HP HSDL-3612-037 Irda data compliant 115.2kb/s 3v to 5v infrared transceiver Datasheet

Agilent HSDL-3612
IrDA® Data Compliant 115.2 kb/s
3 V to 5 V Infrared Transceiver
Data Sheet
Description
The HSDL-3612 is a low-profile
infrared transceiver module that
provides interface between logic
and IR signals for through-air,
serial, half-duplex IR data link.
The module is compliant to IrDA
Data Physical Layer Specifications
1.4 and IEC825-Class 1 Eye Safe.
Functional Block Diagram
VCC
R1
LEDA (10)
TXD (9)
SP
MD0 (4)
HSDL-3612
MD1 (5)
RXD (8)
CX1
GND (7,3)
CX2
VCC (1)
AGND (2)
Applications
• Digital imaging
– Digital still cameras
– Photo-imaging printers
• Data communication
– Notebook computers
– Desktop PCs
– Win CE handheld products
– Personal Digital Assistants
(PDAs)
– Printers
– Fax machines, photocopiers
– Screen projectors
– Auto PCs
– Dongles
– Set-Top box
• Telecommunication products
– Cellular phones
– Pagers
• Small industrial & medical
instrumentation
– General data collection devices
– Patient & pharmaceutical data
collection devices
Features
• Fully compliant to IrDA 1.0
physical layer specifications
– 9.6 kb/s to 115.2 kb/s operation
• Typical link distance > 1.5 m
• IEC825-Class 1 eye safe
• Low power operation range
– 2.7 V to 5.25 V
• Small module size
– 4.0 x 12.2 x 5.1 mm (HxWxD)
• Complete shutdown
– TXD, RXD, PIN diode
• Low shutdown current
– 10 nA typical
• Adjustable optical power
management
– Adjustable LED drive-current to
maintain link integrity
• Integrated EMI shield
– Excellent noise immunity
• Edge detection input
– Prevents the LED from long
turn-on time
• Interface to various super
I/O and controller devices
• Designed to accommodate light
loss with cosmetic window
• Only 2 external components are
required
The HSDL-3612 contains a highspeed and high-efficiency 870 nm
LED, a silicon PIN diode, and an
integrated circuit. The IC contains
an LED driver and a receiver
providing a single output (RXD)
for all data rates supported.
for adjustable optical power. With
two programming pins; MODE 0
and MODE 1, the optical power
output can be adjusted lower
when the nominal desired link
distance is one-third or two-third
of the full IrDA link.
The HSDL-3612 can be
completely shut down to achieve
very low power consumption. In
the shut down mode, the PIN
diode will be inactive and thus
producing very little photocurrent even under very bright
ambient light. The HSDL-3612
also incorporated the capability
The HSDL-3612 front view
options (HSDL-3612-007/-037)
and a top view packaging option
(HSDL-3612-008/-038) come
with integrated shield that helps
to ensure low EMI emission and
high immunity to EMI field, thus
enhancing reliable performance.
Ordering Information
Package Option
2
Application Support Information
The Application Engineering
group is available to assist you
with the technical understanding
associated with HSDL-3612
infrared transceiver module. You
can contact them through your
local sales representatives for
additional details.
Package
Front View
Part Number
HSDL-3612-007
Standard Package Increment
400
Front View
HSDL-3612-037
1800
Top View
HSDL-3612-008
400
Top View
HSDL-3612-038
1800
I/O Pins Configuration Table
Pin
1
2
3
4
5
6
7
8
9
10
Description
Supply Voltage
Analog Ground
Ground
Mode 0
Mode 1
No Connection
Ground
Receiver Data Output
Transmitter Data Input
LED Anode
Symbol
V CC
AGND
GND
MD0
MD1
NC
GND
RXD
TXD
LEDA
10 9
8
7
6
5
4
3
2
10
9
8
7
6
5
4
3
2
Mode 1
0
0
1
1
RX Function
Shutdown
SIR
SIR
SIR
TX Function
Shutdown
Full Distance Power
2/3 Distance Power
1/3 Distance Power
Transceiver I/O Truth Table
Transceiver
Mode
Active
Active
Active
Shutdown
X = Don’t Care
Inputs
TXD
1
0
0
X[3]
EI
X
High[1]
Low
Low
Outputs
LED
On
Off
Off
Not Valid
RXD
Not Valid
Low[2]
High
Not Valid
EI = In-Band Infrared Intensity at detector
Notes:
1. In-Band El ≤ 115.2 kb/s.
2. Logic Low is a pulsed response. The condition is maintained for duration dependent on the pattern and strength of the
incident intensity.
