GSI GS8180DV18GD-100I 18mb burst of 4 sigmaquad sram Datasheet

GS8180DV18D-250/200/167/133/100
250 MHz–100 MHz
2.5 V VDD
1.8 V or 1.5 V I/O
18Mb Burst of 4
SigmaQuad SRAM
165-Bump BGA
Commercial Temp
Industrial Temp
Features
• Simultaneous Read and Write SigmaQuad™ Interface
• JEDEC-standard pinout and package
• Dual DoubleData Rate interface
• Byte Write controls sampled at data-in time
• Burst of 4 Read and Write
• 2.5 V +100/–100 mV core power supply
• 1.5 V or 1.8 V HSTL Interface
• Pipelined read operation
• Fully coherent read and write pipelines
• ZQ mode pin for programmable output drive strength
• IEEE 1149.1 JTAG-compliant Boundary Scan
• 165-bump, 13 mm x 15 mm, 1 mm bump pitch BGA package
• Pin-compatible with future 36Mb, 72Mb, and 144Mb devices
• Pb-Free 165-bump BGA package available
SigmaRAM™ Family Overview
GS8180DV18 are built in compliance with the SigmaQuad
SRAM pinout standard for Separate I/O synchronous SRAMs.
They are18,874,368-bit (18Mb) SRAMs. These are the first in
a family of wide, very low voltage HSTL I/O SRAMs designed
to operate at the speeds needed to implement economical high
performance networking systems.
SigmaQuad SRAMs are offered in a number of configurations.
Some emulate and enhance other synchronous separate I/O
SRAMs. A higher performance SDR (Single Data Rate) Burst
of 2 version is also offered. The logical differences between
the protocols employed by these RAMs hinge mainly on
various combinations of address bursting, output data
registering, and write cueing. Along with the Common I/O
family of SigmaRAMs, the SigmaQuad family of SRAMs
allows a user to implement the interface protocol best suited to
the task at hand.
Clocking and Addressing Schemes
A Burst of 4 SigmaQuad SRAM is a synchronous device. It
employs two input register clock inputs, K and K. K and K are
independent single-ended clock inputs, not differential inputs
to a single differential clock input buffer. The device also
allows the user to manipulate the output register clock inputs
quasi independently with the C and C clock inputs. C and C are
also independent single-ended clock inputs, not differential
inputs. If the C clocks are tied high, the K clocks are routed
internally to fire the output registers instead.
Because Separate I/O Burst of 4 RAMs always transfer data in
four packets, A0 and A1 are internally set to 0 for the first read
Parameter Synopsis
Rev: 2.04 4/2005
-250
-200
-167
-133
-100
tKHKH
4.0 ns
5.0 ns
6.0 ns
7.5 ns
10 ns
tKHQV
2.1 ns
2.3 ns
2.5 ns
3.0 ns
3.0 ns
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Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2002, GSI Technology
GS8180DV18D-250/200/167/133/100
1M x 18 SigmaQuad SRAM—Top View (Package D)
1
2
3
4
5
6
7
8
9
10
11
A
NC
MCL/SA
(144Mb)
NC/SA
(36Mb)
W
BW1
K
NC
R
SA
MCL/SA
(72Mb)
NC
B
NC
Q9
D9
SA
NC
K
BW0
SA
NC
NC
Q8
C
NC
NC
D10
VSS
SA
NC
SA
VSS
NC
Q7
D8
D
NC
D11
Q10
VSS
VSS
VSS
VSS
VSS
NC
NC
D7
E
NC
NC
Q11
VDDQ
VSS
VSS
VSS
VDDQ
NC
D6
Q6
F
NC
Q12
D12
VDDQ
VDD
VSS
VDD
VDDQ
NC
NC
Q5
G
NC
D13
Q13
VDDQ
VDD
VSS
VDD
VDDQ
NC
NC
D5
H
NC
VREF
VDDQ
VDDQ
VDD
VSS
VDD
VDDQ
VDDQ
VREF
ZQ
J
NC
NC
D14
VDDQ
VDD
VSS
VDD
VDDQ
NC
Q4
D4
K
NC
NC
Q14
VDDQ
VDD
VSS
VDD
VDDQ
NC
D3
Q3
L
NC
Q15
D15
VDDQ
VSS
VSS
VSS
VDDQ
NC
NC
Q2
M
NC
NC
D16
VSS
VSS
VSS
VSS
VSS
NC
Q1
D2
N
NC
D17
Q16
VSS
SA
SA
SA
VSS
NC
NC
D1
P
NC
NC
Q17
SA
SA
C
SA
SA
NC
D0
Q0
R
TDO
TCK
SA
SA
SA
C
SA
SA
SA
TMS
TDI
11 x 15 Bump BGA—13 x 15 mm2 Body—1 mm Bump Pitch
Notes:
1. Expansion addresses: A3 for 36Mb, A10 for 72Mb, A2 for 144Mb
2. BW0 controls writes to D0:D8. BW1 controls writes to D9:D17.
3. MCL = Must Connect Low
4. It is recommended that H1 be tied low for compatibility with future devices.
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GS8180DV18D-250/200/167/133/100
Pin Description Table
Symbol
Description
Type
Comments
SA
Synchronous Address Inputs
Input
—
NC
No Connect
—
—
R
Synchronous Read
Input
Active Low
W
Synchronous Write
Input
Active Low
BW0–BW1
Synchronous Byte Writes
Input
Active Low
K
Input Clock
Input
Active High
K
Input Clock
Input
Active Low
C
Output Clock
Input
Active High
C
Output Clock
Input
Active Low
TMS
Test Mode Select
Input
—
TDI
Test Data Input
Input
—
TCK
Test Clock Input
Input
—
TDO
Test Data Output
Output
—
VREF
HSTL Input Reference Voltage
Input
—
ZQ
Output Impedance Matching Input
Input
—
MCL
Must Connect Low
—
—
D0–D17
Synchronous Data Inputs
Input
—
Q0–Q17
Synchronous Data Outputs
Output
—
VDD
Power Supply
Supply
2.5 V Nominal
VDDQ
Isolated Output Buffer Supply
Supply
1.8 or 1.5 V Nominal
VSS
Power Supply: Ground
Supply
—
Note:
NC = Not Connected to die or any other pin
Background
Separate I/O SRAMs, from a system architecture point of view, are attractive in applications where alternating reads and writes are
needed. Therefore, the SigmaQuad SRAM interface and truth table are optimized for alternating reads and writes. Separate I/O
SRAMs are unpopular in applications where multiple reads or multiple writes are needed because burst read or write transfers from
Separate I/O SRAMs can cut the RAM’s bandwidth in half.
