Fairchild MOC8111 6-pin dip optocouplers for power supply applications (no base connection) Datasheet

6-PIN DIP OPTOCOUPLERS FOR
POWER SUPPLY APPLICATIONS
(NO BASE CONNECTION)
MOC8111
MOC8112
MOC8113
PACKAGE
SCHEMATIC
ANODE 1
6
6 N/C
6
CATHODE 2
1
5 COLLECTOR
1
N/C 3
4 EMITTER
6
1
DESCRIPTION
The MOC811X series consists of a Gallium Arsenide IRED coupled with an NPN phototransistor. The base of the transistor is not
bonded to an external pin for improved noise immunity
FEATURES
• High isolation voltage
5300 VAC RMS—1 minute
• High BVCEO minimum 70 Volts
• Current transfer ratio in selected groups:
MOC8111: 20% min.
MOC8112: 50% min.
MOC8113: 100% min.
• Maximum switching time in saturation specified
• Underwriters Laboratory (UL) recognized (File #E90700)
• VDE recognized (File #94766)
APPLICATIONS
•
•
•
•
•
Power Supply Regulators
Digital Logic Inputs
Microprocessor Inputs
Appliance Sensor Systems
Industrial Controls
© 2004 Fairchild Semiconductor Corporation
Page 1 of 10
6/9/04
6-PIN DIP OPTOCOUPLERS FOR
POWER SUPPLY APPLICATIONS
(NO BASE CONNECTION)
MOC8111
MOC8112
MOC8113
ABSOLUTE MAXIMUM RATINGS (TA =25°C Unless otherwise specified)
Parameter
Symbol
Value
Unit
INPUT LED
Forward Current – Continuous
Forward Current – Peak (PW = 1µs, 300pps)
Reverse Voltage
LED Power Dissipation @ TA = 25°C
IF
90
mA
IF(pk)
3
A
VR
6
Volts
135
mW
1.8
mW/°C
200
mW
2.67
mW/°C
260
mW
3.5
mW/°C
PD
Derate above 25°C
OUTPUT TRANSISTOR
Detector Power Dissipation @ TA = 25°C
PD
Derate above 25°C
TOTAL DEVICE
Total Device Power Dissipation @ TA = 25°C
PD
Derate above 25°C
Ambient Operating Temperature Range
TOPR
-55 to +100
°C
Storage Temperature Range
TSTG
-55 to +150
°C
TSOL
260
°C
Lead Soldering Temperature
(1/16” from case, 10 sec. duration)
© 2004 Fairchild Semiconductor Corporation
Page 2 of 10
6/9/04
6-PIN DIP OPTOCOUPLERS FOR
POWER SUPPLY APPLICATIONS
(NO BASE CONNECTION)
MOC8111
MOC8112
MOC8113
ELECTRICAL CHARACTERISTICS (TA = 25°C Unless otherwise specified)
INDIVIDUAL COMPONENT CHARACTERISTICS
Parameter
Test Conditions
Symbol
Device
VF
All
VR
All
Min
Typ
Max
1.35
1.65
1.15
1.50
Unit
EMITTER
IF = 60 mA
Input Forward Voltage
IF = 10 mA
Reverse Voltage
IR = 10 µA
VF = 0 V, f = 1.0 MHz
6.0
15
V
V
50
CJ
All
VR = 3.0 V
IR
All
Breakdow Voltage
Collector to Emitter
IC = 1.0 mA, IF = 0
BVCEO
All
70
V
Breakdow Voltage
Emitter to Collector
IE = 100 µA, IF = 0
BVECO
All
7
V
Leakage Current
Collector to Emitter
VCE = 10 V, IF = 0
ICEO
All
5
Capacitance
Collector to Emitter
VCE = 0 V, f = 1 MHz
CCE
All
8
Capacitance
VF = 1 V, f = 1.0 MHz
Reverse Leakage Current
pF
65
.35
10
µA
DETECTOR
50
V
pF
ISOLATION CHARACTERISTICS
Characteristic
Input-Output Isolation Voltage
Isolation Resistance
Isolation Capacitance
© 2004 Fairchild Semiconductor Corporation
Test Conditions
Symbol
Min
f = 60 Hz, t = 1 min.