3. To maintain low shutdown current, TXD needs to be driven high or low and not left floating.
3
1
BOTTOM VIEW (HSDL-3612-008/-038)
Transceiver Control Truth Table
Mode 0
1
0
0
1
1
BACK VIEW (HSDL-3612-007/-037)
Recommended Application Circuit Components
Component
R1
Recommended Value
6.2 Ω ± 5%, 0.5 Watt, for 2.7 ≤ VCC ≤ 3.6 V operation
15.0 Ω ± 5%, 0.5 Watt, for 4.75 ≤ VCC ≤ 5.25 V operation
0.47 µF ± 20%, X7R Ceramic
6.8 µF ± 20%, Tantalum
CX1[4]
CX2[5]
Notes:
4. CX1 must be placed within 0.7 cm of the HSDL-3612 to obtain optimum noise immunity.
5. In "HSDL-3612 Functional Block Diagram" on page 1 it is assumed that Vled and VCC share the same supply
voltage and filter capacitors. In case the 2 pins are powered by different supplies CX2 is applicable for Vled and
CX1 for VCC . In environments with noisy power supplies, including CX2 on the VCC line can enhance supply
rejection performance.
0.7
200
180
0.6
160
140
LOP (mW/sr)
ILED (A)
0.5
0.4
0.3
120
100
80
60
0.2
40
0.1
0
1.3
20
1.5
1.7
1.9
2.1
LEDA VOLTAGE (V)
ILED vs. LEDA.
2.3
0
0 30 60 90 120 150 180 210 240 270 300
ILED (mA)
Light Output Power (LOP) vs. ILED.
Marking Information
The HSDL-3612-007/-037 is marked “3612YYWW” on the shield where
“YY” indicates the unit’s manufacturing year, and “WW” refers to the work
week in which the unit is tested.
CAUTIONS: The BiCMOS inherent to the design of this component increases the component’s
susceptibility to damage from electrostatic discharge (ESD). It is advised that normal static precautions
be taken in handling and assembly of this component to prevent damage and/or degradation which may
be induced by ESD.
4
Absolute Maximum Ratings [6]
Parameter
Storage Temperature
Operating Temperature
DC LED Current
Peak LED Current
Symbol
TS
TA
ILED(DC)
ILED(PK)
Minimum
–40
–20
Maximum
+100
+70
165
750
Unit
°C
°C
mA
mA
LED Anode Voltage
Supply Voltage
Transmitter Data
Input Current
Receiver Data
Output Voltage
VLEDA
Vcc
ITXD(DC)
–0.5
0
–12
7
7
12
V
V
mA
VO
–0.5
Vcc+0.5
V
Conditions
≤ 2 µs pulse width,
≤ 10% duty cycle
|IO(RXD)| = 20 µA
Note:
6. For implementations where case to ambient thermal resistance ≤ 50°C/W.
Recommended Operating Conditions
Parameter
Operating Temperature
Supply Voltage
Logic High Input Voltage
for TXD, MD0, MD1, and FIR_SEL
Logic Low Transmitter Input Voltage
LED (Logic High) Current Pulse Amplitude
Receiver Signal Rate
5
Symbol
TA
VCC
VIH
Minimum
–20
2.7
2 VCC/3
Maximum
+70
5.25
VCC
Unit
°C
V
V
VIL
ILEDA
0
180
2.4
VCC/3
300
115.2
V
mA
kb/s
Electrical & Optical Specifications
Specifications hold over the Recommended Operating Conditions unless otherwise noted. Unspecified test conditions
can be anywhere in their operating range. All typical values are at 25 °C and 3.3 V unless otherwise noted.