A SigmaQuad SRAM can begin an alternating sequence of reads and writes with either a read or a write. In order for any separate
I/O SRAM that shares a common address between its two ports to keep both ports running all the time, the RAM must implement
some sort of burst transfer protocol. The burst must be at least long enough to cover the time the opposite port is receiving
instructions on what to do next. The rate at which a RAM can accept a new random address is the most fundamental performance
metric for the RAM. Each of the three SigmaQuad SRAMs support similar address rates because random address rate is
determined by the internal performance of the RAM and they are all based on the same internal circuits. Differences between the
truth tables of the different SigmaQuad SRAMs, or any other Separate I/O SRAMs, follow from differences in how the RAM’s
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© 2002, GSI Technology
GS8180DV18D-250/200/167/133/100
interface is contrived to interact with the rest of the system. Each mode of operation has its own advantages and disadvantages. The
user should consider the nature of the work to be done by the RAM to evaluate which version is best suited to the application at
hand.
Alternating Read-Write Operations
SigmaQuad SRAMs follow a few simple rules of operation.
- Read or Write commands issued on one port are never allowed to interrupt an operation in progress on the other port.
- Read or Write data transfers in progress may not be interrupted and re-started.
- R and W high always deselects the RAM.
- All address, data, and control inputs are sampled on clock edges.
In order to enforce these rules, each RAM combines present state information with command inputs. See the Truth Table for
details.
Burst of 4 SigmaQuad SRAM DDR Read
The status of the Address Input, W, and R pins are sampled at each rising edge of K. W and R high causes chip disable. A low on
the Read Enable-bar pin, R, begins a read cycle. R is always ignored if the previous command loaded was a read command. The
four resulting data output transfers begin after the next rising edge of the K clock. Data is clocked out by the next rising edge of the
C, the rising edge of C after that, the next rising edge of C, and finally by the next rising edge of C.
Burst of 4 Double Data Rate SigmaQuad SRAM Read First
Read A
NOP
Read B
Write C
Read D
Write E
NOP
K
K
Address
A
B
C
D
E
R
W
BWx
C
D
C+1
C+2
C+3
E
E+1
C
C
Q
Rev: 2.04 4/2005
A
A+1
A+2
A+3
B
B+1
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Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
B+2
B+3
D
D+1
D+2
© 2002, GSI Technology
GS8180DV18D-250/200/167/133/100
Burst of 4 SigmaQuad SRAM DDR Write
The status of the Address Input, W, and R pins are sampled at each rising edge of K. W and R high causes chip disable. A low on
the Write Enable-bar pin, W, and a high on the Read Enable-bar pin, R, begins a write cycle. W is always ignored if the previous
command was a write command. Data is clocked in by the next rising edge of K, the rising edge of K after that, the next rising edge
of K, and finally by the next rising edge of K.
Burst of 4 Double Data Rate SigmaQuad SRAM Write First
Write A
NOP
Write B
Read C
NOP
Read D
NOP
K
Kbar
Address
A
B
C
D
Rbar
Wbar
B+3
BWx bar
D
A
A+1
A+2
A+3
B
B+1
B+2
B+3
C
Cbar
C
Q
C+1
C+2
C+3
Special Functions
Byte Write Control
Byte Write Enable pins are sampled at the same time that Data In is sampled. A high on the Byte Write Enable pin associated with
a particular byte (e.g., BW0 controls D0–D8 inputs) will inhibit the storage of that particular byte, leaving whatever data may be
stored at the current address at that byte location undisturbed. Any or all of the Byte Write Enable pins may be driven high or low
during the data in sample times in a write sequence.
Each write enable command and write address loaded into the RAM provides the base address for a 4 beat data transfer. The x18
version of the RAM, for example, may write 72 bits in association with each address loaded. Any 9-bit byte may be masked in any
write sequence.
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D
GS8180DV18D-250/200/167/133/100
Example x18 RAM Write Sequence using Byte Write Enables
Data In Sample
Time
BW0
BW1
D0–D8
D9–D17
Beat 1
0
1
Data In
Don’t Care
Beat 2
1
0
Don’t Care
Data In
Beat 3
0
0
Data In
Data In
Beat 4
1
0
Don’t Care
Data In
Resulting Write Operation
Beat 1
D0–D8
Beat 1
D9–D17
Beat 2
D0–D8
Beat 2
D9–D17
Beat 3
D0–D8
Beat 3
D9–D17
Beat 4
D0–D8
Beat 4
D9–D17
Written
Unchanged
Unchanged
Written
Written
Written
Unchanged
Written
Output Register Control
SigmaQuad SRAMs offer two mechanisms for controlling the output data registers. Typically, control is handled by the Output
Register Clock inputs, C and C. The Output Register Clock inputs can be used to make small phase adjustments in the firing of the
output registers by allowing the user to delay driving data out as much as a few nanoseconds beyond the next rising edges of the K
and K clocks. If the C and C clock inputs are tied high, the RAM reverts to K and K control of the outputs, allowing the RAM to
function as a conventional pipelined read SRAM.
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Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2002, GSI Technology
GS8180DV18D-250/200/167/133/100
Example Four Bank Depth Expansion Schematic
R3
W3
R2
W2
R1
W1
R0
W0
A0–An
K
D1–Dn
Bank 0
Bank 1
Bank 2
Bank 3
A
A
A
A
W
W
W
W
R
R
R
R
K
D
C
Q
K
D
Q
C
K
D
K
Q
C
D
Q
C
C
Q1–Qn
Note: For simplicity BWn, K, and C are not shown.
