ON NLX2G16BMX1TCG Dual buffer Datasheet

NLX2G16
Dual Buffer
The NLX2G16 MiniGatet is an advanced high-speed CMOS dual
non-inverting buffer in ultra-small footprint.
The NLX2G16 input and output structures provide protection when
voltages up to 7.0 V are applied, regardless of the supply voltage.
http://onsemi.com
Features
•High Speed: tPD = 1.8 ns (Typ) @ VCC = 5.0 V
•Designed for 1.65 V to 5.5 V VCC Operation
•Low Power Dissipation: ICC = 1 mA (Max) at TA = 25°C
•24 mA Balanced Output Source and Sink Capability
•Balanced Propagation Delays
•Overvoltage Tolerant (OVT) Input and Output Pins
•Ultra-Small Packages
•These are Pb-Free Devices
MARKING
DIAGRAMS
1
1
IN A1
6
M
J
ULLGA6
1.2 x 1.0
CASE 613AE
M
J
1
J
ULLGA6
1.0 x 1.0
CASE 613AD
M
OUT Y2
ULLGA6
1.45 x 1.0
CASE 613AF
1
5
2
GND
VCC
J
M
3
IN A2
4
= Device Marking
= Date Code
OUT Y1
PIN ASSIGNMENT
Figure 1. Pinout (Top View)
IN A1
1
IN A2
1
1
OUT Y2
OUT Y2
IN A1
2
GND
3
IN A2
4
OUT Y2
5
VCC
6
OUT Y1
Figure 2. Logic Symbol
FUNCTION TABLE
A
Y
L
H
L
H
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
© Semiconductor Components Industries, LLC, 2008
March, 2008 - Rev. 0
1
Publication Order Number:
NLX2G16/D
NLX2G16
MAXIMUM RATINGS
Symbol
Value
Unit
VCC
DC Supply Voltage
-0.5 to +7.0
V
VIN
DC Input Voltage
-0.5 to +7.0
V
DC Output Voltage
-0.5 to +7.0
V
VIN < GND
-50
mA
VOUT < GND
-50
mA
VOUT
Parameter
IIK
DC Input Diode Current
IOK
DC Output Diode Current
IO
DC Output Source/Sink Current
±50
mA
ICC
DC Supply Current Per Supply Pin
±100
mA
IGND
DC Ground Current per Ground Pin
±100
mA
TSTG
Storage Temperature Range
-65 to +150
°C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
260
°C
TJ
Junction Temperature Under Bias
150
°C
MSL
FR
ILATCHUP
Moisture Sensitivity
Level 1
Flammability Rating Oxygen
Index: 28 to 34
UL 94 V-0 @ 0.125 in
Latchup Performance Above VCC and Below GND at 125 °C (Note 5)
±500
mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm-by-1 inch, 2 ounce copper trace no air flow.
2. Tested to EIA/JESD22-A114-A.
3. Tested to EIA/UESD22-A115-A.
4. Tested to JESD22-C101-A.
5. Tested to EIA / JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
1.65
5.5
V
VCC
Positive DC Supply Voltage
VIN
Digital Input Voltage
0
5.5
V
Output Voltage
0
5.5
V
-55
+125
°C
0
0
0
0
20
20
10
5
ns/V
VOUT
TA
Operating Free-Air Temperature
Dt/DV
Input Transition Rise or Fall Rate
VCC = 1.8 V ± 0.18
VCC = 2.5 V ± 0.2 V
VCC = 3.3 V ± 0.3 V
VCC = 5.0 V ± 0.5 V
http://onsemi.com
2
NLX2G16
DC ELECTRICAL CHARACTERISTICS
VCC
(V)
Min
Typ
TA = +855C
Max
Min
Max
TA = -555C to
+1255C
Min
Max
Symbol
Parameter
VIH
Low-Level
Input
Voltage
1.65-1.95
0.75 x
VCC
0.75 x
VCC
0.75 x
VCC
2.3 to 5.5
0.70 x
VCC
0.70 x
VCC
0.70 x
VCC
Low-Level
Input
Voltage
1.65-1.95
0.25 x
VCC
0.25 x
VCC
0.25 x
VCC
2.3 - 5.5
0.30 x
VCC
0.30 x
VCC
0.30 x
VCC
VIL
VOH
VOL
HighLevel
Output
Voltage
Low-Level
Output
Voltage
Conditions
TA = 25 5C
VIN = VIH or VIL
IOH = -100 mA
VIN = VIH or VIL
IOH = -4 mA
IOH = -8 mA
IOH = -16 mA
IOH = -24 mA
IOH = -32 mA
VIN = VIH or VIL
IOL = 100 mA
1.65 - 5.5
VCC 0.1
VCC
VCC 0.1
VCC 0.1
1.65
2.3
3.0
3.0
4.5
1.29
1.9
2.4
2.3
3.8
1.52
2.15
2.8
2.68
4.2
1.29
1.9
2.4
2.3
3.8
1.29
1.9
2.4
2.3
3.8
1.65 - 5.5
Unit
V
V
V
0.1
0.1
0.1
0.24
0.3
0.4
0.55
0.55
0.24
0.3
0.4
0.55
0.55
0.24
0.3
0.4
0.55
0.55
V
VIN = VIH or VIL
IOH = 4 mA
IOH = 8 mA
IOH = 16 mA
IOH = 24 mA
IOH = 32 mA
1.65
2.3
3.0
3.0
4.5
Input
Leakage
Current
0 v VIN v 5.5 V
0 to 5.5
±0.1
±1.0
±1.0
mA
IOFF
Power-Off
Output
Leakage
Current
VIN or VOUT =
5.5 V
0
1.0
10
10
mA
ICC
Quiescent
Supply
Current
0 v VIN v VCC
5.5
1.0
10
10
mA
IIN
0.08
0.1
0.15
0.22
0.22
http://onsemi.com
3
NLX2G16
AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 nS)
Symbol
tPLH,
tPHL
Parameter
Propagation Delay Input A to Output
VCC
(V)
Test
Condition
1.65-1.95
TA = -555C
to +1255C
TA = 25 5C
Min
Typ
Max
Min
Max
Unit
RL = 1 MW,
CL = 15 pF
1.8
8.0
9.6
1.8
10.2
ns
2.3-2.7
RL = 1 MW,
CL = 15 pF
1.0
3.0
5.2
1.0
5.8
3.0-3.6
RL = 1 MW,
CL = 15 pF
0.8
2.3
3.6
0.8
4.0
RL = 500 W,
CL = 50 pF
1.2
3.0
4.6
1.2
5.1
RL = 1 MW,
CL = 15 pF
0.5
1.8
2.9
0.5
3.2
RL = 500 W,
CL = 50 pF
0.8
2.4
3.8
0.8
4.2
4.5-5.5
CIN
Input Capacitance
5.5
VIN = 0 V or VCC
7.0
pF
CPD
Power Dissipation Capacitance
(Note 6)
3.3
5.5
10 MHz
VIN = 0 V or VCC
9
11
pF
6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the dynamic operating current consumption without
load. Average operating current can be obtained by the equation ICC(OPR) = CPD • VCC • fin + ICC. CPD is used to determine the no-load
dynamic power consumption: PD = CPD • VCC2 • fin + ICC • VCC.
