IXYS IXDD614SI 14a peak source/sink drive current Datasheet

IXD_614
14-Ampere Low-Side
Ultrafast MOSFET Drivers
INTEGRATED CIRCUITS DIVISION
Features
Description
• 14A Peak Source/Sink Drive Current
• Wide Operating Voltage Range: 4.5V to 35V
• -40°C to +125°C Extended Operating Temperature
Range
• Logic Input Withstands Negative Swing of up to 5V
• Low Propagation Delay Time
• Low, 10A Supply Current
• Low Output Impedance
The IXDD614 / IXDI614 / IXDN614 high-speed gate
drivers are especially well suited for driving the latest
IXYS MOSFETs and IGBTs. Each output can source
and sink 14A of peak current while producing voltage
rise and fall times of less than 30ns. Internal circuitry
eliminates cross-conduction and current
"shoot-through," making the driver virtually immune to
latch up. Low propagation delay with fast rise and fall
times make the IXD_614 family ideal for
high-frequency and high-power applications.
Applications
•
•
•
•
•
•
Efficient Power MOSFET and IGBT Switching
Switch Mode Power Supplies
Motor Controls
DC to DC Converters
Class-D Switching Amplifiers
Pulse Transformer Driver
The IXDD614 is configured as a non-inverting driver
with an enable. The IXDN614 is configured as a
non-inverting driver, and the IXDI614 is configured as
an inverting driver.
The IXD_614 family is available in an 8-pin DIP (PI),
an 8-pin Power SOIC with an exposed metal back (SI),
a 5-pin TO-220 (CI), and a 5-pin TO-263 (YI) package.
Ordering Information
Part Number
IXDD614PI
IXDD614SI
IXDD614SITR
IXDD614CI
IXDD614YI
IXDI614PI
IXDI614SI
IXDI614SITR
IXDI614CI
IXDI614YI
IXDN614PI
IXDN614SI
IXDN614SITR
IXDN614CI
IXDN614YI
DS-IXD_614-R06
Logic
Configuration
IN
OUT
EN
IN
OUT
IN
OUT
Package Type
Packing
Method
Quantity
8-Pin DIP
8-Pin Power SOIC with Exposed Metal Back
8-Pin Power SOIC with Exposed Metal Back
5-Pin TO-220
5-Pin TO-263
8-Pin DIP
8-Pin Power SOIC with Exposed Metal Back
8-Pin Power SOIC with Exposed Metal Back
5-Pin TO-220
5-Pin TO-263
8-Pin DIP
8-Pin Power SOIC with Exposed Metal Back
8-Pin Power SOIC with Exposed Metal Back
5-Pin TO-220
5-Pin TO-263
Tube
Tube
Tape & Reel
Tube
Tube
Tube
Tube
Tape & Reel
Tube
Tube
Tube
Tube
Tape & Reel
Tube
Tube
50
100
2000
50
50
50
100
2000
50
50
50
100
2000
50
50
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1
IXD_614
INTEGRATED CIRCUITS DIVISION
1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.1 Pin Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.2 Pin Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.4 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.5 Electrical Characteristics: TA = 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.6 Electrical Characteristics: TA = - 40°C to +125°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.7 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3
3
3
3
3
4
5
6
2. Performance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1 Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.2 Characteristics Test Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3. Block Diagrams & Truth Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.1 IXDD614 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.2 IXDI614 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3 IXDN614 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7
7
7
7
4. Typical Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.3 Soldering Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.4 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.4.1 SI (8-Pin Power SOIC with Exposed Metal Back). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.4.2 SI Package Tape & Reel Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.4.3 YI (5-Pin TO-263) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.4.4 CI (5-Pin TO-220) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.4.5 PI (8-Pin DIP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2
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R06
IXD_614
INTEGRATED CIRCUITS DIVISION
1 Specifications
1.1 Pin Configurations
1.2 Pin Definitions
IXDD614 PI / SI
IXDD614 CI / YI
Pin Name
VCC
1
8
VCC
IN
2
7
OUT
EN
3
6
OUT
4
5
GND
GND
VCC
1
OUT
2
GND
3
IN
4
EN
5
IXDI614 PI / SI
Description
IN
Logic Input
EN
Output Enable - Drive pin low to disable output,
and force output to a high impedance state
OUT
Output - Sources or sinks current to turn-on or
turn-off a discrete MOSFET or IGBT
OUT
Inverted Output - Sources or sinks current to
turn-on or turn-off a discrete MOSFET or IGBT
VCC
Supply Voltage - Provides power to the device
GND
Ground - Common ground reference for the
device
IXDI614 CI / YI
VCC
1
8
VCC
IN
2
7
OUT
NC
3
6
OUT
GND
4
5
GND
VCC
1
OUT
2
GND
3
IN
4
NC
5
NC
IXDN614 PI / SI
IXDN614 CI / YI
VCC
1
8
VCC
IN
2
7
OUT
NC
GND
Not connected
3
6
OUT
4
5
GND
VCC
1
OUT
2
GND
3
IN
4
NC
5
Note: IXYS Integrated Circuits Division recommends
that the exposed metal pad on the back of the “SI”
package be connected to GND. The pad is not
suitable for carrying current.
