ATMEL AT97SC3204 Trusted platform module Datasheet

1.
Features
• Full Trusted Computing Group (TCG) Trusted
Platform Module (TPM) Version 1.2 Compatibility
• Compliant with TCG PC Client Specific TPM
Interface Specification Version 1.2
• Single-chip Turnkey Solution
Trusted Platform
Module
• Hardware Asymmetric Crypto Engine
• 2048-bit RSA® Sign in 200ms
• AVR® RISC Microprocessor
• Internal EEPROM Storage for RSA Keys
Atmel AT97SC3204
LPC Interface
• 33MHz LPC (Low Pin Count) Bus for Easy PC Interface
• Secure Hardware and Firmware Design and Chip Layout
• True Random Number Generator (RNG) – FIPS 140-2 Compliant
• NV Storage space for 1280-bytes of user defined data
Summary
• 3.3V Supply Voltage
• 28-lead Thin TSSOP, Wide TSSOP or 40-lead QFN Packages
* See the full data sheet for
detailed design information
• Offered in both Commercial (0 to 70°C) and Industrial (-40 to +85°C)
Temperature Ranges
2.
Description
The Atmel® AT97SC3204 is a fully integrated security module designed to be
integrated into personal computers and other embedded systems. It implements
version 1.2 of the Trusted Computing Group (TCG) specification for Trusted Platform
Modules (TPM).
The TPM includes a cryptographic accelerator capable of computing a 2048-bit RSA
signature in 200ms and a 1024-bit RSA signature in 40ms. Performance of the SHA-1
accelerator is 20µs per 64-byte block.
The chip communicates with the PC through the LPC interface. The TPM supports SIRQ
(for interrupts) and CLKRUN to permit clock stopping for power savings in mobile
computers.
5294BS–TPM–9/10
Note: This is a summary document. A complete document
is available under NDA. For more information, please
contact your local Atmel sales office.
Table 1-1.
2
Pin Configurations
Pin Name
Function
VCC
3.3V Supply Voltage
SB3V
Standby 3.3V Supply Voltage
GND
Ground
LRESET#
PCI Reset Input Active Low
LAD0
LPC Command, Address, Data Line Input/Output
LAD1
LPC Command, Address, Data Line Input/Output
LAD2
LPC Command, Address, Data Line Input/Output
LAD3
LPC Command, Address, Data Line Input/Output
LCLK
33MHz PCI Clock Input
LFRAME#
LPC FRAME Input
CLKRUN#
PCI Clock Run Input/Output
LPCPD#
LPC Power Down Input
SERIQ
Serialized Interrupt Request Input/Output
GPIO6
General Purpose Input/Output
TestI
Test Input (disabled)
TestBI
Test Input (disabled)
ATest
Atmel Test Pin
NC
No Connect
NBO
Not Bounded out
Atmel AT24C256C
5294BS–TPM–9/10
Atmel AT24C256C
Pinout Diagrams
28-pin Thin TSSOP
4.4 mm x 9.7 mm Body
0.65 mm Pitch
ATest
1
28 LPCPD#
ATest
2
27 SERIRQ
31 NBO
32 NBO
33 NBO
34 NBO
35 NBO
36 NBO
1
39 ATest
ATest
40 ATest
28-pin TSSOP
6.1 mm x 9.7 mm Body
0.65 mm Pitch
37 SERIRQ
40-pin QFN
6.0 mm x 6.0 mm Body
0.50 mm Pitch
38 LPCPD#
Figure 2-1.
30 LAD0
GND
2
29 GND
3
28 VCC
5
24 VCC
NC
5
26 LFRAME#
GPIO6
6
23 LAD1
TestI
6
25 LCLK
NC
7
22 LFRAME#
TestBI
7
24 LAD2
TestI
8
21 LCLK
VCC
8
23 VCC
20 LAD2
GND
9
22 GND
VCC 10
GND 11
19 VCC
NBO 10
21 LAD3
NBO 12
NBO 13
17 LAD3
NBO 14
15 CLKRUN#
TestBI
9
18 GND
16 LRESET#
LRESET# 20
SB3V
CLKRUN# 19
27 LAD1
NBO 18
4
NBO 17
GPIO6
NBO 16
25 GND
NBO 15
4
NBO 14
GND
NBO 13
26 LAD0
NBO 12
3
NBO 11
ATest
SB3V
3
5294BS–TPM–9/10
Figure 2-2.
GPIO6
Atmel AT97SC3204 Block Diagram
ROM
Program
EEPROM
Program
33MHz
LPC
Interface
AVR
8-bit RISC
CPU
SRAM
EEPROM
Data
GPIO
RNG
CRYPTO
Engine
Timer
Physical
Security
Circuitry
The TPM includes a hardware random number generator, including a FIPS-approved Pseudo Random Number
Generator that is used for key generation and TCG protocol functions. The RNG is also available to the system to
generate random numbers that may be needed during normal operation.
The chip uses a dynamic internal memory management scheme to store multiple RSA keys. Other than the standard
TCG commands (TPM_FlushSpecific, TPM_Loadkey2), no system intervention is required to manage this internal key
cache.
The TPM is offered to OEM and ODM manufacturers as a turnkey solution, including the firmware integrated on the
chip. In addition, Atmel provides the necessary device driver software for integration into certain operating systems,
along with BIOS drivers. Atmel will also provide manufacturing support software for use by OEMs and ODMs during
initialization and verification of the TPM during board assembly.
Full documentation for TCG primitives can be found in the TCG TPM Main Specification, Parts 1 to 3, on the TCG Web
site located at https://www.trustedcomputinggroup.org. TPM features specific to PC Client platforms are specified in
the “TCG PC Client Specific TPM Interface Specification, Version 1.2”, also available on the TCG web site.
