Order this document by MBRB2535CTL/D SEMICONDUCTOR TECHNICAL DATA D2PAK Surface Mount Power Package Motorola Preferred Device The D2PAK Power Rectifier employs the Schottky Barrier principle in a large metal–to–silicon power diode. State–of–the–art geometry features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for use in low voltage, high frequency switching power supplies, free wheeling diodes, and polarity protection diodes. These state–of–the–art devices have the following features: SCHOTTKY BARRIER RECTIFIER 25 AMPERES 35 VOLTS • Center–Tap Configuration • Guardring for Stress Protection • Low Forward Voltage • 125°C Operating Junction Temperature 4 • Epoxy Meets UL94, VO at 1/8″ 1 • Guaranteed Reverse Avalanche 4 1 • Short Heat Sink Tab Manufactured — Not Sheared! 3 3 • Similar in Size to the Industry Standard TO–220 Package CASE 418B–02 Mechanical Characteristics D2PAK • Case: Epoxy, Molded • Weight: 1.7 grams (approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable • Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds • Shipped 50 units per plastic tube • Available in 24 mm Tape and Reel, 800 units per 13″ reel by adding a “T4” suffix to the part number • Marking: B2535L MAXIMUM RATINGS (PER LEG) Rating Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 35 Volts Average Rectified Forward Current (Rated VR) TC = 110°C IF(AV) 12.5 Amps Peak Repetitive Forward Current (Rated VR, Square Wave, 20 kHz), TC = 90°C IFRM 25 Amps Nonrepetitive Peak Surge Current (Surge applied at rated load conditions halfwave, single phase, 60 Hz) IFSM 150 Amps Peak Repetitive Reverse Surge Current (2.0 µs, 1.0 kHz) IRRM 1.0 Amp Tstg – 65 to +150 °C TJ – 65 to +125 °C dv/dt 10,000 V/µs RθJC RθJA 2.0 50 °C/W Storage Temperature Operating Junction Temperature Voltage Rate of Change (Rated VR) THERMAL CHARACTERISTICS (PER LEG) Thermal Resistance — Junction to Case — Junction to Ambient (1) (1) When mounted using minimum recommended pad size on FR–4 board. Designer’s Data for “Worst Case” Conditions — The Designer’s Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit curves — representing boundaries on device characteristics — are given to facilitate “worst case” design. Designer’s and SWITCHMODE are trademarks of Motorola, Inc. Thermal Clad is a trademark of the Bergquist Company Preferred devices are Motorola recommended choices for future use and best overall value. Rev 1 Device Rectifier Motorola, Inc. 1996 Data 1 MBRB2535CTL ELECTRICAL CHARACTERISTICS (PER LEG) Rating Symbol Value Unit Maximum Instantaneous Forward Voltage (2) (iF = 25 Amps, TJ = 25°C) (iF = 12.5 Amps, TJ = 125°C) (iF = 12.5 Amps, TJ = 25°C) vF 0.55 0.41 0.47 Volts Maximum Instantaneous Reverse Current (2) (Rated dc Voltage, TJ = 125°C) (Rated dc Voltage, TJ = 25°C) iR 500 10 mA 1000 20 I R , REVERSE LEAKAGE CURRENT (mA) 50 TJ = 125°C 10 5 TJ = 25°C 2 1 0.5 0.2 0 0.1 0.2 100 TJ = 100°C 10 1 TJ = 25°C 0.1 0.3 0.4 0.5 0.6 0.7 0.8 0.9 10 10 15 20 25 30 Figure 1. Typical Forward Voltage, Per Leg Figure 2. Typical Reverse Current, Per Leg TJ = 125°C 35 SQUARE WAVE 30 25 SINE WAVE (RESISTIVE LOAD) 20 DC 15 10 5 0 5 VR, REVERSE VOLTAGE (VOLTS) 40 0 0 vF, INSTANTANEOUS VOLTAGE (VOLTS) 5 10 15 20 25 30 35 IF(AV), AVERAGE FORWARD CURRENT (AMPS) Figure 3. Typical Forward Power Dissipation 2 TJ = 125°C 0.1 IF(AV), AVERAGE FORWARD CURRENT (AMPS) PF(AV), AVERAGE FORWARD POWER DISSIPATION (WATTS) I F, INSTANTANEOUS FORWARD CURRENT (AMP) (2) Pulse Test: Pulse Width = 300 µs, Duty Cycle ≤ 2.0%. 40 35 32 (RATED Vr APPLIED) RθJC = 2°C/W 28 24 20 DC 16 SQUARE 12 8 4 0 85 95 105 115 TC, CASE TEMPERATURE (°C) 125 Figure 4. Current Derating, Case Rectifier Device Data MBRB2535CTL INFORMATION FOR USING THE D2PAK SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINTS FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process. 