Parameter
Transceiver
Supply
Current
Digital Input
Current
Transmitter
Transmitter
Radiant
Intensity
Symbol
Typ.
Max.
Unit
Conditions
VI(TXD) ≤ VIL or
VI(TXD) ≥ VIH
VI(TXD) ≤ VIL, EI = 0
0 ≤ VI ≤ VCC
Shutdown
I CC1
10
200
nA
Idle
Logic
Low/High
ICC2
IL/H
2.5
–1
5
1
mA
µA
Logic High
Intensity
EIH
50
120
400
mW/sr
Peak
Wavelength
Spectral
Line Half
Width
Viewing Angle
Optical Pulse
Width
Rise and Fall
Times
λP
875
nm
∆λ1/2
35
nm
Maximum
Optical Pulse
Width
tpw (max)
LED Anode
On State Voltage
LED Anode
Off State Leakage Current
6
Min.
2θ1/2
tpw (EI)
30
1.5
1.6
tr (EI),
tf (EI)
20
VON(LEDA)
ILK(LEDA)
1
60
1.8
°
µs
40
ns
50
µs
2.4
V
100
nA
VIH = 3.0 V
ILEDA = 200 mA
θ1/2 ≤ 15°
tpw(TXD) = 1.6 µs at
115.2 kb/s
tpw(TXD) = 1.6 µs at
115.2 kb/s
tr/f (TXD) = 10 ns
TXD pin stuck high
ILEDA = 200 mA,
VI(TXD) ≥ VIH
VLEDA = VCC = 5.25 V,
VI(TXD) ≤ VIL
Electrical & Optical Specifications
Specifications hold over the Recommended Operating Conditions unless otherwise noted. Unspecified test conditions
can be anywhere in their operating range. All typical values are at 25 °C and 3.3 V unless otherwise noted.
Receiver
Receiver
Data Output
Voltage
Parameter
Symbol
Min.
Typ.
Max.
Unit
Logic Low[7]
VOL
0
-
0.4
V
Logic High
VOH
VCC – 0.2 -
VCC
V
2θ1/2
EIH
30
0.0036
500
°
mW/cm2
0.3
µW/cm2
Viewing Angle
Logic High Receiver Input
Irradiance
Logic Low Receiver Input
Irradiance
Receiver Peak Sensitivity
Wavelength
Receiver SIR Pulse Width
Receiver Latency Time
Receiver Rise/Fall Times
Receiver Wake Up Time
EIL
λP
tpw (SIR)
tL
tr/f (RXD)
tW
880
1
20
25
Conditions
IOL = 1.0 mA,
EI ≥ 3.6 µW/cm2 ,
θ1/2 ≤ 15°
IOH = –20 µA,
EI ≤ 0.3 µW/cm2 ,
θ1/2 ≤ 15°
For in-band signals ≤
115.2 kb/s[8]
For in-band signals[8]
nm
4.0
50
100
µs
µs
ns
µs
θ1/2 ≤ 15°[9], CL = 10 pF
[10]
Notes:
7. Logic Low is a pulsed response. The condition is maintained for duration dependent on pattern and strength of the incident intensity.
8. An in-band optical signal is a pulse/sequence where the peak wavelength, lp, is defined as 850 ≤ lp ≤ 900 nm, and the pulse characteristics are
compliant with the IrDA Serial Infrared Physical Layer Link Specification.
9. For in-band signals ≤ 115.2 kb/s where 3.6 µW/cm2 ≤ EI ≤ 500 mW/cm2 .
10. Wake Up Time is the time between the transition from a shutdown state to an active state and the time when the receiver is active and ready
to receive infrared signals.
7
TXD “Stuck ON” Protection
TXD
LED
tpw (MAX.)
