ON MURB1660CTG Switch mode power rectifier Datasheet

MURB1660CT,
NRVUB1660CTT4G
Switch Mode
Power Rectifier
D2PAK Power Surface Mount Package
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These state−of−the−art devices are designed for use in switching
power supplies, inverters, and as free wheeling diodes.
Features
•
•
•
•
•
•
•
•
•
•
•
Package Designed for Power Surface Mount Applications
Ultrafast 60 Nanosecond Recovery Times
175°C Operating Junction Temperature
Epoxy Meets UL 94 V−0 @ 0.125 in
High Temperature Glass Passivated Junction
High Voltage Capability to 600 V
Low Leakage Specified @ 150°C Case Temperature
Short Heat Sink Tab Manufactured − Not Sheared!
Similar in Size to Industrial Standard TO−220 Package
NRV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
These Devices are Pb−Free and are RoHS Compliant
ULTRAFAST RECTIFIER
16 AMPERES, 600 VOLTS
D2PAK
CASE 418B
STYLE 3
1
4
3
MARKING DIAGRAM
AY WW
U1660G
AKA
Mechanical Characteristics:
• Case: Epoxy, Molded, Epoxy Meets UL 94 V−0
• Weight: 1.7 Grams (Approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
•
•
•
Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
Device Meets MSL1 Requirements
ESD Ratings:
♦ Machine Model, C > 400 V
♦ Human Body Model, 3B > 8000 V
D2PAK
CASE 418AJ
STYLE 3
A
Y
WW
U1660
G
AKA
= Assembly Location
= Year
= Work Week
= Specific Device Code
= Pb−Free Package
= Diode Polarity
ORDERING INFORMATION
Device
MURB1660CTG
Package
Shipping†
D2PAK
50 Units/Rail
(418AJ)
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2014
May, 2014 − Rev. 9
1
MURB1660CTT4G
D2PAK
(418AJ)
800 /
Tape & Reel
NRVUB1660CTT4G
D2PAK
(418B)
800 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Publication Order Number:
MURB1660CT/D
MURB1660CT, NRVUB1660CTT4G
MAXIMUM RATINGS (Per Leg)
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
600
V
Average Rectified Forward Current
(Rated VR, TC = 150°C) Total Device
IF(AV)
8.0
16
A
Rating
Peak Repetitive Forward Current
(Rated VR, Square Wave, 20 kHz, TC = 150°C)
IFM
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)
IFSM
A
16
A
100
Operating Junction and Storage Temperature Range
TJ, Tstg
°C
−65 to +175
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS (Per Leg)
Rating
Symbol
Value
Unit
Maximum Thermal Resistance, Junction−to−Case
RqJC
2.0
°C/W
Maximum Thermal Resistance, Junction−to−Ambient (Note 1)
RqJA
50
°C/W
TL
260
°C
Symbol
Max
Unit
Temperature for Soldering Purposes: 1/8″ from Case for 5 Seconds
1. See Chapter 7 for mounting conditions.
ELECTRICAL CHARACTERISTICS (Per Leg)
Characteristic
Maximum Instantaneous Forward Voltage (Note 2)
(iF = 8.0 Amp, TC = 150°C)
(iF = 8.0 Amp, TC = 25°C)
vF
Maximum Instantaneous Reverse Current (Note 2)
(Rated dc Voltage, TC = 150°C)
(Rated dc Voltage, TC = 25°C)
iR
Maximum Reverse Recovery Time
(IF = 1.0 Amp, di/dt = 50 Amp/ms)
(IF = 0.5 Amp, iR = 1.0 Amp, IREC = 0.25 Amp)
trr
V
1.20
1.50
mA
500
10
ns
60
50
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
2. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%.