0.70 17.78 0.0625 1.587 0.450 11.43 0.08 2.032 0.350 8.89 0.15 3.81 inches mm D2PAK POWER DISSIPATION The power dissipation of the D2PAK is a function of the drain pad size. This can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by TJ(max), the maximum rated junction temperature of the die, RθJA, the thermal resistance from the device junction to ambient; and the operating temperature, TA. Using the values provided on the data sheet for the D2PAK package, PD can be calculated as follows: PD = TJ(max) – TA RθJA The values for the equation are found in the maximum ratings table on the data sheet. Substituting these values into the equation for an ambient temperature TA of 25°C, one can calculate the power dissipation of the device which in this case is 2.5 watts. PD = 150°C – 25°C = 2.5 watts 50°C/W The 50°C/W for the D2PAK package assumes the recommended drain pad area of 158K mil2 on FR–4 glass epoxy printed circuit board to achieve a power dissipation of 2.5 watts using the footprint shown. Another alternative is to use a ceramic substrate or an aluminum core board such as Thermal Clad. By using an aluminum core board material such as Thermal Clad, the power dissipation can be doubled using the same footprint. GENERAL SOLDERING PRECAUTIONS The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. • Always preheat the device. • The delta temperature between the preheat and soldering should be 100°C or less.* • When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference shall be a maximum of 10°C. • The soldering temperature and time shall not exceed 260°C for more than 5 seconds. Rectifier Device Data • When shifting from preheating to soldering, the maximum temperature gradient shall be 5°C or less. • After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. • Mechanical stress or shock should not be applied during cooling * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device. * Due to shadowing and the inability to set the wave height to incorporate other surface mount components, the D2PAK is not recommended for wave soldering. 3 MBRB2535CTL RECOMMENDED PROFILE FOR REFLOW SOLDERING the graph shows the actual temperature that might be experienced on the surface of a test board at or near a central solder joint. The two profiles are based on a high density and a low density board. The Vitronics SMD310 convection/infrared reflow soldering system was used to generate this profile. The type of solder used was 62/36/2 Tin Lead Silver with a melting point between 177 –189°C. When this type of furnace is used for solder reflow work, the circuit boards and solder joints tend to heat first. The components on the board are then heated by conduction. The circuit board, because it has a large surface area, absorbs the thermal energy more efficiently, then distributes this energy to the components. Because of this effect, the main body of a component may be up to 30 degrees cooler than the adjacent solder joints. For any given circuit board, there will be a group of control settings that will give the desired heat pattern. The operator must set temperatures for several heating zones, and a figure for belt speed. Taken together, these control settings make up a heating “profile” for that particular circuit board. On machines controlled by a computer, the computer remembers these profiles from one operating session to the next. Figure 5 shows a typical heating profile for use when soldering the D2PAK to a printed circuit board. This profile will vary among soldering systems but it is a good starting point. Factors that can affect the profile include the type of soldering system in use, density and types of components on the board, type of solder used, and the type of board or substrate material being used. This profile shows temperature versus time. The line on STEP 1 PREHEAT ZONE 1 “RAMP” STEP 2 STEP 3 VENT HEATING “SOAK” ZONES 2 & 5 “RAMP” STEP 4 HEATING ZONES 3 & 6 “SOAK” 200°C DESIRED CURVE FOR HIGH MASS ASSEMBLIES STEP 5 HEATING ZONES 4 & 7 “SPIKE” STEP 6 VENT STEP 7 COOLING 205° TO 219°C PEAK AT SOLDER JOINT 170°C 160°C 150°C 150°C 140°C 100°C 100°C SOLDER IS LIQUID FOR 40 TO 80 SECONDS (DEPENDING ON MASS OF ASSEMBLY) DESIRED CURVE FOR LOW MASS ASSEMBLIES 50°C TIME (3 TO 7 MINUTES TOTAL) TMAX Figure 5. Typical Solder Heating Profile for D2PAK 4 Rectifier Device Data MBRB2535CTL PACKAGE DIMENSIONS C E V B 4 A 1 2 3 S –T– SEATING PLANE K J G D 3 PL 0.13 (0.005) H M T CASE 418B–02 ISSUE B Rectifier Device Data NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D E G H J K S V INCHES MIN MAX 0.340 0.380 0.380 0.405 0.160 0.190 0.020 0.035 0.045 0.055 0.100 BSC 0.080 0.110 0.018 0.025 0.090 0.110 0.575 0.625 0.045 0.055 STYLE 3: PIN 1. 2. 3. 4. MILLIMETERS MIN MAX 8.64 9.65 9.65 10.29 4.06 4.83 0.51 0.89 1.14 1.40 2.54 BSC 2.03 2.79 0.46 0.64 2.29 2.79 14.60 15.88 1.14 1.40 ANODE CATHODE ANODE CATHODE 5 MBRB2535CTL Motorola reserves the right to make changes without further notice to any products herein. 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