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© 2002, GSI Technology
Rev: 2.04 4/2005
Q Bank2
Cbar Bank2
C Bank2
Q Bank1
Cbar Bank1
C Bank1
D Bank2
BWx bar Bank2
D Bank1
BWx bar Bank1
W2bar
W1bar
R2bar
R1bar
Address
Kbar
K
A
Read A
B
Write B
A
B
C
A+1
B+1
Read C
A+2
B+2
D
A+3
B+3
Write D
C
D
E
C+1
D+1
Read E
Burst of 4 SigmaQuad SRAM Depth Expansion
C+2
D+2
F
C+3
Write F
D+3
E
F
E+1
NOP
F+1
E+2
F+2
GS8180DV18D-250/200/167/133/100
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
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FLXDrive-II Output Driver Impedance Control
HSTL I/O SigmaQuad SRAMs are supplied with programmable impedance output drivers. The ZQ pin must be connected to VSS
via an external resistor, RQ, to allow the SRAM to monitor and adjust its output driver impedance. The value of RQ must be 5X the
value of the intended line impedance driven by the SRAM. The allowable range of RQ to guarantee impedance matching with a
vendor-specified tolerance is between 150Ω and 300Ω. Periodic readjustment of the output driver impedance is necessary as the
impedance is affected by drifts in supply voltage and temperature. A clock cycle counter periodically triggers an impedance
evaluation, resets and counts again. Each impedance evaluation may move the output driver impedance level one step at a time
towards the optimum level. The output driver is implemented with discrete binary weighted impedance steps. The SRAM requires
32K start-up cycles, selected or deselected, after VDD reaches its operating range to reach its programmed output driver impedance.
Separate I/O Burst of 4 SigmaQuad SRAM Truth Table
A
R
W
Previous
Operation
Current
Operation
D
D
D
D
Q
Q
Q
Q
K↑
(tn)
K↑
(tn)
K↑
(tn)
K↑
(tn-1)
K↑
(tn)
K↑
(tn+1)
K↑
(tn+1½)
K↑
(tn+2)
K↑
(tn+2½)
K↑
(tn+1)
K↑
(tn+1½)
K↑
(tn+2)
K↑
(tn+2½)
X
1
1
Deselect
Deselect
X
X
—
—
Hi-Z
Hi-Z
—
—
X
1
X
Write
Deselect
D2
D3
—
—
Hi-Z
Hi-Z
—
—
X
X
1
Read
Deselect
X
X
—
—
Q2
Q3
—
—
V
1
0
Deselect
Write
D0
D1
D2
D3
Hi-Z
Hi-Z
—
—
V
0
X
Deselect
Read
X
X
—
—
Q0
Q1
Q2
Q3
V
X
0
Read
Write
D0
D1
D2
D3
Q2
Q3
—
—
V
0
X
Write
Read
D2
D3
—
—
Q0
Q1
Q2
Q3
Notes:
1. “1” = input “high”; “0” = input “low”; “V” = input “valid”; “X” = input “don’t care”
2. “—” indicates that the input requirement or output state is determined by the next operation.
3. Q0, Q1, Q2, and Q3 indicate the first, second, third, and fourth pieces of output data transferred during Read operations.
4. D0, D1, D2, and D3 indicate the first, second, third, and fourth pieces of input data transferred during Write operations.
5. Qs are tristated for one cycle in response to Deselect and Write commands, one cycle after the command is sampled, except when preceded by a Read command.
6. Users should not clock in metastable addresses.
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Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
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GS8180DV18D-250/200/167/133/100
Byte Write Clock Truth Table
BW
BW
BW
BW
Current Operation
D
D
D
D
K↑
(tn+1)
K↑
(tn+1½)
K↑
(tn+2)
K↑
(tn+2½)
K↑
(tn)
K↑
(tn+1)
K↑
(tn+1½)
K↑
(tn+2)
K↑
(tn+2½)
T
T
T
T
Write
Dx stored if BWn = 0 in all four data transfers
D0
D2
D3
D4
T
F
F
F
Write
Dx stored if BWn = 0 in 1st data transfer only
D0
X
X
X
F
T
F
F
Write
Dx stored if BWn = 0 in 2nd data transfer only
X
D1
X
X
F
F
T
F
Write
Dx stored if BWn = 0 in 3rd data transfer only
X
X
D2
X
F
F
F
T
Write
Dx stored if BWn = 0 in 4th data transfer only
X
X
X
D3
F
F
F
F
Write Abort
No Dx stored in any of the four data transfers
X
X
X
X
Notes:
1. “1” = input “high”; “0” = input “low”; “X” = input “don’t care”; “T” = input “true”; “F” = input “false”.
2. If one or more BWn = 0, then BW = “T”, else BW = “F”.
x18 Byte Write Enable (BWn) Truth Table
BW0 BW1
D0–D8
D9–D17
1
1
Don’t Care
Don’t Care
0
1
Data In
Don’t Care
1
0
Don’t Care
Data In
0
0
Data In
Data In
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GS8180DV18D-250/200/167/133/100
State Diagram
Power-
Read NOP
READ
READ
READ
R Count = 2
Load New
Write Address
W Count = 0
READ
R Count = 2
Always
DDR Read
R Count = R Count + 1
READ
R Count = 1
Write NOP
WRITE
Load New
Read Address
R Count = 0
Always
WRITE
WRITE
W Count = 2
WRITE
W Count = 2
DDR Write
W Count = W Count + 1
Always
Always
Increment
Read Address
WRITE
W Count = 1
Increment
Write Address
Notes:
1. Internal burst counter is fixed as 2-bit linear (i.e., when first address is A0+), next internal burst address is A0+1.
2. “READ” refers to read active status with R = Low, “READ” refers to read inactive status with R = High. The same is true for
“WRITE” and “WRITE”.
