AVAGO HLMP-HM55-NPCXX 5 mm precision optical performance ingan oval led lamp Datasheet

HLMP-HB55/HLMP-HM55/
HLMP-HB54/HLMP-HM54
5 mm Precision Optical Performance
InGaN Oval LED Lamps
Data Sheet
Description
Features
These Precision Optical Performance Oval LEDs are
specifically designed for full color/video and
passenger information signs. The oval shaped
radiation pattern and high luminous intensity ensure
that this device is excellent for wide field of view
outdoor applications where a wide viewing angle
and readability in sunlight are essential. This lamp
has very smooth, matched radiation patterns ensuring
consistent color mixing in full color applications,
message uniformity across the viewing angle of the
sign. High efficiency LED material is used in this
lamp: Indium Gallium Nitride for Blue and Green.
Each lamp is made with an advanced optical grade
epoxy offering superior high temperature and high
moisture resistance in outdoor applications. The
package epoxy contains both UV-a and UV-b inhibitors
to reduce the effects of long term exposure to direct
sunlight. These lamps are available in two package
options (standoff and without standoff) to give
designer flexibility with device mounting.
• Well-defined spatial radiation pattern
• High brightness material
– Blue InGaN 470 nm
– Green InGaN 525 nm
Applications
• Full color signs
• Commercial outdoor advertising
Benefits
• Viewing angle designed for wide field of view applications
• Superior performance for outdoor environments
CAUTION: InGaN devices are Class 1C HBM ESD sensitive per JEDEC standard. Please observe appropriate precautions
during handling and processing. Refer to Application Note AN-1142 for additional details.
Package Dimensions
Package Drawing A
NOTE: MEASURED JUST ABOVE FLANGE.
1.50 MAX.
(0.059)
3.80
(0.150)
0.70
MAX.
0.50 ± 0.10
(0.019 ± 0.003)
2.54
(0.10)
5.20
(0.204)
CATHODE
LEAD
7.00
(0.275)
1.00 MIN.
(0.039)
25.00 MIN.
(0.984)
NOTES:
1. DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE ± 0.25 mm UNLESS OTHERWISE NOTED.
Package Drawing B
NOTE: MEASURED JUST ABOVE FLANGE.
10.85 ± 0.50
(0.427 ± 0.019)
3.80
(0.150)
1.20
(0.047)
0.50 ± 0.10
(0.019 ± 0.003)
2.54
(0.10)
5.20
(0.204)
1.50 MAX.
(0.059)
7.00
(0.275)
CATHODE
LEAD
25.00 MIN.
(0.984)
NOTES:
1. DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE ± 0.25 mm UNLESS OTHERWISE NOTED.
2
1.00 MIN.
(0.039)
Device Selection Guide
Part Number
Color and
Dominant
Wavelength λd
(nm) Typ.
Luminous
Intensity Iv
(mcd) at
20 mA Min.
Luminous
Intensity Iv
(mcd) at
20 mA Max.
Leads with
Standoff
Package
Drawing
Tinting
Type
HLMP-HB54-FJ0xx
Blue 470
110
310
No
A
Blue
HLMP-HB55-HJCxx
Blue 470
180
310
Yes
B
Blue
HLMP-HB55-JKCxx
Blue 470
240
400
Yes
B
Blue
HLMP-HM54-MQ0xx
Green 525
520
1500
No
A
Green
HLMP-HM55-MQ0xx
Green 525
520
1500
Yes
B
Green
HLMP-HM55-NPCxx
Green 525
680
1150
Yes
B
Green
HLMP-HM55-PQCxx
Green 525
880
1500
Yes
B
Green
Notes:
1 The luminous intensity is measured on the mechanical axis of the lamp package.
2. The optical axis is closely aligned with the package mechanical axis.
3. The dominant wavelength, λd, is derived from the Chromaticity Diagram and represents the color of the lamp.
Part Numbering System
HLMP-X X XX – X X X XX
Mechanical Options
00: Bulk Packaging
DD: Ammo Pack
Color Bin Selections
0: No color bin limitation
Maximum Intensity Bin
0: No Iv bin limitation
Minimum Intensity Bin
Refer to Device Selection Guide
Color
B: 470 nm Blue
M: 525 nm Green
Package
H: 5 mm Oval 40° x 100°
3
Absolute Maximum Ratings at TA = 25°C
Parameter
DC Forward
Value
Current[1]
Peak Pulsed Forward
30 mA
Current[2]
100 mA
Power Dissipation
117 mW
Reverse Voltage
5 V (IR = 10 µA)
LED Junction Temperature
130°C
Operating Temperature Range
–40°C to +80°C
Storage Temperature Range
–40°C to +100°C
Notes:
1. Derate linearly as shown in Figure 3.
2. Duty factor 10%, Frequency 1kHz
Electrical /Optical Characteristics Table
TA = 25°C
Parameter
Symbol
Min.
Typ.
Max.
Units
Test Conditions
Forward Voltage
Blue (λd = 470 nm)
Green (λd = 525 nm)
VF
3.2
3.2
3.7
3.9
V
IF = 20 mA
Reverse Voltage
VR
Capacitance
Blue (λd = 470 nm)
Green (λd = 525 nm)
C
40
pF
VF = 0, f = 1 MHz
Thermal Resistance
RθJ-PIN
240
°C/W
LED Junction-to-Cathode Lead
Viewing Angle
Major Axis
Minor Axis
2θ1/2
100
40
deg
Peak Wavelength
Blue (λd = 470 nm)
Green (λd = 525 nm)
λP
467
520
nm
Peak of Wavelength of Spectral
Distribution at IF = 20 mA
Spectral Halfwidth
Blue (λd = 470 nm)
Green (λd = 525 nm)
∆λ1/2
24
35
nm
Wavelength Width at Spectral
Distribution Power Point at IF = 20 mA
Luminous Efficacy
Blue (λd = 470 nm)
Green (λd = 525 nm)
ηv
75
520
lm/W
Emitted luminous power/Emitted
radiant power
IR = 10 µA
5
Notes:
1. 2θ1/2 is the off-axis angle where the luminous intensity is 1/2 the on axis intensity.
2. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = Iv/ηv where Iv is the luminous intensity in candelas and ηv
is the luminous efficacy in lumens/watt.
4
RELATIVE LUMINOUS INTENSITY
1.0
BLUE
GREEN
0.8
0.6
0.4
0.2
0
400
450
550
500
600
650
700
WAVELENGTH – nm
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
0
5
10
15
20
25
30
MAXIMUM FORWARD CURRENT – mA
Figure 1. Relative intensity vs. wavelength.
35
30
25
20
15
10
5
0
0
Figure 2. Relative luminous intensity vs.
forward current.
25
20
15
10
5
0
0
0.5 1.0 1.5
2.0
2.5 3.0 3.5 4.0
FORWARD VOLTAGE – V
Figure 4. Forward current vs. forward voltage.
5
Figure 3. Forward current vs. ambient temperature.
RELATIVE DOMINANT WAVELENGTH
FORWARD CURRENT – mA
30
10 20 30 40 50 60 70 80 90
AMBIENT TEMPERATURE – °C
FORWARD CURRENT – mA
1.035
1.030
1.025
GREEN
1.020
1.015
1.010
1.005
BLUE
1.000
0.995
0.990
0.985
0
5
10
15
20
25
FORWARD CURRENT – mA
Figure 5. Relative dominant wavelength vs.
forward current.
30
RELATIVE INTENSITY
1.0
0.5
0
-90
-70
-50
-30
-10
10
30
50
70
90
30
50
70
90
ANGLE – DEGREES
Figure 6. Spatial radiation pattern – minor axis.
RELATIVE INTENSITY
1.0
0.5
0
-90
-70
-50
-30
-10
10
ANGLE – DEGREES
Figure 7. Spatial radiation pattern – major axis.
Intensity Bin Limits
(mcd @ 20 mA)
Bin Name
Min.
