MOTOROLA MC14194BCL

SEMICONDUCTOR TECHNICAL DATA
L SUFFIX
CERAMIC
CASE 620
The MC14194B is a 4–bit static shift register capable of operating in the
parallel load, serial shift left, serial shift right, or hold mode. The
asynchronous Reset input, when at a low level, overrides all other inputs,
resets all stages, and forces all outputs low. When Reset is at a logic 1 level,
the two mode control inputs, S0 and S1, control the operating mode as
shown in the truth table. Both serial and parallel operation are triggered on
the positive–going transition of the Clock input. The Parallel Data, Data Shift,
and mode control inputs must be stable for the specified setup and hold
times before and after the positive–going Clock transition.
•
•
•
•
P SUFFIX
PLASTIC
CASE 648
D SUFFIX
SOIC
CASE 751B
Synchronous Right/Left Serial Operation
Synchronous Parallel Load
Asynchronous Hold (Do Nothing) Mode
Functional Pin for Pin Equivalent of LS194
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ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ORDERING INFORMATION
MC14XXXBCP
MC14XXXBCL
MC14XXXBD
MAXIMUM RATINGS* (Voltages Referenced to VSS)
Symbol
Parameter
VDD
DC Supply Voltage
Value
Unit
– 0.5 to + 18.0
V
Vin, Vout
Input or Output Voltage (DC or Transient)
– 0.5 to VDD + 0.5
V
Iin, Iout
Input or Output Current (DC or Transient),
per Pin
± 10
mA
PD
Power Dissipation, per Package†
500
mW
Tstg
Storage Temperature
– 65 to + 150
_C
260
_C
TL
Lead Temperature (8–Second Soldering)
Plastic
Ceramic
SOIC
TA = – 55° to 125°C for all packages.
* Maximum Ratings are those values beyond which damage to the device may occur.
†Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C
Ceramic “L” Packages: – 12 mW/_C From 100_C To 125_C
LOGIC DIAGRAM
3
4
DP0
5
DP1
6
DP2
DP3
S1 10
S0
9
DSR
2
7
DSL
VDD = PIN 16
VSS = PIN 8
DQ
D Q
D Q
D Q
CR
CR
CR
CR
CLOCK 11
RESET 1
Q0
15
Q1
14
Q2
13
Q3
12
REV 3
1/94
MC14194B
Motorola, Inc. 1995
284
MOTOROLA CMOS LOGIC DATA
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ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
Characteristic
Output Voltage
Vin = VDD or 0
Symbol
– 55_C
25_C
125_C
VDD
Vdc
Min
Max
Min
Typ #
Max
Min
Max
Unit
“0” Level
VOL
5.0
10
15
—
—
—
0.05
0.05
0.05
—
—
—
0
0
0
0.05
0.05
0.05
—
—
—
0.05
0.05
0.05
Vdc
“1” Level
VOH
5.0
10
15
4.95
9.95
14.95
—
—
—
4.95
9.95
14.95
5.0
10
15
—
—
—
4.95
9.95
14.95
—
—
—
Vdc
5.0
10
15
—
—
—
1.5
3.0
4.0
—
—
—
2.25
4.50
6.75
1.5
3.0
4.0
—
—
—
1.5
3.0
4.0
5.0
10
15
3.5
7.0
11
—
—
—
3.5
7.0
11
2.75
5.50
8.25
—
—
—
3.5
7.0
11
—
—
—
5.0
5.0
10
15
– 3.0
– 0.64
– 1.6
– 4.2
—
—
—
—
– 2.4
– 0.51
– 1.3
– 3.4
– 4.2
– 0.88
– 2.25
– 8.8
—
—
—
—
– 1.7
– 0.36
– 0.9
– 2.4
—
—
—
—
IOL
5.0
10
15
0.64
1.6
4.2
—
—
—
0.51
1.3
3.4
0.88
2.25
8.8
—
—
—
0.36
0.9
2.4
—
—
—
mAdc
Input Current
Iin
15
—
± 0.1
—
± 0.00001
± 0.1
—
± 1.0
µAdc
Input Capacitance
(Vin = 0)
Cin
—
—
—
—
5.0
7.5
—
—
pF
Quiescent Current
(Per Package)
IDD
5.0
10
15
—
—
—
5.0
10
20
—
—
—
0.005
0.010
0.015
5.0
10
20
—
—
—
150
300
600
µAdc
IT
5.0
10
15
Vin = 0 or VDD
Input Voltage
“0” Level
(VO = 4.5 or 0.5 Vdc)
(VO = 9.0 or 1.0 Vdc)
(VO = 13.5 or 1.5 Vdc)
VIL
“1” Level
VIH
(VO = 0.5 or 4.5 Vdc)
(VO = 1.0 or 9.0 Vdc)
(VO = 1.5 or 13.5 Vdc)
Output Drive Current
(VOH = 2.5 Vdc)
(VOH = 4.6 Vdc)
(VOH = 9.5 Vdc)
(VOH = 13.5 Vdc)
(VOL = 0.4 Vdc)
(VOL = 0.5 Vdc)
(VOL = 1.5 Vdc)
Vdc
Vdc
IOH
Source
Sink
Total Supply Current**†
(Dynamic plus Quiescent,
Per Package)
(CL = 50 pF on all outputs, all
buffers switching)