3. Read and write state machine can be active simultaneously.
4. State machine control timing sequence is controlled by K.
5. R Count is the read counter; Burst of 4 must complete 2 DDR reads.
6. W Count is the write counter; Burst of 4 must complete 2 DDR writes.
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GS8180DV18D-250/200/167/133/100
Absolute Maximum Ratings
(All voltages reference to VSS)
Symbol
Description
Value
Unit
VDD
Voltage on VDD Pins
–0.5 to 3.6
V
VDDQ
Voltage in VDDQ Pins
–0.5 to 3.6
V
VREF
Voltage in VREF Pins
–0.5 to VDDQ
V
VI/O
Voltage on I/O Pins
–0.5 to VDDQ +0.5 (≤ 3.6 V max.)
V
VIN
Voltage on Other Input Pins
–0.5 to VDDQ +0.5 (≤ 3.6 V max.)
V
IIN
Input Current on Any Pin
+/–100
mA dc
IOUT
Output Current on Any I/O Pin
+/–100
mA dc
TJ
Maximum Junction Temperature
125
oC
TSTG
Storage Temperature
–55 to 125
o
C
Note:
Permanent damage to the device may occur if the Absolute Maximum Ratings are exceeded. Operation should be restricted to Recommended
Operating Conditions. Exposure to conditions exceeding the Recommended Operating Conditions, for an extended period of time, may affect
reliability of this component.
Recommended Operating Conditions
Power Supplies
Parameter
Symbol
Min.
Typ.
Max.
Unit
Notes
Supply Voltage
VDD
2.4
2.5
2.6
V
1.8 V I/O Supply Voltage
VDDQ
1.7
1.8
1.95
V
1
1.5 V I/O Supply Voltage
VDDQ
1.4
1.5
1.6
V
1
Ambient Temperature
(Commercial Range Versions)
TA
0
25
70
°C
2
Ambient Temperature
(Industrial Range Versions)
TA
–40
25
85
°C
2
Notes:
1. Unless otherwise noted, all performance specifications quoted are evaluated for worst case at both 1.4 V ≤ VDDQ ≤ 1.6 V (i.e., 1.5 V I/O)
and 1.7 V ≤ VDDQ ≤ 1.95 V (i.e., 1.8 V I/O) and quoted at whichever condition is worst case.
2. The power supplies need to be powered up simultaneously or in the following sequence: VDD, VDDQ, VREF, followed by signal inputs. The
power down sequence must be the reverse. VDDQ must not exceed VDD.
3. Most speed grades and configurations of this device are offered in both Commercial and Industrial Temperature ranges. The part number
of Industrial Temperature Range versions end the character “I”. Unless otherwise noted, all performance specifications quoted are
evaluated for worst case in the temperature range marked on the device.
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GS8180DV18D-250/200/167/133/100
HSTL I/O DC Input Characteristics
Parameter
Symbol
Min
DC Input Logic High
VIH (dc)
VREF + 200
DC Input Logic Low
VIL (dc)
VREF DC Voltage
VREF (dc)
Max
VDDQ (min)/2
Units
Notes
mV
1
VREF – 200
mV
1
VDDQ (max)/2
V
1
Note:
Compatible with both 1.8 V and 1.5 V I/O drivers
HSTL I/O AC Input Characteristics
Parameter
Symbol
Min
AC Input Logic High
VIH (ac)
VREF + 400
AC Input Logic Low
VIL (ac)
VREF (ac)
VREF Peak to Peak AC Voltage
Max
Units
Notes
mV
3,4
VREF – 400
mV
3,4
5% VREF (DC)
mV
1
Notes:
1. The peak to peak AC component superimposed on VREF may not exceed 5% of the DC component of VREF.
2. To guarantee AC characteristics, VIH,VIL, Trise, and Tfall of inputs and clocks must be within 10% of each other.
3. For devices supplied with HSTL I/O input buffers. Compatible with both 1.8 V and 1.5 V I/O drivers.
4. See AC Input Definition drawing below.
HSTL I/O AC Input Definitions
VIH (ac)
VREF
VIL (ac)
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Undershoot Measurement and Timing
Overshoot Measurement and Timing
VIH
20% tKHKH
VDD + 1.0 V
VSS
50%
50%
VDD
VSS – 1.0 V
20% tKHKH
VIL
Capacitance
(TA = 25oC, f = 1 MHZ, VDD = 3.3 V)
Parameter
Symbol
Test conditions
Typ.
Max.
Unit
Input Capacitance
CIN
VIN = 0 V
4
5
pF
Output Capacitance
COUT
VOUT = 0 V
6
7
pF
Note:
This parameter is sample tested.
AC Test Conditions
Parameter
Conditions
Input high level
VDDQ
Input low level
0V
Max. input slew rate
2 V/ns
Input reference level
VDDQ/2
Output reference level
VDDQ/2
Notes:
Test conditions as specified with output loading as shown unless otherwise noted.
AC Test Load Diagram
DQ
50Ω
RQ = 250 Ω (HSTL I/O)
VREF = 0.75 V
VT = VDDQ/2
Rev: 2.04 4/2005
14/28
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2002, GSI Technology
GS8180DV18D-250/200/167/133/100
Input and Output Leakage Characteristics
Parameter
Symbol
Test Conditions
Min.
Max
Input Leakage Current
(except mode pins)
IIL
VIN = 0 to VDD
–2 uA
2 uA
Output Leakage Current
IOL
Output Disable,
VOUT = 0 to VDDQ
–2 uA
2 uA
Notes
Programmable Impedance HSTL Output Driver DC Electrical Characteristics
Parameter
Symbol
Min.
Max.