1.3 Absolute Maximum Ratings
Parameter
Symbol
Minimum
Maximum
Units
VCC
-0.3
40
V
VIN , VEN
-5
VCC+0.3
V
IOUT
-
±14
A
Junction Temperature
TJ
-55
+150
°C
Storage Temperature
TSTG
-65
+150
°C
Supply Voltage
Input Voltage
Output Current
Unless stated otherwise, absolute maximum electrical ratings are at 25°C
Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device.
Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not
implied.
1.4 Recommended Operating Conditions
Parameter
Symbol
Range
Units
VCC
4.5 to 35
V
Operating Temperature Range
TA
-40 to +125
°C
R06
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Supply Voltage
3
IXD_614
INTEGRATED CIRCUITS DIVISION
1.5 Electrical Characteristics: TA = 25°C
Test Conditions: 4.5V < VCC < 35V (unless otherwise noted).
Parameter
Conditions
Symbol
Minimum
Typical
Maximum
Input Voltage, High
4.5V < VCC < 18V
VIH
3.0
-
-
Input Voltage, Low
4.5V < VCC < 18V
VIL
-
-
0.8
Input Current
0V < VIN < VCC
IIN
-
-
±10
EN Input Voltage, High
IXDD614 only
VENH
2/3VCC
-
-
EN Input Voltage, Low
IXDD614 only
VENL
-
-
1/3VCC
Output Voltage, High
-
VOH
VCC-0.025
-
-
Output Voltage, Low
-
VOL
-
-
0.025
Output Resistance, High State
VCC=18V, IOUT=-100mA
ROH
-
0.4
0.8
Output Resistance, Low State
VCC=18V, IOUT=100mA
ROL
-
0.3
0.6
IDC
-
-
±4
tR
Units
V
A
V
V

Rise Time
Limited by package power
dissipation
CLOAD=15nF, VCC=18V
-
25
35
Fall Time
CLOAD=15nF, VCC=18V
tF
-
18
25
On-Time Propagation Delay
CLOAD=15nF, VCC=18V
tONDELAY
-
50
70
Off-Time Propagation Delay
CLOAD=15nF, VCC=18V
tOFFDELAY
-
50
70
Enable to Output-High Delay Time
IXDD614 only
tENOH
-
31
60
Disable to High Impedance State Delay Time
IXDD614 only
tDOLD
-
44
70
Enable Pull-Up Resistor
IXDD614 only
REN
-
200
-
k
-
1
2
mA
-
<1
10
-
<1
10
Output Current, Continuous
VCC=18V, VIN=3.5V
Power Supply Current
VCC=18V, VIN=0V
VCC=18V, VIN=VCC
4
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ICC
A
ns
A
R06
IXD_614
INTEGRATED CIRCUITS DIVISION
1.6 Electrical Characteristics: TA = - 40°C to +125°C
Test Conditions: 4.5V < VCC < 35V.