VISO
5300
VI-O = 500 VDC
RISO
1011
VI-O = 0, f = 1 MHz
CISO
Page 3 of 10
Typ
Max
Units
VRMS
Ω
0.5
pF
6/9/04
6-PIN DIP OPTOCOUPLERS FOR
POWER SUPPLY APPLICATIONS
(NO BASE CONNECTION)
MOC8111
MOC8112
MOC8113
TRANSFER CHARACTERISTICS (TA = 25°C Unless otherwise specified)
DC CHARACTERISTICS
Output/Input Current Transfer
Ratio
Test Conditions
IF = 10 mA, VCE = 5V
Symbol
CTR
Device
Min
MOC8111
20
MOC8112
50
MOC8113
100
Collector-Emitter Saturation
Voltage
IF = 10 mA, IC = 2.5 mA
VCE(SAT)
All
AC CHARACTERISTICSØ
Test Conditions
Symbol
Device
RL = 100 Ω, IC = 2 mA,
VCC = 10 V
See Figure 7
ton
toff
Typ
Max
Units
%
0.27
0.4
V
Typ
Max
Units
All
6.0
10
µS
All
5.5
10
µS
MOC8111
3.0
5.5
MOC812, MOC8113
4.2
8.0
Min
Non-Saturated Switching Times
Turn-On Time
Turn-Off Time
Saturated Switching Times
Turn-On Time
Rise-Time
Turn-Off Time
Fall-Time
IF = 20 mA, VCE = 0.4 V
IF = 10 mA, VCE = 0.4 V
IF = 20 mA, VCE = 0.4 V
IF = 10 mA, VCE = 0.4 V
IF = 20 mA, VCE = 0.4 V
IF = 10 mA, VCE = 0.4 V
IF = 20 mA, VCE = 0.4 V
IF = 10 mA, VCE = 0.4 V
© 2004 Fairchild Semiconductor Corporation
ton
tr
toff
tf
Page 4 of 10
MOC8111
2.0
4.0
MOC812, MOC8113
3.0
6.0
MOC8111
18
34
MOC812, MOC8113
23
39
MOC8111
11
20
MOC812, MOC8113
14
24
µS
µS
µS
µS
6/9/04
6-PIN DIP OPTOCOUPLERS FOR
POWER SUPPLY APPLICATIONS
(NO BASE CONNECTION)
MOC8111
MOC8112
MOC8113
TYPICAL PERFORMANCE CURVES
Fig. 1 LED Forward Voltage vs. Forward Current
Fig. 2 Normalized CTR vs. Forward Current
1.8
1.4
TA = 25°C
VCE = 5.0 V
Normalized to
IF = 10 mA
1.2
1.6
1.0
NORMALIZED CTR
VF - FORWARD VOLTAGE (V)
1.7
1.5
TA = -55°C
1.4
1.3
1.2
0.8
0.6
0.4
TA = 25°C
0.2
1.1
TA = 100°C
1.0
0.0
1
10
100
0
5
IF - LED FORWARD CURRENT (mA)
NORMALIZED CTR
IF = 5 mA
1.2
IF = 10 mA
1.0
0.8
IF = 20 mA
0.4
-75
Normalized to
IF = 10 mA
TA = 25°C
-50
-25
0
25
50
75
TA - AMBIENT TEMPERATURE (°C)
© 2004 Fairchild Semiconductor Corporation
100
125
VCE (sat) - COLLECTOR-EMITTER SATURATION VOLTAGE (V)
1.6
0.6
15
20
IF - FORWARD CURRENT (mA)
Fig. 3 Normalized CTR vs. Ambient Temperature
1.4
10
Page 5 of 10
Fig. 4 Collector Emitter Saturation Voltage
vs Collector Current
100
10
1
IF = 2.5 mA
0.1
IF = 20 mA
0.01
IF = 5 mA
IF = 10 mA
TA = 25°C
0.001
0.01
0.1
1
10
IC - COLLECTOR CURRENT (mA)
6/9/04
6-PIN DIP OPTOCOUPLERS FOR
POWER SUPPLY APPLICATIONS
(NO BASE CONNECTION)
MOC8111
MOC8112
MOC8113
TYPICAL PERFORMANCE CURVES (continued)
Fig. 5 Switching Speed vs. Load Resistor
Fig. 6 Dark current vs. Ambient Temperature.
1000
ICEO - COLLECTOR-EMITTER DARK CURRENT (µA)
1e+1
SWITCHING SPEED - (µs)
IF = 10 mA
VCC = 10 V
TA = 25°C
100
Toff
Tf
10
Ton
1
Tr
0.1
VCE = 10V
1e+0
1e-1
1e-2
1e-3
1e-4
1e-5
1e-6
0.1
1
10
100
R-LOAD RESISTOR (kΩ)
© 2004 Fairchild Semiconductor Corporation
0
25
50
75
100
125
TA - AMBIENT TEMPERATURE (°C)
Page 6 of 10
6/9/04
6-PIN DIP OPTOCOUPLERS FOR
POWER SUPPLY APPLICATIONS
(NO BASE CONNECTION)
MOC8111
MOC8112
Package Dimensions (Through Hole)
MOC8113
Package Dimensions (Surface Mount)
0.350 (8.89)
0.330 (8.38)
PIN 1
ID.
