Intersil ICL3237IA-T 1 microamp supply-current, 3v to 5.5v, 1mbps, rs-232 transmitters/receiver Datasheet

ICL3237
®
Data Sheet
FN6003.3
October 21, 2005
1 Microamp Supply-Current, +3V to +5.5V,
1Mbps, RS-232 Transmitters/Receivers
Features
The Intersil ICL3237 contains 3.0V to 5.5V powered RS-232
transmitters/receivers which meet ElA/TIA-232 and
V.28/V.24 specifications, even at VCC = 3.0V. Targeted
applications are cell phones, PDAs, Palmtops, and notebook
and laptop computers where the low operational, and even
lower standby, power consumption is critical. Efficient onchip charge pumps, coupled with manual powerdown
function, reduce the standby supply current to a 1µA trickle.
Small footprint packaging, and the use of small, low value
capacitors ensure board space savings as well. Data rates
greater than 1Mbps (MBAUD = VCC) are guaranteed at
worst case load conditions. This family is fully compatible
with 3.3V only systems, mixed 3.3V and 5.0V systems, and
5.0V only systems.
• Drop in Replacement for MAX3237
The ICL3237 is a 5 driver, 3 receiver device that also
includes a noninverting always-active receiver for “wake-up”
capability.
Table 1 summarizes the features of the device represented
by this data sheet, while Application Note AN9863
summarizes the features of each device comprising the
ICL32XX 3V family.
• ±15kV ESD Protected (Human Body Model)
• Meets EIA/TIA-232 and V.28/V.24 Specifications at 3V
• Latch-Up Free
• On-Chip Voltage Converters Require Only Four External
Capacitors
• Manual Powerdown Features
• Flow Through Pinout
• Receiver Hysteresis For Improved Noise Immunity
• Pin Selectable Data Rate
• Guaranteed Minimum Data Rate . . . . . . . 250kbps/1Mbps
• Guaranteed Minimum Slew Rate . . . . . . . 6V/µs or 24V/µs
• Wide Power Supply Range . . . . . . . Single +3V to +5.5V
• Low Supply Current in Powerdown State. . . . . . . . . . .1µA
• Pb-Free Plus Anneal Available (RoHS Compliant)
Applications
• Any System Requiring RS-232 Communication Ports
- Battery Powered, Hand-Held, and Portable Equipment
- Laptop Computers, Notebooks, Palmtops
- Modems, Printers and other Peripherals
- Digital Cameras
- Cellular/Mobile Phone
Related Literature
• Technical Brief TB363 “Guidelines for Handling and
Processing Moisture Sensitive Surface Mount Devices
(SMDs)”
• AN9863 “3V to +5.5V, 250k-1Mbps, RS-232
Transmitters/Receivers”
TABLE 1. SUMMARY OF FEATURES
PART
NUMBER
ICL3237
NO. OF NO. OF
Tx.
Rx.
5
3
NO. OF
MONITOR Rx.
(ROUTB)
(NOTE 1)
DATA
RATE
(kbps)
Rx. ENABLE
FUNCTION?
READY
OUTPUT?
MANUAL
POWERDOWN?
AUTOMATIC
POWERDOWN
FUNCTION?
1
250/1000
YES
NO
YES
NO
NOTE:
1. Data rate is selectable via the MBAUD pin.
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2001-2002, 2004-2005. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
ICL3237
Pinout
Ordering Information
ICL3237 (SSOP)
TOP VIEW
PART NO.
28 C1+
C2+ 1
PART
MARKING
TEMP.
RANGE
(°C)
PACKAGE
PKG.
DWG. #
27 V+
ICL3237CA
ICL3237CA
0 to 70
28 Ld SSOP
M28.209
26 VCC
ICL3237CAZ
(See Note)
ICL3237CAZ
0 to 70
28 Ld SSOP
(Pb-free)
M28.209
25 C1-
T1OUT 5
24 T1IN
ICL3237IA
ICL3237IA
-40 to 85 28 Ld SSOP
M28.209
T2OUT 6
23 T2IN
-40 to 85 28 Ld SSOP
(Pb-free)
M28.209
22 T3IN
ICL3237IAZ
(See Note)
ICL3237IAZ
T3OUT 7
R1IN 8
21 R1OUT
*Add “-T” suffix to part number for tape and reel packaging.