RXD Output Waveform
tpw
VOH
90%
50%
VOL
10%
tf
tr
LED Optical Waveform
tpw
LED ON
90%
50%
10%
LED OFF
tr
tf
Receiver Wake Up Time Definition
(when MD0 π 1 and MD1 π 0)
RX
LIGHT
RXD
VALID DATA
tw
8
HSDL-3612-007 and HSDL3612-037 Package Outline with Dimension
and Recommended PC Board Pad Layout
MOUNTING
CENTER
6.10
PIN
FUNCTION
PIN
FUNCTION
1
VCC
6
NC
2
AGND
7
GND
3
GND
8
RXD
4
MD0
9
TXD
5
MD1
10
LEDA
1.17
4.18
4.98
TOP VIEW
2.45
R 2.00
R 1.77
4.00
1.90
1.90
0.80
0.80
1.70
1.20
3.24
4.05
SIDE VIEW
3.84
12.20
FRONT VIEW
ALL DIMENSIONS IN MILLIMETERS (mm).
DIMENSION TOLERANCE IS 0.20 mm
UNLESS OTHERWISE SPECIFIED.
MOUNTING CENTER
MID OF LAND
PIN 1
PIN 10
0.70
0.43
1.05
PIN 10
2.40
PIN 1
2.08
0.45
0.70
4.95
10 CASTELLATION:
PITCH 1.1 ± 0.1
CUMULATIVE 9.90 ± 0.1
BACK VIEW
9
2.35
2.84
LAND PATTERN
HSDL-3612-008 and HSDL3612-038 Package Outline with Dimension
and Recommended PC Board Pad Layout
11.7
5
0.36
0.53
2.5
0.47
0.85
R2
.3
0.31
0.31
2.08
0.84
3.85
.1
R2
0.83
0.3
4.16 +0.05
- 0.00
2.08
1.46
0.42
2.57
0.28
1.77
0.94
3.24
3.84
5
2.15 +0.05
- 0.00
5
12.2 +0.10
- 0.00
11.7 +0.05
- 0.00
0.1
4.65
R2
R1
.77
0.1
0.94
0.8 0.73
10
1.95
Tape and Reel Dimensions (HSDL-3612-007, -037)
ALL DIMENSIONS IN MILLIMETERS (mm)
QUANTITY = 400 PIECES PER REEL (HSDL-3612-007)
1800 PIECES PER TAPE (HSDL-3612-037)
13.00 ± 0.50
R 1.00
(40 mm MIN.)
EMPTY
(400 mm MIN.)
LEADER
PARTS
MOUNTED
21.00 ± 0.80
EMPTY
(40 mm MIN.)
2.00 ± 0.50
DIRECTION OF PULLING
CONFIGURATION OF TAPE
LABEL
SHAPE AND DIMENSIONS OF REELS
A
10°
4
∅1.55 ± 0.05
5
2.00 ± 0.10
6
4.00 ± 0.10
B
3
1.75 ± 0.10
5° (MAX.)
11.50 ± 0.10
2
12 12.50 ± 0.10
A 3.8
24.00 ± 0.30
1
∅1.5 ± 0.1 8
A
A
8.00 ± 0.10
7
B
10 0.40 ± 0.10
11 4.25 ± 0.10
SECTION B-B
5° (MAX.)
4.4 A
5.20 ± 0.10 9
SECTION A-A
11
A
A
Tape and Reel Dimensions (HSDL-3612-008, -038)
QUANTITY = 400 PIECES PER REEL (HSDL-3612-008)
1800 PIECES PER TAPE (HSDL-3612-038)
ALL DIMENSIONS IN MILLIMETERS (mm)
13.00 ± 0.50
R 1.00
(40 mm MIN.)
EMPTY
(400 mm MIN.)
LEADER
PARTS
MOUNTED
21.00 ± 0.80
EMPTY
(40 mm MIN.)
2.00 ± 0.50
DIRECTION OF PULLING
CONFIGURATION OF TAPE
LABEL
SHAPE AND DIMENSIONS OF REELS
Po
Do
P2
D1
B
E
5° (MAX.)
F
W
Bo
8 ± 0.10
A
A
T
B
P1
5.4 ± 0.15
Ko
5° (MAX.)