Units
Notes
Output High Voltage
VOH1
VDDQ/2
VDDQ
V
1, 3
Output Low Voltage
VOL1
Vss
VDDQ/2
V
2, 3
Output High Voltage
VOH2
VDDQ – 0.2
VDDQ
V
4, 5
Output Low Voltage
VOL2
Vss
0.2
V
4, 6
Notes:
1. IOH = (VDDQ/2) / (RQ/5) +/– 15% @ VOH = VDDQ/2 (for: 175Ω ≤ RQ ≤ 350Ω).
2. IOL = (VDDQ/2) / (RQ/5) +/– 15% @ VOL = VDDQ/2 (for: 175Ω ≤ RQ ≤ 350Ω).
3. Parameter tested with RQ = 250Ω and VDDQ = 1.5 V or 1.8 V
4. Minimum Impedance mode, ZQ = VSS
5. IOH = –1.0 mA
6. IOL = 1.0 mA
Operating Currents
-250
Parameter
Operating
Current
Chip
Disable
Current
Org
Symbol
-200
-167
-133
-100
0°C
to
70°C
–40°C
to
+85°C
0°C
to
70°C
–40°C
to
+85°C
0°C
to
70°C
–40°C
to
+85°C
0°C
to
70°C
–40°C
to
+85°C
0°C
to
70°C
–40°C
to
+85°C
IDD
TBD
TBD
460
mA
TBD
400
mA
TBD
340
mA
TBD
280
mA
TBD
IDDQ
TBD
TBD
95 mA
TBD
85 mA
TBD
70 mA
TBD
65 mA
TBD
ISB1
TBD
TBD
130
mA
TBD
120
mA
TBD
115
mA
TBD
110
mA
TBD
ISBQ1
TBD
TBD
5 mA
TBD
5 mA
TBD
5 mA
TBD
5 mA
TBD
x18
x18
Test Conditions
R and W ≤ VIL Max.
tKHKH ≥ tKHKH Min.
All other inputs
VIN ≤ VIL Max. or VIN ≥ VIH Min.
R and W ≥ VIH Min.
tKHKH ≥ tKHKH Min.
All other inputs
VIN ≤ VIL Max. or VIN ≥ VIH Min.
Note:
Power measured with output pins floating.
Rev: 2.04 4/2005
15/28
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2002, GSI Technology
GS8180DV18D-250/200/167/133/100
AC Electrical Characteristics
Parameter
Symbol
-250
-200
-167
-133
-100
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Units
Notes
K, K Clock Cycle Time
C, C Clock Cycle Time
tKHKH
tCHCH
4.0
—
5.0
—
6.0
—
7.5
—
10
—
ns
K, K Clock High Pulse Width
C, C Clock High Pulse Width
tKHKL
tCHCL
1.5
—
1.9
—
2.4
—
3.0
—
3.0
—
ns
K, K Clock Low Pulse Width
C, C Clock Low Pulse Width
tKLKH
tCLCH
1.5
—
1.9
—
2.4
—
3.0
—
3.0
—
ns
K Clock High to K Clock High
C Clock High to C Clock High
tKHKH
tCHCH
1.8
2.2
2.7
—
3.4
—
4.6
ns
K Clock High to K Clock High
C Clock High to C Clock High
tKHKH
tCHCH
1.8
2.2
2.7
—
3.4
—
4.6
ns
K, K Clock High to C, C Clock High
tKHCH
0
1.8
0
2.3
0
2.0
0
2.5
0
3.0
ns
Address Input Setup Time
tAVKH
0.5
—
0.6
—
0.7
—
0.8
—
1.0
—
ns
Address Input Hold Time
tKHAX
0.5
—
0.6
—
0.7
—
0.8
—
1.0
—
ns
Control Input Setup Time
tBVKH
0.5
—
0.6
—
0.7
—
0.8
—
1.0
—
ns
1
Control Input Hold Time
tKHBX
0.5
—
0.6
—
0.7
—
0.8
—
1.0
—
ns
1
Data and Byte Write Input Setup
Time
tDVKH
0.5
—
0.6
—
0.7
—
0.8
—
1.0
—
ns
Data and Byte Write Input Hold Time
tKHDX
0.5
—
0.6
—
0.7
—
0.8
—
1.0
—
ns
K, K Clock High to Data Output Valid
C, C Clock High to Data Output Valid
tKHQV
tCHQV
—
2.1
—
2.2
—
2.5
—
3.0
—
3.0
ns
K, K Clock High to Data Output Hold
C, C Clock High to Data Output Hold
tKHQX
tCHQX
0.5
—
1.0
—
1.2
—
1.2
—
1.2
—
ns
2
K Clock High to Data Output Low-Z
C Clock High to Data Output Low-Z
tKHQX1
tCHQX1
0.5
—
1.0
—
1.2
—
1.2
—
1.2
—
ns
2,3
K Clock High to Data Output High-Z
C Clock High to Data Output High-Z
tKHQZ
tCHQZ
0.5
2.1
—
2.2
—
2.5
—
3.0
—
3.0
ns
2,3
4
Notes:
1. These parameters apply to control inputs R and W.
2. These parameters are guaranteed by design and characterization. Not 100% tested.
3. These parameters are measured at ±50mV from steady state voltage.
4. tKHKH Max is specified by tKHKH Min. tCHCH Max is specified by tCHCH Min.
Rev: 2.04 4/2005
16/28
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2002, GSI Technology
Rev: 2.04 4/2005
Q
D
BWx bar
Wbar
Rbar
Address
Kbar
K
IVKH
KHIX
AVKH
KHAX
KHKH
Read A
KHQX1
IVKH
KHIX
KHKL
Write B
DVKH
IVKH
KHKHbar
KHQV
KLKH
NOP
KHQX
KHDX
KHIX
KHQZ
Write C
Read D
K and K Controlled Read-Write-Read Timing Diagram
Write E
NOP
GS8180DV18D-250/200/167/133/100
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
17/28
© 2002, GSI Technology
Rev: 2.04 4/2005
Q
Cbar
C
D
BWx bar
Wbar
Rbar
Address
Kbar
K
KHKH
A
KLKH
IVKH
KHIX
AVKH
KHAX
KHKH
Read A
KHKL
KHKL
NOP
CHQV
A+1
A+2
KHKHbar
A
B
CHQX1
KLKH
Read B
C
A+3
B
CHQX
IVKH
KHIX
KHKHbar
Write C
C
B+1
DVKH
IVKH
NOP
B+2
C+1
C and C Controlled Read-Write-Read Timing Diagram
C+2
C+3
CHQZ
B+3
KHDX
KHIX
D
Write D
D
NOP
D+1
GS8180DV18D-250/200/167/133/100
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
18/28
© 2002, GSI Technology
GS8180DV18D-250/200/167/133/100
JTAG Port Operation
Overview
The JTAG Port on this RAM operates in a manner that is compliant with IEEE Standard 1149.1-1990, a serial boundary scan
interface standard (commonly referred to as JTAG). The JTAG Port input interface levels scale with VDD. The JTAG output
drivers are powered by VDDQ.