Parameter
Conditions
Symbol
Minimum
Maximum
Input Voltage, High
4.5V < VCC < 18V
VIH
3.3
-
Input Voltage, Low
4.5V < VCC < 18V
VIL
-
0.65
0V < VIN < VCC
IIN
-
±10
Output Voltage, High
-
VOH
VCC-0.025
-
Output Voltage, Low
-
VOL
-
0.025
Output Resistance, High State
VCC=18V, IOUT=-100mA
ROH
-
1.5
Output Resistance, Low State
VCC=18V, IOUT=100mA
ROL
-
1.2
IDC
-
±1
tR
-
50
Input Current
Rise Time
Limited by package power
dissipation
CLOAD=15nF, VCC=18V
Fall Time
CLOAD=15nF, VCC=18V
tF
-
40
On-Time Propagation Delay
CLOAD=15nF, VCC=18V
tONDELAY
-
90
Off-Time Propagation Delay
CLOAD=15nF, VCC=18V
tOFFDELAY
-
90
IXDD614 only
tENOH
-
75
IXDD614 only
tDOLD
-
85
-
3
-
150
-
150
Output Current, Continuous
Enable to Output-High Delay Time
Disable to High Impedance State Delay Time
VCC=18V, VIN=3.5V
Power Supply Current
VCC=18V, VIN=0V
VCC=18V, VIN=VCC
R06
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ICC
Units
V
A
V

A
ns
mA
A
5
IXD_614
INTEGRATED CIRCUITS DIVISION
1.7 Thermal Characteristics
Package
Parameter
Symbol
Rating
CI (5-Pin TO-220)
Units
36
PI (8-Pin DIP)
JA
Thermal Resistance, Junction-to-Ambient
SI (8-Pin Power SOIC)
125
85
YI (5-Pin TO-263)
°C/W
46
CI (5-Pin TO-220)
3
JC
Thermal Resistance, Junction-to-Case
SI (8-Pin Power SOIC)
10
YI (5-Pin TO-263)
°C/W
2
2 Performance
2.1 Timing Diagrams
VIH
IN
VIH
IN
VIL
tONDELAY
VIL
tOFFDELAY
tOFFDELAY
tONDELAY
90%
OUT
OUT
10%
90%
10%
tF
tR
tF
tR
2.2 Characteristics Test Diagram
+
0.1μF
10μF
IN
VCC
-
OUT
VCC
EN
VIN
6
VCC
GND
CLOAD
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Tektronix
Current Probe
6302
R06
IXD_614
INTEGRATED CIRCUITS DIVISION
3 Block Diagrams & Truth Tables
3.1 IXDD614
3.3 IXDN614
VCC
VCC
IN
OUT
OUT
IN
GND
EN
GND
IN
EN
OUT
IN
OUT
0
1 or open
0
0
0
1
1 or open
1
1
1
x
0
Z
3.2 IXDI614
VCC
OUT
IN
GND
R06
IN
OUT
0
1
1
0
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7
IXD_614
INTEGRATED CIRCUITS DIVISION
4 Typical Performance Characteristics
Rise Time vs. Supply Voltage
(VIN=0-5V, f=10kHz, TA=25ºC)
60
CL=15nF
CL=7.5nF
CL=3.6nF
50
40
30
20
CL=15nF
CL=7.5nF
CL=3.6nF
40
30
20
10
10
0
0
5
10
15
20
25
30
Supply Voltage (V)
35
40
0
5
10
15
20
25
30
Supply Voltage (V)
Rise Time vs. Load Capacitance
50
35
30
25
40
20
35
30
25
15
10
10
4
6
8
10
12
Load Capacitance (nF)
Propagation Delay vs. Supply Voltage
(VIN=0-5V, f=1kHz, CL=15nF)
tOFFDLY
150
tONDLY
50
14
16
2
4
6
8
10
12
Load Capacitance (nF)
Propagation Delay vs. Input Voltage
(VIN=0-5V, f=1kHz, CL=15nF, VCC=12V)
160
Propagation Delay (ns)
Propagation Delay (ns)
-40 -20
140
120
100
80
70
tOFFDLY
60
tONDLY
0
10
35
40
Min VIH
2.5
Max VIL
2.0
4
6
8
10
Input Voltage (V)
12
0
100 120 140
20 40 60 80
Temperature (ºC)
100 120 140
16
Propogation Delay
vs. Junction Temperature