SECTION B-B
Ao
SECTION A-A
SYMBOL
SPEC
SYMBOL
SPEC
Ao
Bo
Ko
Po
P1
P2
T
4.4 ± 0.10 12.50 ± 0.10 4.85 ± 0.10 4.0 ±0.10 8.0 ± 0.10 2.0 ± 0.10 0.35 ± 0.10
E
F
Do
D1
W
10Po
1.75 ± 0.10 11.5 ± 0.10 1.55 ± 0.10 1.5 ± 0.10 24.0 ± 0.3 40.0 ± 0.20
NOTES:
1. I.D. sprocket hole pitch cumulative tolerance is ± 0.2 mm.
2. Corner camber shall be not more than 1 mm per 100 mm through a length of 250 mm.
3. Ao and Bo measured on a place 0.3 mm above the bottom of the pocket.
4. Ko measured from a place on the inside bottom of the pocket to top surface of carrier.
5. Pocket position relative to sprocket hole measured as true position of pocket, not pocket hole.
12
Moisture Proof Packaging
All HSDL-3612 options are shipped in moisture proof package. Once
opened, moisture absorption begins.
UNITS IN A SEALED
MOISTURE-PROOF
PACKAGE
Baking Conditions
If the parts are not stored in dry
conditions, they must be baked
before reflow to prevent damage
to the parts.
Package
Temp.
Time
In reels
60°C
≥ 48 hours
In bulk
100°C
≥ 4 hours
125°C
≥ 2 hours
150°C
≥ 1 hour
Baking should be done only once.
PACKAGE IS
OPENED (UNSEALED)
Recommended Storage Conditions
ENVIRONMENT
LESS THAN 30°C,
AND LESS THAN
60% RH
Storage
Temperature
10°C to 30°C
Relative
Humidity
below 60% RH
YES
NO BAKING
IS NECESSARY
YES
PACKAGE IS
OPENED LESS
THAN 72 HOURS
NO
PERFORM RECOMMENDED
BAKING CONDITIONS
13
NO
Time from Unsealing to Soldering
After removal from the bag, the
parts should be soldered within
three days if stored at the recommended storage conditions. If
times longer than 72 hours are
needed, the parts must be stored
in a dry box.
Reflow Profile
MAX. 245°C
T – TEMPERATURE – (°C)
230
R3
200
183
170
150
R2
90 sec.
MAX.
ABOVE
183°C
125
R1
100
R4
R5
50
25
0
50
100
150
200
250
300
t-TIME (SECONDS)
P1
HEAT
UP
Process Zone
Heat Up
Solder Paste Dry
P2
SOLDER PASTE DRY
Symbol
P1, R1
P2, R2
P3, R3
Solder Reflow
Cool Down
P3, R4
P4, R5
The reflow profile is a straightline representation of a nominal
temperature profile for a
convective reflow solder process.
The temperature profile is divided
into four process zones, each
with different ∆T/∆time
temperature change rates. The
∆T/∆time rates are detailed in the
above table. The temperatures
are measured at the component
to printed circuit board
connections.
In process zone P1, the PC
board and HSDL-3612
castellation I/O pins are heated
to a temperature of 125°C to
activate the flux in the solder
paste. The temperature ramp
up rate, R1, is limited to 4°C per
second to allow for even heating
of both the PC board and
HSDL-3612 castellation I/O pins.
14
P3
SOLDER
REFLOW
P4
COOL
DOWN
DT
25°C to 125°C
125°C to 170°C
170°C to 230°C
(245°C at 10 seconds max.)
230°C to 170°C
170°C to 25°C
Process zone P2 should be of
sufficient time duration (> 60
seconds) to dry the solder paste.
The temperature is raised to a
level just below the liquidus point
of the solder, usually 170°C
(338°F).