Max.
F
110
140
G
140
180
H
180
240
J
240
310
K
310
400
L
400
520
M
520
680
N
680
880
P
880
1150
Q
1150
1500
R
1500
1900
Tolerance will be ±15% of these limits.
6
Green Color Bin Table
Bin
Min. Dom.
Max. Dom.
1
520.0
524.0
2
524.0
528.0
3
528.0
532.0
4
532.0
536.0
5
536.0
540.0
Xmin.
Ymin.
Xmax.
Ymax.
0.0743
0.8338
0.1856
0.6556
0.1650
0.6586
0.1060
0.8292
0.1060
0.8292
0.2068
0.6463
0.1856
0.6556
0.1387
0.8148
0.1387
0.8148
0.2273
0.6344
0.2068
0.6463
0.1702
0.7965
0.1702
0.7965
0.2469
0.6213
0.2273
0.6344
0.2003
0.7764
0.2003
0.7764
0.2659
0.6070
0.2469
0.6213
0.2296
0.7543
Xmin.
Ymin.
Xmax.
Ymax.
0.1440
0.0297
0.1766
0.0966
0.1818
0.0904
0.1374
0.0374
0.1374
0.0374
0.1699
0.1062
0.1766
0.0966
0.1291
0.0495
0.1291
0.0495
0.1616
0.1209
0.1699
0.1062
0.1187
0.0671
0.1187
0.0671
0.1517
0.1423
0.1616
0.1209
0.1063
0.0945
0.1063
0.0945
0.1397
0.1728
0.1517
0.1423
0.0913
0.1327
Tolerance for each bin limit is ± 0.5 nm
Blue Color Bin Table
Bin
Min. Dom.
Max. Dom.
1
460.0
464.0
2
464.0
468.0
3
468.0
472.0
4
472.0
476.0
5
476.0
480.0
Tolerance for each bin limit is ± 0.5 nm
Note:
1. All bin categories are established for classification of products. Products may not be available in all bin categories. Please contact your Avago
representative for further information.
7
Avago Color Bin on CIE Chromaticity Diagram
CIE 1931 – Chromaticity Diagram
1.000
0.800
Green
1 2 3
4 5
0.600
Y
0.400
0.200
Blue
5
4
3
2
1
0.000
0.000
0.200
0.400
X
8
0.600
0.800
Relative Light Output vs. Junction Temperature
1.2
RELATIVE LIGHT OUTPUT
(NORMALIZED AT TJ = 25°C)
BLUE
1.0
GREEN
0.8
0.6
0.4
0.2
0
-40
-20
0
20
40
60
80
TJ – JUNCTION TEMPERATURE – °C
Precautions:
Lead Forming
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering into PC board.
• If lead forming is required before soldering, care must
be taken to avoid any excessive mechanical stress
induced to LED package. Otherwise, cut the leads of
LED to length after soldering process at room
temperature. The solder joint formed will absorb the
mechanical stress of the lead cutting from traveling to
the LED chip die attach and wirebond.
• For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
Soldering Conditions
• Care must be taken during PCB assembly and soldering
process to prevent damage to LED component.
• The closest LED is allowed to solder on board is 1.59 mm
below the body (encapsulant epoxy) for those parts
without standoff.
• Recommended soldering conditions:
9
Pre-heat Temperature
Pre-heat Time
Wave Soldering
105 °C Max.
30 sec Max.
Manual Solder
Dipping
–
–
Peak Temperature
Dwell Time
250 °C Max.
3 sec Max.
260 °C Max.
5 sec Max.
• Wave soldering parameter must be set and maintained
according to recommended temperature and dwell
time in the solder wave. Customer is advised to
periodically check on the soldering profile to ensure the
soldering profile used is always conforming to
recommended soldering condition.
Notes:
1. PCB with different size and design (component density)
will have different heat mass (heat capacity). This might
cause a change in temperature experienced by the board if
same wave soldering setting is used. So, it is recommended
to recalibrate the soldering profile again before loading a
new type of PCB.
