TI LM2991S Lm2991 negative low dropout adjustable regulator Datasheet

LM2991
www.ti.com
SNVS099H – MAY 1999 – REVISED JUNE 2013
LM2991 Negative Low Dropout Adjustable Regulator
Check for Samples: LM2991
FEATURES
1
•
2
•
•
•
•
•
•
•
Output Voltage Adjustable from −3V to −24V,
Typically −2V to −25V
Output Current in Excess of 1A
Dropout Voltage Typically 0.6V at 1A Load
Low Quiescent Current
Internal Short Circuit Current Limit
Internal Thermal Shutdown with Hysteresis
TTL, CMOS Compatible ON/OFF Switch
Functional Complement to the LM2941 Series
APPLICATIONS
•
•
•
Post Switcher Regulator
Local, On-Card, Regulation
Battery Operated Equipment
DESCRIPTION
The LM2991 is a low dropout adjustable negative
regulator with a output voltage range between −3V to
−24V. The LM2991 provides up to 1A of load current
and features a On /Off pin for remote shutdown
capability.
The LM2991 uses new circuit design techniques to
provide a low dropout voltage, low quiescent current
and low temperature coefficient precision reference.
The dropout voltage at 1A load current is typically
0.6V and an ensured worst-case maximum of 1V
over the entire operating temperature range. The
quiescent current is typically 1 mA with a 1A load
current and an input-output voltage differential greater
than 3V. A unique circuit design of the internal bias
supply limits the quiescent current to only 9 mA
(typical) when the regulator is in the dropout mode
(VOUT − VIN ≤ 3V).
The LM2991 is short-circuit proof, and thermal
shutdown includes hysteresis to enhance the
reliability of the device when inadvertently overloaded
for extended periods. The LM2991 is available in 5lead TO-220 and DDPAK/TO-263 packages and is
rated for operation over the automotive temperature
range of −40°C to +125°C. Mil-Aero versions are also
available.
Typical Application
VOUT = VREF (1 + R2/R1)
*Required if the regulator is located further than 6 inches from the power supply filter capacitors. A 1 μF solid
tantalum or a 10 μF aluminum electrolytic capacitor is recommended.
**Required for stability. Must be at least a 10 μF aluminum electrolytic or a 1 μF solid tantalum to maintain stability.
May be increased without bound to maintain regulation during transients. Locate the capacitor as close as possible to
the regulator. The equivalent series resistance (ESR) is critical, and should be less than 10Ω over the same operating
temperature range as the regulator.
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1999–2013, Texas Instruments Incorporated
LM2991
SNVS099H – MAY 1999 – REVISED JUNE 2013
www.ti.com
Connection Diagrams
Front View
Top View
Figure 1. TO-220 Package, 5-Lead
See Package Number KC and NDH
Figure 2. DDPAK, TO-263 Package, 5-Lead,
Surface-Mount
See Package Number KTT
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS (1) (2)
−26V to +0.3V
Input Voltage
ESD Susceptibility (3)
2 kV
Power Dissipation (4)
Internally limited
−65°C to +150°C
Storage Temperature Range
Lead Temperature (Soldering, 10 sec.)
(1)
(2)
(3)
(4)
230°C
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications and test
conditions, see the Electrical Characteristics.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
Human body model, 100 pF discharged through a 1.5 kΩ resistor.
The maximum allowable power dissipation is a function of the maximum operating junction temperature (TJ(MAX)), the thermal resistance
of the package (θJA), and the ambient temperature (TA). The maximum allowable power dissipation is: PD = (TJ(MAX) − TA)/θJA, where
TJ(MAX) is 125°C, and TA is the maximum expected ambient temperature. If this dissipation is exceeded, the die temperature will rise
above 125°C. Excessive power dissipation will cause the LM2991 to go into thermal shutdown (See Thermal Shutdown). For the
LM2991, the junction-to-ambient thermal resistance is 53°C/W for the TO-220, 73°C/W for the DDPAK/TO-263, and junction-to-case
thermal resistance is 3°C/W. If the DDPAK/TO-263 package is used, the thermal resistance can be reduced by increasing the PC board
copper area thermally connected to the package. Using 0.5 square inches of copper area, θJA is 50°C/W; with 1 square inch of copper
area, θJA is 37°C/W; and with 1.6 or more square inches of copper area, θJA is 32°C/W.