R2IN 9
20 R2OUT
GND 2
C2-
3
V- 4
NOTE: Intersil Pb-free plus anneal products employ special Pb-free
material sets; molding compounds/die attach materials and 100%
matte tin plate termination finish, which are RoHS compliant and
compatible with both SnPb and Pb-free soldering operations. Intersil
Pb-free products are MSL classified at Pb-free peak reflow
temperatures that meet or exceed the Pb-free requirements of
IPC/JEDEC J STD-020.
19 T4IN
T4OUT 10
18 R3OUT
R3IN 11
17 T5IN
T5OUT 12
EN 13
16 R1OUTB
SHDN 14
15 MBAUD
Pin Descriptions
PIN
VCC
FUNCTION
System Power Supply Input (3.0V to 5.5V).
V+
Internally Generated Positive Transmitter Supply (+5.5V).
V-
Internally Generated Negative Transmitter Supply (-5.5V).
GND
Ground Connection.
C1+
External Capacitor (Voltage Doubler) is connected to this lead.
C1-
External Capacitor (Voltage Doubler) is connected to this lead.
C2+
External Capacitor (Voltage Inverter) is connected to this lead.
C2-
External Capacitor (Voltage Inverter) is connected to this lead.
TIN
TTL/CMOS Compatible Transmitter Inputs.
TOUT
RS-232 level (nominally ±5.5V) transmitter outputs.
RIN
RS-232 Compatible Receiver Inputs.
ROUT
TTL/CMOS Level Receiver Outputs.
ROUTB
EN
SHDN
MBAUD
TTL/CMOS Level, Noninverting, Always Enabled Receiver Output.
Active Low Receiver Enable Control; doesn’t disable ROUTB output.
Active Low Input to Shutdown Transmitters and On-Board Power Supply, to place device in low power mode.
Input Low selects 250kbps data rate, and input high selects 1Mbps data rate.
2
ICL3237
Typical Operating Circuit
ICL3237
+
0.1µF
28
C1
0.1µF
+
C2
0.1µF
+
+
C3 (OPTIONAL CONNECTION, NOTE)
+3.3V
25
1
3
C1+
26
27
VCC
C1C2+
V-
C2T1
24
+
V+
4
C4
0.1µF
+
5
T1IN
T1OUT
T2
23
6
T2IN
T2OUT
T3
22
7
T3IN
T3OUT
T4
19
RS-232
LEVELS
10
T4OUT
T4IN
T5
17
12
T5IN
TTL/CMOS
LOGIC LEVELS
C3
0.1µF
T5OUT
16
R1OUTB
21
8
R1OUT
R1IN
5kΩ
R1
20
9
R2OUT
R2IN
5kΩ
R2
18
11
R3OUT
R3IN
5kΩ
R3
13
VCC
RS-232
LEVELS
EN
14
SHDN
15
TO CONTROL LOGIC
MBAUD
GND
2
NOTE: THE NEGATIVE TERMINAL OF C3 CAN BE CONNECTED TO EITHER VCC OR GND.
3
ICL3237
Absolute Maximum Ratings
Thermal Information
VCC to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6V
V+ to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
V- to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3V to -7V
V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14V
Input Voltages
TIN, EN, SHDN. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6V
MBAUD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to VCC+0.3V
RIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25V
Output Voltages
TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±13.2V
ROUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to VCC +0.3V
Short Circuit Duration
TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table
Thermal Resistance (Typical, Note 2)
θJA (oC/W)
28 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . .
100
Moisture Sensitivity (see Technical Brief TB363)
All Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Level 1
Maximum Junction Temperature (Plastic Package) . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . -65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300oC
(Lead Tips Only)
Operating Conditions
Temperature Range
ICL3237C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0oC to 70oC
ICL3237I. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
2. θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Electrical Specifications
Test Conditions: VCC = 3V, C1 - C4 = 0.22µF; VCC = 3.15V to 5.5V, C1 - C4 = 0.1µF, Unless Otherwise
Specified. Typicals are at TA = 25oC
PARAMETER
TEST CONDITIONS
TEMP
(oC)
MIN
TYP
MAX
UNITS
DC CHARACTERISTICS
Supply Current,
Powerdown Disabled
All Outputs Unloaded, VCC = 3.15V, SHDN = VCC
25
-
0.3
1.0
mA
Supply Current, Powerdown
SHDN = GND
25
-
1.0
10
µA
LOGIC AND TRANSMITTER INPUTS AND RECEIVER OUTPUTS
Input Logic Threshold Low
TIN, EN, SHDN, MBAUD
Full
-
-
0.8
V
Input Logic Threshold High
TIN, EN, SHDN,
MBAUD
VCC = 3.3V
Full
2.0
-
-
V
VCC = 5.0V
Full
2.4
-
-
V
25
-
0.5
-
V
Transmitter Input Hysteresis
Input Leakage Current
TIN, EN, SHDN, MBAUD
Full
-
±0.01
±1.0
µA
Output Leakage Current
EN = VCC (Receivers Disabled)
Full
-
±0.05
±10
µA
Output Voltage Low
IOUT = 1.6mA
Full
-
-
0.4
V
Output Voltage High
IOUT = -1.0mA
Full
-
V
VCC -0.6 VCC -0.1
RECEIVER INPUTS
Input Voltage Range
Full
-25
-
25
V
VCC = 3.3V
25
0.6
1.2
-
V
VCC = 5.0V
25
0.8
1.5
-
V
VCC = 3.3V to 5.0V
25
-
1.6
2.4
V
Input Hysteresis
25
-
0.3
-
V
Input Resistance
25
3
5
7
kΩ
Full
±5.0
±5.4
-
V
Input Threshold Low
Input Threshold High
TRANSMITTER OUTPUTS
Output Voltage Swing
All Transmitter Outputs Loaded with 3kΩ to Ground
4
ICL3237
Electrical Specifications
Test Conditions: VCC = 3V, C1 - C4 = 0.22µF; VCC = 3.15V to 5.5V, C1 - C4 = 0.1µF, Unless Otherwise
Specified. Typicals are at TA = 25oC (Continued)
TEMP
(oC)
MIN
TYP
MAX
UNITS
Full
300
10M
-
Ω
Full
-
±35
±60
mA
VOUT = ±12V, VCC = 0V or 3V to 5.5V, SHDN = GND
Full
-
-
±25
µA
RL = 3kΩ, One
Transmitter Switching
PARAMETER
Output Resistance
TEST CONDITIONS
VCC = V+ = V- = 0V, Transmitter Output = ±2V
Output Short-Circuit Current
Output Leakage Current
TIMING CHARACTERISTICS
Maximum Data Rate
Receiver Propagation Delay
Receiver Input to
Receiver Output,
CL = 150pF
CL = 1000pF
MBAUD = GND
Full
250
700
-
kbps
VCC = 3V to 4.5V,
CL = 250pF
MBAUD = VCC
Full
1000
1700
-
kbps
VCC = 4.5V to 5.5V,
CL = 1000pF
MBAUD = VCC
Full
1000
1100
-
kbps
tPHL
25
-
0.15
-
µs
tPLH
25
-
0.15
-
µs
Receiver Output Enable Time
Normal Operation
25
-
200
-
ns
Receiver Output Disable Time
Normal Operation
25
-
200
-
ns
Transmitter Skew
tPHL - tPLH (Note 3)
MBAUD = GND
25
-
100
ns
MBAUD = VCC, VCC = 3.0V
25
-
25
ns
Receiver Skew
tPHL - tPLH, CL = 150pF
25
-
50
-
ns
Transition Region Slew Rate
CL = 150pF to 1000pF MBAUD = GND
VCC = 3.3V,
RL = 3kΩ to 7kΩ,
MBAUD = VCC
Measured From 3V to
-3V or -3V to 3V
CL = 150pF to 2500pF MBAUD = GND
25
6
17
30
V/µs
25
24
40
150
V/µs
25
4
12
30
V/µs
Human Body Model
25
-
±15
-
kV
IEC61000-4-2 Contact Discharge
25
-
±8
-
kV
IEC61000-4-2 Air Gap Discharge
25
-
>±8
-
kV
Human Body Model
25
-
±2.5
-
kV
ESD PERFORMANCE
RS-232 Pins (TOUT, RIN)
All Other Pins
NOTE:
3. Skew is measured at the input switching points (1.4V).
5
ICL3237
Detailed Description
regardless of the state of any control lines. All the receivers
convert RS-232 signals to CMOS output levels and accept
inputs up to ±25V while presenting the required 3kΩ to 7kΩ
input impedance (see Figure 1) even if the power is off
(VCC = 0V). The receivers’ Schmitt trigger input stage uses
hysteresis to increase noise immunity and decrease errors
due to slow input signal transitions.
The ICL3237 operates from a single +3V to +5.5V supply,
guarantees a 1Mbps minimum data rate, requires only four
small external 0.1µF capacitors, features low power
consumption, and meets all EIA/TIA-232 and V.28
specifications. The circuit is divided into three sections: The
charge pump, the transmitters, and the receivers.
Monitor receivers remain active even during manual
powerdown and forced receiver disable, making them
extremely useful for Ring Indicator monitoring. Standard
receivers driving powered down peripherals must be disabled
to prevent current flow through the peripheral’s protection
diodes (see Figures 2 and 3). This renders them useless for
wake up functions, but the corresponding monitor receiver
can be dedicated to this task as shown in Figure 3.
Charge-Pump
Intersil’s new ICL32XX family utilizes regulated on-chip dual
charge pumps as voltage doublers, and voltage inverters to
generate ±5.5V transmitter supplies from a VCC supply as
low as 3.0V. This allows these devices to maintain RS-232
compliant output levels over the ±10% tolerance range of
3.3V powered systems. The efficient on-chip power supplies
require only four small, external 0.1µF capacitors for the
voltage doubler and inverter functions at VCC = 3.3V. See
the “Capacitor Selection” section, and Table 3 for capacitor
recommendations for other operating conditions. The charge
pumps operate discontinuously (i.e., they turn off as soon as
the V+ and V- supplies are pumped up to the nominal
values), resulting in significant power savings.
VCC
RXOUT
RXIN
-25V ≤ VRIN ≤ +25V
GND ≤ VROUT ≤ VCC
5kΩ
GND
FIGURE 1. INVERTING RECEIVER CONNECTIONS
Transmitters
Powerdown Functionality
The transmitters are proprietary, low dropout, inverting
drivers that translate TTL/CMOS inputs to EIA/TIA-232
output levels. Coupled with the on-chip ±5.5V supplies,
these transmitters deliver true RS-232 levels over a wide
range of single supply system voltages.
This 3V device requires a nominal supply current of 0.3mA
during normal operation (not in powerdown mode). This is
considerably less than the 5mA to 11mA current required of
5V RS-232 devices. The already low current requirement
drops significantly when the device enters powerdown
mode. In powerdown, supply current drops to 1µA, because
the on-chip charge pump turns off (V+ collapses to VCC, Vcollapses to GND), and the transmitter outputs three-state.
This micro-power mode makes the ICL3237 ideal for battery
powered and portable applications.
All transmitter outputs disable and assume a high impedance
state when the device enters the powerdown mode (see Table
2). These outputs may be driven to ±12V when disabled.
The ICL3237 guarantees a 1Mbps data rate (if MBAUD = 1)
for full load conditions (3kΩ and 250pF), VCC ≥ 3.0V, with
one transmitter operating at full speed. Under more typical
conditions of VCC ≥ 3.3V, C1-4 = 0.1µF, RL = 3kΩ, and
CL = 250pF, one transmitter easily operates at 1.7Mbps.
