MOTOROLA MC10H186FN

SEMICONDUCTOR TECHNICAL DATA
The MC10H186 is a hex D type flip–flop with common reset and clock lines.
This MECL 10H part is a functional/pinout duplication of the standard MECL
10K family part, with 100 % improvement in clock toggle frequency and
propagation delay and no increase in power–supply current.
• Propagation Delay, 1.7 ns Typical
• Power Dissipation, 460 mW Typical
• Improved Noise Margin 150 mV (Over Operating Voltage and
Temperature Range)
• Voltage Compensated
• MECL 10K–Compatible
L SUFFIX
CERAMIC PACKAGE
CASE 620–10
P SUFFIX
PLASTIC PACKAGE
CASE 648–08
MAXIMUM RATINGS
Symbol
Rating
Unit
Power Supply (VCC = 0)
Characteristic
VEE
–8.0 to 0
Vdc
Input Voltage (VCC = 0)
VI
0 to VEE
Vdc
Output Current — Continuous
— Surge
Iout
50
100
mA
Operating Temperature Range
TA
0 to +75
°C
Tstg
–55 to +150
–55 to +165
°C
°C
Storage Temperature Range — Plastic
— Ceramic
FN SUFFIX
PLCC
CASE 775–02
CLOCKED TRUTH TABLE
ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%) (See Note)
0°
Characteristic
25°
75°
Symbol
Min
Max
Min
Max
Min
Max
Unit
Power Supply Current
IE
—
121
—
110
—
121
mA
Input Current High
Pins 5,6,7,10,11,12
Pin 9
Pin 1
IinH
—
—
—
430
670
1250
—
—
—
265
420
765
—
—
—
265
420
765
IinL
0.5
—
0.5
—
0.3
—
µA
High Output Voltage
VOH
–1.02
–0.84
–0.98
–0.81
–0.92
–0.735
Vdc
Low Output Voltage
VOL
–1.95
–1.63
–1.95
–1.63
–1.95
–1.60
Vdc
High Input Voltage
VIH
–1.17
–0.84
–1.13
–0.81
–1.07
–0.735
Vdc
Low Input Voltage
VIL
–1.95
–1.48
–1.95
–1.48
–1.95
–1.45
Vdc
C
D
Qn+1
L
L
X
Qn
L
H*
L
L
L
H*
H
H
H
L
X
L
* A clock H is a clock transition from
a low to a high state.
µA
Input Current Low
R
DIP
PIN ASSIGNMENT
AC PARAMETERS
RESET
1
16
VCC
Q0
2
15
Q5
Q1
3
14
Q4
Propagation Delay
tpd
0.7
3.0
0.7
3.0
0.7
3.0
ns
Set–up Time
tset
1.5
—
1.5
—
1.5
—
ns
Hold Time
thold
1.0
—
1.0
—
1.0
—
ns
Rise Time
tr
0.7
2.6
0.7
2.6
0.7
2.6
ns
Q2
4
13
Q3
Fall Time
tf
0.7
2.6
0.7
2.6
0.7
2.6
ns
D0
5
12
D5
ftog
250
—
250
—
250
—
MHz
trr
3.0
—
3.0
—
3.0
—
ns
D1
6
11
D4
D2
7
10
D3
VEE
8
9
CLOCK
Toggle Frequency
Reset Recovery Time
(t1–9+)
NOTE:
Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table,
after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed
circuit board and transverse air flow greater than 500 linear fpm is maintained. Outputs are terminated
through a 50–ohm resistor to –2.0 volts.
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion
Tables on page 6–11 of the Motorola MECL Data
Book (DL122/D).
3/93
 Motorola, Inc. 1996
2–280
REV 5
MC10H186
APPLICATION INFORMATION
transition. A change in the information present at the data
(D) input will not affect the output information any other
time due to the master–slave construction of this device.
A common Reset is included in this circuit. THE RESET
ONLY FUNCTIONS WHEN THE CLOCK IS LOW.
The MC10H186 contains six high–speed, master slave
type “D” flip–flops. Data is entered into the master when
the clock is low. Master–to–slave data transfer takes
place on the positive–going Clock transition. Thus
outputs may change only on a positive–going Clock
LOGIC DIAGRAM
D0
5
2
Q0
D1
6
3
Q1
D2
7
4
Q2
D3
10
13
Q3
D4
11
14
Q4
D5
12
15
Q5
CLOCK
9
RESET
1
VCC = PIN 16
VEE = PIN 8
MECL Data
DL122 — Rev 6
2–281
MOTOROLA
MC10H186
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
0.007 (0.180) M T L–M
B
Y BRK
–N–
U
N
S
0.007 (0.180) M T L–M
S
S
N
S
D
–L–
–M–
Z
W
20
D
1
V
0.010 (0.250)
G1
X
S
T L–M
N
S
S
VIEW D–D
A
0.007 (0.180) M T L–M
S
N
S
R
0.007 (0.180) M T L–M
S
N
S
Z
C
H
–T–
SEATING
PLANE
F
VIEW S
G1
0.010 (0.250) S T L–M
S
0.007 (0.180)
M
T L–M
S
N
S
VIEW S
S
N
S
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
MOTOROLA
N
K
0.004 (0.100)
J
S
K1
E
G
0.007 (0.180) M T L–M
2–282
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.385
0.395
0.385
0.395
0.165
0.180
0.090
0.110
0.013
0.019
0.050 BSC
0.026
0.032
0.020
–––
0.025
–––
0.350
0.356
0.350
0.356
0.042
0.048
0.042
0.048
0.042
0.056
–––
0.020
2_
10 _
0.310
0.330
0.040
–––
MILLIMETERS
MIN
MAX
9.78
10.03
9.78
10.03
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
–––
0.64
–––
8.89
9.04
8.89
9.04
1.07
1.21
1.07
1.21
1.07
1.42
–––
0.50
2_
10 _
7.88
8.38
1.02
–––
MECL Data
DL122 — Rev 6
MC10H186
OUTLINE DIMENSIONS
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE V
–A–
16
9
1
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
–B–
C
L
DIM
A
B
C
D
E
F
G
H
K
L
M
N
–T–
K
N
SEATING
PLANE
M
E
F
J
G
D
16 PL
0.25 (0.010)
16 PL
0.25 (0.010)
M
T A
T B
M
–A–
9
1
8
B
F
C
L
S
–T–
SEATING
PLANE
K
H
G
D
M
J
16 PL
0.25 (0.010)
M
MILLIMETERS
MIN
MAX
19.05
19.93
6.10
7.49
–––
5.08
0.39
0.50
1.27 BSC
1.40
1.65
2.54 BSC
0.21
0.38
3.18
4.31
7.62 BSC
0_
15 _
0.51
1.01
S
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
16
S
INCHES
MIN
MAX
0.750
0.785
0.240
0.295
–––
0.200
0.015
0.020
0.050 BSC
0.055
0.065
0.100 BSC
0.008
0.015
0.125
0.170
0.300 BSC
0_
15 _
0.020
0.040
T A
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
DIM
A
B
C
D
F
G
H
J
K
L
M
S
INCHES
MIN
MAX
0.740
0.770
0.250
0.270
0.145
0.175
0.015
0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008
0.015
0.110
0.130
0.295
0.305
0_
10 _
0.020
0.040
MILLIMETERS
MIN
MAX
18.80
19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0_
10 _
0.51
1.01
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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
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arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
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are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal
Opportunity/Affirmative Action Employer.
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◊
MECL Data
DL122 — Rev 6
2–283
*MC10H186/D*
MC10H186/D
MOTOROLA