(VIN=0-5V, f=1kHz, CL=15nF, VCC=18V)
tOFFDLY
65
60
tONDLY
55
50
45
-40 -20
14
0
20 40 60 80
Temperature (ºC)
100 120 140
Enable Threshold
vs. Supply Voltage
25
3.5
3.0
Min VIH
2.5
Max VIL
2.0
20
Min VENH
15
Max VENL
10
5
0
1.5
-40 -20
14
Input Threshold
vs. Supply Voltage
Input Threshold (V)
3.0
1.5
8
2
Input Threshold
vs. Temperature
(CL=3.6nF, VCC=18V)
3.5
Input Threshold (V)
15
20
25
30
Supply Voltage (V)
Enable Threshold (V)
5
20 40 60 80
Temperature (ºC)
40
40
0
0
5
2
100
tF
20
15
5
200
tR
VCC=4.5V
VCC=8V
VCC=12V
VCC=18V
VCC=25V
VCC=30V
VCC=35V
45
Fall Time (ns)
Rise Time (ns)
40
40
Rise & Fall Time vs. Temperature
(VIN=0-5V, f=10kHz, CL=3.6nF, VCC=18V)
Fall Time vs. Load Capacitance
50
VCC=4.5V
VCC=8V
VCC=12V
VCC=18V
VCC=25V
VCC=30V
VCC=35V
45
35
Propagation Delay (ns)
0
250
15
14
13
12
11
10
9
8
7
6
5
50
Fall Time (ns)
Rise Time (ns)
70
60
Fall Time vs. Supply Voltage
(VIN=0V-5V, f=10kHz, TA=25ºC)
Time (ns)
80
0
5
10
15
20
25
30
Supply Voltage (V)
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35
40
0
5
10
15
20
25
30
Supply Voltage (V)
35
40
R06
IXD_614
INTEGRATED CIRCUITS DIVISION
f=1MHz
f=500kHz
100
f=100kHz
f=50kHz
10
f=10kHz
1000
Supply Current vs. Load Capacitance
(VCC=18V)
f=2MHz
f=1MHz
f=500kHz
100
f=100kHz
f=50kHz
10
f=10kHz
1
f=1kHz
1000
Supply Current (mA)
Supply Current (mA)
f=2MHz
Supply Current (mA)
1000
Supply Current vs. Load Capacitance
(VCC=35V)
Supply Current vs. Load Capacitance
(VCC=12V)
100
f=2MHz
f=1MHz
f=500kHz
10
f=100kHz
f=50kHz
f=10kHz
1
f=1kHz
f=1kHz
16
Supply Current vs. Load Capacitance
(VCC=8V)
100
f=2MHz
f=1MHz
f=500kHz
10
f=100kHz
f=50kHz
1
f=10kHz
f=1kHz
0.1
2
18
2
18
10
1
16
100
10
1
10
100
1000
Frequency (kHz)
1
10
100
1000
Frequency (kHz)
1
0.1
1.0
0.8
0.6
0.4
0.2
100
1000
Frequency (kHz)
-40 -20
0
20 40 60 80
Temperature (ºC)
100 120 140
10000
3.5V
5V
10V
0V & 18V
1.0
0.5
0.0
-25
-20
-15
-10
-5
0
20 40 60 80
Temperature (ºC)
100 120 140
Output Sink Current
vs. Supply Voltage
(CL=330nF)
45
-30
40
35
30
25
20
15
10
5
0
0
0.0
100
1000
Frequency (kHz)
1.5
-0.5
-40 -20
10000
Output Source Current
vs. Supply Voltage
(CL=330nF)
-35
Output Source Current (A)
1.2
10
10
2.0
10
1
Dynamic Supply Current
vs. Temperature
(VIN=0-5V, f=1kHz, CL=5.4nF, VCC=18V)
1
Quiescent Supply Current
vs. Temperature
CL=15nF
CL=7.5nF
CL=3.6nF
100
10000
18
10
1
0.01
0.1
16
CL=15nF
CL=7.5nF
CL=3.6nF
100
10000
Supply Current vs. Frequency
(VCC=8V)
1000
CL=15nF
CL=7.5nF
CL=3.6nF
6
8
10
12
14
Load Capacitance (nF)
0.1
1
18
Supply Current (mA)
6
8
10
12
14
Load Capacitance (nF)
4
Supply Current vs. Frequency
(VCC=18V)
1000
CL=15nF
CL=7.5nF
CL=3.6nF
100
Supply Current (mA)
Supply Current (mA)
4
Supply Current vs. Frequency
(VCC=12V)
1000
Supply Current (mA)