OPERATING RATINGS (1)
−40°C to +125°C
Junction Temperature Range (TJ)
ON/OFF Pin
0V to +5V
−26V
Maximum Input Voltage (Operational)
(1)
2
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications and test
conditions, see the Electrical Characteristics.
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM2991
LM2991
www.ti.com
SNVS099H – MAY 1999 – REVISED JUNE 2013
ELECTRICAL CHARACTERISTICS
VIN = −10V, VO = −3V, IO = 1A, CO = 47 μF, R1 = 2.7 kΩ, TJ = 25°C, unless otherwise specified. Boldface limits apply over
the entire operating junction temperature range.
Parameter
Reference Voltage
Output Voltage Range
Conditions
Typical (1)
Min
Max
−1.210
−1.234
−1.186
−1.27
−1.15
5 mA ≤ IO ≤ 1A
5 mA ≤ IO ≤ 1A, VO − 1V ≥ VIN ≥ −26V
−2
VIN = −26V
−25
Units
−3
−24
V
V
Line Regulation
IO = 5 mA, VO − 1V ≥ VIN ≥ −26V
0.004
0.04
%/V
Load Regulation
50 mA ≤ IO ≤ 1A
0.04
0.4
%
0.1
0.2
IO = 0.1A, ΔVO ≤ 100 mV
0.3
Dropout Voltage
0.6
IO = 1A, ΔVO ≤ 100 mV
0.8
1
Quiescent Current
IO ≤ 1A
0.7
Dropout Quiescent Current
VIN = VO, IO ≤ 1A
16
Ripple Rejection
Vripple = 1 Vrms, fripple = 1 kHz, IO = 5 mA
60
Output Noise
10 Hz − 100 kHz, IO = 5 mA
V
V
5
mA
50
mA
200
450
μV
(VOUT: ON)
1.2
0.8
(VOUT: OFF)
1.3
VON/OFF = 0.8V (VOUT: ON)
0.1
10
VON/OFF = 2.4V (VOUT: OFF)
40
100
Output Leakage Current
VIN = −26V, VON/OFF = 2.4V, VOUT = 0V
60
Current Limit
VOUT = 0V
2
ON /OFF Input Voltage
ON /OFF Input Current
(1)
50
dB
2.4
250
1.5
V
μA
μA
A
Typicals are at TJ = 25°C and represent the most likely parametric norm.
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM2991
3
LM2991
SNVS099H – MAY 1999 – REVISED JUNE 2013
www.ti.com
TYPICAL PERFORMANCE CHARACTERISTICS
4
Dropout Voltage
Normalized Output Voltage
Figure 3.
Figure 4.
Output Voltage
Output Noise Voltage
Figure 5.
Figure 6.
Quiescent Current
Maximum Output Current
Figure 7.
Figure 8.
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM2991
LM2991
www.ti.com
SNVS099H – MAY 1999 – REVISED JUNE 2013
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Line Transient Response
Load Transient Response
Figure 9.
Figure 10.
Maximum Output Current
Ripple Rejection
Figure 11.
Figure 12.
Output Impedance
ON /OFF Control Voltage
Figure 13.
Figure 14.
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM2991
5
LM2991
SNVS099H – MAY 1999 – REVISED JUNE 2013
www.ti.com
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
(1)
6
Adjust Pin Current
Low Voltage Behavior
Figure 15.
Figure 16.
Maximum Power
Dissipation (TO-220)
Maximum Power Dissipation
(DDPAK/TO-263) (1)
Figure 17.
Figure 18.