Disabling the JTAG Port
It is possible to use this device without utilizing the JTAG port. The port is reset at power-up and will remain inactive unless
clocked. TCK, TDI, and TMS are designed with internal pull-up circuits.To assure normal operation of the RAM with the JTAG
Port unused, TCK, TDI, and TMS may be left floating or tied to either VDD or VSS. TDO should be left unconnected.
JTAG Port Registers
JTAG Pin Descriptions
Pin
Pin Name
I/O
Description
TCK
Test Clock
In
Clocks all TAP events. All inputs are captured on the rising edge of TCK and all outputs propagate
from the falling edge of TCK.
TMS
Test Mode Select
In
The TMS input is sampled on the rising edge of TCK. This is the command input for the TAP
controller state machine. An undriven TMS input will produce the same result as a logic one input
level.
In
The TDI input is sampled on the rising edge of TCK. This is the input side of the serial registers
placed between TDI and TDO. The register placed between TDI and TDO is determined by the
state of the TAP Controller state machine and the instruction that is currently loaded in the TAP
Instruction Register (refer to the TAP Controller State Diagram). An undriven TDI pin will produce
the same result as a logic one input level.
TDI
Test Data In
TDO
Test Data Out
Output that is active depending on the state of the TAP state machine. Output changes in
Out response to the falling edge of TCK. This is the output side of the serial registers placed between
TDI and TDO.
Note:
This device does not have a TRST (TAP Reset) pin. TRST is optional in IEEE 1149.1. The Test-Logic-Reset state is entered while TMS is
held high for five rising edges of TCK. The TAP Controller is also reset automaticly at power-up.
Overview
The various JTAG registers, refered to as Test Access Port orTAP Registers, are selected (one at a time) via the sequences of 1s
and 0s applied to TMS as TCK is strobed. Each of the TAP Registers is a serial shift register that captures serial input data on the
rising edge of TCK and pushes serial data out on the next falling edge of TCK. When a register is selected, it is placed between the
TDI and TDO pins.
Instruction Register
The Instruction Register holds the instructions that are executed by the TAP controller when it is moved into the Run, Test/Idle, or
the various data register states. Instructions are 3 bits long. The Instruction Register can be loaded when it is placed between the
TDI and TDO pins. The Instruction Register is automatically preloaded with the IDCODE instruction at power-up or whenever the
controller is placed in Test-Logic-Reset state.
Bypass Register
The Bypass Register is a single bit register that can be placed between TDI and TDO. It allows serial test data to be passed through
the RAM’s JTAG Port to another device in the scan chain with as little delay as possible.
Rev: 2.04 4/2005
19/28
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2002, GSI Technology
GS8180DV18D-250/200/167/133/100
Boundary Scan Register
The Boundary Scan Register is a collection of flip flops that can be preset by the logic level found on the RAM’s input or I/O pins.
The flip flops are then daisy chained together so the levels found can be shifted serially out of the JTAG Port’s TDO pin. The
Boundary Scan Register also includes a number of place holder flip flops (always set to a logic 1). The relationship between the
device pins and the bits in the Boundary Scan Register is described in the Scan Order Table following. The Boundary Scan
Register, under the control of the TAP Controller, is loaded with the contents of the RAMs I/O ring when the controller is in
Capture-DR state and then is placed between the TDI and TDO pins when the controller is moved to Shift-DR state. SAMPLE-Z,
SAMPLE/PRELOAD and EXTEST instructions can be used to activate the Boundary Scan Register.
JTAG TAP Block Diagram
·
·
·
·
·
·
Boundary Scan Register
·
·
0
Bypass Register
0
108
·
1
·
·
2 1 0
Instruction Register
TDI
TDO
ID Code Register
31 30 29
·
· · ·
2 1 0
Control Signals
TMS
TCK
Test Access Port (TAP) Controller
Identification (ID) Register
The ID Register is a 32-bit register that is loaded with a device and vendor specific 32-bit code when the controller is put in
Capture-DR state with the IDCODE command loaded in the Instruction Register. The code is loaded from a 32-bit on-chip ROM.
It describes various attributes of the RAM as indicated below. The register is then placed between the TDI and TDO pins when the
controller is moved into Shift-DR state. Bit 0 in the register is the LSB and the first to reach TDO when shifting begins.
Rev: 2.04 4/2005
20/28
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2002, GSI Technology
GS8180DV18D-250/200/167/133/100
Die
Revision
Code
GSI Technology
JEDEC Vendor
ID Code
I/O
Configuration
Not Used
Presence Register
Tap Controller Instruction Set
ID Register Contents
Bit #
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
0
x18
X
1
X
X
X
0
0
0
X
1
0
0
1
0
0
0
0
1
0
1
0
0
0 0 1 1 0 1 1 0 0 1
Overview
There are two classes of instructions defined in the Standard 1149.1-1990; the standard (Public) instructions, and device specific
(Private) instructions. Some Public instructions are mandatory for 1149.1 compliance. Optional Public instructions must be
implemented in prescribed ways. The TAP on this device may be used to monitor all input and I/O pads, and can be used to load
address, data or control signals into the RAM or to preload the I/O buffers.
When the TAP controller is placed in Capture-IR state the two least significant bits of the instruction register are loaded with 01.
When the controller is moved to the Shift-IR state the Instruction Register is placed between TDI and TDO. In this state the desired
instruction is serially loaded through the TDI input (while the previous contents are shifted out at TDO). For all instructions, the
TAP executes newly loaded instructions only when the controller is moved to Update-IR state. The TAP instruction set for this
device is listed in the following table.