16
0.1
2
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6
8
10
12
14
Load Capacitance (nF)
Supply Current vs. Frequency
(VCC=35V)
1000
0.01
1.4
4
Supply Current (mA)
6
8
10
12
14
Load Capacitance (nF)
Output Sink Current (A)
Supply Current (mA)
4
Supply Current (mA)
2
1000
0.1
0.1
1
0
5
10
15
20
25
30
Supply Voltage (V)
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35
40
0
5
10
15
20
25
30
Supply Voltage (V)
35
40
9
IXD_614
INTEGRATED CIRCUITS DIVISION
Output Source Current
vs. Temperature
(CL=330nF, VCC=18V)
24
Output Sink Current (A)
Output Source Current (A)
-22
-20
-18
-16
-14
-12
-10
0
20 40 60 80
Temperature (ºC)
22
21
20
19
18
17
100 120 140
-40 -20
0
20 40 60 80
Temperature (ºC)
100 120 140
Low-State Output Resistance @ +10mA
vs. Supply Voltage
High-State Output Resistance @ -10mA
vs. Supply Voltage
0.7
1.0
0.9
Output Resistance (Ω)
Output Resistance (Ω)
23
16
-40 -20
0.8
0.7
0.6
0.5
0.4
0.6
0.5
0.4
0.3
0.2
0.1
0.3
0
10
Output Sink Current
vs. Temperature
(CL=330nF, VCC=18V)
5
10
15
20
25
30
Supply Voltage (V)
35
40
0
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5
10
15
20
25
30
Supply Voltage (V)
35
40
R06
IXD_614
INTEGRATED CIRCUITS DIVISION
5 Manufacturing Information
5.1 Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the
latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee
proper operation of our devices when handled according to the limitations and information in that standard as well as
to any limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to
the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
IXD_614SI / IXD_614PI /IXD_614CI / IXD_614YI
MSL 1
5.2 ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard
JESD-625.
5.3 Soldering Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020 must be observed.
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Device
Maximum Temperature x Time
IXD_614CI / IXD_614YI
IXD_614PI
IXD_614SI
245°C for 30 seconds
250°C for 30 seconds
260°C for 30 seconds
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11
IXD_614
INTEGRATED CIRCUITS DIVISION
5.4 Mechanical Dimensions
5.4.1 SI (8-Pin Power SOIC with Exposed Metal Back)
3.80
(0.150)
0.762 ± 0.254
(0.030 ± 0.010)
3.937 ± 0.254
(0.155 ± 0.010)
5.994 ± 0.254
(0.236 ± 0.010)
5.40
2.75
(0.209) (0.108)
1.55
(0.061)
Pin 1
0.406 ± 0.076
(0.016 ± 0.003)
1.27
(0.050)
1.270 REF
(0.050)
4.928 ± 0.254
(0.194 ± 0.010)
0.60
(0.024)
Recommended PCB Land Pattern
1.346 ± 0.076
(0.053 ± 0.003)
2.540 ± 0.254
(0.100 ± 0.010)
7º
0.051 MIN - 0.254 MAX
(0.002 MIN - 0.010 MAX)
Dimensions
mm
(inches)
3.556 ± 0.254
(0.140 ±0.010)
Note: The exposed metal pad on the back of the SI package should be connected to GND. It is not suitable for
carrying current.
