Control Connections
1. Remove all particles and grit from the heat sink and power
substrate.
2. Spread a .004" to .005" layer of silicone grease on the heat
sink, covering the entire area that the power substrate will
occupy. Recommended heat sink flatners is .001 inch/inch and
Total Indicator Readout (TIR) of .003 inch below substrate
3. Place the power substrate onto the heat sink with the
mounting holes aligned and press it firmly into the silicone
grease.
4. Place the 2 M4 mounting screws through the PCB and
power module and into the heat sink and tighten the screws to 1
Nm torque.
All input and output control connections are made via a 16terminal female connector to J3.
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Figure 6. Power Module Mounting Screw Sequence
Figure 7a. Control Signal Connector
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Power Connections
Single-phase input connections are made to terminals R,S and
T (J1). Inverter output terminal connections are made to
terminals U,V and W (J2).
Power-Up Procedure
When single-phase input power is first switched on, PWM
inputs to the IRPT1059C must be inhibited (held high) until the
protection latch circuitry is reset. To reset this latch before
inverter start-up, RESET pin on J3 connector must be pulled
down low for at least 2 µsec. This will set the Fault feedback
signal on J3 high. Now, the PWM input signals can be applied
for inverter start-up.
Power-Down Procedure
The following sequence is recommended for normal power
down:
1. reduce motor speed by PWM control
2. inhibit PWM inputs
3. disconnect main power.
Figure 7b. Input and Output Terminal Blocks
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IRPT1059
IRPT1059D Mechanical Specifications
NOTE: Dimensions are in inches [milliimeters]
4.125
(104.775)
2.25
(57.15)
1.5625
(39.6875)
Capacitor
Capacitor
PCB
Heatsink
1
J3
12
1 2 3
J1
2.875
(73.025)
16
J2
1.500
(38.100)
Capacitor
2.625
(66.675)
1 2 J1
J2 1 2 3
Module
J3
.500
(12.701)
Heatsink
Figure 8a
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IRPT1059
IRPT1059A Mechanical Specifications
.750 [19.05]
ALL PIN COORDINATE DIMENSIONS ARE BASIC
.950 [24.13]
[3.81]
[6.35]
[11.43]
[13.97]
.150
.250
.450
.550
.150 [3.81]
.050 [1.27]
E1
G1
.750 [19.05]
.550 [13.97]
.450 [11.43]
RP
P
IS1
IS2
1.050 [26.67]
NOTE: Dimensions are in inches [milliimeters]
E5
G5
RT1
RT2
N/C
E3
G3
N
.875 [22.27]
PIN CENTER
W
PIN DIAGONAL
.037 – .034
[.940 – .864]
28X
1.050 [26.67]
.850 [21.59]
E4
G4
E6
G6
N/C
.650 [16.51]
V
U
.050 [1.27]
.000 [0.00]
.250 [6.35]
.350 [8.89]
IS4
IS3
E2
G2
N/C
.650 [16.51]
S
.850 [21.59]
PIN CENTER
.875 .[22.27]
R
.000 [0.00]
.010
M
A
28X [ .026 – .024)]
28X .040 [1.02]
MOUNTING SURFACE IN CLAMPED CONDITION
–A–
Figure 8b
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IRPT1059
Part Number Identification and Ordering Instructions
IRPT1059A Power Module
IRPT1059D Driver-Plus Board
Chip and wire epoxy encapsulated module with 800V
rectifiers, 600V short-circuit rated, ultra-fast IGBT inverter with
ultra-fast freewheeling diodes, temperature sensing NTC
thermistor and current-sensing low-inductance shunts.
Printed Circuit board assembled with DC link capacitors, NTC
in-rush limiting thermistor, high-power terminal blocks, surge
suppression MOVs, IGBT gate drivers, protection circuitry and
low power supply. The PCB is functionally tested with standard
power module to meet all system specifications.
IRPT1059C
Integrated Power Module (IRPT1059A) and Driver-Plus
Board (IRPT1059D) pre-assembled and tested to meet all system
specifications.
page 10
IRPT1059E Design Kit
Complete
(IRPT1059C) with full set of design
documentation including schematic diagram, bill of material,
mechanical layout, schematic files, Gerber files and design tips.
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IRPT1059
Functional Information
CAUTION:
All control logic is referenced to negative power bus
which is live with respect to earth/ground.
Capacitor Soft Charge
DC bus capacitors are connected to the rectifier bridge output
through an NTC. At power-up, the NTC limits the inrush current
to 150A. During normal operation current through the NTC
reduces its resistance, hence reducing its losses.