3
2
PIN 1
ID.
1
0.270 (6.86)
0.240 (6.10)
SEATING PLANE
0.270 (6.86)
0.240 (6.10)
0.350 (8.89)
0.330 (8.38)
4
0.070 (1.78)
0.045 (1.14)
5
6
0.300 (7.62)
TYP
0.070 (1.78)
0.045 (1.14)
0.200 (5.08)
0.135 (3.43)
0.200 (5.08)
0.165 (4.18)
0.020 (0.51)
MIN
0.154 (3.90)
0.100 (2.54)
0.016 (0.41)
0.008 (0.20)
0.020 (0.51)
MIN
0.022 (0.56)
0.016 (0.41)
0.100 (2.54)
TYP
0.016 (0.40)
0.008 (0.20)
0.022 (0.56)
0.016 (0.41)
0° to 15°
0.016 (0.40) MIN
0.315 (8.00)
MIN
0.405 (10.30)
MAX
0.300 (7.62)
TYP
Lead Coplanarity : 0.004 (0.10) MAX
0.100 (2.54)
TYP
Package Dimensions (0.4” Lead Spacing)
Recommended Pad Layout for
Surface Mount Leadform
0.070 (1.78)
0.270 (6.86)
0.240 (6.10)
0.060 (1.52)
SEATING PLANE
0.350 (8.89)
0.330 (8.38)
0.415 (10.54)
0.070 (1.78)
0.045 (1.14)
0.100 (2.54)
0.295 (7.49)
0.030 (0.76)
0.200 (5.08)
0.135 (3.43)
0.154 (3.90)
0.100 (2.54)
0.004 (0.10)
MIN
0.016 (0.40)
0.008 (0.20)
0° to 15°
0.022 (0.56)
0.016 (0.41)
0.100 (2.54) TYP
0.400 (10.16)
TYP
NOTE
All dimensions are in inches (millimeters)
© 2004 Fairchild Semiconductor Corporation
Page 7 of 10
6/9/04
6-PIN DIP OPTOCOUPLERS FOR
POWER SUPPLY APPLICATIONS
(NO BASE CONNECTION)
MOC8111
MOC8112
MOC8113
ORDERING INFORMATION1
Option
Example Part Number
Description
MOC8111
Through Hole
MOC8111S
Surface Mount Lead Bend
SD
MOC8111SD
Surface Mount; Tape and Reel
W
MOC8111W
0.4" Lead Spacing
MOC8111300
VDE 0884
MOC8111300W
VDE 0884, 0.4" Lead Spacing
No Suffix
S
300
300W
3S
3SD
MOC81113S
VDE 0884, Surface Mount
MOC81113SD
VDE 0884, Surface Mount, Tape and Reel
MARKING INFORMATION
1
MOC8111
2
V XX YY K
6
3
4
5
Definitions
1
Fairchild logo
2
Device number
3
VDE mark (Note: Only appears on parts ordered with VDE
option – See order entry table)
4
Two digit year code, e.g., ‘03’
5
Two digit work week ranging from ‘01’ to ‘53’
6
Assembly package code
© 2004 Fairchild Semiconductor Corporation
Page 8 of 10
6/9/04
6-PIN DIP OPTOCOUPLERS FOR
POWER SUPPLY APPLICATIONS
(NO BASE CONNECTION)
MOC8111
MOC8112
MOC8113
Carrier Tape Specifications
12.0 ± 0.1
4.85 ± 0.20
4.0 ± 0.1
4.0 ± 0.1
0.30 ± 0.05
Ø1.55 ± 0.05
1.75 ± 0.10
7.5 ± 0.1
13.2 ± 0.2
9.55 ± 0.20
10.30 ± 0.20
0.1 MAX
16.0 ± 0.3
Ø1.6 ± 0.1
User Direction of Feed
NOTE
All dimensions are in inches (millimeters)
Reflow Profile (Black Package, No Suffix)
Temperature (°C)
300
215°C, 10–30 s
250
225 C peak
200
150
Time above 183°C, 60–150 sec
100
50
Ramp up = 3C/sec
• Peak reflow temperature: 225°C (package surface temperature)
• Time of temperature higher than 183°C for 60–150 seconds
• One time soldering reflow is recommended
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
Time (Minute)
© 2004 Fairchild Semiconductor Corporation
Page 9 of 10
6/9/04
6-PIN DIP OPTOCOUPLERS FOR
POWER SUPPLY APPLICATIONS
(NO BASE CONNECTION)
MOC8111
MOC8112
MOC8113
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO
ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME
ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES
OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR
CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body, or
(b) support or sustain life, and (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
result in a significant injury of the user.
© 2004 Fairchild Semiconductor Corporation
2. A critical component in any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
Page 10 of 10
6/9/04
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