SEMICONDUCTOR TECHNICAL DATA The MC10H165 is an 8–Input Priority Encoder. This 10H part is a functional/pinout duplication of the standard MECL 10K family part, with 100% i m p r o v e m e n t i n p r o p a g a t i o n d e l a y, a n d n o i n c r e a s e s i n p o w e r – supply current. • Propagation Delay, Data–to–Output, 2.2 ns Typical • Improved Noise Margin 150 mV (Over Operating Voltage and Temperature Range) • Voltage Compensated • MECL 10K–Compatible L SUFFIX CERAMIC PACKAGE CASE 620–10 P SUFFIX PLASTIC PACKAGE CASE 648–08 MAXIMUM RATINGS Characteristic Symbol Rating Unit VEE VI –8.0 to 0 Vdc Power Supply (VCC = 0) Input Voltage (VCC = 0) 0 to VEE Vdc Output Current — Continuous — Surge Iout 50 100 mA Operating Temperature Range TA Tstg 0 to +75 °C –55 to +150 –55 to +165 °C Storage Temperature Range — Plastic — Ceramic ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%) (See Note) 0° 25° 75° Characteristic Symbol Min Max Min Max Min Max Power Supply Current IE IinH — 144 — 131 — 144 Input Current High Pin 4 Data Inputs Input Current Low High Output Voltage IinL VOH Unit mA µAdc — — 510 600 — — 320 370 — — 320 370 0.5 — 0.5 — 0.3 — µA –1.02 –0.84 –0.98 –0.81 –0.92 –0.735 Vdc –1.95 –1.63 –1.95 –1.63 –1.95 –1.60 Vdc High Input Voltage VOL VIH –1.17 –0.84 –1.13 –0.81 –1.07 –0.735 Vdc Low Input Voltage VIL –1.95 –1.48 –1.95 –1.48 –1.95 –1.45 Vdc Low Output Voltage FN SUFFIX PLCC CASE 775–02 TRUTH TABLE DATA INPUTS D1 D2 D3 D4 D5 D6 D7 H L L L L L L L L X H L L L L L L L X X H L L L L L L X X X H L L L L L X X X X H L L L L X X X X X H L L L X X X X X X H L L X X X X X X X H L Set–up Time Hold Time Rise Time Fall Time tpd H H H H H H H H L L L L L H H H H L ns 1 16 VCC2 Q1 2 15 Q2 Q0 3 14 Q3 CLOCK 4 13 D2 D0 5 12 D5 3.4 2.2 0.7 0.7 3.4 2.2 0.7 0.7 3.4 2.2 tset thold 3.0 — 3.0 — 3.0 — ns D7 6 11 D4 0.5 — 0.5 — 0.5 — ns D1 7 10 D3 tr tf 0.5 2.4 0.5 2.4 0.5 2.4 ns 2.4 0.5 2.4 0.5 2.4 ns VEE 8 9 D6 0.5 L H L H L H L H L Pin assignment is for Dual–in–Line Package. For PLCC pin assignment, see the Pin Conversion Tables on page 6–11 of the Motorola MECL Data Book (DL122/D). 3/93 2–261 L L H H L L H H L VCC1 0.7 0.7 NOTE: Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 Ifpm is maintained. Outputs are terminated through a 50–ohm resistor to –2.0 volts. Motorola, Inc. 1996 Q3 Q2 Q1 Q0 DIP PIN ASSIGNMENT AC PARAMETERS Propagation Delay Data Input → Output Clock Input → Output OUTPUTS D0 REV 5 MC10H165 8–INPUT PRIORITY ENCODER The MC10H165 is a device designed to encode eight inputs to a binary coded output. The output code is that of the highest order input. Any input of lower priority is ignored. Each output incorporates a latch allowing synchronous operation. When the clock is low the outputs follow the inputs and latch when the clock goes high. This device is very useful for a variety of applications in checking system status in control processors, peripheral controllers, and testing systems. The input is active when high, (e.g., the three binary outputs are low when input D0 is high). The Q3 output is high when any input is high. This allows direct extension into another priority encoder when more than eight inputs are necessary. The MC10H165 can also be used to develop binary codes from random logic inputs, for addressing ROMs, RAMs, or for multiplexing data. LOGIC DIAGRAM C4 VCC1 = PIN 1 VCC2 = PIN 16 . VEE = PIN 8 D0 5 D1 7 3 Q0 D2 13 D3 10 D4 11 2 Q1 D5 12 15 Q2 D6 9 14 Q3 D7 6 Numbers at ends of terminals denote pin numbers for L and P packages. MOTOROLA 2–262 MECL Data DL122 — Rev 6 MC10H165 APPLICATION INFORMATION system conditions, as represented at the encoder inputs, which has priority in determining the next system operation to be performed. The binary code showing the address of the highest priority input present will appear at the encoder outputs to control other system logic functions. A typical application of the MC10H165 is the decoding of system status on a priority basis. A 64–line priority encoder is shown in the figure below. System status lines are connected to this encoder such that, when a given condition exists, the respective input will be at a logic high level. This scheme will select the one of 64 different 64–LINE PRIORITY ENCODER LSB Z 1/2 MC10H101 Z Z MC10H164 MC10H164 MC10H164 X0 . . . . . . . X7 A B C X0 . . . . . . . X7 A B C X0 . . . . . . . X7 A B C Six bit output word yielding number of highest priority channel present at input System Clock C Q0 MC10H165 D0 Q0 MC10H165 C C Q0 D0 MC10H165 C D7 D0 MC10H165 C MC10H165 C Q2 Q3 Q0 Q1 Q2 Q3 Q0 Q1 Q2 Q0 Q1 Q2 C Q0 MC10H165 Q3 Q1 Q2 Q3 C Q0 D7 MC10H165 D7 D0 MSB D7 Q1 D7 D0 Q1 Q2 Q3 D7 D0 Q0 Q2 Q3 D7 C D0 Q1 D7 D0 MECL Data DL122 — Rev 6 Q2 Q3 D0 Lowest Priority Input Q1 D7 MC10H165 Highest Priority Input Q1 Q2 Q3 2–263 MOTOROLA MC10H165 OUTLINE DIMENSIONS FN SUFFIX PLASTIC PLCC PACKAGE CASE 775–02 ISSUE C 0.007 (0.180) M T L–M B Y BRK –N– U N S 0.007 (0.180) M T L–M S S N S D –L– –M– Z W 20 D 1 V 0.010 (0.250) G1 X S T L–M N S S VIEW D–D A 0.007 (0.180) M T L–M S N S R 0.007 (0.180) M T L–M S N S Z C H –T– SEATING PLANE F VIEW S G1 0.010 (0.250) S T L–M S 0.007 (0.180) M T L–M S N S VIEW S S N S NOTES: 1. DATUMS –L–, –M–, AND –N– DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM –T–, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). MOTOROLA N K 0.004 (0.100) J S K1 E G 0.007 (0.180) M T L–M 2–264 DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.385 0.395 0.385 0.395 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 ––– 0.025 ––– 0.350 0.356 0.350 0.356 0.042 0.048 0.042 0.048 0.042 0.056 ––– 0.020 2_ 10 _ 0.310 0.330 0.040 ––– MILLIMETERS MIN MAX 9.78 10.03 9.78 10.03 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 ––– 0.64 ––– 8.89 9.04 8.89 9.04 1.07 1.21 1.07 1.21 1.07 1.42 ––– 0.50 2_ 10 _ 7.88 8.38 1.02 ––– MECL Data DL122 — Rev 6 MC10H165 OUTLINE DIMENSIONS L SUFFIX CERAMIC DIP PACKAGE CASE 620–10 ISSUE V –A– 16 9 1 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY. –B– C L DIM A B C D E F G H K L M N –T– K N SEATING PLANE M E F J G D 16 PL 0.25 (0.010) 16 PL 0.25 (0.010) M T A T B M –A– 9 1 8 B F C L S –T– SEATING PLANE K H G D M J 16 PL 0.25 (0.010) M MILLIMETERS MIN MAX 19.05 19.93 6.10 7.49 ––– 5.08 0.39 0.50 1.27 BSC 1.40 1.65 2.54 BSC 0.21 0.38 3.18 4.31 7.62 BSC 0_ 15 _ 0.51 1.01 S P SUFFIX PLASTIC DIP PACKAGE CASE 648–08 ISSUE R 16 S INCHES MIN MAX 0.750 0.785 0.240 0.295 ––– 0.200 0.015 0.020 0.050 BSC 0.055 0.065 0.100 BSC 0.008 0.015 0.125 0.170 0.300 BSC 0_ 15 _ 0.020 0.040 T A M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01 Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. 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Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 or 602–303–5454 JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center, 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 03–81–3521–8315 MFAX: [email protected] – TOUCHTONE 602–244–6609 INTERNET: http://Design–NET.com ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 ◊ MECL Data DL122 — Rev 6 2–265 *MC10H165/D* MC10H165/D MOTOROLA