2. Avago Technologies' high brightness LED are using high
efficiency LED die with single wire bond as shown below.
Customer is advised to take extra precaution during wave
soldering to ensure that the maximum wave temperature
is not exceeding 250° C. Overstressing the LED during
soldering process might cause premature failure to the LED
due to delamination.
Avago Technologies LED Configuration
CATHODE
Note: Electrical connection between bottom surface of LED die
and the lead frame material through conductive paste of solder.
• If necessary, use fixture to hold the LED component
in proper orientation with respect to the PCB
during soldering process.
• At elevated temperature, the LED is more
susceptible to mechanical stress. Therefore, PCB
must be allowed to cool down to room temperature
prior to handling, which includes removal of jigs,
fixtures or pallet.
• Special attention must be given to board fabrication,
solder masking, surface platting and lead holes
size and component orientation to assure the
solderability.
• Recommended PC board plated through hole sizes for
LED component leads:
LED Component
Lead Size
0.457 x 0.457 mm
(0.018 x 0.018 inch)
0.508 x 0.508 mm
(0.020 x 0.020 inch)
Note: Refer to application note AN1027 for more information on
soldering LED components.
• Over sizing of plated through hole can lead to
twisting or improper LED placement during auto
insertion. Under sizing plated through hole can
lead to mechanical stress on the epoxy lens during
clinching.
HOT AIR KNIFE
TOP SIDE
OF PC BOARD
200
TEMPERATURE – °C
Plated Through
Hole Diameter
0.976 to 1.078 mm
(0.038 to 0.042 inch)
1.049 to 1.150 mm
(0.041 to 0.045 inch)
LAMINAR WAVE
TURBULENT WAVE
250
BOTTOM SIDE
OF PC BOARD
150
FLUXING
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150°C (100°C PCB)
SOLDER WAVE TEMPERATURE = 245°C ± 5°C
AIR KNIFE AIR TEMPERATURE = 390°C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40°
LEAD SOLDER: SN63; FLUX: RMA
LEAD FREE SOLDER: 96.5% Sn, 3.0% Ag, 0.5% Cu
100
50
30
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE
EXERTING MECHANICAL FORCE.
PREHEAT
0
10
20
30
40
50
TIME – SECONDS
Figure 8. Recommended wave soldering profile.
10
Diagonal
0.646 mm
(0.025 inch)
0.718 mm
(0.028 inch)
60
70
80
90
100
Ammo Packs Drawing
6.35 ± 1.30
(0.25 ± 0.0512)
12.70 ± 1.00
(0.50 ± 0.0394)
CATHODE
20.5 ± 1.00
(0.8071 ± 0.0394)
9.125 ± 0.625
(0.3593 ± 0.025)
18.00 ± 0.50
(0.7087 ± 0.0197)
A
12.70 ± 0.30
(0.50 ± 0.0118)
0.70 ± 0.20
(0.0276 ± 0.0079)
A
∅ 4.00 ± 0.20 TYP.
(0.1575 ± 0.0079)
VIEW A–A
ALL DIMENSIONS IN MILLIMETERS (INCHES).
Note: The ammo-packs drawing is applicable for packaging option -DD & -ZZ and regardless of standoff or non-standoff.
Packaging Box Ammo Packs
LABEL ON
THIS SIDE
OF BOX.
FROM LEFT SIDE OF BOX,
ADHESIVE TAPE MUST BE
FACING UPWARDS.
A
+
O
AN
O
AG ES
AV LOGI
DE
NO
HO –
CH
AT
DE
TE
C
ANODE LEAD LEAVES
THE BOX FIRST.
C
L
BE
LA
ER
TH
MO
Note: For InGaN device, the ammo pack packaging box contains ESD logo.
11
DISCLAIMER
AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR
SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR
DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS
SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL
LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
For product information and a complete list of distributors, please go to our website:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.
Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved. Obsoletes 5989-4145EN
AV02-0206EN March 20, 2007
12
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