GlobalOptoisolator " ! ! (400 Volts Peak) The MOC3020 Series consists of gallium arsenide infrared emitting diodes, optically coupled to a silicon bilateral switch. • To order devices that are tested and marked per VDE 0884 requirements, the suffix ”V” must be included at end of part number. VDE 0884 is a test option. They are designed for applications requiring isolated triac triggering. Recommended for 115/240 Vac(rms) Applications: • Solenoid/Valve Controls • Lamp Ballasts • Interfacing Microprocessors to 115 Vac Peripherals • Static ac Power Switch • Solid State Relays • Incandescent Lamp Dimmers 6 1 STANDARD THRU HOLE • Motor Controls SCHEMATIC MAXIMUM RATINGS (TA = 25°C unless otherwise noted) Rating Symbol Value Unit Reverse Voltage VR 3 Volts Forward Current — Continuous IF 60 mA Total Power Dissipation @ TA = 25°C Negligible Power in Triac Driver Derate above 25°C PD 100 mW 1.33 mW/°C INFRARED EMITTING DIODE OUTPUT DRIVER Off–State Output Terminal Voltage VDRM 400 Volts Peak Repetitive Surge Current (PW = 1 ms, 120 pps) ITSM 1 A PD 300 4 mW mW/°C VISO 7500 Vac(pk) PD 330 4.4 mW mW/°C Junction Temperature Range TJ – 40 to +100 °C Ambient Operating Temperature Range TA – 40 to +85 °C Storage Temperature Range Tstg – 40 to +150 °C Soldering Temperature (10 s) TL 260 °C Total Power Dissipation @ TA = 25°C Derate above 25°C 1 6 2 5 3 4 1. 2. 3. 4. 5. 5. 6. ANODE CATHODE NC MAIN TERMINAL SUBSTRATE DO NOT CONNECT MAIN TERMINAL TOTAL DEVICE Isolation Surge Voltage(1) (Peak ac Voltage, 60 Hz, 1 Second Duration) Total Power Dissipation @ TA = 25°C Derate above 25°C 1. Isolation surge voltage, VISO, is an internal device dielectric breakdown rating. 1. For this test, Pins 1 and 2 are common, and Pins 4, 5 and 6 are common. 1 MOC3021, MOC3022, MOC3023 ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Characteristic Symbol Min Typ Max Unit Reverse Leakage Current (VR = 3 V) IR — 0.05 100 µA Forward Voltage (IF = 10 mA) VF — 1.15 1.5 Volts Peak Blocking Current, Either Direction (Rated VDRM(1)) IDRM — 10 100 nA Peak On–State Voltage, Either Direction (ITM = 100 mA Peak) VTM — 1.8 3 Volts Critical Rate of Rise of Off–State Voltage (Figure 7, Note 2) dv/dt — 10 — V/µs — — — 8 — — 15 10 5 — 100 — INPUT LED OUTPUT DETECTOR (IF = 0 unless otherwise noted) COUPLED LED Trigger Current, Current Required to Latch Output (Main Terminal Voltage = 3 V(3)) MOC3021 MOC3022 MOC3023 IFT Holding Current, Either Direction IH 1. 2. 3. 3. mA µA Test voltage must be applied within dv/dt rating. This is static dv/dt. See Figure 7 for test circuit. Commutating dv/dt is a function of the load–driving thyristor(s) only. All devices are guaranteed to trigger at an IF value less than or equal to max IFT. Therefore, recommended operating IF lies between max IFT (15 mA for MOC3021, 10 mA for MOC3022, 5 mA for MOC3023) and absolute max IF (60 mA). TYPICAL ELECTRICAL CHARACTERISTICS TA = 25°C +800 ITM , ON-STATE CURRENT (mA) VF, FORWARD VOLTAGE (VOLTS) 2 1.8 PULSE ONLY PULSE OR DC 1.6 1.4 TA = –40°C 25°C 1.2 85°C 1 1 +400 0 –400 –800 10 100 IF, LED FORWARD CURRENT (mA) 1000 Figure 1. LED Forward Voltage versus Forward Current –3 –2 –1 0 1 2 VTM, ON–STATE VOLTAGE (VOLTS) Figure 2. On–State Characteristics 3 MOC3021, MOC3022, MOC3023 IFT, NORMALIZED LED TRIGGER CURRENT IFT, TRIGGER CURRENT – NORMALIZED 1.4 1.3 1.2 1.1 1 0.9 0.8 0.7 0.6 –40 –20 0 20 40 60 TA, AMBIENT TEMPERATURE (°C) 80 100 25 NORMALIZED TO: PWin 100 µs q 20 15 10 5 0 1 2 Figure 3. Trigger Current versus Temperature 100 100 I DRM, LEAKAGE CURRENT (nA) STATIC dv/dt CIRCUIT IN FIGURE 7 10 dv/dt, STATIC (V/ µs) 50 Figure 4. LED Current Required to Trigger versus LED Pulse Width 12 8 6 4 2 0 25 30 5 10 20 PWin, LED TRIGGER WIDTH (µs) 40 50 60 70 80 TA, AMBIENT TEMPERATURE (°C) 90 10 1 – 40 – 30 – 20 –10 0 10 20 30 40 50 60 TA, AMBIENT TEMPERATURE (°C) 100 Figure 5. dv/dt versus Temperature +400 Vdc PULSE INPUT APPLIED VOLTAGE WAVEFORM RTEST 1. The mercury wetted relay provides a high speed repeated pulse to the D.U.T. 2. 