Process zone P3 is the solder
reflow zone. In zone P3, the
temperature is quickly raised
above the liquidus point of solder
to 230°C (446°F) for optimum
results. The dwell time above the
liquidus point of solder should be
between 15 and 90 seconds. It
usually takes about 15 seconds to
assure proper coalescing of the
solder balls into liquid solder and
the formation of good solder
connections. Beyond a dwell time
of 90 seconds, the intermetallic
growth within the solder
connections becomes excessive,
Maximum DT/Dtime
4°C/s
0.5°C/s
4°C/s
-4°C/s
-3°C/s
resulting in the formation of weak
and unreliable connections. The
temperature is then rapidly
reduced to a point below the
solidus temperature of the solder,
usually 170°C (338°F), to allow
the solder within the connections
to freeze solid.
Process zone P4 is the cool
down after solder freeze. The
cool down rate, R5, from the
liquidus point of the solder to
25°C (77°F) should not exceed
-3°C per second maximum. This
limitation is necessary to allow
the PC board and HSDL-3612
castellation I/O pins to change
dimensions evenly, putting
minimal stresses on the
HSDL-3612 transceiver.
Appendix A: HSDL-3612-007/-037 SMT Assembly Application Note
1.0 Solder Pad, Mask and Metal Solder Stencil Aperture
METAL STENCIL
FOR SOLDER PASTE
PRINTING
STENCIL
APERTURE
LAND PATTERN
SOLDER
MASK
PCBA
Figure 1.0. Stencil and PCBA.
1.1 Recommended Land Pattern for HSDL-3612-007/-037
Dim.
a
b
c (pitch)
d
e
f
g
mm
2.40
0.70
1.10
2.35
2.80
3.13
4.31
Inches
0.095
0.028
0.043
0.093
0.110
0.123
0.170
SHIELD SOLDER PAD
Rx LENS
Tx LENS
e
d
g
b
Y
f
a
X
theta
FIDUCIAL
10x PAD
Figure 2.0. Top view of land pattern.
15
c
FIDUCIAL
1.2 Adjacent Land Keep-out and
Solder Mask Areas
Dim.
h
j
k
l
mm
min. 0.2
13.4
4.7
3.2
Inches
min. 0.008
0.528
0.185
0.126
Note: Wet/Liquid Photo-Imaginable solder resist/mask is recommended.
j
• Adjacent land keep-out is the
maximum space occupied by
the unit relative to the land
pattern. There should be no
other SMD components within
this area.
Tx LENS
LAND
Rx LENS
SOLDER
MASK
h
k
Y
• “h” is the minimum solder
resist strip width required to
avoid solder bridging adjacent
pads.
• It is recommended that 2
fiducial cross be placed at midlength of the pads for unit
alignment.
2.0 Recommended Solder Paste/
Cream Volume for Castellation
Joints
Based on calculation and
experiment, the printed solder
paste volume required per
castellation pad is 0.30 cubic
mm (based on either no-clean or
aqueous solder cream types with
typically 60 to 65% solid content
by volume).
16
l
Figure 3.0. HSDL-3612-007/-037 PCBA – Adjacent land keep-out and solder mask.
2.1 Recommended Metal Solder
Stencil Aperture
It is recommended that only
0.152 mm (0.006 inches) or
0.127 mm (0.005 inches) thick
stencil be used for solder paste
printing. This is to ensure
adequate printed solder paste
volume and no shorting. The
following combination of metal
stencil aperture and metal stencil
thickness should be used:
See Fig 4.0
t, nominal stencil thickness
l, length of aperture
mm
inches
mm
inches
0.152
0.006
2.8 ± 0.05
0.110 ± 0.002
0.127
0.005
3.4 ± 0.05
0.134 ± 0.002
w, the width of aperture is fixed at 0.70 mm (0.028 inches)
Aperture opening for shield pad is 2.8 mm x 2.35 mm as per land dimensions
APERTURE AS PER
LAND DIMENSIONS
t (STENCIL THICKNESS)
SOLDER
PASTE
w
l
Figure 4.0. Solder paste stencil aperture.
3.0 Pick and Place Misalignment
Tolerance and Product SelfAlignment after Solder Reflow
If the printed solder paste volume
is adequate, the unit will selfalign in the X-direction after
solder reflow. Units should be
properly reflowed in IR Hot Air
convection oven using the
recommended reflow profile. The
direction of board travel does not
matter.