System Power Supply
A buck converter designed with IR2152 and operating from
the dc bus generates VCC (15V) and VDD(5V) for drive and
protection circuits. Both VCC and VDD are available at the
control connector to supply microprocessor controls. Total
current available from VCC and VDD (ICC and I D, respectively) is
60mA for external use.
Floating power supplies for high side devices are derived
through bootstrap technique, simplifying power supply
requirements.
Gate Drive Circuits
Gate drive for the inverter is implemented with an IR2132J
monolithic 3-phase HVIC driver. Short circuit buffer power
supply counters the voltage drop across a shunt in the negative dc
bus, allowing the device to have nominal gate voltage during
short circuit and maintaining short circuit current to a detectable
level.
The undervoltage circuit monitors the local gate driver power
supply voltage and sends a high input signal during
undervoltage, setting the latch and inhibiting the PWM input
signals.
System Protections
Short circuit is monitored through a shunt in the negative
bus, which detects phase-to-phase short circuits and phase-toearth short circuits (when current flows from earth to negative
bus). Voltage drop across the shunt is compared to a pre-set limit
and when the current exceeds a nominal value of 30A this
protection is activated.
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Earth/ground fault from positive bus to earth is detected by
the shunt in the postive bus and an opto-coupler. When fault
current exceeds a nominal value of 36A, this protection is
activated.
Overtemperature is measured by a thermistor mounted close
to the inverter section. When the substrate temperature exceeds a
nominal value of 100°C, this protection is activated.
If any of the protection features is activated, the TRIP signal
goes high and is latched high, activating the internal latch in
IR2132J, which turns all gates to the inverter section off,
acknowledging to the controller through FAULT and turns on the
LED.
Trip Reset
The internal latch of the IR2132J can be reset by holding IN2,
IN4 and IN6 OFF simultaneously for a period greater than 12 µs.
The TRIP signal can be removed by pulling down the RESET
pin through the open collector device for 2µs, this should be
done only after IN1,...,IN6 are turned OFF.
Interface with system controller
All signals are referred to negative DC bus (N). IN1,...IN6 are
TTL/CMOS compatible active low signals. Maximum voltage
rating for these signals is 5V. All channels are provided with
pull-up resistors and can be used with open collector inputs as
well.
FAULT is open collector, active low signal, provided with
47K pull-up resistor. Typical current sink capacity for this pin is
5 mA.
RESET should be applied with open collector device only and
only after IN1,...IN6 are turned OFF. Recommended RESET
pulse duration is 2µs.
VDD is 5V and VCC is 15V output. If 5V output is used with a
large external capacitor, a diode should be connected between
VDD (anode) and VCC (cathode) to ensure that V DD does not
exceed VCC, due to potentially different discharge times for
storage capacitors when power is turned OFF.
VFB is scaled down dc bus voltage (0.023 X Vbus nominal).
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IRPT1059
I FB is DC bus current, 0.045V/A nominal. This pin must not be
connected to circuit ground (N) through low impedance. If
filtering of this signal is required, it shoud be done by adding a
high impedance buffer stage between signal and filter.
Heat sink Requirements
Figures 5a and 5b of the IRPT1059 datasheet show the
thermal resistance of the heat sink required for various output
power levels and PWM switching frequencies. Maximum total
losses of the unit are also shown.
This data is based on the following key operating conditions:
• The maximum continuous combined losses of the rectifier
and inverter occur at full pulse-width-modulation. These
maximum losses set the maximum continuous operating
temperature of the heat sink.
• The maximum combined losses of the rectifier and
inverter at full pulse-width modulation under overload set
the incremental temperature rise of the heat sink during
overload, which is limited to 10°C due to ZthSA.
• The minimum output frequency at which full overload
current is to be delivered sets the peak IGBT junction
temperatures.
• At low output frequency IGBT junction temperature tends
to follow the instantaneous fluctuations of the output
current. Thus, peak junction temperature rise increases as
output frequency decreases.
Voltage Rise During Braking
The motor will feed energy back to the DC link during electric
braking, forcing DC bus voltage to rise above the level defined
by input line voltage. Deceleration of the motor must be
controlled by appropriate PWM control to keep the DC bus
voltage within the rated maximum value.
WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, Tel: (310) 322 3331
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IR FAR EAST: 171 (K&H Bldg.), 30-4 Nishi-ikebukuro 3-Chome, Toshima-ku, Tokyo Japan Tel: 81 3 3983 0086
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Data and specifications subject to change without notice.
8/97
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