100x scope probes are used, to allow high speeds and voltages. 3. The worst–case condition for static dv/dt is established by triggering the D.U.T. with a normal LED input current, then removing the current. The variable RTEST allows the dv/dt to be gradually increased until the D.U.T. continues to trigger in response to the applied voltage pulse, even after the LED current has been removed. The dv/dt is then decreased until the D.U.T. stops triggering. tRC is measured at this point and recorded. R = 10 kΩ D.U.T. X100 SCOPE PROBE Vmax = 400 V 252 V ń + 0.63 RCVmax + 252 RC dv dt 0 VOLTS 80 Figure 6. Leakage Current, IDRM versus Temperature CTEST MERCURY WETTED RELAY 70 t tRC Figure 7. Static dv/dt Test Circuit t MOC3021, MOC3022, MOC3023 VCC Rin 6 1 2 3 MOC 3021/ 3022/ 3023 360 470 HOT 5 0.05 µF 240 VAC 39 4 0.01 µF LOAD * This optoisolator should not be used to drive a load directly. It is intended to be a trigger device only. Additional information on the use of optically coupled triac drivers is available in Application Note AN–780A. GROUND In this circuit the “hot” side of the line is switched and the load connected to the cold or ground side. The 39 ohm resistor and 0.01 µF capacitor are for snubbing of the triac, and the 470 ohm resistor and 0.05 µF capacitor are for snubbing the coupler. These components may or may not be necessary depending upon the particular triac and load used. Figure 8. Typical Application Circuit MOC3021, MOC3022, MOC3023 PACKAGE DIMENSIONS –A– 6 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4 –B– 1 3 F 4 PL C N –T– L K SEATING PLANE J 6 PL 0.13 (0.005) G M E 6 PL D 6 PL 0.13 (0.005) M T A B M M T B M A M DIM A B C D E F G J K L M N M INCHES MIN MAX 0.320 0.350 0.240 0.260 0.115 0.200 0.016 0.020 0.040 0.070 0.010 0.014 0.100 BSC 0.008 0.012 0.100 0.150 0.300 BSC 0_ 15 _ 0.015 0.100 STYLE 6: PIN 1. 2. 3. 4. 5. 6. MILLIMETERS MIN MAX 8.13 8.89 6.10 6.60 2.93 5.08 0.41 0.50 1.02 1.77 0.25 0.36 2.54 BSC 0.21 0.30 2.54 3.81 7.62 BSC 0_ 15 _ 0.38 2.54 ANODE CATHODE NC MAIN TERMINAL SUBSTRATE MAIN TERMINAL THRU HOLE –A– 6 4 –B– 1 S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3 F 4 PL L H C –T– G J K 6 PL E 6 PL 0.13 (0.005) D 6 PL 0.13 (0.005) M T A M B M SEATING PLANE T B M A M M SURFACE MOUNT DIM A B C D E F G H J K L S INCHES MIN MAX 0.320 0.350 0.240 0.260 0.115 0.200 0.016 0.020 0.040 0.070 0.010 0.014 0.100 BSC 0.020 0.025 0.008 0.012 0.006 0.035 0.320 BSC 0.332 0.390 MILLIMETERS MIN MAX 8.13 8.89 6.10 6.60 2.93 5.08 0.41 0.50 1.02 1.77 0.25 0.36 2.54 BSC 0.51 0.63 0.20 0.30 0.16 0.88 8.13 BSC 8.43 9.90 MOC3021, MOC3022, MOC3023 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. –A– 6 4 –B– 1 3 L N F 4 PL C –T– SEATING PLANE G J K D 6 PL E 6 PL 0.13 (0.005) M T A M B M 0.4" LEAD SPACING DIM A B C D E F G J K L N INCHES MIN MAX 0.320 0.350 0.240 0.260 0.115 0.200 0.016 0.020 0.040 0.070 0.010 0.014 0.100 BSC 0.008 0.012 0.100 0.150 0.400 0.425 0.015 0.040 MILLIMETERS MIN MAX 8.13 8.89 6.10 6.60 2.93 5.08 0.41 0.50 1.02 1.77 0.25 0.36 2.54 BSC 0.21 0.30 2.54 3.81 10.16 10.80 0.38 1.02 DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. 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