MOTOROLA MBRB20100CT-D

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by MBRB20100CT/D
SEMICONDUCTOR TECHNICAL DATA
  D2PAK Surface Mount Power Package
Motorola Preferred Device
The D2PAK Power Rectifier employs the use of the Schottky Barrier principle
with a platinum barrier metal. These state–of–the–art devices have the
following features:
SCHOTTKY BARRIER
RECTIFIER
20 AMPERES
100 VOLTS
• Package Designed for Power Surface Mount Applications
• Center–Tap Configuration
• Guardring for Stress Protection
• Low Forward Voltage
• 150°C Operating Junction Temperature
• Epoxy Meets UL94, VO at 1/8″
• Guaranteed Reverse Avalanche
• Short Heat Sink Tab Manufactured — Not Sheared!
1
• Similar in Size to Industry Standard TO–220 Package
Mechanical Characteristics
3
• Case: Epoxy, Molded
• Weight: 1.7 grams (approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal Leads are
Readily Solderable
• Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
• Shipped 50 units per plastic tube
• Available in 24 mm Tape and Reel, 800 units per 13″ reel by adding a “T4”
suffix to the part number
• Marking: B20100T
4
4
1
3
CASE 418B–02
D2PAK
MAXIMUM RATINGS, PER LEG
Rating
Symbol
Value
Unit
VRRM
VRWM
VR
100
Volts
IF(AV)
10
20
Amps
Peak Repetitive Forward Current
(Rated VR, Square Wave, 20 kHz), TC = 100°C
IFRM
20
Amps
Non-repetitive Peak Surge Current
(Surge applied at rated load conditions halfwave, single phase, 60 Hz)
IFSM
150
Amps
Peak Repetitive Reverse Surge Current (2.0 µs, 1.0 kHz)
IRRM
0.5
Amp
Tstg
– 65 to +175
°C
TJ
– 65 to +150
°C
dv/dt
10000
V/µs
RθJC
RθJA
2.0
50
°C/W
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Average Rectified Forward Current
(Rated VR) TC = 110°C
Total Device
Storage Temperature
Operating Junction Temperature
Voltage Rate of Change (Rated VR)
THERMAL CHARACTERISTICS, PER LEG
Thermal Resistance — Junction to Case
— Junction to Ambient (1)
(1) See Chapter 7 for mounting conditions
Designer’s Data for “Worst Case” Conditions — The Designer’s Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit
curves — representing boundaries on device characteristics — are given to facilitate “worst case” design.
Designer’s and SWITCHMODE are trademarks of Motorola, Inc.
Thermal Clad is a trademark of the Bergquist Company
Preferred devices are Motorola recommended choices for future use and best overall value.
Rev 1
Device
Rectifier
Motorola, Inc.
1996 Data
1
MBRB20100CT
ELECTRICAL CHARACTERISTICS, PER LEG
Rating
Symbol
Value
Unit
Maximum Instantaneous Forward Voltage (2)
(iF = 10 Amp, TC = 125°C)
(iF = 10 Amp, TC = 25°C)
(iF = 20 Amp, TC = 125°C)
(iF = 20 Amp, TC = 25°C)
vF
0.75
0.85
0.85
0.95
Volts
Maximum Instantaneous Reverse Current (2)
(Rated dc Voltage, TJ = 125°C)
(Rated dc Voltage, TJ = 25°C)
iR
6.0
0.1
mA
50
TJ = 150°C
150°C
20
I R, REVERSE CURRENT (mA)
i F, INSTANTANEOUS FORWARD CURRENT (AMPS)
(2) Pulse Test: Pulse Width = 300 µs, Duty Cycle ≤ 2.0%.
175°C
10
100°C
5
TJ = 25°C
3
1
10
TJ = 125°C
TJ = 100°C
1
0.1
0.01
0.5
0
0.1
0.2
0.3
0.4
0.5 0.6
0.7
0.8
vF, INSTANTANEOUS VOLTAGE (VOLTS)
0.9
1
TJ = 25°C
0
20
32
RATED VOLTAGE
APPLIED
28
18
24
RθJC = 2°C/W
20
16
DC
SQUARE
WAVE
12
8
120
IPK/IAV = 5
TJ = 125°C
PI
16
IPK/IAV = 10
14
12
IPK/IAV = 20
10
SQUARE
WAVE
8
6
DC
4
4
0
80
2
90
100
110
120
130
140
TC, CASE TEMPERATURE (°C)
150
Figure 3. Typical Current Derating, Case,
Per Leg
2
40
60
80
100
VR, REVERSE VOLTAGE (VOLTS)
Figure 2. Typical Reverse Current Per Diode
AVERAGE POWER (WATTS)
I F(AV), AVERAGE FORWARD CURRENT (AMPS)
Figure 1. Typical Forward Voltage Per Diode
20
160
0
0
2
4
6
8
10
12
14
AVERAGE CURRENT (AMPS)
16
18
20
Figure 4. Average Power Dissipation and
Average Current
Rectifier Device Data
MBRB20100CT
INFORMATION FOR USING THE D2PAK SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor packages must be
the correct size to insure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will self align when subjected to a
solder reflow process.
0.74
18.79
0.065
1.651
0.420
10.66
0.07
1.78
0.330
8.38
0.14
3.56
inches
mm
D2PAK POWER DISSIPATION
The power dissipation of the D2PAK is a function of the drain
pad size. This can vary from the minimum pad size for
soldering to a pad size given for maximum power dissipation.