Rev: 2.04 4/2005
21/28
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2002, GSI Technology
GS8180DV18D-250/200/167/133/100
JTAG Tap Controller State Diagram
1
0
Test Logic Reset
0
Run Test Idle
1
Select DR
1
Select IR
0
0
1
1
Capture DR
Capture IR
0
0
Shift DR
1
1
Shift IR
0
1
1
Exit1 DR
0
Exit1 IR
0
0
Pause DR
1
Exit2 DR
1
Update DR
1
1
0
0
Pause IR
1
Exit2 IR
0
1
0
0
Update IR
1
0
Instruction Descriptions
BYPASS
When the BYPASS instruction is loaded in the Instruction Register the Bypass Register is placed between TDI and TDO. This
occurs when the TAP controller is moved to the Shift-DR state. This allows the board level scan path to be shortened to facilitate testing of other devices in the scan path.
SAMPLE/PRELOAD
SAMPLE/PRELOAD is a Standard 1149.1 mandatory public instruction. When the SAMPLE / PRELOAD instruction is
loaded in the Instruction Register, moving the TAP controller into the Capture-DR state loads the data in the RAMs input and
I/O buffers into the Boundary Scan Register. Boundary Scan Register locations are not associated with an input or I/O pin, and
are loaded with the default state identified in the Boundary Scan Chain table at the end of this section of the datasheet. Because
the RAM clock is independent from the TAP Clock (TCK) it is possible for the TAP to attempt to capture the I/O ring contents
while the input buffers are in transition (i.e. in a metastable state). Although allowing the TAP to sample metastable inputs will
not harm the device, repeatable results cannot be expected. RAM input signals must be stabilized for long enough to meet the
TAPs input data capture set-up plus hold time (tTS plus tTH). The RAMs clock inputs need not be paused for any other TAP
operation except capturing the I/O ring contents into the Boundary Scan Register. Moving the controller to Shift-DR state then
places the boundary scan register between the TDI and TDO pins.
EXTEST
EXTEST is an IEEE 1149.1 mandatory public instruction. It is to be executed whenever the instruction register is loaded with
all logic 0s. The EXTEST command does not block or override the RAM’s input pins; therefore, the RAM’s internal state is
Rev: 2.04 4/2005
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Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2002, GSI Technology
GS8180DV18D-250/200/167/133/100
still determined by its input pins.
Typically, the Boundary Scan Register is loaded with the desired pattern of data with the SAMPLE/PRELOAD command.
Then the EXTEST command is used to output the Boundary Scan Register’s contents, in parallel, on the RAM’s data output
drivers on the falling edge of TCK when the controller is in the Update-IR state.
Alternately, the Boundary Scan Register may be loaded in parallel using the EXTEST command. When the EXTEST instruction is selected, the sate of all the RAM’s input and I/O pins, as well as the default values at Scan Register locations not associated with a pin, are transferred in parallel into the Boundary Scan Register on the rising edge of TCK in the Capture-DR
state, the RAM’s output pins drive out the value of the Boundary Scan Register location with which each output pin is associated.
IDCODE
The IDCODE instruction causes the ID ROM to be loaded into the ID register when the controller is in Capture-DR mode and
places the ID register between the TDI and TDO pins in Shift-DR mode. The IDCODE instruction is the default instruction
loaded in at power up and any time the controller is placed in the Test-Logic-Reset state.
SAMPLE-Z
If the SAMPLE-Z instruction is loaded in the instruction register, all RAM outputs are forced to an inactive drive state (highZ) and the Boundary Scan Register is connected between TDI and TDO when the TAP controller is moved to the Shift-DR
state.
RFU
These instructions are Reserved for Future Use. In this device they replicate the BYPASS instruction.
Rev: 2.04 4/2005
23/28
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2002, GSI Technology
GS8180DV18D-250/200/167/133/100
JTAG Port AC Test Conditions
Parameter
Conditions
Input high level
VDD – 0.2 V
Input low level
0.2 V
Input slew rate
1 V/ns
Input reference level
VDDQ/2
Output reference level
VDDQ/2
JTAG Port AC Test Load
DQ
50Ω
30pF*
VDDQ/2
* Distributed Test Jig Capacitance
Notes:
1. Include scope and jig capacitance.
2. Test conditions as shown unless otherwise noted.
JTAG TAP Instruction Set Summary
Instruction
Code
Description
Notes
EXTEST
000
Places the Boundary Scan Register between TDI and TDO.
1
IDCODE
001
Preloads ID Register and places it between TDI and TDO.
1, 2
SAMPLE-Z
010
Captures I/O ring contents. Places the Boundary Scan Register between TDI and
TDO.
Forces all RAM output drivers to High-Z.
1
RFU
011
Do not use this instruction; Reserved for Future Use.
Replicates BYPASS instruction. Places Bypass Register between TDI and TDO.
1
SAMPLE/
PRELOAD
100
Captures I/O ring contents. Places the Boundary Scan Register between TDI and
TDO.
1
GSI
101
GSI private instruction.
1
RFU
110
Do not use this instruction; Reserved for Future Use.
Replicates BYPASS instruction. Places Bypass Register between TDI and TDO.
1
BYPASS
111
Places Bypass Register between TDI and TDO.
1
Notes:
1. Instruction codes expressed in binary, MSB on left, LSB on right.
2. Default instruction automatically loaded at power-up and in test-logic-reset state.
Rev: 2.04 4/2005
24/28
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2002, GSI Technology
GS8180DV18D-250/200/167/133/100
JTAG Port Recommended Operating Conditions and DC Characteristics
Parameter
Symbol
Min.
Max.