10 K
20
1.0 K
400
I R, REVERSE CURRENT (A)
μ
i F , INSTANTANEOUS FORWARD CURRENT (AMPS)
100
50
TJ = 150°C
10
25°C
5.0
2.0
100°C
1.0
TJ = 150°C
10
100°C
2.0
1.0
0.4
25°C
0.1
0.04
0.3
0.1
100
40
0.01
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
100
vF, INSTANTANEOUS VOLTAGE (V)
200
300
400
500
VR, REVERSE VOLTAGE (V)
Figure 1. Typical Forward Voltage, Per Leg
Figure 2. Typical Reverse Current, Per Leg
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2
600
10
PF(AV), AVERAGE POWER DISSIPATION (WATTS
I F(AV), AVERAGE FORWARD CURRENT (AMPS)
MURB1660CT, NRVUB1660CTT4G
RATED VR APPLIED
RqJC = 2°C/W
9.0
8.0
DC
7.0
6.0
5.0
4.0
SQUARE WAVE
3.0
2.0
1.0
0
140
150
180
160
170
TC, CASE TEMPERATURE (°C)
14
13
12
11
10
9.0
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0
SQUARE WAVE
DC
TJ = 175°C
0
1
9
10
Figure 4. Power Dissipation, Per Leg
1.0
D = 0.5
0.5
0.2
P(pk)
0.1
0.1
0.05
0.01
ZqJC(t) = r(t) RqJC
D curves apply for power
pulse train shown
read time at T1
t1
0.05
t2
Duty Cycle, D = t1/t2TJ(pk) - TC = P(pk) ZqJC(t)
SINGLE PULSE
0.02
0.01
0.01
0.02
0.05
0.1
0.2
0.5
1
2
5
10
20
50
t, TIME (ms)
Figure 5. Thermal Response
1K
300
C, CAPACITANCE (pF)
r(t), TRANSIENT THERMAL RESISTANCE (NORMALIZED)
Figure 3. Current Derating, Case, Per Leg
2
3
4
5
6
7
8
IF(AV), AVERAGE FORWARD CURRENT (AMPS)
TJ = 25°C
100
30
10
1
10
VR, REVERSE VOLTAGE (V)
Figure 6. Typical Capacitance, Per Leg
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3
100
100
200
500
1K
MURB1660CT, NRVUB1660CTT4G
PACKAGE DIMENSIONS
D2PAK 3
CASE 418B−04
ISSUE K
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 418B−01 THRU 418B−03 OBSOLETE,
NEW STANDARD 418B−04.
C
E
V
W
−B−
4
DIM
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
S
V
A
1
2
S
3
−T−
SEATING
PLANE
K
W
J
G
D
H
3 PL
0.13 (0.005)
M
T B
VARIABLE
CONFIGURATION
ZONE
M
N
R
P
L
M
L
M
M
F
F
F
VIEW W−W
1
VIEW W−W
2
VIEW W−W
3
SOLDERING FOOTPRINT*
10.49
8.38
16.155
2X
3.504
2X
1.016
5.080
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
4
MILLIMETERS
MIN
MAX
8.64
9.65
9.65 10.29
4.06
4.83
0.51
0.89
1.14
1.40
7.87
8.89
2.54 BSC
2.03
2.79
0.46
0.64
2.29
2.79
1.32
1.83
7.11
8.13
5.00 REF
2.00 REF
0.99 REF
14.60 15.88
1.14
1.40
STYLE 3:
PIN 1. ANODE
2. CATHODE
3. ANODE
4. CATHODE
U
L
INCHES
MIN
MAX
0.340 0.380
0.380 0.405
0.160 0.190
0.020 0.035
0.045 0.055
0.310 0.350
0.100 BSC
0.080
0.110
0.018 0.025
0.090
0.110
0.052 0.072
0.280 0.320
0.197 REF
0.079 REF
0.039 REF
0.575 0.625
0.045 0.055
MURB1660CT, NRVUB1660CTT4G
PACKAGE DIMENSIONS
D2PAK−3 (TO−263, 3−LEAD)
CASE 418AJ
ISSUE B
B
E2
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. CHAMFER OPTIONAL
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH. MOLD FLASH SHALL NOT EXCEED 0.005
PER SIDE. THESE DIMENSIONS ARE MEASURED
AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY AT DATUM H.
5. THERMAL PAD CONTOUR IS OPTIONAL WITHIN
DIMENSIONS E, L1, D1 AND E1.
6. OPTIONAL MOLD FEATURE
A
A
E
SEATING
PLANE
L1
c2
NOTE 3
A
D1
L1
D
H
DETAIL C
E1
0.10
M
B A
M
L2
A
e
c
NOTE 6
2X
TOP VIEW
b
0.10
VIEW A−A
SIDE VIEW
M
B A
M
H
GAUGE
PLANE
L3
A1
L
M
B
SEATING
PLANE
DETAIL C
RECOMMENDED
SOLDERING FOOTPRINT
VIEW A−A
OPTIONAL CONSTRUCTIONS
DIM
A
A1
b
c
c2
D
D1
E
E1
e
H
L
L1
L2
L3
M
INCHES
MIN
MAX
0.160 0.190
0.000 0.010
0.020 0.039
0.012 0.029
0.045 0.065
0.330 0.380
0.260
−−−−
0.380 0.420
0.245
−−−−
0.100 BSC
0.575 0.625
0.070
0.110
−−−− 0.066
−−−− 0.070
0.010 BSC
0°
8°
MILLIMETERS
MIN
MAX
4.06
4.83
0.00
0.25
0.51
0.99
0.30
0.74
1.14
1.65
8.38
9.65
6.60
−−−−
9.65 10.67
6.22
−−−−
2.54 BSC
14.60 15.88
1.78
2.79
−−−−
1.68
−−−−
1.78
0.25 BSC
0°
8°
STYLE 3:
PIN 1. ANODE
2. CATHODE
3. ANODE
4. CATHODE
0.436
0.366
0.653
2X
0.169
2X
0.063
0.100
PITCH
DIMENSIONS: INCHES
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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