Implementation guidance for 32-bit PC platforms is outlined in the “TCG PC Client Specific Implementation
Specification for Conventional BIOS for TCG Version 1.2”, also available on the TCG web site.
4
Atmel AT24C256C
5294BS–TPM–9/10
Atmel AT24C256C
3.
Ordering Information
Table 1-2.
Atmel AT24C256C Ordering Information
Atmel Ordering Code
AT97SC3204
(1)
Package
Operating Range
28A2 (28-pin Thin TSSOP)
Lead-free, RoHS
Commercial (0°C to 70°C)
Industrial (-40°C to 85°C)
AT97SC3204(1)
28A3 (28-pin TSSOP)
Lead-free, RoHS
Commercial (0°C to 70°C)
Industrial (-40°C to 85°C)
AT97SC3204(1)
40ML1 (40-pin QFN) (2)
Lead-free, RoHS
Commercial (0°C to 70°C)
Industrial (-40°C to 85°C)
Notes:
1. Please see the Atmel AT97SC3204 datasheet addendum for the complete catalog number ordering code
5
5294BS–TPM–9/10
4.
Package Drawing
28A2 – Thin TSSOP
b
L
L1
E
E1
e
D
A
A2
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
1.
2.
3.
4.
Dimension "D" does not include mold flash, protrusions or gate
burrs. Mold flash, protrusions and gate burrs shall not exceed
.15mm (.006 in) per side.
Dimension "E1" does not include inter-lead flash or protrusions.
Inter-lead flash and protrusions shall not exceed .25mm (.010 in)
per side.
Dimension 'b' does not include Dambar protrusion. Allowable
Dambar protrusion shall be 0.08 mm total in excess of the 'b'
dimension at maximum material condition. Dambar cannot be
located on the lower radius of the foot. Minimum space between
protrusion and adjacent lead is 0.07 mm.
Dimension 'D' and 'E1' to be determined at Datum Plane H.
D
MIN
NOM
MAX
NOTE
9.60
9.70
9.80
1,4
4.50
2,4
E
E1
6.40 BSC
4.30
4.40
A
1.20
A2
0.80
b
0.19
e
L
L1
1.00
1.05
0.30
0.65 BSC
0.45
0.60
0.75
1.00 REF
This drawing is for general information only. Please refer to
JEDEC Drawing MO-153, Variation AE for additional information.
Package Drawing Contact:
[email protected]
6
TITLE
28A2, 28-lead, 4.4x9.7 mm Body, 0.65 pitch,
Thin Shrink Small Outline Package (TSSOP)
3
6/17/08
GPC
TFL
DRAWING NO.
REV.
28A2
B
Atmel AT24C256C
5294BS–TPM–9/10
Atmel AT24C256C
28A3 – TSSOP
b
L
L1
E E1
e
End View
Top View
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
D
D
A
A2
NOM
MAX
NOTE
9.70
9.80
2, 5
6.20
3, 5
E
E1
Side View
MIN
9.60
8.10 BSC
6.00
A
–
–
1.20
A2
0.80
1.00
1.05
b
0.19
–
0.30
e
L
L1
Note: 1.
2.
3.
4.
5.
R
6.10
4
0.65 BSC
0.45
0.60
0.75
1.00 REF
This drawing is for general information only. Please refer to JEDEC Drawing MO-153, Variation DB for additional
information.
Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall
not exceed 0.15 mm (0.006 in) per side.
Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed
0.25 mm (0.010 in) per side.
Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of
the b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum
space between protrusion and adjacent lead is 0.07 mm.
Dimension D and E1 to be determined at Datum Plane H.
1/8/02
2325 Orchard Parkway
San Jose, CA 95131
TITLE
28A3, 28-lead, 6.1 x 9.7 mm Body, 0.65 pitch,
Thin Shrink Small Outline Package (TSSOP)
DRAWING NO.
REV.
28A3
A
7
5294BS–TPM–9/10
40ML1 – QFN
A
D
A1
N
A2
A3
1
2
Pin 1 Indicator
3
E
Top View
L
0
Side View
COMMON DIMENSIONS
(Unit of Measure = mm)
D2
SYMBOL
MIN
D
E2
2
b
1
N
R
8
4.25
3.95
4.10
4.25
-
0.85
0.90
A1
0.0
0.01
0.05
A2
-
0.65
0.70
0.20 REF
0.30
e
Bottom View
2.
4.10
E2
L
PIN1 ID
Note: 1.
3.95
A
b
NOTE
6.00 BSC
D2
A3
e
MAX
6.00 BSC
E
3
NOM
0.40
0.50
0.50 BSC
0.18
0.23
0.30
2
This drawing is for general information only. Refer to JEDEC Drawing MO-220, Variation WJJD-2, for proper
dimensions, tolerances, datums, etc.
Dimension b applies to metallized terminal and is measured between 0.15 mm and 0.30 mm from the terminal
tip. If the terminal has the optional radius on the other end of the terminal, the dimension should not be
measured in that radius area.
9/27/07
2325 Orchard Parkway
San Jose, CA 95131
TITLE
40ML1, , 40-lead 6.0 x 6.0 mm Body, 0.50 mm Pitch, Molded
Quad Flat No Lead Package (QFN) Punched
DRAWING NO.
REV.
40ML1
C
Atmel AT24C256C
5294BS–TPM–9/10
Atmel AT24C256C
5.
Revision History
Doc. Rev.
Date
Comments
5294BS
10/2010
Added Industrial Grade support detail
5294AS
01/2008
Initial document release
9
5294BS–TPM–9/10
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© 2010 Atmel Corporation. All rights reserved. / Rev.: 5294BS−TPM−10/10
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