17
Allowable Misalignment Tolerance
X – direction
Theta – direction
≤ 0.2 mm (0.008 inches)
± 2 degrees
3.1 Tolerance for X-axis Alignment
of Castellation
Misalignment of castellation to
the land pad should not exceed
0.2 mm or approximately half the
width of the castellation during
placement of the unit. The
castellations will completely selfalign to the pads during solder
reflow as seen in the pictures
below.
Photo 1.0. Castellation misaligned to land pads in x-axis before
reflow.
3.2 Tolerance for Rotational (Theta)
Misalignment
Units when mounted should not
be rotated more than ± 2 degrees
with reference to center X-Y as
specified in Fig 2.0. Pictures 3.0
and 4.0 show units before and
Photo 3.0. Unit is rotated before reflow.
Photo 2.0. Castellation self-align to land pads after reflow.
after reflow. Units with a Theta
misalignment of more than 2
degrees do not completely self
align after reflow. Units with ± 2
degree rotational or Theta
misalignment self-aligned
completely after solder reflow.
Photo 4.0. Unit self-aligns after reflow.
3.3 Y-axis Misalignment of
Castellation
In the Y-direction, the unit does
not self-align after solder reflow.
It is recommended that the unit
be placed in line with the fiducial
mark (mid-length of land pad.)
This will enable sufficient land
length (minimum of 1/2 land
length.) to form a good joint.
See Fig 5.0.
LENS
EDGE
FIDUCIAL
Y
MINIMUM 1/2 THE LENGTH
OF THE LAND PAD
Figure 5.0. Section of a castellation in Y-axis.
3.4 Example of Good HSDL-3612007/-037 Castellation Solder Joints
This joint is formed when the
printed solder paste volume is
adequate, i.e. 0.30 cubic mm and
reflowed properly. It should be
reflowed in IR Hot-air convection
reflow oven. Direction of board
travel does not matter.
Photo 5.0. Good solder joint.
4.0 Solder Volume Evaluation and
Calculation
Geometry of an HSDL-3612-007/
-037 solder fillet.
0.425
0.20
0.8
0.4
1.2
0.70
0.7
Appendix B: HSDL-3612-008/-038 SMT Assembly Application Note
1.0. Solder Pad, Mask, and Metal Solder Stencil Aperture
METAL STENCIL
FOR SOLDER PASTE
PRINTING
STENCIL
APERTURE
LAND PATTERN
SOLDER
MASK
PCBA
Figure 1. Stencil and PCBA.
1.1. Recommended Land Pattern for HSDL-3612-008/-038
SHIELD SOLDER PAD
e
Dim.
a
b
c (pitch)
d
e
f
g
mm
1.95
0.60
1.10
1.60
5.70
3.80
2.40
inches
0.077
0.024
0.043
0.063
0.224
0.123
0.170
d
g
Y
Rx LENS
b
Tx LENS
theta
f
X
h
a
FIDUCIAL
20
10x PAD
c
FIDUCIAL
2.0 Y-axis Misalignment of Castellation
In the Y-direction, the unit does not self-align after solder reflow. It is
recommended that the unit be placed in line with the fiducial mark
(mid-length of land pad). This will enable sufficient land length
(minimum of 1/2 land length) to form a good joint. See Figure 2.
Y
FIDUCIAL
1/2 THE LENGTH OF THE
CASTELLATION PAD
Figure 2. Section of a castellation in Y-axis.
21
Appendix C: Optical Port
Dimensions for HSDL-3612:
To ensure IrDA compliance,
some constraints on the height
and width of the window exist.
The minimum dimensions ensure
that the IrDA cone angles are met
without vignetting. The maximum
dimensions minimize the effects
of stray light. The minimum size
corresponds to a cone angle of
300 and the maximum size
corresponds to a cone angle of
60º.
In the figure below, X is the
width of the window, Y is the
height of the window and Z is the
distance from the HSDL-3612 to
OPAQUE
MATERIAL
the back of the window. The
distance from the center of the
LED lens to the center of the
photodiode lens, K, is 7.08mm.