Power dissipation for a surface mount device is determined by
TJ(max), the maximum rated junction temperature of the die,
RθJA, the thermal resistance from the device junction to
ambient; and the operating temperature, TA. Using the values
provided on the data sheet for the D2PAK package, PD can be
calculated as follows:
PD =
TJ(max) – TA
RθJA
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values into
the equation for an ambient temperature TA of 25°C, one can
calculate the power dissipation of the device which in this case
is 2.5 watts.
PD =
The 50°C/W for the D2PAK package assumes the use of the
recommended footprint on a glass epoxy printed circuit board
to achieve a power dissipation of 2.5 watts. There are other
alternatives to achieving higher power dissipation from the
D2PAK package. One is to increase the area of the drain pad.
By increasing the area of the drain pad, the power dissipation
can be increased. Although one can almost double the power
dissipation with this method, one will be giving up area on the
printed circuit board which can defeat the purpose of using
surface mount technology.
Another alternative would be to use a ceramic substrate or
an aluminum core board such as Thermal Clad. Using a
board material such as Thermal Clad, an aluminum core
board, the power dissipation can be doubled using the same
footprint.
150°C – 25°C
= 2.5 watts
50°C/W
Rectifier Device Data
3
MBRB20100CT
SOLDERING PRECAUTIONS
• When shifting from preheating to soldering, the maximum
The melting temperature of solder is higher than the rated
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within a
short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.
• Always preheat the device.
• The delta temperature between the preheat and soldering
should be 100°C or less.*
• When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering method,
the difference shall be a maximum of 10°C.
• The soldering temperature and time shall not exceed
260°C for more than 5 seconds.
temperature gradient shall be 5°C or less.
• After soldering has been completed, the device should be
allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and result
in latent failure due to mechanical stress.
• Mechanical stress or shock should not be applied during
cooling.
* Soldering a device without preheating can cause excessive
thermal shock and stress which can result in damage to the
device.
* Due to shadowing and the inability to set the wave height to
incorporate other surface mount components, the D2PAK is
not recommended for wave soldering.
TYPICAL SOLDER HEATING PROFILE
the graph shows the actual temperature that might be
experienced on the surface of a test board at or near a central
solder joint. The two profiles are based on a high density and
a low density board. The Vitronics SMD310 convection/infrared reflow soldering system was used to generate this
profile. The type of solder used was 62/36/2 Tin Lead Silver
with a melting point between 177 –189°C. When this type of
furnace is used for solder reflow work, the circuit boards and
solder joints tend to heat first. The components on the board
are then heated by conduction. The circuit board, because it
has a large surface area, absorbs the thermal energy more
efficiently, then distributes this energy to the components.
Because of this effect, the main body of a component may be
up to 30 degrees cooler than the adjacent solder joints.
For any given circuit board, there will be a group of control
settings that will give the desired heat pattern. The operator
must set temperatures for several heating zones, and a figure
for belt speed. Taken together, these control settings make up
a heating “profile” for that particular circuit board. On
machines controlled by a computer, the computer remembers
these profiles from one operating session to the next. Figure
5 shows a typical heating profile for use when soldering the
D2PAK to a printed circuit board. This profile will vary among
soldering systems but it is a good starting point. Factors that
can affect the profile include the type of soldering system in
use, density and types of components on the board, type of
solder used, and the type of board or substrate material being
used. This profile shows temperature versus time. The line on
STEP 1
PREHEAT
ZONE 1
“RAMP”
STEP 2
STEP 3
VENT
HEATING
“SOAK” ZONES 2 & 5
“RAMP”
STEP 4
HEATING
ZONES 3 & 6
“SOAK”
200°C
DESIRED CURVE FOR HIGH
MASS ASSEMBLIES
STEP 5
HEATING
ZONES 4 & 7
“SPIKE”
STEP 6
VENT
STEP 7
COOLING
205° TO 219°C
PEAK AT
SOLDER JOINT
170°C
160°C
150°C
150°C
140°C
100°C
100°C
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
(DEPENDING ON
MASS OF ASSEMBLY)
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
50°C
TIME (3 TO 7 MINUTES TOTAL)
TMAX
Figure 5. Typical Solder Heating Profile for D2PAK
4
Rectifier Device Data
MBRB20100CT
PACKAGE DIMENSIONS
C
E
V
B
4
A
1
2
3
S
–T–
SEATING
PLANE
K
J
G
D 3 PL
0.13 (0.005)
H
M
T
CASE 418B–02
ISSUE B
Rectifier Device Data
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM
A
B
C
D
E
G
H
J
K
S
V
INCHES
MIN
MAX
0.340
0.380
0.380
0.405
0.160
0.190
0.020
0.035
0.045
0.055
0.100 BSC
0.080
0.110
0.018
0.025
0.090
0.110
0.575
0.625
0.045
0.055
STYLE 3:
PIN 1.
2.
3.
4.
MILLIMETERS
MIN
MAX
8.64
9.65
9.65
10.29
4.06
4.83
0.51
0.89
1.14
1.40
2.54 BSC
2.03
2.79
0.46
0.64
2.29
2.79
14.60
15.88
1.14
1.40
ANODE
CATHODE
ANODE
CATHODE
5
MBRB20100CT
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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
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arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
Motorola was negligent regarding the design or manufacture of the part. Motorola and
are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal
Opportunity/Affirmative Action Employer.
Mfax is a trademark of Motorola, Inc.
How to reach us:
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6
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CODELINE TO BE PLACED HERE
Rectifier
Device Data
MBRB20100CT/D