The maximum allowable power dissipation is a function of the maximum operating junction temperature (TJ(MAX)), the thermal resistance
of the package (θJA), and the ambient temperature (TA). The maximum allowable power dissipation is: PD = (TJ(MAX) − TA)/θJA, where
TJ(MAX) is 125°C, and TA is the maximum expected ambient temperature. If this dissipation is exceeded, the die temperature will rise
above 125°C. Excessive power dissipation will cause the LM2991 to go into thermal shutdown (See Thermal Shutdown). For the
LM2991, the junction-to-ambient thermal resistance is 53°C/W for the TO-220, 73°C/W for the DDPAK/TO-263, and junction-to-case
thermal resistance is 3°C/W. If the DDPAK/TO-263 package is used, the thermal resistance can be reduced by increasing the PC board
copper area thermally connected to the package. Using 0.5 square inches of copper area, θJA is 50°C/W; with 1 square inch of copper
area, θJA is 37°C/W; and with 1.6 or more square inches of copper area, θJA is 32°C/W.
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM2991
LM2991
www.ti.com
SNVS099H – MAY 1999 – REVISED JUNE 2013
APPLICATION HINTS
External Capacitors
Like any low-dropout regulator, external capacitors are required to stabilize the control loop. These capacitors
must be correctly selected for proper performance.
Input Capacitor
An input capacitor is required if the regulator is located more than 6 inches from the input power supply filter
capacitor (or if no other input capacitor is present).
A solid Tantalum or ceramic capacitor whose value is at least 1 µF is recommended, but an aluminum electrolytic
(≥ 10 µF) may be used. However, aluminum electrolytic types should not be used in applications where the
ambient temperature can drop below 0°C because their internal impedance increases significantly at cold
temperatures.
Output Capacitor
The output capacitor must meet the ESR limits shown in Figure 19, which means it must have an ESR between
about 25 mΩ and 10Ω.
Figure 19. Output Capacitor ESR Range
A solid Tantalum (value ≥ 1 µF) is the best choice for the output capacitor. An aluminum electrolytic (≥ 10 µF)
may be used if the ESR is in the stable range.
It should be noted that the ESR of a typical aluminum electrolytic will increase by as much as 50X as the
temperature is reduced from 25°C down to −40°C, while a Tantalum will exhibit an ESR increase of about 2X
over the same range. For this and other reasons, aluminum electrolytics should not be used in applications
where low operating temperatures occur.
The lower stable ESR limit of 25 mΩ means that ceramic capacitors can not be used directly on the output of an
LDO. A ceramic (≥ 2.2 µF) can be used on the output if some external resistance is placed in series with it (1Ω
recommended). Dielectric types X7R or X5R must be used if the temperature range of the application varies
more than ± 25° from ambient to assure the amount of capacitance is sufficient.
Ceramic Bypass Capacitors
Many designers place distributed ceramic capacitors whose value is in the range of 1000 pF to 0.1 µF at the
power input pins of the IC's across a circuit board. These can cause reduced phase margin or oscillations in LDO
regulators.
The advent of multi-layer boards with dedicated power and ground planes has removed the trace inductance that
(previously) provided the necessary "de-coupling" to shield the output of the LDO from the effects of bypass
capacitors.
These capacitors should be avoided if possible, and kept as far away from the LDO output as is practical.
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM2991
7
LM2991
SNVS099H – MAY 1999 – REVISED JUNE 2013
www.ti.com
Minimum Load
A minimum load current of 500 μA is required for proper operation. The external resistor divider can provide the
minimum load, with the resistor from the adjust pin to ground set to 2.4 kΩ.
Setting the Output Voltage
The output voltage of the LM2991 is set externally by a resistor divider using the following equation:
VOUT = VREF x (1 + R2/R1) − (IADJ x R2)
where
•
VREF = −1.21V
(1)
The output voltage can be programmed within the range of −3V to −24V, typically an even greater range of −2V
to −25V. The adjust pin current is about 60 nA, causing a slight error in the output voltage. However, using
resistors lower than 100 kΩ makes the error due to the adjust pin current negligible. For example, neglecting the
adjust pin current, and setting R2 to 100 kΩ and VOUT to −5V, results in an output voltage error of only 0.16%.
