ON MURD620CTG Switchmode power rectifier Datasheet

MURD620CT
SWITCHMODE
Power Rectifier
DPAK Surface Mount Package
These state−of−the−art devices are designed for use in switching
power supplies, inverters and as free wheeling diodes.
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ULTRAFAST RECTIFIER
6.0 AMPERES
200 VOLTS
Features
•
•
•
•
Ultrafast 35 Nanosecond Recovery Time
Low Forward Voltage Drop
Low Leakage
Pb−Free Packages are Available
1
4
Mechanical Characteristics:
3
• Case: Epoxy, Molded
• Weight: 0.4 Gram (Approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
•
Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
200
V
Average Rectified Forward Current
(Rated VR, TC = 140°C)
Per Diode
Per Device
IF(AV)
Peak Repetitive Forward Current
(Rated VR, Square Wave,
Per Diode
20 kHz, TC = 145°C)
IF
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions
Halfwave, 60 Hz)
Operating Junction and Storage
Temperature Range
4
1 2
DPAK
CASE 369C
3
A
Y
WW
U620T
G
= Assembly Location
= Year
= Work Week
= Device Code
= Pb−Free Package
ORDERING INFORMATION
6.0
A
Package
Shipping†
DPAK
75 Units/Rail
MURD620CTG
DPAK
(Pb−Free)
75 Units/Rail
MURD620CTT4
DPAK
2500/Tape & Reel
DPAK
(Pb−Free)
2500/Tape & Reel
Device
MURD620CT
IFSM
50
A
TJ, Tstg
−65 to +175
°C
MURD620CTT4G
Symbol
AYWW
U
620TG
A
3.0
6.0
THERMAL CHARACTERISTICS (Per Diode)
Rating
MARKING
DIAGRAM
Value
Unit
Thermal Resistance, Junction−to−Case
RqJC
9
°C/W
Thermal Resistance, Junction−to−Ambient
(Note 1)
RqJA
80
°C/W
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Rating applies when surface mounted on the minimum pad sizes
recommended.
© Semiconductor Components Industries, LLC, 2011
January, 2011 − Rev. 9
1
Publication Order Number:
MURD620CT/D
MURD620CT
ELECTRICAL CHARACTERISTICS (Per Diode)
Rating
Symbol
Maximum Instantaneous Forward Voltage Drop (Note 2)
(iF = 3 Amps, TC = 25°C)
(iF = 3 Amps, TC = 125°C)
(iF = 6 Amps, TC = 25°C)
(iF = 6 Amps, TC = 125°C)
vF
Maximum Instantaneous Reverse Current (Note 2)
(TJ = 25°C, Rated dc Voltage)
(TJ = 125°C, Rated dc Voltage)
iR
Maximum Reverse Recovery Time
(IF = 1 Amp, di/dt = 50 Amps/ms, VR = 30 V, TJ = 25°C)
(IF = 0.5 Amp, iR = 1 Amp, IREC = 0.25 A, VR = 30 V, TJ = 25°C)
trr
Value
Unit
V
1
0.96
1.2
1.13
mA
5
250
ns
35
25
2. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%.
100
100
IR, REVERSE CURRENT (mA)
70
50
20
10
7.0
150°C
1
100°C
0.1
0.01
25°C
0.001
0.0001
0
20
40
5.0
60 80 100 120 140 160 180 200
VR, REVERSE VOLTAGE (V)
Figure 2. Typical Leakage Current* (Per Leg)
3.0
175°C
* The curves shown are typical for the highest voltage device in the
voltage grouping. Typical reverse current for lower voltage selections
can be estimated from these curves if VR is sufficiently below rated
VR.
TJ = 25°C
2.0
150°C
100°C
1.0
0.7
0.5
0.3
0.2
0.1
0
0.2
0.4
0.6
0.8
1.0
1.2
vF, INSTANTANEOUS VOLTAGE (V)
1.4
PF(AV) , AVERAGE POWER DISSIPATION (WATTS)
i , INSTANTANEOUS FORWARD CURRENT (AMPS)
F
30
TJ = 175°C
10
14
13
12
11
10
9.0
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0
5.0
10
SINE
WAVE
IPK/IAV = 20
dc
SQUARE
WAVE
TJ = 175°C
1.0
0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10
IF(AV), AVERAGE FORWARD CURRENT (A)
Figure 1. Typical Forward Voltage (Per Leg)
Figure 3. Average Power Dissipation (Per Leg)
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2
IF(AV) , AVERAGE FORWARD CURRENT (AMPS)
8.0
RATED VOLTAGE APPLIED
RqJC = 9°C/W
7.0
6.0
TJ = 175°C
5.0
dc
4.0
SINE WAVE
OR
SQUARE WAVE
3.0
2.0
1.0
0
100
110
120
130
140
150
160
170
4.0
RATED VOLTAGE APPLIED
RqJA = 80°C/W
3.5
3.0
SURFACE MOUNTED ON
MIN. PAD SIZE RECOMMENDED
2.5
2.0
dc
TJ = 175°C
1.5
SINE WAVE
OR
SQUARE WAVE
1.0
0.5
0
180
0
20
40
60
80
100
120
140
160
180 200
TC, CASE TEMPERATURE (°C)
TA, AMBIENT TEMPERATURE (°C)
Figure 4. Current Derating, Case (Per Leg)
Figure 5. Current Derating, Ambient (Per Leg)
100
C, CAPACITANCE (pF)
IF(AV) , AVERAGE FORWARD CURRENT (AMPS)
MURD620CT
TJ = 25°C
10
1
0
10
20
30
40
50
60
70
80
VR, REVERSE VOLTAGE (V)
Figure 6. Typical Capacitance (Per Leg)
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3
90
100
MURD620CT
PACKAGE DIMENSIONS
DPAK (SINGLE GAUGE)
CASE 369C−01
ISSUE D
A
E
b3
c2
B
Z
D
1
L4
A
4
L3
b2
e
2
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. THERMAL PAD CONTOUR OPTIONAL WITHIN DIMENSIONS b3, L3 and Z.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL
NOT EXCEED 0.006 INCHES PER SIDE.
5. DIMENSIONS D AND E ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY.
6. DATUMS A AND B ARE DETERMINED AT DATUM
PLANE H.
C
H
DETAIL A
3
c
b
0.005 (0.13)
M
H
C
L2
GAUGE
PLANE
C
L
SEATING
PLANE
A1
L1
DETAIL A
ROTATED 905 CW
DIM
A
A1
b
b2
b3
c
c2
D
E
e
H
L
L1
L2
L3
L4
Z
INCHES
MIN
MAX
0.086 0.094
0.000 0.005
0.025 0.035
0.030 0.045
0.180 0.215
0.018 0.024
0.018 0.024
0.235 0.245
0.250 0.265
0.090 BSC
0.370 0.410
0.055 0.070
0.108 REF
0.020 BSC
0.035 0.050
−−− 0.040
0.155
−−−
MILLIMETERS
MIN
MAX
2.18
2.38
0.00
0.13
0.63
0.89
0.76
1.14
4.57
5.46
0.46
0.61
0.46
0.61
5.97
6.22
6.35
6.73
2.29 BSC
9.40 10.41
1.40
1.78
2.74 REF
0.51 BSC
0.89
1.27
−−−
1.01
3.93
−−−
SOLDERING FOOTPRINT*
6.20
0.244
2.58
0.102
5.80
0.228
3.00
0.118
1.60
0.063
6.17
0.243
SCALE 3:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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MURD620CT/D
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