VCC
VCC
A or B
50%
GND
tPLH
PULSE
GENERATOR
DUT
RT
tPHL
CL
RL
Y
50% VCC
RT = ZOUT of pulse generator (typically 50 W)
Figure 4. Test Circuit
Figure 3. Switching Waveforms
ORDERING INFORMATION
Package
Shipping†
NLX2G16AMX1TCG
ULLGA6, 1.45 x 1.0, 0.5P
(Pb-Free)
3000 / Tape & Reel
NLX2G16BMX1TCG
ULLGA6, 1.2 x 1.0, 0.4P
(Pb-Free)
3000 / Tape & Reel
NLX2G16CMX1TCG
ULLGA6, 1.0 x 1.0, 0.35P
(Pb-Free)
3000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
http://onsemi.com
4
NLX2G16
PACKAGE DIMENSIONS
ULLGA6 1.0x1.0, 0.35P
CASE 613AD-01
ISSUE A
PIN ONE
REFERENCE
0.10 C
ÉÉ
ÉÉ
ÉÉ
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
A
B
D
E
DIM
A
A1
b
D
E
e
L
L1
TOP VIEW
0.05 C
A
6X
0.05 C
SEATING
PLANE
SIDE VIEW
MOUNTING FOOTPRINT
SOLDERMASK DEFINED*
C
A1
MILLIMETERS
MIN
MAX
--0.40
0.00
0.05
0.12
0.22
1.00 BSC
1.00 BSC
0.35 BSC
0.25
0.35
0.30
0.40
5X
0.48
6X
0.22
e
5X
L
NOTE 4
3
1
1.18
L1
0.53
6
4
6X
b
0.05 C
0.35
PITCH
DIMENSIONS: MILLIMETERS
0.10 C A B
BOTTOM VIEW
1
PKG
OUTLINE
NOTE 3
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
5
NLX2G16
PACKAGE DIMENSIONS
ULLGA6 1.2x1.0, 0.4P
CASE 613AE-01
ISSUE A
PIN ONE
REFERENCE
0.10 C
ÉÉ
ÉÉ
ÉÉ
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
A
B
D
E
DIM
A
A1
b
D
E
e
L
L1
TOP VIEW
0.05 C
A
6X
0.05 C
SEATING
PLANE
SIDE VIEW
MOUNTING FOOTPRINT
SOLDERMASK DEFINED*
C
A1
MILLIMETERS
MIN
MAX
--0.40
0.00
0.05
0.15
0.25
1.20 BSC
1.00 BSC
0.40 BSC
0.25
0.35
0.35
0.45
5X
0.49
e
5X
L
6X
0.26
NOTE 4
3
1
1.24
L1
0.53
6
4
6X
b
0.05 C
0.40
PITCH
DIMENSIONS: MILLIMETERS
0.10 C A B
BOTTOM VIEW
1
PKG
OUTLINE
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
NOTE 3
http://onsemi.com
6
NLX2G16
PACKAGE DIMENSIONS
ULLGA6 1.45x1.0, 0.5P
CASE 613AF-01
ISSUE A
PIN ONE
REFERENCE
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
A
B
D
ÉÉÉ
ÉÉÉ
ÉÉÉ
E
DIM
A
A1
b
D
E
e
L
L1
TOP VIEW
0.10 C
0.05 C
MILLIMETERS
MIN
MAX
--0.40
0.00
0.05
0.15
0.25
1.45 BSC
1.00 BSC
0.50 BSC
0.25
0.35
0.30
0.40
A
6X
0.05 C
MOUNTING FOOTPRINT
SOLDERMASK DEFINED*
SEATING
PLANE
SIDE VIEW
5X
C
A1
e
5X
L
0.49
NOTE 4
3
1
6X
0.30
1.24
L1
0.53
6
4
BOTTOM VIEW
6X
b
0.10 C A B
0.05 C
1
PKG
OUTLINE
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
NOTE 3
MiniGate is a trademark of Semiconductor Components Industries, LLC (SCILLC).
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada
Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800-282-9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81-3-5773-3850
http://onsemi.com
7
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NLX2G16/D
Similar pages