The equations for computing the
window dimensions are as
follows:
X = K + 2*(Z+D)*tanA
Y = 2*(Z+D)*tanA
The above equations assume that
the thickness of the window is
negligible compared to the
distance of the module from the
back of the window (Z). If they are
comparable, Z' replaces Z in the
above equation. Z' is defined as
Z'=Z+t/n
where ‘t’ is the thickness of the
window and ‘n’ is the refractive
index of the window material.
The depth of the LED image
inside the HSDL-3612, D, is
8mm. ‘A’ is the required half
angle for viewing. For IrDA
compliance, the minimum is 150
and the maximum is 300 .
Assuming the thickness of the
window to be negligible, the
equations result in the following
tables and graphs:
IR TRANSPARENT WINDOW
Y
X
IR TRANSPARENT
WINDOW
K
Z
A
D
Section of a castellation in Y-axis.
22
OPAQUE
MATERIAL
Aperture Width
(x, mm)
max.
min.
16.318
11.367
17.472
11.903
18.627
12.439
19.782
12.975
20.936
13.511
22.091
14.047
23.246
14.583
24.401
15.118
25.555
15.654
26.710
16.190
APERTURE WIDTH (X) vs MODULE DEPTH
APERTURE HEIGHT (Y) vs MODULE DEPTH
30
25
25
20
15
10
X MAX.
X MIN.
5
0
0
1
2
3
4
5
6
7
MODULE DEPTH (Z) – mm
23
APERTURE HEIGHT (Y) – mm
APERTURE WIDTH (X) – mm
Module Depth, (z) mm
0
1
2
3
4
5
6
7
8
9
Aperture height
(y, mm)
max.
min.
9.238
4.287
10.392
4.823
11.547
5.359
12.702
5.895
13.856
6.431
15.011
6.967
16.166
7.503
17.321
8.038
18.475
8.574
19.630
9.110
8
9
20
15
10
5
0
0
Y MAX.
Y MIN.
1
2
3
4
5
6
7
MODULE DEPTH (Z) – mm
8
9
Window Material
Almost any plastic material will
work as a window material.
Polycarbonate is recommended.
The surface finish of the plastic
should be smooth, without any
texture. An IR filter dye may be
used in the window to make it
look black to the eye, but the
total optical loss of the window
should be 10 percent or less for
best optical performance. Light
loss should be measured at 875
nm.
Shape of the Window
From an optics standpoint, the
window should be flat. This
Flat Window
(First choice)
24
ensures that the window will not
alter either the radiation pattern
of the LED, or the receive pattern
of the photodiode.
If the window must be curved for
mechanical or industrial design
reasons, place the same curve on
the back side of the window that
has an identical radius as the
front side. While this will not
completely eliminate the lens
effect of the front curved surface,
it will significantly reduce the
effects. The amount of change in
the radiation pattern is dependent
upon the material chosen for the
Curved Front and Back
(Second choice)
window, the radius of the front
and back curves, and the distance
from the back surface to the
transceiver. Once these items are
known, a lens design can be
made which will eliminate the
effect of the front surface curve.
The following drawings show the
effects of a curved window on the
radiation pattern. In all cases,
the center thickness of the
window is 1.5 mm, the window is
made of polycarbonate plastic,
and the distance from the
transceiver to the back surface of
the window is 3 mm.
Curved Front, Flat Back
(Do not use)
www.agilent.com/semiconductors
For product information and a complete list of
distributors, please go to our web site.
For technical assistance call:
Americas/Canada: +1 (800) 235-0312 or
(408) 654-8675
Europe: +49 (0) 6441 92460
China: 10800 650 0017
Hong Kong: (+65) 6756 2394
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or 0120-61-1280(Domestic Only)
Korea: (+65) 6755 1989
Singapore, Malaysia, Vietnam, Thailand,
Philippines, Indonesia: (+65) 6755 2044
Taiwan: (+65) 6755 1843
Data subject to change.
Copyright © 2003 Agilent Technologies, Inc.
Obsoletes 5988-8423EN
April 30, 2003
5988-9349EN
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