Unit Notes
Test Port Input High Voltage
VIHJ
0.6 * VDD
VDD2 +0.3
V
1
Test Port Input Low Voltage
VILJ
–0.3
0.3 * VDD
V
1
TMS, TCK and TDI Input Leakage Current
IINHJ
–300
1
uA
2
TMS, TCK and TDI Input Leakage Current
IINLJ
–1
100
uA
3
TDO Output Leakage Current
IOLJ
–1
1
uA
4
Test Port Output High Voltage
VOHJ
1.7
—
V
5, 6
Test Port Output Low Voltage
VOLJ
—
0.4
V
5, 7
Test Port Output CMOS High
VOHJC
VDDQ – 100 mV
—
V
5, 8
Test Port Output CMOS Low
VOLJC
—
100 mV
V
5, 9
Notes:
1. Input Under/overshoot voltage must be – V > Vi < VDDn + V not to exceed .6 V maximum, with a pulse width not to exceed 20% tTKC.
2. VILJ ≤ VIN ≤ VDDn
3. 0 V ≤ VIN ≤ VILJn
4. Output Disable, VOUT = 0 to VDDn
5. The TDO output driver is served by the VDDQ supply.
6. IOHJ = –4 mA
7. IOLJ = + 4 mA
8. IOHJC = –100 uA
9. IOLJC = +100 uA
JTAG Port Timing Diagram
tTKC
tTKH
tTKL
TCK
tTH
tTS
TDI
tTH
tTS
TMS
tTKQ
TDO
tTH
tTS
Parallel SRAM input
Rev: 2.04 4/2005
25/28
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2002, GSI Technology
GS8180DV18D-250/200/167/133/100
JTAG Port AC Electrical Characteristics
Parameter
Symbol
Min
Max
Unit
TCK Cycle Time
tTKC
50
—
ns
TCK Low to TDO Valid
tTKQ
—
20
ns
TCK High Pulse Width
tTKH
20
—
ns
TCK Low Pulse Width
tTKL
20
—
ns
TDI & TMS Set Up Time
tTS
10
—
ns
TDI & TMS Hold Time
tTH
10
—
ns
Rev: 2.04 4/2005
26/28
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2002, GSI Technology
GS8180DV18D-250/200/167/133/100
Package Dimensions—165-Bump FPBGA (Package D; Variation 3)
A1 CORNER
TOP VIEW
BOTTOM VIEW
Ø0.10 M C
Ø0.25 M C A B
Ø0.44~0.64 (165x)
1 2 3 4 5 6 7 8 9 10 11
A1 CORNER
11 10 9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
1.0
14.0
15±0.05
1.0
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
A
1.0
1.0
0.20 C
B
C
Rev: 2.04 4/2005
SEATING PLANE
13±0.05
0.20(4x)
0.36~0.46
1.40 MAX.
0.36 REF
0.53 REF
0.35 C
10.0
27/28
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2002, GSI Technology
GS8180DV18D-250/200/167/133/100
Ordering Information—GSI SigmaQuad SRAM
Org
Part Number1
Type
Package
Speed
(MHz)
TA3
1M x 18
GS8180DV18D-250
SigmaQuad SRAM
1 mm Pitch, 165-Pin BGA (var. 3)
250
C
1M x 18
GS8180DV18D-200
SigmaQuad SRAM
1 mm Pitch, 165-Pin BGA (var. 3)
200
C
1M x 18
GS8180DV18D-167
SigmaQuad SRAM
1 mm Pitch, 165-Pin BGA (var. 3)
167
C
1M x 18
GS8180DV18D-133
SigmaQuad SRAM
1 mm Pitch, 165-Pin BGA (var. 3)
133
C
1M x 18
GS8180DV18D-100
SigmaQuad SRAM
1 mm Pitch, 165-Pin BGA (var. 3)
100
C
1M x 18
GS8180DV18D-250I
SigmaQuad SRAM
1 mm Pitch, 165-Pin BGA (var. 3)
250
I
1M x 18
GS8180DV18D-200I
SigmaQuad SRAM
1 mm Pitch, 165-Pin BGA (var. 3)
200
I
1M x 18
GS8180DV18D-167I
SigmaQuad SRAM
1 mm Pitch, 165-Pin BGA (var. 3)
167
I
1M x 18
GS8180DV18D-133I
SigmaQuad SRAM
1 mm Pitch, 165-Pin BGA (var. 3)
133
I
1M x 18
GS8180DV18D-100I
SigmaQuad SRAM
1 mm Pitch, 165-Pin BGA (var. 3)
100
I
1M x 18
GS8180DV18GD-250
SigmaQuad SRAM
Pb-Free 1 mm Pitch, 165-Pin BGA (var. 3)
250
C
1M x 18
GS8180DV18GD-200
SigmaQuad SRAM
Pb-Free 1 mm Pitch, 165-Pin BGA (var. 3)
200
C
1M x 18
GS8180DV18GD-167
SigmaQuad SRAM
Pb-Free 1 mm Pitch, 165-Pin BGA (var. 3)
167
C
1M x 18
GS8180DV18GD-133
SigmaQuad SRAM
Pb-Free 1 mm Pitch, 165-Pin BGA (var. 3)
133
C
1M x 18
GS8180DV18GD-100
SigmaQuad SRAM
Pb-Free 1 mm Pitch, 165-Pin BGA (var. 3)
100
C
1M x 18
GS8180DV18GD-250I
SigmaQuad SRAM
Pb-Free 1 mm Pitch, 165-Pin BGA (var. 3)
250
I
1M x 18
GS8180DV18GD-200I
SigmaQuad SRAM
Pb-Free 1 mm Pitch, 165-Pin BGA (var. 3)
200
I
1M x 18
GS8180DV18GD-167I
SigmaQuad SRAM
Pb-Free 1 mm Pitch, 165-Pin BGA (var. 3)
167
I
1M x 18
GS8180DV18GD-133I
SigmaQuad SRAM
Pb-Free 1 mm Pitch, 165-Pin BGA (var. 3)
133
I
1M x 18
GS8180DV18GD-100I
SigmaQuad SRAM
Pb-Free 1 mm Pitch, 165-Pin BGA (var. 3)
100
I
Notes:
1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS818x18D-200T.
2. TA = C = Commercial Temperature Range. TA = I = Industrial Temperature Range.
Rev: 2.04 4/2005
28/28
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2002, GSI Technology
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