Software Controlled (Manual) Powerdown
On the ICL3237, the powerdown control is via a simple
shutdown (SHDN) pin. Driving this pin high enables normal
operation, while driving it low forces the IC into it’s
powerdown state. Connect SHDN to VCC if the powerdown
function isn’t needed. Note that all the receiver outputs
remain enabled during shutdown (see Table 2). For the
lowest power consumption during powerdown, the receivers
should also be disabled by driving the EN input high (see
next section, and Figures 2 and 3). The time required to exit
powerdown, and resume transmission is only 100µs.
Transmitter inputs float if left unconnected, and may cause
ICC increases. Connect unused inputs to GND for the best
performance.
Receivers
The ICL3237 device contains standard inverting receivers
that three-state only when the EN control line is driven high.
Additionally, it includes a noninverting (monitor) receiver
(denoted by the ROUTB label) that is always active,
TABLE 2. POWERDOWN AND ENABLE LOGIC TRUTH TABLE
SHDN INPUT
EN INPUT
TRANSMITTER OUTPUTS
RECEIVER OUTPUTS
ROUTB OUTPUT
L
L
High-Z
Active
Active
Manual Powerdown
L
H
High-Z
High-Z
Active
Manual Powerdown w/Rcvr. Disabled
H
L
Active
Active
Active
Normal Operation
H
H
Active
High-Z
Active
Normal Operation w/Rcvr. Disabled
6
MODE OF OPERATION
ICL3237
Receiver ENABLE Control
This device also features an EN input to control the receiver
outputs. Driving EN high disables all the inverting (standard)
receiver outputs placing them in a high impedance state.
This is useful to eliminate supply current, due to a receiver
output forward biasing the protection diode, when driving the
input of a powered down (VCC = GND) peripheral (see
Figure 2). The enable input has no effect on transmitter nor
monitor (ROUTB) outputs.
VCC
CURRENT
FLOW
VOUT = VCC
Rx
POWERED
DOWN
UART
When using minimum required capacitor values, make sure
that capacitor values do not degrade excessively with
temperature. If in doubt, use capacitors with a larger nominal
value. The capacitor’s equivalent series resistance (ESR)
usually rises at low temperatures and it influences the
amount of ripple on V+ and V-.
Tx
SHDN = GND
GND
OLD
RS-232 CHIP
FIGURE 2. POWER DRAIN THROUGH POWERED DOWN
PERIPHERAL
VCC
TRANSITION
DETECTOR
TO
WAKE-UP
LOGIC
ICL3237
R1OUTB
POWERED
DOWN
UART
VOUT = HI-Z
R1OUT
TX
TABLE 3. REQUIRED CAPACITOR VALUES
VCC (V)
C1 (µF)
C2, C3, C4 (µF)
3.0 to 3.6
0.22
0.22
3.15 to 3.6
0.1
0.1
4.5 to 5.5
0.047
0.33
3.0 to 5.5
0.22
1.0
Power Supply Decoupling
VCC
RX
Capacitor Selection
The charge pumps require 0.1µF capacitors for 3.3V
operation. For other supply voltages refer to Table 3 for
capacitor values. Do not use values smaller than those listed
in Table 3. Increasing the capacitor values (by a factor of 2)
reduces ripple on the transmitter outputs and slightly
reduces power consumption. C2, C3, and C4 can be
increased without increasing C1’s value, however, do not
increase C1 without also increasing C2, C3, and C4 to
maintain the proper ratios (C1 to the other capacitors).
VCC
VCC
For higher speed serial communications, the ICL3237
features MegaBaud operation. In MegaBaud operating
mode (MBAUD = VCC), the ICL3237 transmitters guarantee
a 1Mbps data rate with worst-case loads of 3kΩ in parallel
with 250pF for 3.0V < VCC < 4.5V. For 5V ±10% operation,
the ICL3237 transmitters guarantee a 1Mbps data rate into
worst-case loads of 3kΩ in parallel with 1000pF.