5.4.2 SI Package Tape & Reel Information
330.2 DIA.
(13.00 DIA.)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
K0= 2.10
(0.083)
A0=6.50
(0.256)
P=8.00
(0.315)
User Direction of Feed
Embossed Carrier
Embossment
12
W=12.00
(0.472)
B0=5.30
(0.209)
Dimensions
mm
(inches)
NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2
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R06
IXD_614
INTEGRATED CIRCUITS DIVISION
5.4.3 YI (5-Pin TO-263)
14.605 / 15.875
(0.575 / 0.625)
1.143 / 1.651
(0.045 / 0.065)
1.143 / 1.397
(0.045 / 0.055)
9.652 / 10.312
(0.380 / 0.406)
4.318 / 4.597
(0.170 / 0.181)
Recommended PCB Pattern
10.40
(0.409)
8.636 / 9.144
(0.340 / 0.360)
9.30
(0.366)
3.65
(0.144)
1 2 3 4 5
6.35
(0.250)
3.95
(0.156)
0º - 8º
1.70 BSC
(0.067 BSC)
0.737 / 0.889
(0.029 / 0.035)
1.70
(0.067)
1.00
(0.039)
2.286 / 2.794
(0.090 / 0.110)
6.223 MIN
(0.245 MIN)
0.000 / 0.305
(0.000 / 0.012)
6.858 MIN
(0.270 MIN)
DIMENSIONS
mm MIN / mm MAX
(inches MIN / inches / MAX)
6
NOTES:
1. All metal surfaces are solder-plated except trimmed area.
2. No. 3 lead is connected to No. 6 lead (bottom heat sink) internally.
5.4.4 CI (5-Pin TO-220)
1.14 / 1.40
(0.045 / 0.055)
4.32 / 4.83
(0.170 / 0.190)
9.91 / 10.54
(0.390 / 0.415)
14.73 / 15.75
(0.580 / 0.620)
11.94 / 12.95
(0.470 / 0.510)
7.823
(0.308)
12.387
(0.487)
8.64 / 9.40
(0.340 / 0.370)
6.299
(0.248)
3
1 2 3 4 5
6.502
(0.256)
25.27 / 26.54
(0.995 / 1.045)
0.64 / 1.02
(0.025 / 0.040)
1.70 BSC
(0.067 BSC)
NOTES:
1. This drawing will meet all dimensions requirement of
JEDEC outlines TS-001AA and 5-lead version TO-220AB.
2. Mounting hole diameter: 3.53 / 3.96 (0.139 / 0.156)
3. The metal tab is connected to pin 3 (GND).
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7.620
(0.300)
DIMENSIONS
mm MIN / mm MAX
(inches MIN / inches / MAX)
0.38 / 0.64
(0.015 / 0.025)
2.29 / 2.92
(0.090 / 0.115)
12.70 / 14.73
(0.50 / 0.58)
Recommended Hole Pattern
Finished Hole Diameter = 1.45mm (0.057 in.)
1.70mm (0.067 in.)
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13
IXD_614
INTEGRATED CIRCUITS DIVISION
5.4.5 PI (8-Pin DIP)
2.540 ± 0.127
(0.100 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
8-0.800 DIA.
(8-0.031 DIA.)
2.540 ± 0.127
(0.100 ± 0.005)
9.144 ± 0.508
(0.360 ± 0.020)
6.350 ± 0.127
(0.250 ± 0.005)
Pin 1
PCB Hole Pattern
7.620 ± 0.254
(0.300 ± 0.010)
6.350 ± 0.127
(0.250 ± 0.005)
0.457 ± 0.076
(0.018 ± 0.003)
4.064 TYP
(0.160)
3.302 ± 0.051
(0.130 ± 0.002)
7.239 TYP.
(0.285)
7.620 ± 0.127
(0.300 ± 0.005)
0.254 ± 0.0127
(0.010 ± 0.0005)
7.620 ± 0.127
(0.300 ± 0.005)
Dimensions
mm
(inches)
0.813 ± 0.102
(0.032 ± 0.004)
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-IXD_614-R06
©Copyright 2015, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
1/6/2015
14
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R06
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