mAdc
IT = (0.95 µA/kHz) f + IDD
IT = (1.90 µA/kHz) f + IDD
IT = (2.90 µA/kHz) f + IDD
µAdc
#Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
** The formulas given are for the typical characteristics only at 25_C.
†To calculate total supply current at loads other than 50 pF:
IT(CL) = IT(50 pF) + (CL – 50) Vfk
where: IT is in µA (per package), CL in pF, V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.002.
This device contains protection circuitry to guard against damage
due to high static voltages or electric fields. However, precautions must
be taken to avoid applications of any voltage higher than maximum rated
voltages to this high-impedance circuit. For proper operation, Vin and
Vout should be constrained to the range VSS ≤ (Vin or Vout) ≤ VDD.
Unused inputs must always be tied to an appropriate logic voltage
level (e.g., either VSS or VDD). Unused outputs must be left open.
MOTOROLA CMOS LOGIC DATA
PIN ASSIGNMENT
R
1
16
DSR
2
15
Q0
DP0
3
14
Q1
DP1
4
13
Q2
DP2
5
12
Q3
DP3
6
11
C
DSL
7
10
S1
VSS
8
9
S0
VDD
MC14194B
285
TRUTH TABLE
Operating
Mode
Hold
Shift Left
Shift Right
Inputs
(Reset = 1)
Outputs
(@ tn+1)
S1
S0
DSR
DSL
DP0–3
Q0
Q1
Q2
Q3
0
0
X
X
X
Q0
Q1
Q2
Q3
1
0
X
0
X
Q1
Q2
Q3
0
1
0
X
1
X
Q1
Q2
Q3
1
0
1
0
X
X
0
Q0
Q1
Q2
0
1
1
X
X
1
Q0
Q1
Q2
1
1
X
X
0
0
0
0
0
1
1
X
X
1
1
1
1
1
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ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Parallel
X = Don’t Care
tn+1 = State after the next positive–going transition of the clock.
SWITCHING CHARACTERISTICS* (CL = 50 pF, TA = 25_C)
Characteristic
Symbol
Output Rise and Fall Time
tTLH, tTHL = (1.35 ns/pF) CL + 32 ns
tTLH, tTHL = (0.6 ns/pF) CL + 20 ns
tTLH, tTHL = (0.4 ns/pF) CL + 20 ns
tTLH, tTHL
Propagation Delay Time
Clock to Q
tPLH, tPHL = (0.9 ns/pF) CL + 230 ns
tPLH, tPHL = (0.36 ns/pF) CL + 92 ns
tPLH, tPHL = (0.26 ns/pF) CL + 72 ns
tPLH,tPHL
VDD
Vdc
Min
Typ #
Max
5.0
10
15
—
—
—
100
50
40
200
100
80
Unit
ns
ns
5.0
10
15
—
—
—
275
110
85
550
220
170
5.0
10
15
—
—
—
350
140
110
700
280
220
Reset to Q
tPHL = (0.9 ns/pF) CL + 305 ns
tPHL = (0.36 ns/pF) CL + 122 ns
tPHL = (0.26 ns/pF) CL + 97 ns
Clock Pulse Width
tPHL
tWH
5.0
10
15
280
110
85
140
55
40
—
—
—
ns
Reset Pulse Width
tWH
5.0
10
15
180
70
50
90
35
26
—
—
—
ns
fcl
5.0
10
15
—
—
—
3.6
9.0
12
1.8
4.5
6.0
MHz
tTLH, tTHL
5.0
10
15
—
—
—
—
—
—
15
5
4
µs
5.0
10
15
10
20
40
– 8.0
0
9.0
—
—
—
5.0
10
15
200
75
55
100
36
27
—
—
—
5.0
10
15
180
50
35
90
25
10
—
—
—
5.0
10
15
0
0
0
– 40
– 27
– 20
—
—
—
ns
5.0
10
15
300
110
80
150
55
40
—
—
—
ns
Clock Pulse Frequency
(Shift Right or Left Mode)
Clock Pulse Rise and Fall Time
Setup Time
Data to Clock
tsu
Mode Control (S) to Clock
Hold Time
Data to Clock
ns
th
Mode Control (S) to Clock
Reset Removal Time
ns
trem
ns
ns
* The formulas given are for the typical characteristics only at 25_C.
#Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
MC14194B
286
MOTOROLA CMOS LOGIC DATA
Parallel Load
Serial Load
VDD
16
VDD
16
3
4
5
6
11
2
7
9
10
PULSE
GENERATOR
Q0
DP0
DP1
DP2
DP3
CLOCK
DSR
DSL
S0
S1
R
15
3
4
5
6
11
2
7
9
10
CL
Q1
14
CL
Q2
PULSE
GENERATOR
13
CL
Q3
12
CL
8
1
VSS
Q0
DP0
DP1
DP2
DP3
CLOCK
DSR
DSL
S0
S1
R
1
15
CL
Q1
14
CL
Q2
13
CL
Q3
12
CL
8
VSS
NOTE: Interchange DSR with DSL and S0 with
S1 for testing shift left.
20 ns
DPn
DSR
DSL
20 ns
VDD
90%
50%
10%
tsu
VSS
th
th
tsu
VDD
50%
CLOCK
tWH(cl)
tPLH
90%
50%
10%
tTLH
Qn
VSS
1/fcl
tPHL
VOH
VOL
tTHL
tPHL
trem
50%
RESET
VDD
VSS
tWL
Figure 1. Switching Time Test Circuits and Waveforms
VDD
16
PULSE
GENERATOR
3
4
5
6
11
2
7
9
10
DP0
DP1
DP2
DP3
CLOCK
DSR
DSL
S0
S1
R
1
Q0
15
CL
Q1
14
20 ns
CL
Q2
CL
Q3
90%
50%
VDD
10%
1/f
DSR
12
CL
8
CLOCK
13
20 ns
Qn
VSS
ID
VSS
VDD
VSS
VOH
VOL
500 µF
Figure 2. Dynamic Power Dissipation Test Circuit and Waveforms
MOTOROLA CMOS LOGIC DATA
MC14194B
287
OUTLINE DIMENSIONS
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE V
–A–
16
9
1
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
–B–
C
L
DIM
A
B
C
D
E
F
G
H
K
L
M
N
–T–
K
N
SEATING
PLANE
M
E
F
J
G
D
16 PL
0.25 (0.010)
16 PL
0.25 (0.010)
M
T A
T B
M
S
INCHES
MIN
MAX
0.750
0.785
0.240
0.295
–––
0.200
0.015
0.020
0.050 BSC
0.055
0.065
0.100 BSC
0.008
0.015
0.125
0.170
0.300 BSC
0_
15 _
0.020
0.040
MILLIMETERS
MIN
MAX
19.05
19.93
6.10
7.49
–––
5.08
0.39
0.50
1.27 BSC
1.40
1.65
2.54 BSC
0.21
0.38
3.18
4.31
7.62 BSC
0_
15 _
0.51
1.01
S
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
–A–
16
9
1
8
B
F
C
L
S
–T–
K
H
G
D
J
16 PL
0.25 (0.010)
MC14194B
288
SEATING
PLANE
M
T A
M
M
DIM
A
B
C
D
F
G
H
J
K
L
M
S
INCHES
MIN
MAX
0.740
0.770
0.250
0.270
0.145
0.175
0.015
0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008
0.015
0.110
0.130
0.295
0.305
0_
10 _
0.020
0.040
MILLIMETERS
MIN
MAX
18.80
19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0_
10 _
0.51
1.01
MOTOROLA CMOS LOGIC DATA
OUTLINE DIMENSIONS
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B–05
ISSUE J
–A–
16
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
9
–B–
1
P
8 PL
0.25 (0.010)
8
M
B
S
G
R
K
F
X 45 _
C
–T–
SEATING
PLANE
M
D
16 PL
0.25 (0.010)
M
T B
S
A
S
J
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.386
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.229
0.244
0.010
0.019
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MOTOROLA CMOS LOGIC DATA
◊
*MC14194B/D*
MC14194B
MC14194B/D
289