R1IN
In most circumstances a 0.1µF bypass capacitor is
adequate. In applications that are particularly sensitive to
power supply noise, decouple VCC to ground with a
capacitor of the same value as the charge-pump capacitor C1.
Connect the bypass capacitor as close as possible to the IC.
T1IN
T1OUT
SHDN = GND, EN = VCC
FIGURE 3. DISABLED RECEIVERS PREVENT POWER DRAIN
MegaBaud Selection
In normal operating mode (MBAUD = GND), the ICL3237
transmitters guarantee a 250kbps data rate with worst-case
loads of 3kΩ in parallel with 1000pF. This provides
compatibility with PC-to-PC communication software, such
as Laplink™.
7
Transmitter Outputs when Exiting
Powerdown
Figure 4 shows the response of two transmitter outputs
when exiting powerdown mode. As they activate, the two
transmitter outputs properly go to opposite RS-232 levels,
with no glitching, ringing, nor undesirable transients. Each
transmitter is loaded with 3kΩ in parallel with 2500pF. Note
that the transmitters enable only when the magnitude of the
supplies exceed approximately 3V.
High Data Rates
The ICL3237 maintains the RS-232 ±5V minimum
transmitter output voltages even at high data rates. Figure 5
Laplink® is a registered trademark of Traveling Software.
ICL3237
details a transmitter loopback test circuit, and Figure 6
illustrates the standard speed loopback test result for a
single transmitter driving 1000pF and an RS-232 load at
250kbps. Figure 7 shows the megabaud loopback results for
a single transmitter driving 250pF and an RS-232 load at
1Mbps. The static transmitters were also loaded with an
RS-232 receiver.
5V/DIV. MBAUD = GND
T1IN
T1OUT
5V/DIV.
SHDN
T1
R1OUT
VCC = +3.3V
C1 - C4 = 0.1µF
2V/DIV.
2µs/DIV.
FIGURE 6. LOOPBACK TEST AT 250kbps (CL = 1000pF)
T2
5V/DIV. MBAUD = VCC
VCC = +3.3V
C1 - C4 = 0.1µF
T1IN
TIME (20µs/DIV.)
FIGURE 4. TRANSMITTER OUTPUTS WHEN EXITING
POWERDOWN
T1OUT
VCC
+
0.1µF
R1OUT
+
C1+
VCC
V+
C1
C1-
+
C3
VCC = +3.3V
C1 - C4 = 0.1µF
0.5µs/DIV.
ICL3237
+
V-
C2+
C2
C4
+
FIGURE 7. LOOPBACK TEST AT 1Mbps (CL = 250pF)
C2TIN
RIN
ROUT
EN
VCC
Interconnection with 3V and 5V Logic
TOUT
CL
The ICL3237 directly interfaces with most 5V logic families,
including ACT and HCT CMOS. See Table 4 for more
information on possible combinations of interconnections.
5K
SHDN
MBAUD
GND or VCC
FIGURE 5. TRANSMITTER LOOPBACK TEST CIRCUIT
8
TABLE 4. LOGIC FAMILY COMPATIBILITY WITH VARIOUS
SUPPLY VOLTAGES
SYSTEM
POWER-SUPPLY
VOLTAGE
(V)
VCC
SUPPLY
VOLTAGE
(V)
3.3
3.3
5
5
5
3.3
COMPATIBILITY
Compatible with all CMOS
families.
Compatible with all TTL and
CMOS logic families.
Compatible with ACT and HCT
CMOS, and with TTL.
Incompatible with AC, HC, or
CD4000 CMOS.