ON/OFF Pin
The LM2991 regulator can be turned off by applying a TTL or CMOS level high signal to the ON/OFF pin. The
impedance of the voltage source driving the ON/OFF pin should be low enough to source the ON/OFF pin input
current to meet the OFF threshold voltage level, 100 µA maximum at 2.4V.
If the ON/OFF function is not needed, the pin should be connected to Ground. The ON/OFF pin should not be
left floating, as this is not an ensured operating condition.
See the Adjustable Current Sink Application, Figure 21.
Forcing the Output Positive
Due to an internal clamp circuit, the LM2991 can withstand positive voltages on its output. If the voltage source
pulling the output positive is DC, the current must be limited to 1.5A. A current over 1.5A fed back into the
LM2991 could damage the device. The LM2991 output can also withstand fast positive voltage transients up to
26V, without any current limiting of the source. However, if the transients have a duration of over 1 ms, the
output should be clamped with a Schottky diode to ground.
Thermal Shutdown
The LM2991 has an internally set thermal shutdown point of typically 160°C, with approximately 10°C of
hysteresis. This thermal shutdown temperature point is outside the specified Operating Rating range, above the
Absolute Maximum Ratings, and is intended as a safety feature for momentary fault conditions only. Continuous
operation near the thermal shutdown temperature should be avoided as it may have a negative affect on the life
of the device.
8
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM2991
LM2991
www.ti.com
SNVS099H – MAY 1999 – REVISED JUNE 2013
Typical Applications
Figure 20. Fully Isolated Post-Switcher Regulator
Figure 21. Adjustable Current Sink
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM2991
9
LM2991
SNVS099H – MAY 1999 – REVISED JUNE 2013
www.ti.com
Equivalent Schematic
10
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM2991
LM2991
www.ti.com
SNVS099H – MAY 1999 – REVISED JUNE 2013
REVISION HISTORY
Changes from Revision G (April 2013) to Revision H
•
Page
Changed layout of National Data Sheet to TI format .......................................................................................................... 10
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM2991
11
PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM2991S
NRND
DDPAK/
TO-263
KTT
5
45
TBD
Call TI
Call TI
-40 to 125
LM2991S
P+
LM2991S/NOPB
ACTIVE
DDPAK/
TO-263
KTT
5
45
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
-40 to 125
LM2991S
P+
LM2991SX
NRND
DDPAK/
TO-263
KTT
5
500
TBD
Call TI
Call TI
-40 to 125
LM2991S
P+
LM2991SX/NOPB
ACTIVE
DDPAK/
TO-263
KTT
5
500
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
-40 to 125
LM2991S
P+
LM2991T
NRND
TO-220
KC
5
45
TBD
Call TI
Call TI
-40 to 125
LM2991T
P+
LM2991T/LB03
NRND
TO-220
NDH
5
45
TBD
Call TI
Call TI
LM2991T
P+
LM2991T/LF03
ACTIVE
TO-220
NDH
5
45
Pb-Free (RoHS
Exempt)
CU SN
Level-1-NA-UNLIM
LM2991T
P+
LM2991T/NOPB
ACTIVE
TO-220
KC
5
45
Pb-Free (RoHS
Exempt)
CU SN
Level-1-NA-UNLIM
-40 to 125
LM2991T
P+
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
(4)
1-Nov-2013
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
LM2991SX
DDPAK/
TO-263
KTT
5
500
330.0
24.4
LM2991SX/NOPB
DDPAK/
TO-263
KTT
5
500
330.0
24.4
Pack Materials-Page 1
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
10.75
14.85
5.0
16.0
24.0
Q2
10.75
14.85
5.0
16.0
24.0
Q2
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM2991SX
DDPAK/TO-263
KTT
5
500
367.0
367.0
45.0
LM2991SX/NOPB
DDPAK/TO-263
KTT
5
500
367.0
367.0
45.0
Pack Materials-Page 2
MECHANICAL DATA
NDH0005D
www.ti.com
MECHANICAL DATA
KTT0005B
TS5B (Rev D)
BOTTOM SIDE OF PACKAGE
www.ti.com
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated
Similar pages