ON MSC3130T1 Npn rf amplifier transistor surface mount Datasheet

MSC3130T1
Preferred Device
NPN RF Amplifier Transistor
Surface Mount
MAXIMUM RATINGS (TA = 25°C)
Symbol
Value
Unit
Collector−Base Voltage
VCBO
15
Vdc
Collector−Emitter Voltage
VCEO
10
Vdc
Emitter−Base Voltage
VEBO
3.0
Vdc
IC
50
mAdc
Symbol
Max
Unit
Power Dissipation
PD
200
mW
Junction Temperature
TJ
150
°C
Storage Temperature
Tstg
−55 ~ +150
°C
Rating
Collector Current − Continuous
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COLLECTOR
3
THERMAL CHARACTERISTICS
Characteristic
2
BASE
1
EMITTER
3
2
ELECTRICAL CHARACTERISTICS (TA = 25°C)
1
Symbol
Min
Max
Unit
Collector Cutoff Current
(VCB = 10 Vdc, IE = 0)
ICBO
—
1.0
mAdc
Collector−Emitter Breakdown Voltage
(IC = 2.0 mAdc, IB = 0)
VCEO
10
−
Vdc
Emitter−Base Breakdown Voltage
(IE = 10 mAdc, IC = 0)
VEBO
3.0
−
Vdc
DC Current Gain (Note 1)
(VCE = 4.0 Vdc, IC = 5.0 mAdc)
hFE
75
400
−
Collector−Emitter Saturation Voltage
(IC = 20 mAdc, IB = 4.0 mAdc)
VCE(sat)
−
0.5
Vdc
Current−Gain − Bandwidth Product
(VCB = 4.0 Vdc, IE = −5.0 mAdc)
fT
1.4
2.5
GHz
Characteristic
1. Pulse Test: Pulse Width ≤ 300 ms, D.C. v 2%.
SC−59
SUFFIX
CASE 318D
MARKING DIAGRAM
1S M
1S = Specific Device Code
M = Date Code
Preferred devices are recommended choices for future use
and best overall value.
© Semiconductor Components Industries, LLC, 2006
August, 2006 − Rev. 4
1
Publication Order Number:
MSC3130T1/D
MSC3130T1
INFORMATION FOR USING THE SC−59 SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
interface between the board and the package. With the
correct pad geometry, the packages will self align when
subjected to a solder reflow process.
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor packages must
be the correct size to insure proper solder connection
0.037
0.95
0.037
0.95
0.094
2.4
0.039
1.0
0.031
0.8
inches
mm
SC−59 POWER DISSIPATION
The power dissipation of the SC−59 is a function of the
pad size. This can vary from the minimum pad size for soldering to the pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by TJ(max), the maximum rated junction temperature
of the die, RqJA, the thermal resistance from the device
junction to ambient; and the operating temperature, TA. Using the values provided on the data sheet, PD can be calculated as follows.
PD =
the equation for an ambient temperature TA of 25°C, one
can calculate the power dissipation of the device which in
this case is 338 milliwatts.
PD =
150°C − 25°C
370°C/W
= 338 milliwatts
The 370°C/W assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a
power dissipation of 338 milliwatts. Another alternative
would be to use a ceramic substrate or an aluminum core
board such as Thermal Clad™. Using a board material such
as Thermal Clad, the power dissipation can be doubled using the same footprint.
TJ(max) − TA
RqJA
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values into
SOLDERING PRECAUTIONS
The melting temperature of solder is higher than the rated
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within
a short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are subjected.
• Always preheat the device.
• The delta temperature between the preheat and soldering should be 100°C or less.*
• When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method,
the difference should be a maximum of 10°C.
• The soldering temperature and time should not exceed
•
•
•
260°C for more than 10 seconds.
When shifting from preheating to soldering, the maximum temperature gradient should be 5°C or less.
After soldering has been completed, the device should
be allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and result in latent failure due to mechanical stress.
Mechanical stress or shock should not be applied during cooling
* Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage
to the device.
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2
MSC3130T1
SOLDER STENCIL GUIDELINES
The stencil opening size for the surface mounted package
should be the same as the pad size on the printed circuit
board, i.e., a 1:1 registration.
Prior to placing surface mount components onto a printed
circuit board, solder paste must be applied to the pads. A
solder stencil is required to screen the optimum amount of
solder paste onto the footprint. The stencil is made of brass
or stainless steel with a typical thickness of 0.008 inches.
TYPICAL SOLDER HEATING PROFILE
The line on the graph shows the actual temperature that
might be experienced on the surface of a test board at or
near a central solder joint. The two profiles are based on a
high density and a low density board. The Vitronics
SMD310 convection/infrared reflow soldering system was
used to generate this profile. The type of solder used was
62/36/2 Tin Lead Silver with a melting point between
177−189°C. When this type of furnace is used for solder reflow work, the circuit boards and solder joints tend to heat
first. The components on the board are then heated by conduction. The circuit board, because it has a large surface
area, absorbs the thermal energy more efficiently, then distributes this energy to the components. Because of this effect, the main body of a component may be up to 30 degrees
cooler than the adjacent solder joints.
For any given circuit board, there will be a group of control settings that will give the desired heat pattern. The operator must set temperatures for several heating zones, and
a figure for belt speed. Taken together, these control settings make up a heating “profile” for that particular circuit
board. On machines controlled by a computer, the computer remembers these profiles from one operating session to
the next. Figure 7 shows a typical heating profile for use
when soldering a surface mount device to a printed circuit
board. This profile will vary among soldering systems but
it is a good starting point. Factors that can affect the profile
include the type of soldering system in use, density and
types of components on the board, type of solder used, and
the type of board or substrate material being used. This profile
shows
temperature
versus
time.
STEP 1
PREHEAT
ZONE 1
RAMP"
200°C
150°C
STEP 5
STEP 4
HEATING
HEATING
ZONES 3 & 6 ZONES 4 & 7
SPIKE"
SOAK"
STEP 2
STEP 3
VENT
HEATING
SOAK" ZONES 2 & 5
RAMP"
DESIRED CURVE FOR HIGH
MASS ASSEMBLIES
205° TO 219°C
PEAK AT
SOLDER JOINT
170°C
160°C
150°C
140°C
100°C
100°C
50°C
STEP 6 STEP 7
VENT COOLING
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
(DEPENDING ON
MASS OF ASSEMBLY)
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
TIME (3 TO 7 MINUTES TOTAL)
TMAX
Figure 1. Typical Solder Heating Profile
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3
MSC3130T1
PACKAGE DIMENSIONS
SC−59
CASE 318D−04
ISSUE F
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
L
3
S
2
DIM
A
B
C
D
G
H
J
K
L
S
B
1
D
G
J
C
H
MILLIMETERS
MIN
MAX
2.70
3.10
1.30
1.70
1.00
1.30
0.35
0.50
1.70
2.10
0.013
0.100
0.09
0.18
0.20
0.60
1.25
1.65
2.50
3.00
INCHES
MIN
MAX
0.1063 0.1220
0.0512 0.0669
0.0394 0.0511
0.0138 0.0196
0.0670 0.0826
0.0005 0.0040
0.0034 0.0070
0.0079 0.0236
0.0493 0.0649
0.0985 0.1181
STYLE 1:
PIN 1. EMITTER
2. BASE
3. COLLECTOR
K
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are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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