ICL3237
Typical Performance Curves
VCC = 3.3V, TA = 25oC
6
TRANSMITTER OUTPUT VOLTAGE (V)
TRANSMITTER OUTPUT VOLTAGE (V)
6
VOUT+
4
2
1 TRANSMITTER AT 250kbps
OTHER TRANSMITTERS AT 30kbps
0
MBAUD = GND
-2
VOUT -
-4
-6
VOUT+
4
2
1 TRANSMITTER AT 1Mbps
OTHER TRANSMITTERS AT 30kbps
0
MBAUD = VCC
-2
VOUT -4
-6
0
1000
2000
3000
4000
5000
0
1000
2000
LOAD CAPACITANCE (pF)
3000
4000
FIGURE 8. LOW SPEED TRANSMITTER OUTPUT VOLTAGE
vs LOAD CAPACITANCE
FIGURE 9. HIGH SPEED TRANSMITTER OUTPUT VOLTAGE
vs LOAD CAPACITANCE
90
25
MBAUD = GND
MBAUD = VCC
70
SLEW RATE (V/µs)
20
SLEW RATE (V/µs)
5000
LOAD CAPACITANCE (pF)
+SLEW
15
-SLEW
10
+SLEW
50
30
-SLEW
-SLEW
10
0
5
0
1000
2000
3000
4000
0
5000
1000
FIGURE 10. LOW SPEED SLEW RATE vs LOAD CAPACITANCE
3000
4000
5000
FIGURE 11. HIGH SPEED SLEW RATE vs LOAD
CAPACITANCE
90
55
MBAUD = VCC
MBAUD = GND
1Mbps
80
45
SUPPLY CURRENT (mA)
50
SUPPLY CURRENT (mA)
2000
LOAD CAPACITANCE (pF)
LOAD CAPACITANCE (pF)
250kbps
40
120kbps
35
30
25
70
60
50
250kbps
40
120kbps
30
20kbps
20
20
0
1000
2000
3000
4000
5000
LOAD CAPACITANCE (pF)
FIGURE 12. LOW SPEED SUPPLY CURRENT vs LOAD
CAPACITANCE WHEN TRANSMITTING DATA
9
0
1000
2000
3000
4000
5000
LOAD CAPACITANCE (pF)
FIGURE 13. HIGH SPEED SUPPLY CURRENT vs LOAD
CAPACITANCE WHEN TRANSMITTING DATA
ICL3237
Typical Performance Curves
VCC = 3.3V, TA = 25oC (Continued)
3.5
NO LOAD
ALL OUTPUTS STATIC
SUPPLY CURRENT (mA)
3.0
2.5
2.0
1.5
1.0
0.5
0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
SUPPLY VOLTAGE (V)
FIGURE 14. SUPPLY CURRENT vs SUPPLY VOLTAGE
Die Characteristics
SUBSTRATE POTENTIAL (POWERED UP)
GND
TRANSISTOR COUNT
619
PROCESS
Si Gate CMOS
10
6.0
ICL3237
Shrink Small Outline Plastic Packages (SSOP)
M28.209 (JEDEC MO-150-AH ISSUE B)
N
28 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
INDEX
AREA
H
0.25(0.010) M
2
GAUGE
PLANE
3
0.25
0.010
SEATING PLANE
-A-
INCHES
E
-B-
1
B M
L
A
D
-C-
α
e
B
C
0.10(0.004)
0.25(0.010) M
C A M
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
-
0.078
-
2.00
-
A1
0.002
-
0.05
-
-
A2
0.065
0.072
1.65
1.85
-
B
0.009
0.014
0.22
0.38
9
C
0.004
0.009
0.09
0.25
-
D
0.390
0.413
9.90
10.50
3
E
0.197
0.220
5.00
5.60
4
e
A2
A1
B S
NOTES:
MILLIMETERS
0.026 BSC
H
0.292
L
0.022
N
α
0.65 BSC
0.322
7.40
0.037
0.55
28
0°
-
0.95
6
28
8°
0°
-
8.20
7
8°
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2
of Publication Number 95.
Rev. 2 6/05
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.20mm (0.0078 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions.
Interlead flash and protrusions shall not exceed 0.20mm (0.0078
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.13mm (0.005 inch) total in excess of
“B” dimension at maximum material condition.
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
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11
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